High-strength packaging structure for LED chip

Abstract

The utility model relates to the technical field of packaging structures, in particular to a high-strength packaging structure for an LED chip, which comprises a packaging substrate, the top surface of the packaging substrate is fixedly connected with an interface transition layer, the top surface of the interface transition layer is bonded with a die bonding layer, and the top surface of the die bonding layer is bonded with an LED chip main body. Compared with the prior art, the LED chip has the advantages that the bonding wires are welded between the two metal contacts and the LED chip main body, a layer of glue is coated on the top plate of the side plates, the two connecting frames are bonded on the side plates, at the moment, the receding groove corresponds to the flow channel up and down, the glass plate is located between the two side plates, and packaging glue is filled in the filling groove, the filling cavity and the flow channel. At the moment, the glass plate is wrapped in the packaging glue, high light transmission and weather resistance of the glass can be kept, stress can be relieved through the flexibility of the packaging glue, meanwhile, the glue can protect the edge of the glass from cracking, in addition, the glass plate can achieve the supporting effect, and the strength of the packaging mechanism is greatly improved.

Description

Technical Field

[0001] This utility model relates to the field of packaging structure technology, and in particular to a high-strength packaging structure for LED chips. Background Technology

[0002] LED (Light Emitting Diode) chip packaging structures hold a crucial position in the semiconductor industry. LED packaging refers to the process of assembling LED chips and other components (such as interconnects and packaging materials) together to form a complete LED device. The main purpose of this process is to ensure that the LED chip can function properly in practical applications and exhibit sufficient brightness and stability. The applications of LED chip packaging structures are wide-ranging and important. First, packaging provides the necessary mechanical protection for the LED chip, enhancing its reliability.

[0003] Existing LED chips are typically encapsulated using glass covers or encapsulating adhesives. When using glass covers, there are problems such as fragility and interface separation due to thermal expansion mismatch. On the other hand, encapsulating adhesives have the drawback of insufficient mechanical strength. Both have low compressive strength. Therefore, a high-strength encapsulation structure for LED chips is needed to solve the above problems. Utility Model Content

[0004] The purpose of this invention is to at least solve one of the aforementioned technical defects.

[0005] Therefore, one objective of this utility model is to propose a high-strength packaging structure for LED chips to solve the problems mentioned in the background art and overcome the shortcomings of the existing technology.

[0006] To achieve the above objectives, one embodiment of this utility model provides a high-strength packaging structure for LED chips, including a packaging substrate. An interface transition layer is fixedly connected to the top surface of the packaging substrate. A die-bonding layer is bonded to the top surface of the interface transition layer. An LED chip body is bonded to the top surface of the die-bonding layer. Side plates symmetrically arranged on both sides are fixedly connected to the top surface of the packaging substrate. The LED chip body is located between the two side plates. A connecting frame is bonded to the top of each side plate. A glass plate is fixedly connected between the two connecting frames. The glass plate is located between the two side plates. A filling groove is formed between the top surface of the glass plate and the two side plates. A filling cavity is formed between the bottom surface of the glass plate, the top surface of the packaging substrate, and the two side plates. A flow channel is formed on the inner wall of each side plate. The filling groove communicates with the filling cavity through two flow channels. The filling groove, the filling cavity, and the flow channels are all filled with encapsulating adhesive.

[0007] Preferably, the encapsulating adhesive is made of silicone, as described in any of the above embodiments.

[0008] Preferably, one side of the packaging substrate has two symmetrically arranged metal contacts fixedly connected to it, and each of the two metal contacts is fixedly connected to the LED chip body with a bonding wire, the bonding wire being made of gold.

[0009] Preferably, in any of the above embodiments, the interface transition layer is made of copper, and a plurality of linear array protrusions are fixedly connected to the top surface of the interface transition layer, and the plurality of protrusions are all inserted into the bottom of the die-bonding layer.

[0010] Preferably, in any of the above embodiments, the die bond layer is made of eutectic solder, and the bottom surface of the die bond layer is bonded to the top surface of the interface transition layer.

[0011] Preferably, one side of each of the above solutions is provided with a clearance groove, which corresponds vertically to the flow channel.

[0012] Preferably, one side of the connecting frame is fixedly connected with a positioning pin, and the connecting frame is engaged with the side plate by the positioning pin.

[0013] Compared with the prior art, the advantages and beneficial effects of this utility model are as follows:

[0014] During the LED chip packaging process, the LED chip body is bonded to the interface transition layer through the die bond layer, and bonding wires are soldered between the two metal contacts and the LED chip body. Then, a layer of adhesive is applied to the top plate of the side plate, and two connecting brackets are bonded to the side plate. At this time, the clearance groove and the flow channel are aligned vertically, and the glass plate will be located between the two side plates. Finally, encapsulating adhesive is filled into the filling groove, filling cavity, and flow channel. At this time, the glass plate is encapsulated inside the encapsulating adhesive, which can maintain the high light transmittance and weather resistance of the glass, and the flexibility of the encapsulating adhesive can relieve stress. At the same time, the adhesive can protect the glass edges from cracking. In addition, the glass plate can also provide support, greatly improving the strength of the packaging mechanism. Attached Figure Description

[0015] Figure 1 This is a cross-sectional view of the packaging structure of this utility model;

[0016] Figure 2 This is a schematic diagram of the structure at point A of this utility model;

[0017] Figure 3 This is a structural schematic diagram of part B of the present invention.

[0018] In the figure: 1-packaging substrate, 2-interface transition layer, 3-die bonding layer, 4-LED chip body, 5-side plate, 6-connector frame, 7-glass plate, 8-filling groove, 9-filling cavity, 10-flow channel, 11-encapsulating adhesive, 12-metal contact, 13-bonding line, 14-protrusion, 15-avoidance groove, 16-positioning pin. Detailed Implementation

[0019] The present invention will be further described below with reference to the accompanying drawings, but the scope of protection of the present invention is not limited thereto.

[0020] like Figures 1 to 3 As shown, a high-strength packaging structure for LED chips includes a packaging substrate 1. An interface transition layer 2 is fixedly connected to the top surface of the packaging substrate 1. A die-bonding layer 3 is bonded to the top surface of the interface transition layer 2. An LED chip body 4 is bonded to the top surface of the die-bonding layer 3. Side plates 5 are symmetrically arranged on both sides and fixedly connected to the top surface of the packaging substrate 1. The LED chip body 4 is located between the two side plates 5. A connecting frame 6 is bonded to the top of each side plate 5. A glass plate 7 is fixedly connected between the two connecting frames 6. The glass plate 7 is located between the two side plates 5. A filling groove 8 is formed between the top surface of the glass plate 7 and the two side plates 5. A filling cavity 9 is formed between the bottom surface of the glass plate 7, the top surface of the packaging substrate 1, and the two side plates 5. A flow channel 10 is opened on the inner wall of each side plate 5. The filling groove 8 is connected to the filling cavity 9 through the two flow channels 10. The filling groove 8, the filling cavity 9, and the flow channels 10 are all filled with encapsulating adhesive 11.

[0021] As an optional technical solution of this utility model, the encapsulating adhesive 11 is made of silicone. Silicone encapsulating adhesive has good flexibility and weather resistance, can effectively buffer mechanical stress, and provides excellent high temperature resistance.

[0022] As an optional technical solution of this utility model, two symmetrically arranged metal contacts 12 are fixedly connected to one side of the packaging substrate 1. Each of the two metal contacts 12 is fixedly connected to the LED chip body 4 with a bonding wire 13. The bonding wire 13 is made of gold. The gold bonding wire ensures a stable electrical connection, has excellent conductivity and oxidation resistance, and improves the reliability of signal transmission.

[0023] As an optional technical solution of this utility model, the interface transition layer 2 is made of copper. Several linear array protrusions 14 are fixedly connected to the top surface of the interface transition layer 2. The protrusions 14 are all inserted into the bottom of the die bonding layer 3. The copper interface transition layer combined with the linear array protrusion design enhances the adhesion of the die bonding layer and improves the heat conduction efficiency.

[0024] As an optional technical solution of this utility model, the die bonding layer 3 is made of eutectic solder. The bottom surface of the die bonding layer 3 is attached to the top surface of the interface transition layer 2. The eutectic solder die bonding layer provides high-strength mechanical connection and excellent thermal conductivity, ensuring stable bonding between the chip and the substrate.

[0025] As an optional technical solution of this utility model, a clearance groove 15 is provided through one side of each connecting frame 6. The clearance groove 15 corresponds vertically to the flow channel 10. The design of the clearance groove ensures that the flow channel and the connecting frame do not interfere with each other, optimizes the space utilization of the packaging structure, and facilitates process implementation.

[0026] As an optional technical solution of this utility model, a positioning pin 16 is fixedly connected to one side of the connecting frame 6. The connecting frame 6 is engaged with the side plate 5 through the positioning pin 16. The engagement structure between the positioning pin and the side plate simplifies the assembly process and improves the overall stability and positioning accuracy of the packaging structure. These designs together enhance the strength, reliability and production efficiency of the LED packaging structure.

[0027] A high-strength packaging structure for LED chips works as follows:

[0028] 1): When performing LED chip packaging, the LED chip body 4 is bonded to the interface transition layer 2 through the die bond layer 3, and bonding wires 13 are welded between the two metal contacts 12 and the LED chip body 4.

[0029] 2): Apply a layer of glue to the top plate of the side plate 5 and attach the two connecting brackets 6 to the side plate 5. At this time, the clearance groove 15 corresponds vertically to the flow channel 10, and the glass plate 7 will be located between the two side plates 5.

[0030] 3): Fill the filling groove 8, filling cavity 9 and flow channel 10 with encapsulating adhesive 11. At this time, the glass plate 7 is covered inside the encapsulating adhesive 11, which can maintain the high light transmittance and weather resistance of the glass.

[0031] In summary, this LED chip uses a high-strength packaging structure. During the LED chip packaging process, the LED chip body 4 is bonded to the interface transition layer 2 through the die-bonding layer 3, and bonding wires 13 are welded between the two metal contacts 12 and the LED chip body 4. Then, a layer of adhesive is applied to the top plate of the side plate 5, and the two connecting brackets 6 are bonded to the side plate 5. At this time, the clearance groove 15 corresponds vertically to the flow channel 10, and the glass plate 7 is located between the two side plates 5. Finally, the encapsulating adhesive 11 is filled into the filling groove 8, the filling cavity 9, and the flow channel 10. At this time, the glass plate 7 is covered inside the encapsulating adhesive 11, which can maintain the high light transmittance and weather resistance of the glass, and can also relieve stress by utilizing the flexibility of the encapsulating adhesive. At the same time, the adhesive can protect the glass edges from cracking. In addition, the glass plate 7 can also play a supporting role, which greatly improves the strength of the packaging mechanism.

Claims

1. A high-strength packaging structure for an LED chip, characterized by: The application relates to a packaging structure of LED chip, which comprises a packaging substrate (1), the top surface of the packaging substrate (1) is fixedly connected with an interface transition layer (2), the top surface of the interface transition layer (2) is bonded with a die bonding layer (3), the top surface of the die bonding layer (3) is bonded with an LED chip body (4), the top surface of the packaging substrate (1) is fixedly connected with two side plates (5) which are symmetrically arranged on two sides, the LED chip body (4) is located between the two side plates (5), the top of each side plate (5) is bonded with a connecting frame (6), a glass plate (7) is fixedly connected between the two connecting frames (6), the glass plate (7) is located between the two side plates (5), the top surface of the glass plate (7) and the two side plates (5) form a filling groove (8), the bottom surface of the glass plate (7), the top surface of the packaging substrate (1) and the two side plates (5) form a filling cavity (9), a flow channel (10) is formed in the inner wall of each side plate (5), the filling groove (8) is connected with the filling cavity (9) through the two flow channels (10), and the filling groove (8), the filling cavity (9) and the flow channel (10) are filled with packaging glue (11).

2. The high-strength packaging structure for an LED chip according to claim 1, wherein: The material of the packaging glue (11) is silica gel.

3. The high-strength packaging structure for an LED chip according to claim 2, wherein: One side of the packaging substrate (1) is fixedly connected with two symmetrically arranged metal contacts (12), the metal contacts (12) are fixedly connected with the LED chip body (4) through bonding wires (13), and the material of the bonding wires (13) is gold.

4. The high-strength packaging structure for an LED chip according to claim 3, wherein: The material of the interface transition layer (2) is copper, the top surface of the interface transition layer (2) is fixedly connected with a plurality of linear array protrusions (14), and the protrusions (14) are inserted into the bottom of the die bonding layer (3).

5. The high-strength packaging structure for an LED chip according to claim 4, wherein: The material of the die bonding layer (3) is eutectic solder, and the bottom surface of the die bonding layer (3) is attached to the top surface of the interface transition layer (2).

6. The high-strength packaging structure for an LED chip according to claim 5, wherein: One side of each connecting frame (6) is provided with an avoiding groove (15) penetratingly formed, and the avoiding groove (15) corresponds to the flow channel (10) in the up-down direction.

7. The high-strength packaging structure for an LED chip according to claim 6, wherein: One side of the connecting frame (6) is fixedly connected with a positioning pin (16), and the connecting frame (6) is clamped with the side plate (5) through the positioning pin (16).

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