Chip protective film laminating device

Abstract

The utility model relates to the technical field of chip film coating, in particular to a chip protective film coating device which comprises a processing table, two groups of clamping storage tables fixedly mounted on the surface of one side of the processing table, and a supporting sleeve arranged on the surface of the bottom of the processing table and positioned in the middle, auxiliary tensioning rollers are symmetrically arranged on the inner side wall face of the machining table and located on the edges of the two sides, and a plurality of sets of transmission rollers are arranged on the surfaces of the two sides of the machining table. The thin film is pulled by matching with the transmission roller, the surface of the thin film slides on the outer side surface of the auxiliary tensioning roller, meanwhile, the position of the thin film is changed by utilizing the auxiliary tensioning roller, and the position of the thin film is tensioned, so that the thin film is horizontally laid on the top surface of the supporting sleeve when the storage table is clamped; and the top surface of the supporting sleeve is used for supporting the bottom surface of the thin film in position, and the clamped chip is conveyed into the machining table under pushing of the lap joint sleeve shell.

Description

Technical Field

[0001] This utility model relates to the field of chip coating technology, and in particular to a chip protective film coating device. Background Technology

[0002] Chips are an indispensable component of electronic devices such as computers, communications, and televisions. Integrated circuit molding is a technology that protects chips. Through the molding process, chips are protected from factors such as temperature, humidity, and mechanical impact, ensuring the stability of chip performance and lifespan. In the integrated circuit molding process, coating is a very critical step, which can prevent water ingress, enhance structural stability, improve dehumidification capacity, and isolate air and other impurities during the storage, transportation, and use of integrated circuits.

[0003] A patent with publication number CN119560406A discloses an integrated circuit chip packaging coating device, including a device frame, a slide, a coating frame, a packaging film, a roll, a conveyor belt, and a coating tray. It also includes a rotation mechanism, an intermittent adjustment mechanism, a guiding mechanism, and a coating mechanism. The intermittent adjustment mechanism includes a linkage component and a control component, and the coating mechanism includes a pressing component and a cutting component. This integrated circuit chip packaging coating device, through its coating mechanism in cooperation with the rotation mechanism, coating tray, intermittent adjustment mechanism, and guiding mechanism, can automatically package and coat chips. It can effectively and fully press the packaging film along the trajectory from the chip's edge to its center, ensuring the stability of the connection between the packaging film and the chip, improving the chip packaging quality and efficiency, thereby increasing the device's working efficiency and practicality, reducing chip packaging time, and lowering chip packaging costs.

[0004] In current chip lamination packaging, the lamination bag is directly wrapped around the chip's surface, and then the lamination is heated using a high-temperature heater. The thermoplastic shrinkage of the lamination allows it to wrap around the chip's surface. However, this relatively loose lamination method can easily lead to air bubbles, dust, and wrinkles remaining inside the lamination. Furthermore, during transportation before thermoplastic shrinkage, the sliding between the lamination and the chip can cause the chip to tilt. As a result, the lamination may shift position during the thermoplastic shrinkage process, leading to gaps in the lamination on the chip's surface. Utility Model Content

[0005] Therefore, the technical problem to be solved by this utility model is to overcome the problem that when a loosely wrapped film bag is used to wrap a chip, the shrinkage speed and direction of the larger film bag cannot be kept consistent during thermoforming, which easily leaves wrinkles on the surface of the chip. Dust and air bubbles will be trapped inside the wrinkles. If the distance between the chip and the heat pack bag is offset, it will cause gaps in the film on the surface of the chip.

[0006] To solve the above-mentioned technical problems, this utility model provides a chip protective film coating device, including a processing table and two sets of clamping and storage tables fixedly installed on one side surface of the processing table, a support sleeve disposed on the bottom surface of the processing table and located in the middle, auxiliary tension rollers symmetrically arranged on the inner wall of the processing table and located at the two side edges, multiple sets of transmission rollers disposed on the two side surfaces of the processing table, a film movably sleeved on the outer surface of the multiple sets of transmission rollers, the outer surface of the film movably overlapping the outer surface of the auxiliary tension rollers, the top surface of the support sleeve movably overlapping the bottom surface of the film, and a hydraulic rod fixedly installed on the top surface of the processing table, the output end of the hydraulic rod movably overlapping the top surface of the film.

[0007] In one embodiment of this utility model, a cutting blade is provided on the output end of the hydraulic rod, and the outer surface of the cutting blade is movably attached to the top surface of the film and the inner wall of the support sleeve.

[0008] In one embodiment of this utility model, a heating cavity is provided on the bottom surface of the hydraulic rod and on the inner wall of the cutting blade, and a chip is provided on the inner wall of the heating cavity.

[0009] In one embodiment of the present invention, an opening two is provided on the outer surface of the support sleeve at the middle position, and a hydraulic rod two is fixedly installed on the bottom inner wall of the support sleeve.

[0010] In one embodiment of this utility model, an extrusion plate is fixedly connected to the output end of the hydraulic rod 2, and the top surface of the extrusion plate movably overlaps the bottom surface of the film.

[0011] In one embodiment of the present invention, a limiting groove is provided on the inner walls of both sides of the clamping and storage platform, and an overlapping sleeve is movably sleeved on the top surface of the clamping and storage platform and on the inner wall of the limiting groove, and a motor is fixedly installed on one side surface of the overlapping sleeve.

[0012] In one embodiment of this utility model, a bidirectional threaded rod is fixedly connected to the output end of the motor and movably sleeved on the outer surface of the top of the clamping and storage platform. A swing arm is movably sleeved on the outer surface of the bidirectional threaded rod.

[0013] In one embodiment of the present invention, a semi-circular soft strip wrapped around the chip surface is fixedly connected to one end of the swing arm, and an opening is provided on the outer surface of the bottom clamping and storage platform, and a slide is provided on the bottom surface of the clamping and storage platform at the entrance of the opening.

[0014] The above-mentioned technical solution of this utility model has the following advantages compared with the prior art:

[0015] The chip protective film coating device of this utility model, in conjunction with the transmission roller, pulls the film and makes the surface of the film slide on the outer surface of the auxiliary tension roller. At the same time, the auxiliary tension roller changes the position of the film and tightens the film so that the film is horizontally laid on the top surface of the support sleeve of the clamping and storage table. The top surface of the support sleeve supports the bottom surface of the film. After clamping, the chip is pushed into the processing table by the overlapping sleeve and placed in the middle of the two films. The bottom surface of the film is supported by the support sleeve, so that the chip does not cause excessive deformation when it is squeezed into the film.

[0016] The chip protective film coating device described in this utility model, when used with a hydraulic rod to press down on the surface of a pair of top films, causes the double-layer film to wrap around the surface of the chip from top to bottom, and the film to adhere and press against the top surface of the extrusion plate. The stretched film will tightly adhere to the surface of the chip, thereby greatly reducing the gas inside the double-layer film. Using the staggered connection between the cutting blade and the support sleeve, the double layers are extruded and cut off. The bottom surface of the cutting blade will press the edges of the double-layer film. At this time, the high temperature inside the cutting blade will cause the film to undergo thermoplastic deformation. The deformed film will gradually adhere to the surface of the chip, and the edges of the film will also be sealed under the pressure of the heat source. This achieves the effect of keeping the chip in the middle of the coating bag, and expelling gas during the extrusion and thermoplastic process, and sealing the edges of the thermoplastic bag. Attached Figure Description

[0017] To make the content of this utility model easier to understand, the present utility model will be further described in detail below with reference to specific embodiments and accompanying drawings.

[0018] Figure 1 This is a perspective view of the present invention;

[0019] Figure 2 This is a sectional perspective view of the processing table and the clamping and storage table in this utility model;

[0020] Figure 3 This is a three-dimensional cross-sectional view of the processing table in this utility model;

[0021] Figure 4 This is a three-dimensional sectional view of the hydraulic rod and the support sleeve joined together in this utility model;

[0022] Figure 5 This is a three-dimensional sectional view of the hydraulic rod and support sleeve in this utility model.

[0023] Figure 6 This is a three-dimensional view of the clamping and storage platform in this utility model;

[0024] Explanation of reference numerals in the accompanying drawings: 11. Processing table; 111. Transmission roller; 112. Film; 113. Hydraulic rod one; 114. Cutting blade; 115. Heating chamber; 116. Auxiliary tensioning roller; 12. Clamping and storage table; 121. Limiting groove; 122. Overlapping sleeve; 123. Motor; 124. Bidirectional threaded rod; 125. Swing arm; 126. Semi-circular flexible strip; 127. Opening one; 128. Slide; 13. Support sleeve; 131. Opening two; 132. Hydraulic rod two; 133. Extrusion plate. Detailed Implementation

[0025] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, so that those skilled in the art can better understand and implement the present invention. However, the embodiments are not intended to limit the present invention.

[0026] Reference Figure 1 - Figure 2 and Figure 6 As shown, a chip protective film coating device of the present invention has a limiting groove 121 provided on the inner walls of both sides of the clamping and storage platform 12. An overlapping sleeve 122 is movably sleeved on the top surface of the clamping and storage platform 12 and on the inner wall of the limiting groove 121. A motor 123 is fixedly installed on one side surface of the overlapping sleeve 122. A bidirectional threaded rod 124 is fixedly connected to the output end of the motor 123 and is movably sleeved on the outer surface of the top of the clamping and storage platform 12. A swing arm 125 is threadedly sleeved on the outer surface of the bidirectional threaded rod 124. A semi-circular soft strip 126 wrapped on the chip surface is fixedly connected to one end of the swing arm 125. An opening 127 is opened on the outer surface of the bottom clamping and storage platform 12. A slide 128 is provided on the bottom surface of the clamping and storage platform 12 and at the entrance of the opening 127.

[0027] The chip is placed on the top surface of the clamping and receiving platform 12, and the motor 123 rotates the bidirectional threaded rod 124, causing the swing arm 125 on the outer surface of the bidirectional threaded rod 124 to move in the same direction. The semi-circular flexible strip 126 at one end of the swing arm 125 wraps around the surface of the chip. At this time, the transmission roller 111 pulls the film 112, causing the surface of the film 112 to slide on the outer surface of the auxiliary tension roller 116. Simultaneously, the auxiliary tension roller 116 changes the position of the film 112 and... The position of 12 is tightened so that the clamping and storage platform 12 can be used to horizontally lay the film 112 on the top surface of the support sleeve 13, and the top surface of the support sleeve 13 can be used to support the bottom surface of the film 112. After clamping, the chip is pushed into the processing table 11 by the overlapping sleeve 122 and placed in the middle of the two films 112. The bottom surface of the film 112 is supported by the support sleeve 13 so that the chip does not cause excessive deformation when it is squeezed onto the film 112.

[0028] Reference Figure 1 - Figure 6 As shown, in one embodiment of this utility model, it includes a processing table 11 and two sets of clamping and storage tables 12 fixedly installed on one side surface of the processing table 11. A support sleeve 13 is disposed on the bottom surface of the processing table 11 and located in the middle position. Auxiliary tension rollers 116 are symmetrically arranged on the inner side wall of the processing table 11 and located at the two side edges. Multiple sets of transmission rollers 111 are arranged on the two side surfaces of the processing table 11. A film 112 is movably sleeved on the outer surface of the multiple sets of transmission rollers 111. The outer surface of the film 112 movably overlaps the outer surface of the auxiliary tension rollers 116. The top surface of the support sleeve 13 is movably connected to the bottom surface of the film 112. A hydraulic rod 113 is fixedly installed on the top surface of the processing table 11. The output end of the hydraulic rod 113 is movably connected to the top surface of the film 112. A cutting blade 114 is provided on the output end of the hydraulic rod 113. The outer surface of the cutting blade 114 is movably connected to the top surface of the film 112 and the inner wall of the support sleeve 13. A heating chamber 115 is provided on the bottom surface of the hydraulic rod 113 and on the inner wall of the cutting blade 114. A chip is provided on the inner wall of the heating chamber 115.

[0029] After the chip is placed, when the hydraulic rod 113 presses down on the surface of the top film 112, the double-layer film 112 wraps around the chip surface from top to bottom, and the film 112 is pressed against the top surface of the extrusion plate 133. The stretched film 112 adheres tightly to the chip surface, thus greatly reducing the gas inside the double-layer film 112. When the cutting blade 114 penetrates into the support sleeve 13, the double-layer film is cut off by the staggered connection between the cutting blade 114 and the support sleeve 13. The chip is wrapped around the top surface of the extrusion plate 133, while the bottom surface of the cutting blade 114 presses the edge of the double-layer film 112. At this time, the high temperature inside the cutting blade 114 causes the film 112 to undergo thermoplastic deformation. The deformed film 112 gradually adheres to the surface of the chip, and the edge of the film 112 is also sealed under the pressure of the heat source. This achieves the effect of keeping the chip in the middle of the film bag, squeezing and releasing gas during the extrusion and thermoplastic process, and sealing the edge of the thermoplastic bag.

[0030] Reference Figure 1 - Figure 5 As shown, in one embodiment of the present invention, an opening 131 is provided on the outer surface of the support sleeve 13 at the middle position, and a hydraulic rod 132 is fixedly installed on the bottom inner wall of the support sleeve 13. An extrusion plate 133 is fixedly connected to the output end of the hydraulic rod 132, and the top surface of the extrusion plate 133 is movably overlapped on the bottom surface of the film 112.

[0031] After the chip is coated, the transmission roller 111 pulls and changes the position of the film 112, while the hydraulic rod 132 lowers the extrusion plate 133 to the horizontal entrance of the opening 131. The chip is then clamped by the bottom semi-circular soft strip 126 extending into the support sleeve 13. The chip is then extracted and guided into the slide 128 through the opening 127 for chip recycling.

[0032] Working principle: The chip is placed on the top surface of the clamping and storage platform 12, and the motor 123 rotates the bidirectional threaded rod 124, causing the swing arm 125 on the outer surface of the bidirectional threaded rod 124 to move in the same direction. The semi-circular flexible strip 126 at one end of the swing arm 125 wraps around the surface of the chip. At this time, the transmission roller 111 pulls the film 112, causing the surface of the film 112 to slide on the outer surface of the auxiliary tension roller 116. Simultaneously, the auxiliary tension roller 116 changes the position of the film 112 and adjusts its position. The position of the film 112 is tightened so that the clamping and storage platform 12 can be used to horizontally lay the film 112 on the top surface of the support sleeve 13, and the top surface of the support sleeve 13 can be used to support the bottom surface of the film 112. After clamping, the chip is pushed into the processing table 11 by the overlapping sleeve 122 and placed in the middle of the two films 112. The bottom surface of the film 112 is supported by the support sleeve 13 so that the chip does not cause excessive deformation when it is squeezed against the film 112.

[0033] After the chip is placed, when the hydraulic rod 113 presses down on the surface of the top film 112, the double-layer film 112 wraps around the chip surface from top to bottom, and the film 112 is pressed against the top surface of the extrusion plate 133. The stretched film 112 adheres tightly to the chip surface, thus greatly reducing the gas inside the double-layer film 112. When the cutting blade 114 penetrates into the support sleeve 13, the double-layer film is cut off by the staggered connection between the cutting blade 114 and the support sleeve 13. The chip is wrapped around the top surface of the extrusion plate 133, while the bottom surface of the cutting blade 114 presses the edge of the double-layer film 112. At this time, the high temperature inside the cutting blade 114 causes the film 112 to undergo thermoplastic deformation. The deformed film 112 gradually adheres to the surface of the chip, and the edge of the film 112 is also sealed under the pressure of the heat source. This achieves the effect of keeping the chip in the middle of the film bag, squeezing and releasing gas during the extrusion and thermoplastic process, and sealing the edge of the thermoplastic bag.

[0034] Obviously, the above embodiments are merely illustrative examples for clarity and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the protection scope of this invention.

Claims

1. A chip protection film coating device, comprising a processing table (11) and two sets of clamping and receiving tables (12) fixedly installed on one side surface of the processing table (11), a supporting sleeve (13) arranged on the bottom surface of the processing table (11) and located at the middle position, characterized in that: The inner side wall surface of the processing table (11) is symmetrically provided with an auxiliary tension roller (116) at both side edge positions, a plurality of groups of transmission roller cylinders (111) are arranged on the two side surfaces of the processing table (11), a plurality of groups of the outer side surfaces of the transmission roller cylinders (111) are movably sleeved with a film (112), the outer side surface of the film (112) is movably overlapped on the outer side surface of the auxiliary tension roller (116), the top surface of the supporting sleeve (13) is movably overlapped on the bottom surface of the film (112), and a hydraulic rod one (113) is fixedly installed on the top surface of the processing table (11).

2. The chip protection film laminating apparatus according to claim 1, wherein: A cutting knife (114) is arranged on the output end of the hydraulic rod one (113), and the outer side surface of the cutting knife (114) is movably overlapped on the top surface of the film (112) and the inner side wall surface of the supporting sleeve (13).

3. The chip protection film laminating apparatus according to claim 2, wherein: A heating cavity (115) is arranged on the bottom surface of the hydraulic rod one (113) and located on the inner side wall surface of the cutting knife (114), and the inner side wall surface of the heating cavity (115) is provided with a chip.

4. The chip protection film laminating apparatus according to claim 3, wherein: An opening two (131) is formed on the outer side surface of the supporting sleeve (13) and located at the middle position, and a hydraulic rod two (132) is fixedly installed on the bottom inner side wall surface of the supporting sleeve (13).

5. The chip protection film laminating apparatus according to claim 4, wherein: An extrusion plate (133) is fixedly connected to the output end of the hydraulic rod two (132), and the top surface of the extrusion plate (133) is movably overlapped on the bottom surface of the film (112).

6. The chip protection film laminating apparatus according to claim 1, wherein: Limiting sliding grooves (121) are arranged on the two side inner wall surfaces of the clamping storage table (12), a clamping sleeve (122) is movably sleeved on the top surface of the clamping storage table (12) and located on the inner side wall surface of the limiting sliding groove (121), and a motor (123) is fixedly installed on one side surface of the clamping sleeve (122).

7. The chip protection film laminating apparatus according to claim 6, wherein: A bidirectional threaded rod (124) movably sleeved on the top outer side surface of the clamping storage table (12) is fixedly connected to the output end of the motor (123), and a swing arm (125) is threadedly movably sleeved on the outer side surface of the bidirectional threaded rod (124).

8. The chip protection film laminating apparatus according to claim 7, wherein: A semicircular soft strip (126) wrapped on the surface of the chip is fixedly connected to one end of the swing arm (125), an opening one (127) is formed on the outer side surface of the bottom clamping storage table (12), and a slide (128) is arranged on the bottom surface of the clamping storage table (12) and located at the entrance of the opening one (127).

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