Heat absorption device packaging structure, heat absorption device, battery assembly and electric equipment

Abstract

The utility model provides a heat absorption device packaging structure, a heat absorption device, a battery assembly and electric equipment, and relates to the technical field of batteries, and the heat absorption device packaging structure comprises a first packaging structure which is provided with a first sealing cavity, and the first sealing cavity is suitable for arranging a heat absorption material; the first pressure relief structure is arranged on the first packaging structure, and the first pressure relief structure is used for discharging gas and / or liquid in the first sealing cavity when the pressure of the first sealing cavity is larger than first set pressure; and the second packaging structure at least covers the outer side of the first pressure relief structure. The heat absorption device packaging structure provided by the embodiment of the utility model can improve the heat absorption effect of the heat absorption material, thereby improving the heat absorption effect of the heat absorption device.

Description

Technical Field

[0001] This application relates to the field of battery technology, and in particular to a heat absorption device packaging structure, a heat absorption device, a battery assembly, and an electrical device. Background Technology

[0002] There is a risk of thermal runaway in the cells of a battery module. When a cell in a battery module experiences thermal runaway, the high temperature it generates will be transferred to the surrounding cells that are not faulty, thereby causing thermal runaway in other components of the battery module.

[0003] In related technologies, a heat-absorbing device is set up around the battery. The phase change material in the heat-absorbing device can absorb the heat when the battery experiences thermal runaway, thereby reducing the probability of heat transfer to surrounding batteries and reducing the degree of damage to the battery components.

[0004] However, the phase change material in the heat absorption device of the above-mentioned related technologies cannot fully exert its heat absorption effect, resulting in poor heat absorption effect of the heat absorption device. Utility Model Content

[0005] This application provides a heat absorption device packaging structure, a heat absorption device, a battery module, and an electrical device to solve the technical problem in the above-mentioned related technologies that the phase change material in the heat absorption device packaging structure cannot fully exert its heat absorption effect, resulting in poor heat absorption effect of the heat absorption device.

[0006] To achieve the above objectives, the embodiments of this application provide the following technical solutions:

[0007] A first aspect of this application provides a heat-absorbing device encapsulation structure, comprising:

[0008] A first encapsulation structure has a first sealed cavity, and the first sealed cavity is adapted to contain a heat-absorbing material;

[0009] A first pressure relief structure is disposed in the first encapsulation structure. The first pressure relief structure is used to discharge gas and / or liquid in the first sealing cavity when the pressure in the first sealing cavity is greater than the first set pressure.

[0010] The second encapsulation structure covers at least the outside of the first pressure relief structure.

[0011] This application provides a heat-absorbing device encapsulation structure. The heat-absorbing device encapsulation structure places heat-absorbing material in the first sealed cavity of the first encapsulation structure. After the heat-absorbing material absorbs heat, the first pressure relief structure is used to discharge the gas and / or liquid in the first sealed cavity when the pressure in the first sealed cavity is greater than a first set pressure, so as to realize the function of the heat-absorbing device encapsulation structure to directionally release the heat-absorbing material after absorbing heat.

[0012] By setting up a second encapsulation structure, the heat-absorbing material can be released from the first pressure relief structure into the second encapsulation structure after absorbing heat from the battery. Compared to releasing the heat-absorbing material directly from the first pressure relief structure to the external environment, the portion of the released heat-absorbing material that has not fully absorbed heat can be fully absorbed within the space enclosed by the second encapsulation structure. This allows the heat-absorbing material to fully exert its heat absorption effect, improves the heat absorption effect of the heat-absorbing material and the heat absorption device, and enhances the temperature management capability when the battery experiences thermal runaway.

[0013] Based on the above technical solution, the following improvements can be made to this application.

[0014] In one possible implementation, the second packaging structure covers the outside of the first packaging structure and the first pressure relief structure.

[0015] In this way, by covering the outside of the first packaging structure with the second packaging structure, the space between the second packaging structure and the first packaging structure for storing heat-absorbing material can be increased, which helps the heat-absorbing material to fully absorb heat when it flows into the second packaging structure, and improves the heat-absorbing device packaging structure's ability to store heat-absorbing material.

[0016] In one possible implementation, the sealing pressure of the first pressure relief structure is less than the sealing pressure of the first encapsulation structure, and the sealing pressure of the second encapsulation structure is greater than the sealing pressure of the first encapsulation structure.

[0017] In this way, by making the sealing pressure of the second packaging structure greater than that of the first packaging structure, the second packaging structure can be prevented from breaking with the first packaging structure first, thereby improving the sealing strength of the second packaging structure. It also enables the storage stability of the heat-absorbing material leaking from the first pressure relief structure within the second packaging structure, which helps the heat-absorbing material leaking into the second packaging structure to fully absorb heat.

[0018] In one possible implementation, the heat absorption device encapsulation structure further includes a second pressure relief structure, which is disposed within the second encapsulation structure;

[0019] A second sealing cavity is formed between the first packaging structure and the second packaging structure. The second pressure relief structure is used to discharge the gas and / or liquid in the second sealing cavity when the pressure in the second sealing cavity is greater than the second set pressure.

[0020] The sealing pressure of the second pressure relief structure is less than the sealing pressure of the second encapsulation structure.

[0021] In this way, by setting a second pressure relief structure on the second packaging structure, the second pressure relief structure is used to discharge the gas and / or liquid in the second sealing cavity when the pressure in the second sealing cavity is greater than the second set pressure, and the sealing pressure of the second pressure relief structure is less than the sealing pressure of the second packaging structure. This allows the heat-absorbing material released from the first pressure relief structure to be released and depressurized in a directional manner by the second pressure relief structure, avoiding the second packaging structure from being ruptured, or avoiding the heat-absorbing device packaging structure from bulging or deforming, which would lead to deformation and bulging of the battery and battery assembly.

[0022] In one possible implementation, the sealing pressure of the first encapsulation structure is greater than the sealing pressure of the second pressure relief structure; the sealing pressure of the first pressure relief structure is less than the sealing pressure of the second pressure relief structure.

[0023] In this way, by ensuring that the sealing pressure of the first encapsulation structure is greater than the sealing pressure of the second pressure relief structure, and the sealing pressure of the first pressure relief structure is less than that of the second pressure relief structure, the heat-absorbing material can absorb heat. When the pressure inside the first sealed cavity exceeds the sealing pressure of the first pressure relief structure, the heat-absorbing material will break through the first pressure relief structure and enter the second sealed cavity. As the heat-absorbing material continues to absorb heat, the generated gas accumulates in the cavity. When the pressure exceeds the sealing pressure of the second pressure relief structure, the heat-absorbing material breaks through the second pressure relief structure and is released. Thus, before the first encapsulation structure ruptures, the heat-absorbing material inside the second encapsulation structure can be directionally leaked to the outside through the second pressure relief structure, achieving step-by-step directional pressure relief from the first and second pressure relief structures.

[0024] In one possible implementation, the first pressure relief structure is positioned lower than the second pressure relief structure in the height direction of the heat absorption device encapsulation structure.

[0025] In this way, by positioning the first pressure relief structure lower than the second pressure relief structure in the height direction of the heat absorption device's encapsulation structure, the heat-absorbing material released from the first pressure relief structure can rise upwards along the height direction of the heat-absorbing material within the second sealed cavity until it is released again from the second pressure relief structure to the outside of the heat absorption device's encapsulation structure. This delays the process of the heat-absorbing material being released to the external environment, allowing the heat-absorbing material to further and fully absorb the heat released during battery thermal runaway within the second encapsulation structure, thereby improving the heat absorption effect of the heat absorption device.

[0026] In one possible implementation, the first pressure relief structure is disposed on the bottom surface of the first encapsulation structure in the height direction of the heat-absorbing device encapsulation structure; or...

[0027] Along the length of the heat absorption device encapsulation structure, the first pressure relief structure is disposed on the end face of the first encapsulation structure, and the first pressure relief structure is disposed near the bottom surface of the first encapsulation structure.

[0028] By placing the first pressure relief structure on the bottom surface of the first encapsulation structure, the first pressure relief structure can be positioned at the lowest point of the first encapsulation structure in the height direction. This increases the height at which the heat-absorbing material released into the second encapsulation structure rises from the first pressure relief structure to the second pressure relief structure, delays the time it takes for the heat-absorbing material to be released from the second pressure relief structure, facilitates the full absorption of heat by the heat-absorbing material, and improves the heat absorption effect of the heat-absorbing device.

[0029] Since multiple square batteries are typically arranged along their thickness, when a heat-absorbing device is located on one side of the battery, the heat-absorbing device and the adjacent battery are also typically arranged along the thickness direction of the battery (i.e., the thickness direction of the heat-absorbing device). Therefore, by positioning the first pressure-relief structure on the end face of the first packaging structure along its length, and close to the bottom surface of the first packaging structure, the end face of the heat-absorbing device along its length will not be affected by battery compression. By positioning the first pressure-relief structure on the end face of the first packaging structure along its length and close to the bottom surface of the first packaging structure, the problem of the first pressure-relief structure being compressed by the battery, which would hinder the release of heat-absorbing material into the cavity between the second and first packaging structures, can be avoided.

[0030] In one possible implementation, the second pressure relief structure is disposed on the top surface of the second encapsulation structure in the height direction of the heat-absorbing device encapsulation structure; or...

[0031] Along the length of the heat absorption device encapsulation structure, the second pressure relief structure is disposed on the end face of the second encapsulation structure, and the second pressure relief structure is disposed near the top surface of the second encapsulation structure.

[0032] In this way, by setting the second pressure relief structure on the top surface of the second encapsulation structure, the distance between the first pressure relief structure and the second pressure relief structure can be further increased in the height direction of the heat absorption device encapsulation structure. This further prolongs the time for the heat absorption material to flow from the first pressure relief structure to the second pressure relief structure and be released to the outside from the second pressure relief structure, thereby enabling the heat absorption material to fully absorb the heat released during battery thermal runaway.

[0033] In this way, by setting the second pressure relief structure on the end face of the second encapsulation structure and close to the top surface of the second encapsulation structure, it is possible to delay the time for the heat-absorbing material to flow from the first pressure relief structure to the second pressure relief structure, and also facilitate the release of the heat-absorbing material from the end face of the heat-absorbing device encapsulation structure. This avoids the problem that the heat-absorbing material is not conducive to the release of the second pressure relief structure due to the squeezing force between the heat-absorbing device encapsulation structure and the battery, and can reduce the impact of the released heat-absorbing material on the battery.

[0034] In one possible implementation, the first pressure relief structure is a first weak part, and the wall thickness of the first weak part is less than the wall thickness of the first encapsulation structure.

[0035] In this way, by making the first pressure relief structure the first weak part and making the wall thickness of the first weak part less than the wall thickness of the first encapsulation structure, the sealing pressure at the first pressure relief structure can be less than the sealing pressure at the first encapsulation structure, thereby making the first pressure relief structure easier to break than the first encapsulation structure, so that the heat-absorbing material can be released from the first pressure relief structure.

[0036] In one possible implementation, the second pressure relief structure is a second weak part, and the wall thickness of the second weak part is less than the wall thickness of the second encapsulation structure.

[0037] In this way, by making the second pressure relief structure the second weak part and making the wall thickness of the second weak part less than the wall thickness of the second encapsulation structure, the sealing pressure at the second pressure relief structure can be less than the sealing pressure of the second encapsulation structure. This makes the second pressure relief structure easier to break than the second encapsulation structure, so that the heat-absorbing material between the second encapsulation structure and the first encapsulation structure can be released from the second pressure relief structure.

[0038] In one possible implementation, a first groove is formed on the first packaging structure, and the portion of the first packaging structure corresponding to the bottom of the first groove serves as the first weak part.

[0039] In this way, by opening a first groove on the first packaging structure and making the part of the first packaging structure corresponding to the bottom of the first groove the first weak part, the manufacturing process of the first weak part can be simplified, thereby simplifying the manufacturing process of the first pressure relief structure, reducing the manufacturing cost of the first pressure relief structure, improving the manufacturing efficiency of the heat absorption device packaging structure and reducing the manufacturing cost of the heat absorption device packaging structure.

[0040] In one possible implementation, a second groove is formed on the second packaging structure, and the portion of the second packaging structure corresponding to the bottom of the second groove serves as the second weak part.

[0041] In this way, by opening a second groove on the second packaging structure and making the part of the second packaging structure corresponding to the bottom of the second groove the second weak part, the manufacturing process of the second weak part can be simplified, thereby simplifying the manufacturing process of the second pressure relief structure, reducing the manufacturing cost of the second pressure relief structure, improving the manufacturing efficiency of the heat absorption device packaging structure and reducing the manufacturing cost of the heat absorption device packaging structure.

[0042] In one possible implementation, the heat-absorbing material includes a phase change material.

[0043] In one possible implementation, the phase change material includes at least one of paraffin, hard fatty acids, hydrogels, alcohols, or hydrated salts of crystallization.

[0044] In one possible implementation, at least one of the first pressure relief structure and the second pressure relief structure is a pressure relief valve.

[0045] A second aspect of this application provides a heat-absorbing device, which includes the heat-absorbing device encapsulation structure as described above, wherein a heat-absorbing material is disposed within the first sealed cavity.

[0046] In this way, by using the above-mentioned heat absorption device encapsulation structure, the heat absorption material in the heat absorption device can absorb heat more fully, thereby improving the heat absorption effect of the heat absorption device.

[0047] A third aspect of this application provides a battery assembly including a battery and the aforementioned heat-absorbing device, wherein the heat-absorbing device is disposed on one side of the battery.

[0048] This application provides a battery assembly. By using the aforementioned heat-absorbing device, the battery assembly can effectively absorb the heat released by the battery during thermal runaway when the temperature rises due to thermal runaway near the heat-absorbing device. This reduces the probability of batteries that have not experienced thermal runaway being affected by high temperatures and improves the safety of the battery assembly.

[0049] A fourth aspect of this application provides an electrical device that includes a battery assembly as described above.

[0050] This application provides an electrical device that improves the safety of its use by using the aforementioned battery assembly. Attached Figure Description

[0051] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0052] Figure 1 This is a schematic diagram of the structure of a battery assembly provided in an embodiment of this application;

[0053] Figure 2 A cross-sectional view of a battery assembly provided in an embodiment of this application;

[0054] Figure 3 for Figure 1 A cross-sectional view of a heat-absorbing device at point AA;

[0055] Figure 4 for Figure 1 Another heat-absorbing device in the diagram is shown in the cross-sectional view at point AA.

[0056] Explanation of reference numerals in the attached figures:

[0057] 10 - Heat absorption device; 20 - Battery;

[0058] 11- Encapsulation structure of the heat absorption device;

[0059] 100 - First package structure;

[0060] 110 - First sealing cavity; 120 - First pressure relief structure; 130 - First end face; 140 - Second end face;

[0061] 150 - First groove;

[0062] 200 - Second package structure;

[0063] 210 - Second pressure relief structure; 220 - Receiving cavity; 230 - Third end face; 240 - Fourth end face;

[0064] 250 - Second groove; 260 - Second sealing cavity;

[0065] 300 - Heat-absorbing material. Detailed Implementation

[0066] As described in the background section, the phase change material in the heat absorption device encapsulation structure of the related technology cannot fully absorb the heat released by the thermally runaway battery, resulting in poor heat absorption effect of the heat absorption device.

[0067] The reason for this problem is that the heat-absorbing material in the relevant technology is sealed by an encapsulation layer. After absorbing heat and breaking through the encapsulation layer, the heat-absorbing material is directly released into the external environment. Because some of the heat-absorbing material that has fully absorbed heat is released when it breaks through the encapsulation layer, some of the material that has not fully absorbed heat is also released to the outside. This results in some of the heat-absorbing material in the heat-absorbing device not being able to fully absorb heat, leading to poor heat absorption. For example, phase change materials are a common type of heat-absorbing material. The phase change process of most phase change materials is "solid → liquid → gas". When a battery experiences thermal runaway and rapid temperature rise, the phase change material is partially solid, partially liquid, and partially gaseous. When the gas is released from the weak area, it will carry liquid material with it. This reduces the amount of material actually involved in heat absorption; that is, some phase change material does not undergo the liquid-to-gas endothermic reaction, greatly reducing the heat absorption effect of the heat-absorbing device.

[0068] To address the aforementioned technical problems, this application provides a heat-absorbing device encapsulation structure. This structure places heat-absorbing material within a first sealed cavity of the first encapsulation structure. After the heat-absorbing material absorbs heat, a first pressure relief structure is used to discharge all or part of the gas and / or liquid within the first sealed cavity when the pressure in the first sealed cavity exceeds a first set pressure. This achieves the function of directional pressure relief and discharge of the heat-absorbing material after heat absorption.

[0069] By setting up a second encapsulation structure, the heat-absorbing material can be released from the first pressure relief structure into the second encapsulation structure after absorbing heat from the battery. Compared to releasing the heat-absorbing material directly from the first pressure relief structure to the external environment, the portion of the released heat-absorbing material that has not fully absorbed heat can be fully absorbed within the space enclosed by the second encapsulation structure. This improves the heat absorption effect of the heat-absorbing material, enhances the heat absorption effect of the heat-absorbing device, and improves the temperature management capability when the battery experiences thermal runaway.

[0070] To make the above-mentioned objectives, features, and advantages of the embodiments of this application more apparent and understandable, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0071] refer to Figure 3 and Figure 4 This application provides a heat absorption device encapsulation structure 11, which may include a first encapsulation structure 100 and a second encapsulation structure 200. The first encapsulation structure 100 has a first sealing cavity 110, and the first sealing cavity 110 is adapted to contain a heat absorption material.

[0072] In some embodiments, the heat-absorbing material 300 can be a phase change material. If the phase change material is solid when it has not absorbed heat, it can become liquid and then further gaseous after absorbing heat, thereby absorbing the heat released by the battery 20 through phase change. This is especially effective when the battery 20 experiences thermal runaway, allowing it to absorb a large amount of heat released by the battery 20 in a timely manner. For example, when the heat-absorbing material 300 is a phase change material, when the battery 20 experiences thermal runaway and a rapid temperature rise, the heat-absorbing material 300 absorbs some or all of the heat and undergoes a phase change to liquid and gaseous states. When the gas is released from the weak area, it carries the liquid material and sprays it from the first sealing cavity 110 of the first encapsulation structure 100 to the space between the first encapsulation structure 100 and the second encapsulation structure 200. The liquid material also has a certain heat absorption capacity and can continue to absorb heat between the first encapsulation structure 100 and the second encapsulation structure 200, improving the heat absorption effect of the heat-absorbing device 10.

[0073] In some examples, the phase change material can also be at least one of paraffin wax, hard fatty acids, alcohols, and hydrated salts of crystallization. The phase change material can be a mixture of paraffin wax, hard fatty acids, alcohols, and hydrated salts of crystallization. Alternatively, the phase change material can also include functional materials such as glass fibers, resins, or graphite. Adding glass fiber to the above mixture can improve the strength of paraffin wax absorption. Adding resin to the mixture can help improve the molding of hydrated salts of crystallization. Adding graphite to the mixture can improve thermal conductivity.

[0074] In one embodiment of the present invention, the heat-absorbing material 300 is a solid or liquid phase change material, such as paraffin, water, ethanol, isopropanol, n-heptane, inorganic salt solution, etc. In another embodiment of the present invention, the heat-absorbing material 300 is at least one of hydrogel, hydrated salt, and colloid. For example, the heat-absorbing material 300 includes one or more of polyacrylamide hydrogel, sodium polyacrylate hydrogel, polyvinyl alcohol hydrogel, poly(N-isopropylacrylamide) hydrogel, calcium chloride hexahydrate, sodium sulfate decahydrate, potassium nitrate trihydrate, silica sol, and gelatin colloid. Because the above materials include a matrix and a phase change material, the matrix is ​​used to bind the phase change material, which has already formed a solid or gel state. The phase change material is one or more of water, ethanol, isopropanol, n-heptane, inorganic salt solution, etc.

[0075] The first encapsulation structure 100 has a first sealing cavity 110, and the first sealing cavity 110 is provided with heat-absorbing material 300.

[0076] The first pressure relief structure 120 is disposed in the first encapsulation structure 100. The first pressure relief structure 120 is used to discharge all or part of the gas and / or liquid in the first sealing cavity 110 when the pressure in the first sealing cavity 110 is greater than the first set pressure. The sealing pressure of the first pressure relief structure 120 is less than the sealing pressure of the first encapsulation structure 100.

[0077] In some embodiments, the value of the first set pressure can be any point within the range of greater than or equal to 0.1 MPa and less than or equal to 0.5 MPa.

[0078] It should be noted that the sealing pressure in this application can be understood as the pressure at which the first encapsulation structure 100 ruptures when its internal pressure reaches a certain threshold. For example, the sealing pressure of the first encapsulation structure 100 can be understood as the pressure inside the first sealing cavity 110 when the heat-absorbing material 300 absorbs heat, undergoes a phase change, and breaks through the first encapsulation structure 100. The sealing pressure of the first pressure relief structure 120 can be understood as the pressure inside the first sealing cavity 110 when the heat-absorbing material 300 absorbs heat, undergoes a phase change, and breaks through the first pressure relief structure 120. The sealing pressure of the second encapsulation structure 200 can be understood as the pressure inside the second encapsulation structure 200 when the heat-absorbing material 300 undergoes a phase change and breaks through the second pressure relief structure 210.

[0079] In some embodiments, a pressure detection device can be used to detect the pressure in the first sealing cavity 110 or the pressure in the second encapsulation structure 200. For example, the sealing pressure of the first encapsulation structure 100 can be provided by a first encapsulation structure 100 without the first pressure relief structure 120, which is the same as the first encapsulation structure 100 with the first pressure relief structure 120 except that it does not have the first pressure relief structure 120.

[0080] The sealing pressure of the first encapsulation structure 100 is obtained by simulating the heat absorption phase change process of the heat-absorbing material 300 and by using a gas pressure detection device to detect the sealing pressure of the first encapsulation structure 100 without the first pressure relief structure 120, and recording the pressure of the first sealing cavity 110 when the first encapsulation structure 100 is ruptured.

[0081] This application provides a heat absorption device 10. The heat absorption device 10 dissipates heat-absorbing material 300 in a first sealed cavity 110 of a first encapsulation structure 100 by placing heat-absorbing material 300 inside the first sealed cavity 110 of the first encapsulation structure 100, and allows the heat-absorbing material 300 to be discharged through a first pressure relief structure 120 after absorbing heat.

[0082] Since the sealing pressure of the first pressure relief structure 120 is less than the sealing pressure of the first encapsulation structure 100, when the pressure in the first sealing cavity 110 increases as the gas generated by the phase change material absorbs heat, the first pressure relief structure 120 will break or rupture before the first encapsulation structure 100. This allows the heat-absorbing material 300 to be released directionally from the first pressure relief structure 120 to the external environment, avoiding problems such as bulging and deformation of the first encapsulation structure 100, and preventing the heat-absorbing device 10 from exploding and rupturing, thus improving the safety of the heat-absorbing device 10.

[0083] In some embodiments, the material of the first encapsulation structure 100 can be a thermally conductive material, thereby facilitating the transfer of heat released during thermal runaway of the battery 20 to the heat-absorbing material 300 within the first encapsulation structure 100. In one possible implementation, the thermally conductive material can be a metallic material.

[0084] The first pressure relief structure 120 can be a pressure relief valve disposed on the first encapsulation structure 100. The sealing pressure of the pressure relief valve is lower than that of the first encapsulation structure 100, so as to release the heat-absorbing material 300 inside the first encapsulation structure 100 at the pressure relief valve.

[0085] Alternatively, the first pressure relief structure 120 may be a relatively weak area on the first encapsulation structure 100, the sealing pressure of which is lower than that of other areas on the first encapsulation structure 100, thereby enabling the heat-absorbing material 300 to be released to the outside from the weak area.

[0086] In some embodiments, the sealing pressure of the first encapsulation structure 100 can be greater than or equal to 0.3 MPa and less than or equal to 3 MPa. For example, the sealing pressure of the first encapsulation structure 100 can be one of 0.4 MPa, 0.6 MPa, 1 MPa, 1.7 MPa, 2.2 MPa, and 2.7 MPa. Alternatively, the sealing pressure of the first encapsulation structure 100 can be any value within the range of greater than or equal to 0.3 MPa and less than or equal to 3 MPa.

[0087] If the sealing pressure of the first encapsulation structure 100 is less than 0.3 MPa, the first encapsulation structure 100 will be easily broken by the heat-absorbing material 300, causing the heat-absorbing material 300 to break through the first encapsulation structure 100 with less heat absorption, thus reducing the heat absorption effect of the heat-absorbing device 10.

[0088] refer to Figure 3 and Figure 4 The second encapsulation structure 200 can at least cover the outside of the first pressure relief structure 120, and the sealing pressure of the second encapsulation structure 200 is greater than the sealing pressure of the first encapsulation structure 100. In some embodiments, the second encapsulation structure 200 and the first encapsulation structure 100 can be made of different materials, thereby enabling the sealing pressure of the second encapsulation structure 200 to be greater than the sealing pressure of the first encapsulation structure 100.

[0089] In some embodiments, the second encapsulation structure 200 can cover the outside of the first pressure relief structure 120, or the second encapsulation structure 200 can cover the outside of both the first encapsulation structure 100 and the first pressure relief structure 120.

[0090] It is understood that one side of the first sealing cavity 110 is the inner side of the first encapsulation structure 100 and the first pressure relief structure 120, and the side away from the first sealing cavity 110 is the outer side of the first encapsulation structure 100 and the first pressure relief structure 120.

[0091] In this way, by covering the outside of the first encapsulation structure 100 and the first pressure relief structure 120 with a second encapsulation structure 200, and making the sealing pressure of the second encapsulation structure 200 greater than that of the first encapsulation structure 100, the heat-absorbing material 300 can be released from the first pressure relief structure 120 of the first encapsulation structure 100 into the second encapsulation structure 200 after absorbing heat from the battery 20. Compared with releasing the heat-absorbing material 300 directly from the first pressure relief structure 120 to the external environment, the part of the released heat-absorbing material 300 that has not fully absorbed heat can be fully absorbed within the space enclosed by the second encapsulation structure 200, which can improve the heat absorption effect of the heat-absorbing material 300 and improve the temperature management capability when the battery 20 experiences thermal runaway.

[0092] It is understood that, in the embodiments of this application, the second packaging structure 200 covering the outside of the first packaging structure 100 can mean that the second packaging structure 200 completely covers the outer surface of the first packaging structure 100, or it can mean that the second packaging structure 200 covers the outer surface of the first packaging structure 100 around the first pressure relief structure 120. For example Figure 3 As shown, the first pressure relief structure 120 is located at the lower left corner of the first encapsulation structure 100. The second encapsulation structure 200 can seal and wrap the left outer surface and the bottom outer surface of the first encapsulation structure 100, which can also ensure that the heat-absorbing material leaking from the first pressure relief structure 120 is located between the second encapsulation structure 200 and the first encapsulation structure 100.

[0093] In this embodiment, the following description is specifically based on the example of the second packaging structure 200 completely enclosing the outer surface of the first packaging structure 100.

[0094] refer to Figure 3 and Figure 4 In some embodiments, the heat absorption device encapsulation structure 11 may further include a second pressure relief structure 210. The second pressure relief structure 210 is disposed in the second encapsulation structure 200. A second sealing cavity 260 is formed between the first encapsulation structure 100 and the second encapsulation structure 200. The second pressure relief structure 210 is used to discharge the gas and / or liquid in the second sealing cavity 260 when the pressure in the second sealing cavity 260 is greater than the second set pressure. The sealing pressure of the second pressure relief structure 210 is less than the sealing pressure of the second encapsulation structure 200.

[0095] In some embodiments, the value of the second set pressure can be any point within the range of greater than or equal to 0.5 MPa and less than or equal to 2 MPa.

[0096] In some embodiments, the second pressure relief structure 210 may also be a pressure relief valve, which can release the heat-absorbing material 300 between the second encapsulation structure 200 and the first encapsulation structure 100 to the outside of the heat-absorbing device 10 through the pressure relief valve.

[0097] Alternatively, the second pressure relief structure 210 may be a relatively weak area on the second encapsulation structure 200, where the sealing pressure is lower than that of other areas on the second encapsulation structure 200, thereby enabling the heat-absorbing material 300 to be released to the outside from the weak area.

[0098] In this way, by providing a second pressure relief structure 210 on the second encapsulation structure 200, the second pressure relief structure 210 is used to discharge the gas and / or liquid in the second sealing cavity 260 when the pressure in the second sealing cavity 260 is greater than the second set pressure, and to make the sealing pressure of the second pressure relief structure 210 less than the sealing pressure of the second encapsulation structure 200, so that the heat-absorbing material 300 released from the first pressure relief structure 120 can be directionally released and directionally depressurized by the second pressure relief structure 210, avoiding the second encapsulation structure 200 from being ruptured, or avoiding the heat-absorbing device encapsulation structure 11 from bulging and deforming, which would lead to deformation and bulging of the battery 20 and battery assembly.

[0099] In some embodiments, the sealing pressure of the first encapsulation structure 100 is greater than the sealing pressure of the second pressure relief structure 210, and the sealing pressure of the first pressure relief structure 120 is less than the sealing pressure of the second pressure relief structure 210.

[0100] In this way, by making the sealing pressure of the first encapsulation structure 100 greater than the sealing pressure of the second pressure relief structure 210, and the sealing pressure of the first pressure relief structure 120 less than the sealing pressure of the second pressure relief structure 210, the heat-absorbing material 300 can absorb heat. When the pressure inside the first sealing cavity 110 exceeds the sealing pressure of the first pressure relief structure 120, the heat-absorbing material 300 will break through the first pressure relief structure 120 and enter the second sealing cavity 260. As the heat-absorbing material 300 continues to absorb heat, the generated gas accumulates in the cavity. When the pressure exceeds the sealing pressure of the second pressure relief structure 210, the heat-absorbing material 300 breaks through the second pressure relief structure 210 and is released. Thus, before the first encapsulation structure 100 ruptures, the heat-absorbing material inside the second encapsulation structure 200 can be directionally leaked to the outside through the second pressure relief structure 210, achieving stepwise directional pressure relief of the first pressure relief structure 120 and the second pressure relief structure 210.

[0101] In some embodiments, the first pressure relief structure 120 and the second pressure relief structure 210 are staggered. (See reference...) Figure 3 and Figure 4 In some embodiments, in the height direction of the heat absorption device encapsulation structure 11 (e.g.) Figure 3 As indicated by arrow Y in the diagram, the position of the first pressure relief structure 120 is lower than the position of the second pressure relief structure 210.

[0102] It is understandable that the height direction of the heat absorption device encapsulation structure 11 can also be the height direction of the heat absorption device 10.

[0103] In this way, by positioning the first pressure relief structure 120 lower than the second pressure relief structure 210 in the height direction of the heat absorption device encapsulation structure 11, the gas released from the first pressure relief structure 120 can rise upwards along the height direction of the heat absorption device encapsulation structure 11 within the sealed cavity of the second encapsulation structure 200 until it is released again from the second pressure relief structure 210 to the outside of the heat absorption device encapsulation structure 11. The liquid or solid remains between the first encapsulation structure 100 and the second encapsulation structure 200, and further vaporizes under the action of temperature, absorbing more heat, thus playing a role in gas-liquid or gas-solid separation. This can delay the process of releasing the insufficiently heat-absorbing liquid or solid heat-absorbing material 300 to the external environment, allowing the heat-absorbing material 300 to further fully absorb the heat released when the battery 20 experiences thermal runaway within the second encapsulation structure 200, thereby improving the heat absorption effect of the heat absorption device 10.

[0104] refer to Figure 4 In some embodiments, in the height direction of the heat absorption device encapsulation structure 11 (e.g.) Figure 4 As indicated by arrow Y in the diagram, the first pressure relief structure 120 is disposed on the bottom surface of the first encapsulation structure 100. The first pressure relief structure 120 can be disposed at any position on the bottom surface of the first encapsulation structure 100.

[0105] In this way, by placing the first pressure relief structure 120 on the bottom surface of the first encapsulation structure 100, the first pressure relief structure 120 can be located at the lowest point of the first encapsulation structure 100 in the height direction. This can further improve the gas-liquid or gas-solid separation effect in the material discharged by the first pressure relief structure 120, delay the process of releasing the liquid or solid heat-absorbing material 300 that has not absorbed enough heat into the external environment, and improve the heat absorption effect of the heat-absorbing device 10.

[0106] refer to Figure 3 In other embodiments, along the length direction of the heat-absorbing device encapsulation structure 11 (e.g.) Figure 4 As shown by arrow X in the diagram, the first pressure relief structure 120 is disposed on the end face of the first packaging structure 100, and the first pressure relief structure 120 is disposed close to the bottom surface of the first packaging structure 100. The first pressure relief structure 120 can be disposed on any side wall of the first packaging structure 100 near the bottom surface.

[0107] It is understandable that the first pressure relief structure 120 being closer to the bottom surface of the first packaging structure 100 means that the first pressure relief structure 120 is closer to the bottom surface of the first packaging structure 100 than the top surface of the first packaging structure 100, and the distance between the first pressure relief structure 120 and the bottom surface of the first packaging structure 100 is less than the distance between the first pressure relief structure 120 and the top surface of the first packaging structure 100.

[0108] For example, the first pressure relief structure 120 can be set in Figure 3 The junction of the left and / or right end face and the bottom face of the first packaging structure 100.

[0109] Thus, in the thickness direction of the heat absorption device encapsulation structure 11, wherein the thickness direction is... Figure 3 The direction of the vertical screen, or the thickness direction of the heat absorption device packaging structure 11, can be... Figure 1 In the Z direction. Since the heat-absorbing device encapsulation structure 11 is sandwiched between the two batteries 20, the end face of the heat-absorbing device encapsulation structure 11 in the length direction is not affected by the compression of the batteries 20. By setting the first pressure relief structure 120 on the end face of the first encapsulation structure 100 along the length direction of the heat-absorbing device encapsulation structure 11 and close to the bottom surface of the first encapsulation structure 100, the problem of the first pressure relief structure 120 being squeezed by the batteries 20, which is not conducive to the release of the heat-absorbing material 300 into the second sealing cavity 260 between the second encapsulation structure 200 and the first encapsulation structure 100, can be avoided.

[0110] refer to Figure 3 and Figure 4 In some embodiments, in the height direction of the heat absorption device encapsulation structure 11 (e.g.) Figure 3 As indicated by arrow Y in the diagram, the second pressure relief structure 210 is disposed on the top surface of the second packaging structure 200. The second pressure relief structure 210 can be disposed at any position on the top surface of the second packaging structure 200.

[0111] In this way, by setting the second pressure relief structure 210 on the top surface of the second encapsulation structure 200, the distance between the first pressure relief structure 120 and the second pressure relief structure 210 can be further increased in the height direction of the heat absorption device encapsulation structure 11, thereby further improving the gas-liquid or gas-solid separation effect in the substance discharged by the first pressure relief structure 120, delaying the release of the insufficiently heat-absorbing liquid or solid heat-absorbing material 300 into the external environment, and improving the heat absorption effect of the heat absorption device 10.

[0112] In some embodiments, the first pressure relief structure 120 is disposed on the bottom surface of the first packaging structure 100, and the second pressure relief structure 210 is disposed on the top surface of the second packaging structure 200. Alternatively, the first pressure relief structure 120 is disposed on the end face of the first packaging structure 100 and close to the bottom surface of the first packaging structure 100, and the second pressure relief structure 210 is disposed on the top surface of the second packaging structure 200.

[0113] refer to Figure 3 and Figure 4 In some embodiments, in the height direction of the heat absorption device encapsulation structure 11, the second pressure relief structure 210 is disposed on the end face of the second encapsulation structure 200, and the second pressure relief structure 210 is disposed close to the top surface of the second encapsulation structure 200.

[0114] For example, the second pressure relief structure 210 can be set in Figure 3 The junction of the left and / or right end face and the top face of the second packaging structure 200.

[0115] It is understandable that the second pressure relief structure 210 being closer to the top surface of the second packaging structure 200 means that the second pressure relief structure 210 is closer to the top surface of the second packaging structure 200 than the bottom surface of the second packaging structure 200, and the distance between the second pressure relief structure 210 and the top surface of the second packaging structure 200 is less than the distance between the second pressure relief structure 210 and the bottom surface of the second packaging structure 200.

[0116] In this way, by setting the second pressure relief structure 210 on the end face of the second encapsulation structure 200 and close to the top surface of the second encapsulation structure 200, it is possible to delay the flow time of the non-gaseous heat-absorbing material 300 from the first pressure relief structure 120 to the second pressure relief structure 210, and also facilitate the release of the heat-absorbing material 300 from the end face of the heat-absorbing device encapsulation structure 11. This avoids the problem that the heat-absorbing material 300 is not conducive to the release of the second pressure relief structure 210 due to the squeezing force between the heat-absorbing device encapsulation structure 11 and the battery 20, and can reduce the impact of the released heat-absorbing material 300 on the battery 20.

[0117] In some embodiments, the first pressure relief structure 120 is disposed on the bottom surface of the first packaging structure 100, and the second pressure relief structure 210 is disposed on the end face of the second packaging structure 200 and close to the top surface of the second packaging structure 200. Alternatively, the first pressure relief structure 120 is disposed on the end face of the first packaging structure 100 and close to the bottom surface of the first packaging structure 100, and the second pressure relief structure 210 is disposed on the end face of the second packaging structure 200 and close to the top surface of the second packaging structure 200.

[0118] refer to Figure 3 and Figure 4In some embodiments, in the horizontal direction perpendicular to the height of the heat-absorbing device encapsulation structure 11 (e.g.) Figure 3 As indicated by arrow X in the diagram, the horizontal direction is the length direction of the heat absorption device encapsulation structure 11. The first encapsulation structure 100 has opposing first end faces 130 and second end faces 140, and the second encapsulation structure 200 may have opposing third end faces 230 and fourth end faces 240. The first end faces 130 and third end faces 230 are close to each other, and the second end faces 140 and fourth end faces 240 are close to each other.

[0119] If the first pressure relief structure 120 is disposed on the first end face 130 and close to the bottom surface of the first encapsulation structure 100, then the second pressure relief structure 210 can be disposed on the third end face 230 and close to the top surface of the second encapsulation structure 200. This increases the distance the heat-absorbing material 300 travels from the first pressure relief structure 120 to the second pressure relief structure 210, facilitating gas-liquid or gas-solid separation in the material discharged from the first pressure relief structure 120, delaying the release of insufficiently heat-absorbing liquid or solid heat-absorbing material 300 into the external environment, and enabling the heat-absorbing material 300 within the second encapsulation structure 200 to absorb heat more fully.

[0120] refer to Figure 3 and Figure 4 In some embodiments, a receiving cavity 220 is formed in the second packaging structure 200, the volume of which is larger than that of the first packaging structure 100, so that a flow channel is formed between the inner surface of the second packaging structure 200 and the outer surface of the first packaging structure 100, the flow channel being used to connect the first pressure relief structure 120 and the second pressure relief structure 210.

[0121] In some embodiments, the flow channel can be formed through the gap between the second encapsulation structure 200 and the first encapsulation structure 100, so that the first pressure relief structure 120 can be connected to the second pressure relief structure 210 through the gap.

[0122] refer to Figure 3 and Figure 4 In one possible implementation, the first pressure relief structure 120 is a first weak point, and the wall thickness of the first weak point (e.g.) Figure 4 The thickness of the first packaging structure 100 is less than that shown in h1.

[0123] In this way, by making the first pressure relief structure 120 the first weak part and making the wall thickness of the first weak part less than the wall thickness of the first encapsulation structure 100, the sealing pressure at the first pressure relief structure 120 can be less than the sealing pressure at the first encapsulation structure 100, thereby making the first pressure relief structure 120 easier to break through compared to the first encapsulation structure 100, so that the heat-absorbing material 300 can be released from the first pressure relief structure 120.

[0124] In other embodiments, the second pressure relief structure 210 is a second weak point, and the wall thickness of the second weak point (e.g.) Figure 4 The wall thickness of the second packaging structure 200 is less than that shown in h2.

[0125] By making the second pressure relief structure 210 a second weak part and making the wall thickness of the second weak part less than the wall thickness of the second encapsulation structure 200, the sealing pressure at the second pressure relief structure 210 can be less than the sealing pressure of the second encapsulation structure 200. This makes the second pressure relief structure 210 easier to break than the second encapsulation structure 200, so that the heat-absorbing material 300 released between the second encapsulation structure 200 and the first encapsulation structure 100 can be released from the second pressure relief structure 210.

[0126] refer to Figure 3 In some embodiments, a first groove 150 is provided on the first packaging structure 100, and the part of the first packaging structure 100 corresponding to the bottom of the first groove 150 is used as a first weak part.

[0127] In this way, by opening a first groove 150 on the first packaging structure 100 and making the part of the first packaging structure 100 corresponding to the bottom of the first groove 150 the first weak part, the manufacturing process of the first weak part can be simplified, thereby simplifying the manufacturing process of the first pressure relief structure 120, reducing the manufacturing cost of the first pressure relief structure 120, improving the manufacturing efficiency of the heat absorption device packaging structure 11, and reducing the manufacturing cost of the heat absorption device packaging structure 11.

[0128] refer to Figure 3 and Figure 4 In some embodiments, the opening of the first groove 150 can face the inner wall of the second encapsulation structure 200, thereby providing a certain deformation space when the bottom of the first groove 150 is deformed and broken, which is conducive to the heat-absorbing material 300 being released from the opening of the first groove 150 into the second encapsulation structure 200.

[0129] refer to Figure 3 and Figure 4 In some embodiments, a second groove 250 is formed on the second packaging structure 200, and the portion of the second packaging structure 200 corresponding to the bottom of the second groove 250 serves as a second weak point. In some examples, the opening of the second groove 250 can face the outside of the second packaging structure 200.

[0130] In this way, by opening a second groove 250 on the second packaging structure 200 and making the part of the second packaging structure 200 corresponding to the bottom of the second groove 250 the second weak part, the manufacturing process of the second weak part can be simplified, thereby simplifying the manufacturing process of the second pressure relief structure 210, reducing the manufacturing cost of the second pressure relief structure 210, improving the manufacturing efficiency of the heat absorption device packaging structure 11, and reducing the manufacturing cost of the heat absorption device packaging structure 11.

[0131] refer to Figure 1 and Figure 2 This application embodiment also provides a battery assembly, which includes a battery 20 and the heat absorption device 10 described above. The heat absorption device 10 is disposed on one side of the battery 20, which can mean that the heat absorption device 10 is disposed on any side of the battery 20.

[0132] The battery assembly may include at least two batteries 20 and at least one heat-absorbing device 10, which is the heat-absorbing device 10 as described above. The heat-absorbing device 10 and the batteries 20 on both sides are arranged along the thickness direction of the battery 20. It is understood that the thickness of the battery 20 is less than the width of the battery 20, and the width of the battery 20 is less than the length of the battery 20.

[0133] This application provides a battery assembly. By providing a heat absorption device 10 between two adjacent batteries 20, the battery assembly can effectively absorb the heat released by the battery 20 during thermal runaway when the temperature rises due to thermal runaway. This reduces the probability of the battery 20 that has not experienced thermal runaway being affected by high temperature, avoids heat diffusion within the overall battery assembly, and improves the safety of the battery assembly.

[0134] In some embodiments, the battery assembly may be a battery pack or a battery module, etc.

[0135] This application embodiment also provides an electrical device, which may include an electrical device and a battery assembly as described above, the battery assembly being used to supply power to the electrical device.

[0136] This application provides an electrical device that improves the safety of its use by using the aforementioned battery assembly.

[0137] In some embodiments, the electrical equipment can be a vehicle or an energy storage device, and the vehicle can be a pure electric vehicle, a hybrid electric vehicle, a range-extended electric vehicle, or a plug-in hybrid electric vehicle.

[0138] The various embodiments or implementation methods described in this specification are presented in a progressive manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the embodiments can be referred to each other.

[0139] It should be noted that phrases such as "in specific implementations," "in some embodiments," "in this embodiment," and "exemplarily" in the specification indicate that the described embodiments may include specific features, structures, or characteristics, but not every embodiment necessarily includes that specific feature, structure, or characteristic. Furthermore, such phrases do not necessarily refer to the same embodiment. Moreover, when a specific feature, structure, or characteristic is described in connection with an embodiment, implementing such a feature, structure, or characteristic in conjunction with other embodiments, whether explicitly described or not, is within the knowledge scope of those skilled in the art.

[0140] Generally speaking, terms should be understood at least in part by their use in context. For example, at least in part by context, the term "one or more" as used in the text can be used to describe any feature, structure, or characteristic of the singular meaning, or a combination of features, structures, or characteristics of the plural meaning. Similarly, at least in part by context, terms such as "a" or "the" can also be understood to convey either singular or plural usage.

[0141] It should be readily understood that the terms “on,” “above,” and “on top of” in this disclosure should be interpreted in the broadest possible sense, such that “on” means not only “directly on something” but also “on something” with an intermediate feature or layer therebetween, and that “above” or “on top of” means not only “on top of something” but also “on top of something” without an intermediate feature or layer therebetween (i.e., directly on something).

[0142] Furthermore, for ease of explanation, spatially relative terms such as "below," "below," "under," "above," and "above" may be used to describe the relationship of one element or feature relative to other elements or features as shown in the figures. Spatially relative terms are intended to encompass different orientations of the device in use or operation other than those shown in the figures. The device may have other orientations (rotated 90 degrees or in other orientations), and the spatially relative descriptive terms used herein may be interpreted accordingly.

[0143] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A heat-absorbing device packaging structure, characterized in that, include: The first encapsulation structure has a first sealed cavity, and the first sealed cavity is suitable for disposing of a heat-absorbing material. A first pressure relief structure is disposed in the first encapsulation structure. The first pressure relief structure is used to discharge gas and / or liquid in the first sealing cavity when the pressure in the first sealing cavity is greater than the first set pressure. The second encapsulation structure covers at least the outside of the first pressure relief structure.

2. The heat absorption device packaging structure according to claim 1, characterized in that, The second packaging structure covers the outside of the first packaging structure and the first pressure relief structure.

3. The heat absorption device packaging structure according to claim 1, characterized in that, The sealing pressure of the first pressure relief structure is less than the sealing pressure of the first encapsulation structure, and the sealing pressure of the second encapsulation structure is greater than the sealing pressure of the first encapsulation structure.

4. The heat absorption device packaging structure according to claim 2, characterized in that, The heat absorption device encapsulation structure further includes a second pressure relief structure, which is disposed in the second encapsulation structure; A second sealing cavity is formed between the first packaging structure and the second packaging structure. The second pressure relief structure is used to discharge the gas and / or liquid in the second sealing cavity when the pressure in the second sealing cavity is greater than the second set pressure.

5. The heat absorption device packaging structure according to claim 4, characterized in that, The sealing pressure of the second pressure relief structure is less than the sealing pressure of the second encapsulation structure.

6. The heat absorption device packaging structure according to claim 5, characterized in that, The sealing pressure of the first encapsulation structure is greater than the sealing pressure of the second pressure relief structure; the sealing pressure of the first pressure relief structure is less than the sealing pressure of the second pressure relief structure.

7. The heat absorption device packaging structure according to claim 4, characterized in that, In the height direction of the heat absorption device encapsulation structure, the position of the first pressure relief structure is lower than the position of the second pressure relief structure.

8. The heat absorption device packaging structure according to claim 7, characterized in that, In the height direction of the heat absorption device encapsulation structure, the first pressure relief structure is disposed on the bottom surface of the first encapsulation structure; or, Along the length of the heat absorption device encapsulation structure, the first pressure relief structure is disposed on the end face of the first encapsulation structure, and the first pressure relief structure is disposed near the bottom surface of the first encapsulation structure.

9. The heat absorption device packaging structure according to claim 7, characterized in that, In the height direction of the heat absorption device encapsulation structure, the second pressure relief structure is disposed on the top surface of the second encapsulation structure; or Along the length of the heat absorption device encapsulation structure, the second pressure relief structure is disposed on the end face of the second encapsulation structure, and the second pressure relief structure is disposed near the top surface of the second encapsulation structure.

10. The heat-absorbing device packaging structure according to any one of claims 4-9, characterized in that, The first pressure relief structure is a first weak point, and the wall thickness of the first weak point is less than the wall thickness of the first encapsulation structure; and / or, The second pressure relief structure is the second weak part, and the wall thickness of the second weak part is less than the wall thickness of the second encapsulation structure.

11. The heat absorption device packaging structure according to claim 10, characterized in that, The first packaging structure has a first groove, and the portion of the first packaging structure corresponding to the bottom of the first groove serves as the first weak point; and / or, The second packaging structure has a second groove, and the part of the second packaging structure corresponding to the bottom of the second groove serves as the second weak part.

12. The heat-absorbing device packaging structure according to any one of claims 1-9, characterized in that, The heat-absorbing material includes a phase change material.

13. The heat absorption device packaging structure according to claim 12, characterized in that, The phase change material includes paraffin, hard fatty acids, hydrogels, alcohols, or hydrated salts.

14. The heat-absorbing device packaging structure according to any one of claims 4-9, characterized in that, At least one of the first pressure relief structure and the second pressure relief structure is a pressure relief valve.

15. A heat-absorbing device, characterized in that, The heat-absorbing device encapsulation structure includes any one of claims 1-14, wherein the first sealed cavity is provided with heat-absorbing material.

16. A battery assembly, characterized in that, It includes a battery and the heat-absorbing device as described in claim 15, wherein the heat-absorbing device is disposed on one side of the battery.

17. An electrical appliance, characterized in that, Includes the battery assembly as described in claim 16.

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