Electronic device

Abstract

The utility model discloses an electronic device, and belongs to the technical field of electronic devices. The electronic equipment comprises a main body and a microphone, the microphone comprises a shell assembly, the bottom wall of the shell assembly is connected to the main body, and a containing cavity is defined by the shell assembly; the main body is provided with a sound inlet, the electronic equipment is provided with a first channel, the first channel penetrates through the bottom wall of the shell assembly and at least part of the main body, and the first channel is communicated with the sound inlet; the piezoelectric assembly is arranged in the containing cavity and corresponds to the first channel. And the processing module is arranged in the accommodating cavity, and the processing module is electrically connected to the piezoelectric assembly.

Description

Technical Field

[0001] This utility model relates to the field of electronic equipment technology, and specifically to an electronic device. Background Technology

[0002] With the continuous development of electronic devices and the increasingly complex application scenarios, the waterproofness of electronic devices is receiving more and more attention from users. Electronic devices include microphones, which have sound inlet channels. Electronic devices also have sound inlets, which are connected to the outside of the device, and the sound inlet channels are connected to the sound inlets.

[0003] In related technologies, a waterproof and breathable membrane is installed inside the sound inlet channel to prevent liquid water from seeping into the microphone, thereby achieving the microphone's waterproofing.

[0004] However, while waterproof and breathable membranes can prevent water from entering the environment, they can also hinder sound transmission in water, causing microphone sound distortion and affecting the user experience. Utility Model Content

[0005] This utility model discloses an electronic device to solve, or at least partially solve, the problem of microphone sound distortion that affects the user experience in related technologies.

[0006] To solve the above-mentioned technical problems, this utility model is implemented as follows:

[0007] This utility model discloses an electronic device, which includes a main unit and a microphone. The microphone includes a housing assembly, the bottom wall of which is connected to the main unit, and the housing assembly encloses a receiving cavity. The main unit has a sound inlet, and the electronic device is provided with a first channel that penetrates the bottom wall of the housing assembly and at least part of the main unit, and the first channel is connected to the sound inlet. A piezoelectric component is disposed in the receiving cavity and is correspondingly disposed with respect to the first channel. A processing module is disposed in the receiving cavity and is electrically connected to the piezoelectric component.

[0008] The electronic device disclosed in this utility model has a processing module electrically connected to a piezoelectric component. The processing module can control the piezoelectric component to pick up sound based on the voltage value output by the piezoelectric component. In other words, in specific application scenarios, the processing module can control the piezoelectric component to pick up sound based on the voltage value output by the piezoelectric component, thereby improving the microphone's sensitivity and ensuring the clarity and accuracy of sound pickup in specific application scenarios, thus enhancing the user experience. Attached Figure Description

[0009] Figure 1 This is a schematic diagram showing the structure of the electronic device described in the embodiments of this utility model;

[0010] Figure 2This is a simplified equivalent circuit diagram of the microphone described in an embodiment of the present invention.

[0011] Figure label:

[0012] 10: Housing assembly; 11: Receiving cavity; 12: Housing; 13: Base plate;

[0013] 14: Main channel; 141: Sound inlet; 142: Second channel; 143: First channel; 144: Third channel;

[0014] 21: MEMS membrane; 22: First membrane;

[0015] 30: Piezoelectric component; 31: Waterproof component; 32: Piezoelectric module;

[0016] 40: Processing module; 41: Voltage comparator; 42: Switching device; 43: Amplifier.

[0017] 50: First conductive element; 51: Second conductive element. Detailed Implementation

[0018] Embodiments of the present invention will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention. All other embodiments obtained by those skilled in the art based on the embodiments in this application without inventive effort are within the scope of protection of this application.

[0019] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this invention, unless otherwise stated, "a plurality of" means two or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0020] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0021] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0022] Reference Figure 1 The diagram shows a structural schematic of the electronic device disclosed in an embodiment of the present invention; refer to Figure 2 The diagram shows a simplified equivalent circuit diagram of the microphone disclosed in an embodiment of the present invention.

[0023] like Figure 1 As shown in the figure, this utility model embodiment discloses an electronic device, which includes a main body 14 and a microphone. The microphone includes a housing assembly 10, the bottom wall of which is connected to the main body 14, and the housing assembly 10 encloses a receiving cavity 11. The main body 14 has a sound inlet 141. The electronic device is provided with a first channel 143, which penetrates the bottom wall of the housing assembly 10 and at least part of the main body 14, and is connected to the sound inlet 141. A piezoelectric component 30 is disposed in the receiving cavity 11 and is correspondingly disposed to the first channel 143. A processing module 40 is disposed in the receiving cavity 11 and is electrically connected to the piezoelectric component 30.

[0024] This utility model discloses an electronic device, including but not limited to mobile phones, watches, tablet computers, and desktop computers. The following description will use a mobile phone as an example to illustrate the electronic device disclosed in this utility model.

[0025] The electronic device includes a main support 14, which serves as a support for the electronic device and can fix core components such as the motherboard, battery, and camera to ensure stable operation. For example, the main support 14 can be the frame of the electronic device.

[0026] like Figure 1 As shown, the electronic device also includes a microphone, which can receive external sounds and convert sound waves into electrical signals to support various voice interaction and audio recording functions of the electronic device. For example, the microphone can support voice calls, video calls, and voice message sending on a mobile phone to ensure clear transmission of the user's voice.

[0027] like Figure 1As shown, the microphone disclosed in this embodiment of the present invention includes a housing assembly 10, the bottom wall of which is connected to a main upper part 14 to fix the microphone. The housing assembly 10 encloses a receiving cavity 11, which can accommodate other components of the microphone. The main upper part 14 has a sound inlet 141, through which external sound can enter the electronic device. The electronic device is provided with a first channel 143, which penetrates the bottom wall of the housing assembly 10 and at least part of the main upper part 14, and is connected to the sound inlet 141. That is, sound entering from the sound inlet 141 can enter the receiving cavity 11 through the first channel 143.

[0028] For example, the housing assembly 10 in this embodiment of the present invention may include a base plate 13 and a housing 12. The base plate 13 is connected to the main upper part 14, and the housing 12 is disposed on the side of the base plate 13 away from the main upper part 14. The base plate 13 and the housing 12 together form a receiving cavity 11. A first channel 143 penetrates the base plate 13 and part of the main upper part 14, and communicates with the sound inlet 141, so that external sound from the electronic device can enter the first channel 143 through the sound inlet 141, and then enter the receiving cavity 11 from the first channel 143.

[0029] Of course, the above are merely individual examples of the specific structure of the housing assembly 10 and are not intended to limit the present invention. In practical applications, those skilled in the art can also customize the specific structure of the housing assembly 10 as needed.

[0030] In this embodiment of the invention, the piezoelectric component 30 is disposed within the receiving cavity 11 and corresponds to the first channel 143. For example, as shown... Figure 1 As shown, the piezoelectric assembly 30 includes a waterproof component 31 and a piezoelectric module 32. The waterproof component 31 is connected to the base plate 13 and is disposed opposite to the first channel 143. The piezoelectric module 32 is connected to the side of the waterproof component 31 away from the base plate 13. The waterproof component 31 can prevent water and other liquids from entering the receiving cavity 11 through the first channel 143. The piezoelectric module 32 can collect underwater sound.

[0031] The processing module 40 is disposed within the receiving cavity 11 and is electrically connected to the piezoelectric component 30. The processing module 40 can acquire the voltage value output by the piezoelectric component 30 and control the piezoelectric component 30 to pick up sound based on the voltage value. In other words, in specific application scenarios, the processing module 40 can control the piezoelectric component 30 to pick up sound, thereby increasing the microphone's sensitivity and ensuring the clarity and accuracy of the microphone's sound pickup, thus improving the user experience.

[0032] For example, when the electronic device is filming underwater, sound waves directly drive the waterproof component 31 and the piezoelectric module 32 to vibrate through the water, outputting a high voltage through the positive piezoelectric effect. However, the first diaphragm 22 has air and water as its two sides, resulting in high acoustic impedance and causing the MEMS diaphragm 21 to output a low voltage. The processing module 40 compares the low voltage output by the MEMS diaphragm 21 with the high voltage output by the piezoelectric module 32, and then determines to output the signal from the piezoelectric module 32.

[0033] The electronic device disclosed in this embodiment of the invention connects a processing module 40 to a piezoelectric component 30. The processing module 40 can control the piezoelectric component 30 to output sound based on the voltage value it outputs. In other words, in specific application scenarios, the processing module 40 can control the piezoelectric component 30 to pick up sound based on the voltage value it outputs, thereby improving the microphone's sensitivity and ensuring the clarity and accuracy of sound pickup in specific application scenarios, thus enhancing the user experience.

[0034] In some embodiments, such as Figure 1 As shown, the electronic device also includes a second channel 142, which penetrates the bottom wall of the housing assembly 10 and at least part of the upper part 14, and is connected to the sound inlet 141; the microphone also includes: a MEMS diaphragm 21, which is disposed in the receiving cavity 11 and is disposed opposite to the second channel 142; a first diaphragm 22, which is disposed in the second channel 142; and a processing module 40 electrically connected to the MEMS diaphragm 21, which is used to control the MEMS diaphragm 21 to receive sound based on the voltage level output by the MEMS diaphragm 21.

[0035] like Figure 1 As shown, the second channel 142 extends through the bottom and at least part of the upper part 14 of the housing assembly 10, and is connected to the sound inlet 141. That is, sound waves entering through the sound inlet 141 can enter the receiving cavity 11 through the second channel 142, and / or, sound waves entering through the sound inlet 141 can enter the receiving cavity 11 through the first channel 143. It should be noted that when the electronic device is used in applications such as underwater shooting, rain shooting, or outdoor sports, water can also enter the second channel 142 and the first channel 143 through the sound inlet 141.

[0036] like Figure 1As shown, the first diaphragm 22 is disposed within the second channel 142 and located near the receiving cavity 11. The first diaphragm 22 isolates the liquid, while allowing sound waves to pass through the first diaphragm 11 into the receiving cavity 11 via gas, preventing liquid from entering the receiving cavity 11 through the first diaphragm 22. A MEMS diaphragm 21 is disposed within the receiving cavity 11, with the MEMS diaphragm 21 positioned opposite the second channel 142. Exemplarily, the MEMS diaphragm 21 can be connected to the base plate 13 near the first channel 142 via a connector, so that the MEMS diaphragm 21 is positioned opposite the first channel 142.

[0037] When the sound wave entering through the inlet 141 passes through the second channel 142 into the receiving cavity 11, it impacts the MEMS diaphragm 21, causing the MEMS diaphragm 21 to vibrate in sync with the sound wave frequency. The MEMS diaphragm 21 and the base plate 13 form a miniature capacitor. When the MEMS diaphragm 21 vibrates, the distance between the MEMS diaphragm 21 and the base plate 13 changes, causing a change in the capacitance of the capacitor. This change in capacitance is converted into a weak analog electrical signal.

[0038] For example, when sound waves in the air enter the second channel 142 and the first channel 143 through the sound inlet 141, the sound waves can directly drive the MEMS diaphragm 21 to move through the first diaphragm 22, thereby outputting a high voltage. At this time, the piezoelectric module 32 experiences less pressure and outputs a low voltage. After comparing the high voltage output by the MEMS diaphragm 21 with the low voltage output by the piezoelectric module 32, the processing module 40 controls the MEMS diaphragm 21 to pick up sound.

[0039] When the electronic device is submerged in water for filming, sound waves directly drive the waterproof component 31 and the piezoelectric module 32 to vibrate through the water, outputting a high voltage through the positive piezoelectric effect. However, the first diaphragm 22 has air and water as its two sides, resulting in high acoustic impedance and causing the MEMS diaphragm 21 to output a low voltage. The processing module 40 compares the low voltage output by the MEMS diaphragm 21 with the high voltage output by the piezoelectric module 32, and then controls the piezoelectric module 32 to pick up sound.

[0040] The electronic device disclosed in this embodiment of the present invention allows the processing module 40 to select either the MEMS diaphragm 21 or the piezoelectric module 32 to receive sound in different application scenarios, thereby improving the sensitivity of the microphone and ensuring that the microphone can receive clear and accurate sound in different application scenarios, thus improving the user experience.

[0041] It should be noted that the first diaphragm 22 in this embodiment of the present invention is a waterproof and breathable diaphragm, which is a special material that combines waterproof and acoustic performance. The core material of the waterproof and breathable diaphragm is usually expanded polytetrafluoroethylene, which has a microporous structure (pore size of about 0.1μm to 10μm), which can block liquid water penetration while allowing air molecules to pass through, without affecting sound wave transmission.

[0042] Semiconductor-grade monocrystalline silicon or polycrystalline silicon can be used to fabricate an ultrathin layer with a thickness of about 1 μm to 5 μm through microfabrication technology to form a MEMS film 21.

[0043] In some embodiments, such as Figure 1 As shown, the piezoelectric assembly 30 includes a waterproof component 31, which is disposed within the receiving cavity 11 and connected to the bottom wall of the housing assembly 10, and is disposed opposite to the first channel 143; a piezoelectric module 32, which is disposed within the receiving cavity 11 and connected to the side of the waterproof component 31 away from the first channel 143; and a processing module 40 electrically connected to the piezoelectric module 32, which is used to control the piezoelectric module 32 to receive sound based on the voltage level output by the piezoelectric module 32.

[0044] like Figure 1 As shown, in this embodiment of the present invention, the waterproof component 31 is connected to the bottom wall of the housing assembly 10 and is disposed opposite to the first channel 143, so as to prevent water and other liquids in the first channel 143 from entering the receiving cavity 11.

[0045] For example, the waterproof component 31 can be a rubber sheet, which can be bonded to the base plate 13 near the first channel 143 so that the rubber sheet is positioned opposite to the first channel 143. The rubber sheet can prevent water or other liquids in the first channel 143 from entering the receiving cavity 11. Of course, in this embodiment of the present invention, there are no excessive restrictions on the specific material of the waterproof component 31. In actual applications, those skilled in the art can choose according to their needs.

[0046] The piezoelectric module 32 is disposed within the receiving cavity 11 and connected to the side of the waterproof component 32 away from the bottom plate 13. The piezoelectric module 32 can collect underwater sound waves and directly convert the mechanical vibration of the sound waves into electrical signals using the piezoelectric effect. When the sound waves entering through the sound inlet 141 pass through the first channel 143 into the receiving cavity 11, the sound wave vibration acts on the piezoelectric material within the piezoelectric module 32. The piezoelectric material generates charges due to deformation, forming a voltage signal matching the frequency and amplitude of the sound waves. The processing module 40 is electrically connected to the piezoelectric module 32. The processing module 40 can acquire the voltage signal from the piezoelectric module 32 and control the piezoelectric module 32 to pick up sound based on the level of the voltage signal output by the piezoelectric module 32.

[0047] In other words, in specific application scenarios such as underwater shooting, the processing module 40 can control the piezoelectric module 32 to pick up sound based on the voltage value output by the piezoelectric module 32, thereby improving the microphone's sensitivity and ensuring the clarity and accuracy of the microphone's sound pickup in specific application scenarios, thus enhancing the user experience.

[0048] In some embodiments, such as Figure 2 As shown, the processing module 40 includes: a voltage comparator 41, which is electrically connected to the MEMS diaphragm 21 and the piezoelectric module 32; and a switch 42, which is electrically connected to the voltage comparator 41, the MEMS diaphragm 21, and the piezoelectric module 32. The voltage comparator 41 is used to control the switch 42 to be electrically connected to the MEMS diaphragm 21 or the piezoelectric module 32 based on the high or low level output by the MEMS diaphragm 21 and the piezoelectric module 32, so as to output the voltage signal of the MEMS diaphragm 21 or the piezoelectric module 32.

[0049] like Figure 2 As shown, the processing module 40 disclosed in this embodiment of the present invention includes a charge pump, a voltage comparator 41, and a switch 42. The charge pump is electrically connected to the MEMS diaphragm 21 and the piezoelectric module 32, respectively, and provides bias voltage to the MEMS diaphragm 21 and the piezoelectric module 32 through the charge pump.

[0050] In this embodiment of the invention, the voltage comparator 41 is electrically connected to the MEMS diaphragm 21 and the piezoelectric module 32, and the switch 42 is electrically connected to the voltage comparator 41, the MEMS diaphragm 21, and the piezoelectric module 32. The voltage comparator 41 can acquire a first voltage value output by the MEMS diaphragm 21 and a second voltage value output by the piezoelectric module 32, compare the magnitudes of the first and second voltage values, and control the switch 42 to be electrically connected to the MEMS diaphragm 21 or the piezoelectric module 32 with the larger voltage value, so as to output the voltage signal of the MEMS diaphragm 21 or the piezoelectric module 32.

[0051] The voltage comparator 41 and the switch 42 in this embodiment of the present invention allow the processing module 40 to select the output voltage signal of the MEMS diaphragm 21 or the piezoelectric module 32 in different application scenarios, thereby improving the sensitivity of the microphone, ensuring the clarity and accuracy of the microphone's sound pickup in different application scenarios, and enhancing the user experience.

[0052] In some embodiments, such as Figure 2 As shown, the processing module 40 also includes an amplifier 43, which is electrically connected to the switching element 42. The amplifier 43 is used to amplify the voltage signal output by the MEMS diaphragm 21 or the piezoelectric module 32.

[0053] like Figure 2As shown, amplifier 43 is electrically connected to switch 42 to amplify the voltage signal output by MEMS diaphragm 21 or piezoelectric module 32. It can be understood that amplifier 43 can directly amplify and filter the weak electrical signal generated by MEMS diaphragm 21 or piezoelectric module 32, eliminating environmental noise (such as current interference and wind noise), improving the signal-to-noise ratio (SNR), and ensuring sound clarity.

[0054] In some embodiments, such as Figure 1 As shown, the housing assembly 10 includes a base plate 13 connected to the main upper part 14; and a housing 12 connected to the side of the base plate 13 away from the main upper part 14. The base plate 13 and the housing 12 together form a receiving cavity 11.

[0055] like Figure 1 As shown, the base plate 13 is fixedly connected to one side of the main upper plate 14, and the housing 12 is connected to the side of the base plate 13 away from the main upper plate 14. The housing 12 and the base plate 13 together form a receiving cavity 11. The base plate 13 is provided with circuit traces and solder pads. The housing 12 forms a groove, and the base plate 13 closes the opening of the groove, thus forming the receiving cavity 11. In other words, the housing 12 can enclose the microphone and shield external noise. The housing 12 is typically a metal housing; exemplarily, the housing 12 can be a stainless steel housing.

[0056] In this embodiment of the invention, the housing 12 and the base plate 13 enclose a cavity 11 to provide a sealed space for the microphone, improving its enclosure and preventing external noise from affecting its clarity and accuracy. Furthermore, the base plate 13 can also form a miniature capacitor with the MEMS diaphragm 21. When the MEMS diaphragm 21 vibrates, the distance between the MEMS diaphragm 21 and the base plate 13 changes, causing a change in the capacitor's capacitance. This capacitance change is converted into a weak analog electrical signal, thereby enabling the microphone's function.

[0057] In some embodiments, the electronic device is further provided with a third channel 144, wherein the first channel 143 is connected to the sound inlet 141 through the third channel 144, and the second channel 142 is connected to the sound inlet 141 through the third channel 144.

[0058] In this embodiment of the present invention, a third channel 144 is provided in the electronic device. The third channel 144 connects the first channel 143 and the sound inlet 141, as well as the second channel 142 and the sound inlet 141, to simplify the connection between the second channel 142 and the first channel 143 and the sound inlet 141. This helps to reduce the manufacturing difficulty of the main upper part 14, simplify the manufacturing process of the main upper part 14, and reduce the manufacturing cost of the electronic device.

[0059] For example, there are two sound inlets 141 and two third channels 144. One third channel 144 is connected between the first channel 143 and one sound inlet 141, and the other third channel 144 is connected between the second channel 142 and another sound inlet 141.

[0060] For example, the sound inlet 141 includes only one channel, and the third channel 144 also includes one channel. The third channel 144 is connected to the sound inlet 141, and the third channel 144 is also connected to the first channel 143 and the second channel 142. It should be noted that the shape of the third channel 144 can be linear, Y-shaped, or any other arbitrary shape. In this embodiment of the present invention, there are no excessive restrictions on the specific shape of the third channel 144, as long as the third channel 144 can connect the first channel 143, the second channel 142, and the sound inlet 141.

[0061] like Figure 1 As shown, the third channel 144 extends along the extension direction of the main upper 14. One end of the third channel 144 is connected to the sound inlet 141, and the other end of the third channel 144 is connected to the second channel 142. The first channel 143 is connected to the middle position of the third channel 144.

[0062] Of course, the above are just examples of specific configurations of the third channel 144, and are not intended to limit this utility model.

[0063] In some embodiments, such as Figure 1 As shown, the third channel 144 is disposed inside the main upper 14 and extends along the extension direction of the main upper 14; the first channel 143 penetrates the bottom plate 13 and part of the main upper 14 and connects to the third channel 144; the second channel 142 penetrates the bottom plate 13 and part of the main upper 14 and connects to the third channel 144.

[0064] like Figure 1 As shown, in this embodiment of the present invention, the third channel 144 is disposed inside the main upper 14, and the extension direction of the third channel 144 is the same as the extension direction of the main upper 14, so as to simplify the structure of the third channel 144 and reduce the processing difficulty of the main upper 14.

[0065] The first channel 143 penetrates the base plate 13 and part of the main upper plate 14, and connects to the third channel 144, so that the sound waves entering through the sound inlet 141 can enter the first channel 143 through the third channel 144, and then enter the receiving cavity 11 from the first channel 143. The second channel 142 penetrates the base plate 13 and part of the main upper plate 14, and connects to the third channel 144, so that the sound waves entering through the sound inlet 141 can enter the second channel 142 through the third channel 144, and then enter the receiving cavity 11 from the second channel 142.

[0066] In this embodiment of the invention, a third channel 144 is disposed within the main upper part 14, extending along the extending direction of the main upper part 14. A first channel 143 penetrates the base plate 13 and a portion of the main upper part 14, connecting to the third channel 144. A second channel 142 also penetrates the base plate 13 and a portion of the main upper part 14, connecting to the third channel 144. This simplifies the fabrication of the main upper part 14, optimizes its fabrication process, and reduces the fabrication cost of the electronic device.

[0067] In some embodiments, such as Figure 1 As shown, the electronic device also includes a first conductive element 50 and a second conductive element 51. The first conductive element 50 is electrically connected to the piezoelectric module 32 and the processing module 40, and the second conductive element 51 is electrically connected to the MEMS diaphragm 21 and the processing module 40.

[0068] like Figure 1 As shown in this embodiment, the piezoelectric module 32 and the processing module 40 are electrically connected via a first conductive element 50, and the MEMS diaphragm 21 and the processing module 40 are electrically connected via a second conductive element 51. This conducts power between the piezoelectric module 32 and the processing module 40, as well as between the MEMS diaphragm 21 and the processing module 40. The processing module 40 can then acquire the voltage signals output by the piezoelectric module 32 and the MEMS diaphragm 21, and control either the MEMS diaphragm 21 or the piezoelectric module 32 to pick up sound based on the voltage values ​​output by the piezoelectric module 32 and the MEMS diaphragm 21. In other words, in different application scenarios, the processing module 40 can choose to output either the MEMS diaphragm 21 or the piezoelectric module 32 to pick up sound, thereby improving the microphone's sensitivity and ensuring that the microphone can pick up clear and accurate sound in different application scenarios, thus enhancing the user experience.

[0069] It should be noted that in this embodiment of the present invention, both the first conductive element 50 and the second conductive element 51 can be connecting wires. For example, both the first conductive element 50 and the second conductive element 51 are metal wires. Of course, in this embodiment of the present invention, there are no excessive restrictions on the specific materials of the first conductive element 50 and the second conductive element 51; in practical applications, those skilled in the art can choose according to their needs.

[0070] In some embodiments, the waterproof component 31 includes a rubber sheet disposed between the bottom wall of the housing assembly 10 and the piezoelectric module 32.

[0071] In this embodiment of the invention, the waterproof component 31 is configured as a rubber sheet, which prevents water and other liquids in the first channel 143 from entering the receiving cavity 11. The rubber sheet has good elasticity and deformation recovery ability, and can fit tightly against the base plate 13 to form a good physical barrier, effectively preventing water and other liquids from seeping into the receiving cavity 11. At the same time, the rubber sheet can also adapt to minor deformations caused by temperature changes.

[0072] Furthermore, the rubber sheet is soft and thin, which, while achieving waterproofing, minimizes interference with sound wave transmission, maintaining the microphone's pickup sensitivity and sound clarity, and preventing sound distortion caused by the waterproof design.

[0073] It should be noted that the use of a rubber sheet as the waterproof component 31 is merely an example of the specific material of the waterproof component 31 and is not intended to limit the scope of this utility model. In practical applications, technicians can also select appropriate materials to manufacture the waterproof component 31 as needed.

[0074] In some embodiments, such as Figure 1 As shown, along the thickness direction of the electronic device, the sound inlet 141 is flush with the third channel 144. This further simplifies the processing difficulty of the main upper part 14, optimizes the manufacturing process of the main upper part 14, and reduces the manufacturing cost of the electronic device.

[0075] Of course, the above arrangement of the sound inlet 141 being flush with the third channel 144 is merely a specific example of this utility model and is not intended to limit the scope of this utility model. In practical applications, it is also feasible to have the sound inlet 141 and the third channel 144 not flush along the thickness direction of the electronic device.

[0076] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0077] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. An electronic device comprising a main unit (14) and a microphone, characterized in that, The microphone includes: The housing assembly (10) has its bottom wall connected to the main body (14) and the housing assembly (10) encloses to form a receiving cavity (11). The main body (14) has a sound inlet (141), and the electronic device is provided with a first channel (143). The first channel (143) penetrates the bottom wall of the housing assembly (10) and at least part of the main body (14), and the first channel (143) is connected to the sound inlet (141). A piezoelectric component (30) is disposed in the receiving cavity (11) and is disposed corresponding to the first channel (143); The processing module (40) is disposed in the receiving cavity (11) and is electrically connected to the piezoelectric component (30).

2. The electronic device according to claim 1, characterized in that, The electronic device is further provided with a second channel (142), which penetrates the bottom wall of the housing assembly (10) and at least part of the main upper part (14), and the second channel (142) is connected to the sound inlet (141). The microphone also includes: MEMS membrane (21), the MEMS membrane (21) is disposed in the receiving cavity (11) and is disposed opposite to the second channel (142); A first diaphragm (22) is disposed within the second channel (142); The processing module (40) is electrically connected to the MEMS diaphragm (21). The processing module (40) is used to control the MEMS diaphragm (21) to receive sound based on the voltage level output by the MEMS diaphragm (21).

3. The electronic device according to claim 2, characterized in that, The piezoelectric component (30) includes: Waterproof component (31) is disposed in the receiving cavity (11), the waterproof component (31) is connected to the bottom wall of the housing assembly (10), and is disposed opposite to the first channel (143); A piezoelectric module (32) is disposed in the receiving cavity (11) and connected to the waterproof component (31) on the side away from the first channel (143); The processing module (40) is electrically connected to the piezoelectric module (32). The processing module (40) is used to control the piezoelectric module (32) to receive sound based on the voltage level output by the piezoelectric module (32).

4. The electronic device according to claim 3, characterized in that, The processing module (40) includes: Voltage comparator (41), the voltage comparator (41) is electrically connected to the MEMS diaphragm (21) and the piezoelectric module (32); A switching element (42) is electrically connected to the voltage comparator (41), the MEMS diaphragm (21), and the piezoelectric module (32). The voltage comparator (41) is used to control the switch (42) to be electrically connected to the MEMS diaphragm (21) or the piezoelectric module (32) based on the voltage level output by the MEMS diaphragm (21) and the piezoelectric module (32) so as to output the voltage signal of the MEMS diaphragm (21) or the piezoelectric module (32).

5. The electronic device according to claim 4, characterized in that, The processing module (40) further includes: An amplifier (43) is electrically connected to the switch (42) and is used to amplify the voltage signal output by the MEMS diaphragm (21) or the piezoelectric module (32).

6. The electronic device according to claim 2, characterized in that, The housing assembly (10) includes: Base plate (13), which is connected to the main plate (14); The housing (12) is connected to the side of the base plate (13) away from the main upper (14), and the base plate (13) and the housing (12) enclose a receiving cavity (11).

7. The electronic device according to claim 6, characterized in that, The electronic device is also provided with a third channel (144). The first channel (143) is connected to the sound inlet (141) through the third channel (144); The second channel (142) is connected to the sound inlet (141) through the third channel (144).

8. The electronic device according to claim 7, characterized in that, The third channel (144) is disposed within the main upper part (14), and the third channel (144) extends along the extension direction of the main upper part (14); The first channel (143) passes through the base plate (13) and part of the main upper part (14) and connects to the third channel (144), and the second channel (142) passes through the base plate (13) and part of the main upper part (14) and connects to the third channel (144).

9. The electronic device according to claim 3, characterized in that, The electronic device also includes a first conductive element (50) and a second conductive element (51). The first conductive element (50) is electrically connected to the piezoelectric module (32) and the processing module (40), and the second conductive element (51) is electrically connected to the MEMS diaphragm (21) and the processing module (40).

10. The electronic device according to claim 3, characterized in that, The waterproof component (31) includes a rubber sheet disposed between the bottom wall of the housing assembly (10) and the piezoelectric module (32).

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