Multi-chip LED packaging structure, backlight module and lighting device
By designing the connection method of lateral conductive lines and center conductive lines in the multi-chip LED packaging structure, the problem of large package size is solved, and the compactness and applicability are improved, making it suitable for small-size modules and high-density packaging scenarios.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-09
- Publication Date
- 2026-04-07
AI Technical Summary
Existing multi-chip LED packaging structures have large package sizes, which affects compactness and applicability.
A multi-chip LED packaging structure is adopted, in which the peripheral LED chip is set on the second fixing part, the conductive line led out from the peripheral electrode is laterally connected to the bonding wire area, the bonding wire area is located between adjacent bonding areas, the central LED chip is connected across the channel through the central conductive line, a heat dissipation bonding area is set on the substrate to cover the bonding area, and conductive vias realize the conduction between the chip and the electrode.
The package size has been reduced, improving the compactness and applicability of the multi-chip LED package structure. It exhibits higher integration and applicability, especially in small-size module applications, and enhances heat dissipation efficiency and luminous uniformity.
Smart Images
Figure CN224098078U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of LED packaging technology, and in particular to a multi-chip LED packaging structure, a backlight module, and a lighting device. Background Technology
[0002] COB packaging, short for Chip-on-Board (COB), is an innovative technology addressing the heat dissipation problem of light-emitting diodes (LEDs). The core of COB packaging lies in tightly adhering the LED chip to a substrate using conductive or non-conductive adhesive, followed by wire bonding to achieve electrical connection. To prevent the LED chip from being contaminated by air or damaged by human intervention, affecting its function, this technology also uses an encapsulant to cover the chip and leads; this packaging method is also known as flexible encapsulation.
[0003] However, in existing packaging structures, wire bonding typically uses straight or symmetrical wiring. This wiring method requires extending the wires to the periphery of the LED chip, resulting in a large area requiring adhesive application during packaging, increasing the package size, and affecting the compactness and applicability of the packaging structure.
[0004] Therefore, existing technologies still need to be improved and developed. Utility Model Content
[0005] The technical problem to be solved by this application is to provide a multi-chip LED packaging structure, a backlight module and a lighting device, in order to address the above-mentioned deficiencies of the prior art and solve the problem of large packaging size of the existing multi-chip LED packaging structure.
[0006] The technical solution adopted by this application to solve the technical problem is as follows:
[0007] A multi-chip LED packaging structure, comprising:
[0008] A substrate; a first fixing part and a second fixing part are provided on the substrate, the second fixing part including a plurality of welding areas arranged radially; the first fixing part surrounds the second fixing part, and an outer ring channel is formed between the first fixing part and the second fixing part; and the first fixing part includes a plurality of bonding wire areas, the bonding wire areas extending to the space between two adjacent welding areas;
[0009] A peripheral LED chip is disposed in the welding area; peripheral electrodes are disposed on the peripheral LED chip.
[0010] The outer conductive wire has one end connected to the outer electrode and the other end crossing the outer ring channel and connecting to the bonding wire area.
[0011] In the multi-chip LED packaging structure, one end of the peripheral LED chip is positioned facing the center of the second fixing part, and the other end is provided with the peripheral electrode.
[0012] The multi-chip LED packaging structure includes four welding areas arranged in a cross-shaped interval; and four peripheral LED chips, with one peripheral LED chip disposed on each welding area.
[0013] The peripheral conductive lines are provided at least eight, and each peripheral electrode is connected to at least one peripheral conductive line at both ends.
[0014] In the multi-chip LED packaging structure, at least eight of the peripheral conductive lines extend in a ring or polygonal pattern.
[0015] The multi-chip LED packaging structure, wherein the center of the second fixing part is hollowed out, forming a central region; the multi-chip LED packaging structure includes:
[0016] A third fixing part is provided in the central area; an inner ring channel is formed between the third fixing part and the second fixing part;
[0017] A central LED chip is disposed on the third fixing part; a central electrode is provided on the central LED chip;
[0018] The central conductive wire has one end connected to the central electrode and the other end spanning the inner ring channel and the outer ring channel, and is connected to the bonding wire area.
[0019] In the multi-chip LED packaging structure, the first fixing part is a positive electrode fixing part, and the second fixing part and the third fixing part are both negative electrode fixing parts.
[0020] The multi-chip LED packaging structure includes an anode, peripheral LED chip cathodes, and a central LED chip cathode. The anode, peripheral LED chip cathodes, and central LED chip cathode are all disposed on the substrate and located on the side of the substrate away from the second fixing part.
[0021] A first conductive through hole is provided on the substrate at a position opposite to the first fixing part, and the first conductive through hole is used to conduct electricity between the first fixing part and the anode.
[0022] A through-hole is formed on the substrate at the position opposite to the second fixing part. The second conductive hole is used to conduct the connection between the second fixing part and the cathode of the peripheral LED chip.
[0023] A through-hole is formed on the substrate opposite the third fixing part, and the through-hole is used to connect the third fixing part and the cathode of the central LED chip.
[0024] The multi-chip LED packaging structure includes a heat dissipation soldering area, and the heat dissipation soldering area and the second fixing part are disposed opposite to each other on the substrate; and the projection area of the heat dissipation soldering area on the substrate covers each of the soldering areas.
[0025] This application discloses a backlight module, which includes a multi-chip LED packaging structure as described above.
[0026] This application discloses a lighting device, which includes a multi-chip LED package structure as described in any of the above.
[0027] Beneficial effects:
[0028] The peripheral LED chip disclosed in this application is disposed on the second fixing part, and the peripheral conductive lines led out from the peripheral electrodes face the bonding wire area, thereby connecting the positive and negative electrodes of the peripheral LED chip to the second fixing part and the first fixing part, respectively. The bonding wire area is located between two adjacent bonding areas, so it is led out laterally and not outward to the outside of the peripheral LED chip. The package size on the substrate is reduced, thereby improving the compactness and applicability of the multi-chip LED package structure, especially its applicability in small-size module applications. Attached Figure Description
[0029] Figure 1 This is a schematic diagram of the multi-chip LED packaging structure in this application;
[0030] Figure 2 This is a schematic diagram of the multi-chip LED packaging structure from another angle in this application.
[0031] Among them, 10 is the substrate; 11 is the second fixing part; 111 is the welding area; 12 is the first fixing part; 121 is the wire bonding area; 13 is the outer ring channel; 14 is the third fixing part; 15 is the inner ring channel; 20 is the peripheral LED chip; 21 is the peripheral electrode; 30 is the peripheral conductive line; 40 is the central LED chip; 41 is the central electrode; 50 is the central conductive line; 60 is the anode; 70 is the peripheral LED chip cathode; 80 is the central LED chip cathode; and 90 is the heat dissipation welding area. Detailed Implementation
[0032] The embodiments of this application will be described below with reference to the accompanying drawings and preferred embodiments. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. This application can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this application. It should be understood that the preferred embodiments are only for illustrating this application and are not intended to limit the scope of protection of this application.
[0033] It should be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of this application. Therefore, the drawings only show the components related to this application and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.
[0034] like Figure 1 As shown, one embodiment of this application provides a multi-chip LED packaging structure, including a substrate 10, peripheral LED chips 20, and peripheral conductive lines 30. The substrate 10 is provided with a second fixing part 11 and a first fixing part 12. The second fixing part 11 includes a plurality of soldering areas 111 arranged radially. The first fixing part 12 surrounds the second fixing part 11, and an outer ring channel 13 is formed between the first fixing part 12 and the second fixing part 11. Furthermore, the first fixing part 12 includes a plurality of bonding areas 121, and the bonding areas 121 extend to the space between two adjacent soldering areas 111. The peripheral LED chips 20 are disposed in the soldering areas 111. Peripheral electrodes 21 are disposed on the peripheral LED chips 20. One end of the peripheral conductive line 30 is connected to the peripheral electrode 21, and the other end crosses the outer ring channel 13 and is connected to the bonding area 121.
[0035] In this embodiment, a second fixing portion 11 and a first fixing portion 12 are provided on the substrate 10. The second fixing portion 11 is radially arranged and located in the middle. The first fixing portion 12 surrounds the second fixing portion 11 but does not contact the second fixing portion 11. The second fixing portion 11 and the first fixing portion 12 serve as negative electrode pads and positive electrode pads, respectively, and play a role in conducting electricity.
[0036] In this embodiment, the peripheral LED chip 20 is disposed on the second fixing part 11 and can be fixed by welding or conductive adhesive bonding, while simultaneously making the negative electrode of the peripheral LED chip 20 conductive to the second fixing part 11. The peripheral conductive wire 30 led out from the peripheral electrode 21 faces the bonding area 121, thereby making the first fixing part 12 conductive. That is to say, the positive and negative electrodes of the peripheral LED chip 20 are conductive to the first fixing part 12 and the second fixing part 11, respectively, while being separated from the second fixing part 11 and the first fixing part 12 by the outer ring channel 13 to avoid short circuit.
[0037] Specifically, the second fixing part 11 consists of several welding areas 111, and the wire bonding area 121 is located between two adjacent welding areas 111. The extension direction of the peripheral conductive line 30 is laterally led out and does not extend to the outside of the peripheral LED chip 20. Therefore, unlike the prior art which extends the dispensing range to the outside of the LED chip, the dispensing range in this embodiment only includes the second fixing part 11 and the wire bonding area 121 on the first fixing part 12. The package size on the substrate 10 is reduced, thereby improving the compactness and applicability of the multi-chip LED package structure, especially its applicability in small-size module applications, which is conducive to the manufacture of highly integrated display products and increases market value.
[0038] Specifically, the peripheral conductive wire 30 disclosed in this embodiment includes, but is not limited to, gold wire. Utilizing the advantages of gold wire's good conductivity and stability, the stability of the structure can be improved and its service life extended.
[0039] like Figure 1 As shown, in another embodiment of this application, one end of the peripheral LED chip 20 is disposed facing the center of the second fixing part 11, and the other end is disposed with the peripheral electrode 21. The second fixing part 11 disclosed in this embodiment is composed of multiple welding areas 111 arranged radially. Therefore, the center position is the connection position, the multiple welding areas 111 are connected to each other, the gap between two adjacent welding areas 111 is small, while the gap at the edge position is large, and the distance between two adjacent welding areas 111 is relatively far.
[0040] In this embodiment, peripheral LED chips 20 can be set on any one of the welding areas 111, or multiple peripheral LED chips 20 can be set on multiple welding areas 111. In order to make reasonable use of space, the peripheral electrode 21 is set at the far end of the peripheral LED chip 20, that is, at the edge position facing the second fixing part 11, so that there is a larger operating space when setting the peripheral conductive line 30, and interference between the peripheral conductive lines 30 on two adjacent peripheral LED chips 20 is avoided.
[0041] For example Figure 1As shown, in another embodiment of this application, four welding areas 111 are disclosed, and the four welding areas 111 are arranged in a cross-shaped interval; four peripheral LED chips 20 are provided, and one peripheral LED chip 20 is provided on each welding area 111; at least eight peripheral conductive lines 30 are provided, and at least one peripheral conductive line 30 is connected to both ends of each peripheral electrode 21; in another embodiment of this embodiment, more peripheral conductive lines 30 can be provided depending on the current of the chip.
[0042] The second fixing part 11 disclosed in this embodiment is generally cross-shaped, with four welding areas 111 arranged at intervals of °. At the same time, four peripheral LED chips 20 are arranged in a cross shape, which can emit uniform array light and improve display brightness and uniformity.
[0043] In this embodiment, each peripheral LED chip 20 has at least two peripheral conductive lines 30 led out. Therefore, at least two connection points of the peripheral conductive lines 30 need to be arranged within a bonding area 121. By setting four bonding areas 111, the spacing angle between two adjacent peripheral LED chips 20 is large, meaning the bonding area 121 is large, which facilitates the connection of the peripheral conductive lines 30. Overall, the spatial arrangement of the multi-chip LED packaging structure is reasonable, which helps to reduce the processing difficulty.
[0044] Specifically, as another embodiment of this application, at least eight peripheral conductive lines 30 are disclosed to have extension trajectories arranged in a ring or polygonal pattern. In this embodiment, the two peripheral conductive lines 30 connected to each peripheral LED chip 20 extend to both sides respectively, with a total of eight conductive lines arranged in a ring or polygonal pattern. The overall trajectory is close to a ring, which reduces the package size and thus the package volume, which is beneficial to improving the compactness of the package structure and enabling the integrated production of display devices.
[0045] For example Figure 1 As shown, in another embodiment of this application, the center of the second fixing part 11 is hollowed out, forming a central region; the multi-chip LED packaging structure includes a third fixing part 14, a central LED chip 40, and a central conductive line 50, the third fixing part 14 being disposed in the central region; an inner ring channel 15 is formed between the third fixing part 14 and the second fixing part 11; the central LED chip 40 is disposed on the third fixing part 14; a central electrode 41 is provided on the central LED chip 40; one end of the central conductive line 50 is connected to the central electrode 41, and the other end crosses the inner ring channel 15 and the outer ring channel 13, and is connected to the bonding area 121.
[0046] In this embodiment, by setting a central LED chip 40 at the center of the second fixing part 11, the light source distribution on the entire packaging structure is more uniform. Multiple peripheral LED chips 20 surround the central LED chip 40, and the light emitted during operation is more uniform, reducing dark areas.
[0047] Specifically, in this embodiment, a third fixing part 14 is provided on the substrate 10, and the central LED chip 40 is bonded to the third fixing part 14 with conductive adhesive. The other electrode of the central LED chip 40 is connected to the first fixing part 12 through the central conductive line 50, thereby forming a situation where the peripheral LED chip 20 and the central LED chip 40 share a single electrode, which simplifies the wiring complexity and facilitates improved processing efficiency.
[0048] Specifically, in this embodiment, the third fixing part 14, the second fixing part 11, and the first fixing part 12 are nested sequentially without contacting each other, ensuring orderly circuitry between the peripheral LED chip 20 and the central LED chip 40, allowing for long-term use. More importantly, the central LED chip 40 is located inside the second fixing part 11, allowing the central conductive line 50 to cross the inner ring channel 15 and the outer ring channel 13 to connect to the bonding area 121. In other words, the extension trajectory of the central conductive line 50 is also within the bonding area 121, thus minimizing the overall package size and further optimizing the package volume, which is beneficial for the integration of multi-chip LED package structures.
[0049] Specifically, in this embodiment, the peripheral LED chip 20 and the central LED chip 40 can be the same chip, and the peripheral conductive line 30 and the central conductive line 50 are made of the same material, such as gold wire, thereby optimizing the material and saving processing costs.
[0050] Specifically, as another embodiment of this application, the first fixing part 12 is disclosed as a positive electrode fixing part, and the second fixing part 11 and the third fixing part 14 are both negative electrode fixing parts. In this embodiment, the first fixing part 12 serves as an electrode shared by the peripheral LED chip 20 and the central LED chip 40, which can save space and simplify the structure. The second fixing part 11 and the third fixing part 14 respectively conduct the peripheral LED chip 20 and the central LED chip 40, so as to facilitate independent control, precise voltage distribution, and increased control flexibility of the light emission mode.
[0051] In addition, in this embodiment, both the peripheral LED chip 20 and the central LED chip 40 are upright chips. The negative electrode of the chip is close to the bottom and directly connected to the second fixing part 11 and the third fixing part 14, reducing the wiring. The positive electrode is located at the top of the chip and a conductive line is led out through the electrode sheet to the common positive electrode, making the wiring layout more reasonable.
[0052] like Figure 1 and Figure 2 As shown in another embodiment of this application, the multi-chip LED packaging structure includes an anode 60, peripheral LED chip cathodes 70, and a central LED chip cathode 80. The anode 60, peripheral LED chip cathodes 70, and central LED chip cathode 80 are all disposed on the substrate 10 and located on the side of the substrate 10 opposite to the second fixing part 11. A first conductive via is provided on the substrate 10 opposite to the first fixing part 12, and the first conductive via is used to conduct the first fixing part 12 and the anode 60. A second conductive via is formed on the substrate 10 opposite to the second fixing part 11, and the second conductive via is used to conduct the second fixing part 11 and the peripheral LED chip cathode 70. A third conductive via is formed on the substrate 10 opposite to the third fixing part 14, and the third conductive via is used to conduct the third fixing part 14 and the central LED chip cathode 80.
[0053] The multi-chip LED packaging structure disclosed in this embodiment has multiple chips on the substrate 10, so the front space of the substrate 10 is limited. By setting the first conductive through hole, the second conductive through hole, and the third conductive through hole, the front and back sides of the substrate 10 are connected, so that the anode 60 is connected to the first fixing part 12, the second fixing part 11 is connected to the peripheral LED chip cathode 70, and the third fixing part 14 is connected to the central LED chip cathode 80, respectively. This makes it easier to design circuit patterns on the back side of the substrate 10, making the space utilization of the packaging structure higher and the structure more compact.
[0054] For example Figure 2 As shown, as another embodiment of this application, the multi-chip LED packaging structure is disclosed to include a heat dissipation welding area 90, the heat dissipation welding area 90 and the second fixing part 11 are disposed opposite to each other on the substrate 10; and the projection area of the heat dissipation welding area 90 on the substrate 10 covers each of the welding areas 111.
[0055] In this embodiment, by setting the heat dissipation soldering area 90 to correspond to the position of the peripheral LED chip 20, the local heat dissipation efficiency is improved, the LED chip maintains good luminous efficiency, increases reliability, and extends the service life of the packaging structure.
[0056] In summary, the multi-chip LED packaging structure disclosed in this application can utilize various packaging processes such as surface-mount LED (SMD LED) and COB packaging, offering a wide range of applications suitable for various high-density packaging scenarios. For example, when used in LED lighting modules, it can reduce packaging volume, making the LED lighting module structure more compact; when used in automotive LEDs, it helps optimize the layout of LED lamp groups, adapting to the installation requirements of the limited space inside automotive lights; and when used in micro-projection devices, it can reduce the packaging size of the LED light source, improve the space utilization of LEDs, and optimize the structural layout of the projection device.
[0057] As another embodiment of this application, a backlight module is disclosed, which includes the multi-chip LED packaging structure as described above.
[0058] As another embodiment of this application, a lighting device is disclosed, which includes a multi-chip LED packaging structure as described in any of the above.
[0059] In summary, this application provides a multi-chip LED packaging structure, including a substrate 10, peripheral LED chips 20, and peripheral conductive lines 30. The substrate 10 is provided with a second fixing part 11 and a first fixing part 12. The second fixing part 11 includes a plurality of soldering areas 111 arranged radially. The first fixing part 12 surrounds the second fixing part 11, and an outer ring channel 13 is formed between the first fixing part 12 and the second fixing part 11. Furthermore, the first fixing part 12 includes a plurality of bonding areas 121, and the bonding areas 121 extend to the space between two adjacent soldering areas 111. The peripheral LED chips 20 are disposed in the soldering areas 111. Peripheral electrodes 21 are provided on the peripheral LED chips 20. One end of the peripheral conductive line 30 is connected to the peripheral electrode 21, and the other end crosses the outer ring channel 13 and is connected to the bonding area 121. In this embodiment, the bonding area 121 is located between two adjacent bonding areas 111, so it is led out laterally and does not lead out to the outside of the LED chip 20. The package size on the substrate 10 is reduced, thereby improving the compactness and applicability of the multi-chip LED package structure, especially its applicability in small-size module applications.
[0060] It should be understood that the application of this application is not limited to the examples above. Those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.
Claims
1. A multi-chip LED packaging structure, characterized in that, include: A substrate having a first fixing portion and a second fixing portion thereon, the second fixing portion including a plurality of soldering areas arranged radially; the first fixing portion surrounding the second fixing portion, an outer annular channel being formed between the first fixing portion and the second fixing portion; and the first fixing portion including a plurality of bonding wire areas extending to the space between two adjacent soldering areas. A peripheral LED chip is disposed in the welding area; peripheral electrodes are disposed on the peripheral LED chip. The outer conductive wire has one end connected to the outer electrode and the other end crossing the outer ring channel and connecting to the bonding wire area.
2. The multi-chip LED packaging structure according to claim 1, characterized in that, One end of the peripheral LED chip is positioned toward the center of the second fixing part, and the other end is provided with the peripheral electrode.
3. The multi-chip LED packaging structure according to claim 2, characterized in that, The welding area is provided with four welding areas, which are arranged in a cross shape; the peripheral LED chip is provided with four peripheral LED chips, and one peripheral LED chip is provided on each welding area; The peripheral conductive lines are provided at least eight, and each peripheral electrode is connected to at least one peripheral conductive line at both ends.
4. The multi-chip LED packaging structure according to claim 3, characterized in that, The extension trajectories of at least eight of the peripheral conductive lines are arranged in a ring or polygonal pattern.
5. The multi-chip LED packaging structure according to claim 1, characterized in that, The center of the second fixing part is hollowed out, forming a central area; The multi-chip LED packaging structure includes: A third fixing part is provided in the central area; an inner ring channel is formed between the third fixing part and the second fixing part; A central LED chip is disposed on the third fixing part; a central electrode is provided on the central LED chip; The central conductive wire has one end connected to the central electrode and the other end spanning the inner ring channel and the outer ring channel, and is connected to the bonding wire area.
6. The multi-chip LED packaging structure according to claim 5, characterized in that, The first fixing part is a positive electrode fixing part, and the second fixing part and the third fixing part are both negative electrode fixing parts.
7. The multi-chip LED packaging structure according to claim 6, characterized in that, The multi-chip LED packaging structure includes an anode, peripheral LED chip cathodes, and a central LED chip cathode. The anode, peripheral LED chip cathodes, and central LED chip cathode are all disposed on the substrate and located on the side of the substrate away from the second fixing part. A first conductive through hole is provided on the substrate at a position opposite to the first fixing part, and the first conductive through hole is used to conduct electricity between the first fixing part and the anode. A through-hole is formed on the substrate at the position opposite to the second fixing part. The second conductive hole is used to conduct the connection between the second fixing part and the cathode of the peripheral LED chip. A through-hole is formed on the substrate opposite the third fixing part, and the through-hole is used to connect the third fixing part and the cathode of the central LED chip.
8. The multi-chip LED packaging structure according to any one of claims 1 to 7, characterized in that, The multi-chip LED packaging structure includes a heat dissipation welding area, which is disposed opposite to the second fixing part on both sides of the substrate; and the projection area of the heat dissipation welding area on the substrate covers each of the welding areas.
9. A backlight module, characterized in that, Includes the multi-chip LED packaging structure as described in any one of claims 1 to 8.
10. A lighting device, characterized in that, Includes the multi-chip LED packaging structure as described in any one of claims 1 to 8.