Handheld device for semiconductor wafer processing

Abstract

The utility model relates to the technical field of wafer processing, and discloses a handheld device for semiconductor wafer processing, which comprises a storage box, the inner wall of the storage box is fixedly connected with a plurality of groups of support plates, the support plates are internally connected with a limiting assembly and a jacking assembly, and the outer wall of the storage box is connected with a buffer assembly. Compared with the prior art, the handheld device for semiconductor wafer processing has the advantages that in the handheld device for semiconductor wafer processing, the wafer is conveniently taken out by using the jacking assembly, the wafer is prevented from being damaged when being taken out from the empty slot, time and labor are saved, and the wafer placed and stored in the empty slot is more stable and cannot be bumped and shaken out by using the limiting assembly; and the buffer assembly is used for conveniently damping and buffering vibration on the outer side of the storage box, so that the wafer is effectively protected.

Description

Technical Field

[0001] This utility model relates to the field of wafer processing technology, and in particular to a handheld device for semiconductor wafer processing. Background Technology

[0002] A wafer is a silicon wafer used to make silicon semiconductor circuits. Its raw material is silicon. High-purity polycrystalline silicon is dissolved and mixed with silicon crystal seed crystals, and then slowly pulled out to form cylindrical single-crystal silicon. After grinding, polishing and slicing, the silicon crystal rod is formed into a silicon wafer, which is a wafer. At present, wafers are mostly stored in storage boxes during processing, and need to be transported or stored by hand by workers.

[0003] Existing handheld devices for semiconductor wafer processing are not convenient for fixing and storing wafers, making them inconvenient to retrieve when needed, time-consuming, labor-intensive, and prone to damaging the wafers; they are also not convenient for buffering external forces to protect the wafers and storage boxes, which can easily cause vibration damage to the wafers, thus the device has certain shortcomings. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a handheld device for semiconductor wafer processing.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a handheld device for semiconductor wafer processing, comprising a storage box, wherein a support plate is fixedly connected to the inner wall of the storage box, the support plate is provided with multiple sets, a limiting component and a lifting component are connected inside the support plate, and a buffer component is connected to the outer wall of the storage box;

[0006] The lifting assembly includes a fixed rod. The support plate has a hollow groove and a through groove. The fixed rod is rotatably connected in the through groove. A cam is fixedly connected to the outer wall of the fixed rod. One end of the fixed rod passes through the support plate and is fixedly connected to a turntable. The turntable has limit holes. Multiple sets of limit holes are provided. The side of the support plate has a threaded groove. A fixing bolt is threaded into the threaded groove. One end of the fixing bolt passes through a set of limit holes.

[0007] As a further description of the above technical solution:

[0008] The limiting component includes a fixing plate, which is rotatably connected to the top side of the support plate. A groove is provided inside the fixing plate, and a second spring is fixedly connected to the top of the groove. A connecting plate is fixedly connected to the bottom of the second spring. The connecting plate slides in the groove, and a connecting rod is fixedly connected to the bottom of the connecting plate. A limiting plate is fixedly connected to the bottom of the connecting rod.

[0009] As a further description of the above technical solution:

[0010] The buffer assembly includes a first spring, which is fixedly connected to the outer wall of the storage box. One end of the first spring is fixedly connected to a buffer plate, and multiple sets of the first spring are provided.

[0011] As a further description of the above technical solution:

[0012] The storage box is equipped with a door on one side, and a handle is fixedly connected to the outer wall of the door.

[0013] As a further description of the above technical solution:

[0014] A hand handle is fixedly connected to the top of the storage box.

[0015] As a further description of the above technical solution:

[0016] The limiting plate is parallel to the support plate.

[0017] As a further description of the above technical solution:

[0018] The turntable is parallel to the side of the support plate.

[0019] This utility model has the following beneficial effects:

[0020] 1. In this utility model, in the handheld device used for semiconductor wafer processing, the lifting component is used to facilitate the removal of the wafer, avoid damage when removing it from the empty slot, save time and effort, and the limiting component is used to make the wafer placed in the empty slot more stable and prevent it from being shaken out.

[0021] 2. In this utility model, in the handheld device used for semiconductor wafer processing, the use of a buffer component facilitates the damping and buffering of vibrations received on the outside of the storage box, effectively protecting the wafer. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the overall structure of a handheld device for semiconductor wafer processing proposed in this utility model;

[0023] Figure 2 This is a partial structural diagram of a handheld device for semiconductor wafer processing proposed in this utility model. Figure 1 ;

[0024] Figure 3 This invention proposes a handheld device for semiconductor wafer processing. Figure 2 Enlarged view of point A in the middle;

[0025] Figure 4 This invention proposes a handheld device for semiconductor wafer processing. Figure 2 Enlarged view at point B in the middle;

[0026] Figure 5 This is a partial structural diagram of a handheld device for semiconductor wafer processing proposed in this utility model. Figure 2 .

[0027] Legend:

[0028] 1. Storage box; 2. Box door; 3. Hand handle; 4. Grip; 5. First spring; 6. Buffer plate; 7. Support plate; 8. Hollow slot; 9. Through slot; 10. Fixing rod; 11. Cam; 12. Turntable; 13. Limiting hole; 14. Threaded groove; 15. Fixing bolt; 16. Fixing plate; 17. Groove; 18. Second spring; 19. Connecting plate; 20. Connecting rod; 21. Limiting plate. Detailed Implementation

[0029] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0030] Reference Figures 1-5 An embodiment of this utility model is provided: a handheld device for semiconductor wafer processing, including a storage box 1, a support plate 7 fixedly connected to the inner wall of the storage box 1, multiple sets of support plates 7, a limiting component and a lifting component connected inside the support plate 7, and a buffer component connected to the outer wall of the storage box 1.

[0031] The lifting assembly includes a fixed rod 10. A slot 8 and a through slot 9 are provided in the support plate 7. The fixed rod 10 is rotatably connected in the through slot 9. A cam 11 is fixedly connected to the outer wall of the fixed rod 10. One end of the fixed rod 10 passes through the support plate 7 and is fixedly connected to a turntable 12. A limit hole 13 is provided in the turntable 12. Multiple sets of limit holes 13 are provided. A threaded groove 14 is provided on the side of the support plate 7. A fixing bolt 15 is threadedly connected in the threaded groove 14. One end of the fixing bolt 15 passes through a set of limit holes 13 for easy positioning.

[0032] The limiting assembly includes a fixed plate 16, which is rotatably connected to the top side of the support plate 7. A groove 17 is provided inside the fixed plate 16. A second spring 18 is fixedly connected to the top of the groove 17. A connecting plate 19 is fixedly connected to the bottom of the second spring 18. The connecting plate 19 slides in the groove 17. A connecting rod 20 is fixedly connected to the bottom of the connecting plate 19. A limiting plate 21 is fixedly connected to the bottom of the connecting rod 20. The buffer assembly includes a first spring 5, which is fixedly connected to the outer wall of the storage box 1. A buffer plate 6 is fixedly connected to one end of the first spring 5. Multiple sets of the first spring 5 are provided. A door 2 is connected to one side of the storage box 1. A handle 4 is fixedly connected to the outer wall of the door 2. A hand handle 3 is fixedly connected to the top of the storage box 1. The limiting plate 21 is parallel to the support plate 7. The turntable 12 is parallel to the side of the support plate 7, making the movement process more stable.

[0033] Working principle: In the handheld device used for semiconductor wafer processing, the fixing plate 16 is rotated away from the top of the empty slot 8, and the rotating turntable 12 drives the fixing rod 10 to rotate. The fixing rod 10 drives the cam 11 to rotate, so that the convex side of the cam 11 lifts the wafer, making it easier to remove the wafer and avoiding damage when removing it from the empty slot 8. This saves time and effort. Rotating the fixing plate 16 to the top position of the empty slot 8 makes the wafer placed in the empty slot 8 more stable and prevents it from being shaken out. The multiple sets of first springs 5 ​​help to dampen and buffer the vibrations on the outside of the storage box 1, effectively protecting the wafer.

[0034] All electrical components mentioned in this article are electrically connected to an external main controller and 220V AC mains power. The main controller can be a conventional known device such as a computer for control. The detailed description of known functions and known components is omitted in the specific embodiments disclosed herein. To ensure the compatibility of the device, the operating methods used are consistent with the parameters of commercially available instruments.

[0035] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A handheld device for semiconductor wafer processing, comprising a storage box (1), characterized in that: The inner wall of the storage box (1) is fixedly connected to a support plate (7), and the support plate (7) is provided in multiple sets. The support plate (7) is connected to a limiting component and a lifting component, and the outer wall of the storage box (1) is connected to a buffer component. The lifting assembly includes a fixed rod (10), and the support plate (7) has a slot (8) and a through slot (9). The fixed rod (10) is rotatably connected in the through slot (9). A cam (11) is fixedly connected to the outer wall of the fixed rod (10). One end of the fixed rod (10) passes through the support plate (7) and is fixedly connected to a turntable (12). The turntable (12) has limit holes (13) and multiple sets of limit holes (13). The support plate (7) has a threaded groove (14) on its side. A fixing bolt (15) is threadedly connected in the threaded groove (14). One end of the fixing bolt (15) passes through a set of limit holes (13).

2. The handheld device for semiconductor wafer processing according to claim 1, characterized in that: The limiting component includes a fixing plate (16), which is rotatably connected to the top side of the support plate (7). The fixing plate (16) has a groove (17) inside. A second spring (18) is fixedly connected to the top of the groove (17). A connecting plate (19) is fixedly connected to the bottom of the second spring (18). The connecting plate (19) slides in the groove (17). A connecting rod (20) is fixedly connected to the bottom of the connecting plate (19). A limiting plate (21) is fixedly connected to the bottom of the connecting rod (20).

3. A handheld device for semiconductor wafer processing according to claim 1, characterized in that: The buffer assembly includes a first spring (5), which is fixedly connected to the outer wall of the storage box (1). One end of the first spring (5) is fixedly connected to a buffer plate (6), and the first spring (5) is provided in multiple sets.

4. A handheld device for semiconductor wafer processing according to claim 1, characterized in that: The storage box (1) is provided with a door (2) on one side, and a handle (4) is fixedly connected to the outer wall of the door (2).

5. A handheld device for semiconductor wafer processing according to claim 1, characterized in that: The storage box (1) is fixedly connected to a hand handle (3) on the top.

6. A handheld device for semiconductor wafer processing according to claim 2, characterized in that: The limiting plate (21) is parallel to the support plate (7).

7. A handheld device for semiconductor wafer processing according to claim 1, characterized in that: The turntable (12) is parallel to the side of the support plate (7).

Images