Cold and hot integrated semiconductor cold and hot compress equipment

Abstract

The utility model discloses cold and hot integrated semiconductor cold and hot compress equipment which comprises a cold and hot compress part, a box body and a temperature control assembly, a first pipeline is detachably connected into the cold and hot compress body; an air cooling heat dissipation assembly and a water tank are detachably connected into the box body, the air cooling heat dissipation assembly communicates with the water tank through a pipeline, and the box body is detachably connected with a semiconductor refrigeration assembly. The temperature in the cold and hot compress body is obtained through the first temperature sensor, the temperature of the fluid medium in the water tank is obtained through the second temperature sensor, and the main controller in the temperature control assembly controls the temperature of the fluid medium according to temperature information fed back by the first temperature sensor and the second temperature sensor. The air speed of the air cooling heat dissipation assembly, the refrigerating capacity of the semiconductor refrigeration assembly and the flow of fluid pumped by the water pump are controlled, so that the temperature and the flow speed of a fluid medium flowing into the first pipeline are regulated and controlled, the temperature of the cold and hot compress body is accurately controlled, the situation of sudden cold and sudden hot does not exist, and stable low temperature is continuously maintained.

Description

TECHNICAL FIELD

[0001] The utility model belongs to cold and hot compress technical field especially relates to a cold and hot integrated semiconductor cold and hot compress equipment. BACKGROUND

[0002] In the clinical medical field, cold compress equipment is often used for fever, relieve local pain, reduce swelling and promote wound healing. The traditional cold compress products mostly adopt the form such as ice bag, gel pad, fever relieving paste, the heat dissipation effect of these products is limited, it is difficult to maintain stable low temperature continuously, and temperature control is not accurate enough, which may cause discomfort to patients, and the existing cold compress products can only realize cold compress, cannot realize hot compress, and cannot adapt to the needs of patients in different periods. SUMMARY

[0003] The utility model aims at providing a cold and hot integrated semiconductor cold and hot compress equipment to solve the problems in the prior art.

[0004] In order to realize the above-mentioned purpose, the utility model provides a cold and hot integrated semiconductor cold and hot compress equipment, including cold and hot compress part, box and temperature control assembly, the cold and hot compress part includes cold and hot compress body, the first pipeline is detachably connected in the cold and hot compress body, the first temperature sensor is arranged in the cold and hot compress body, the water tank is detachably connected in the box, the air cooling heat dissipation assembly is detachably connected in the box, the air cooling heat dissipation assembly and water tank are communicated through the pipeline, the water pump is arranged on the pipeline, the water inlet end and water outlet end of the first pipeline are detachably connected with the water outlet end of the water tank and the water inlet end of the air cooling heat dissipation assembly and are communicated, the semiconductor refrigeration assembly is detachably connected on the side of the water tank of the box, the output end of the semiconductor refrigeration assembly is in contact with the water tank, the output end of the semiconductor refrigeration assembly is divided into heating end and refrigeration end according to the direction of current flowing through the semiconductor refrigeration assembly, the second temperature sensor is arranged in the water tank.

[0005] The temperature control assembly includes a main controller, the first temperature sensor, the second temperature sensor, the air cooling heat dissipation assembly, the semiconductor refrigeration assembly and the water pump are electrically connected with the main controller, the main controller receives the temperature information fed back by the first temperature sensor and the second temperature sensor, controls the air speed of the air cooling heat dissipation assembly, controls the refrigerating capacity of the semiconductor refrigeration assembly, controls the flow of the fluid pumped by the water pump.

[0006] Optionally, the semiconductor refrigeration assembly comprises a semiconductor refrigerator, the semiconductor refrigerator comprises oppositely arranged first and second end faces, the first end face is an output end; the semiconductor refrigerator is detachably connected and electrically connected with a first electrode and a second electrode, when the current flows from the first electrode to the second electrode, the first end face is a refrigeration end, and the second end face is a heating end; when the current flows from the second electrode to the first electrode, the first end face is a heating end, and the second end face is a refrigeration end; the box body is provided with a first heat dissipation hole on the side of the semiconductor refrigerator away from the water tank, the second end face of the semiconductor refrigerator is arranged opposite to the first heat dissipation hole, and the semiconductor refrigerator is electrically connected with the main controller.

[0007] Optionally, the box body is detachably connected with a second heat dissipation fan on the side of the second end face of the semiconductor refrigerator, the second heat dissipation fan is arranged opposite to the first heat dissipation hole, and the second heat dissipation fan is electrically connected with the main controller.

[0008] Optionally, the air-cooled heat dissipation assembly comprises a heat dissipation grid, the heat dissipation grid is detachably connected with a heat dissipation pipeline inside, and the heat dissipation pipeline is communicated between the first pipeline and the water tank; one side of the heat dissipation grid is provided with a first heat dissipation fan, the first heat dissipation fan is correspondingly arranged with the heat dissipation pipeline, and the first heat dissipation fan is electrically connected with the main controller.

[0009] Optionally, the box body is provided with an air inlet hole and an air outlet hole on the two sides of the air-cooled heat dissipation assembly respectively, and the air inlet hole, the first heat dissipation fan, the heat dissipation pipeline and the air outlet hole are correspondingly arranged.

[0010] Optionally, the heat dissipation grid comprises a shell, the shell is provided with a heat dissipation cavity inside, the heat dissipation cavity is arranged between the air inlet hole and the air outlet hole; the heat dissipation pipeline is arranged in the heat dissipation cavity in layers in an up-down direction, and adjacent layers of the heat dissipation pipeline are arranged in a staggered manner in the horizontal direction.

[0011] Optionally, the shell is detachably connected with a grid plate on the two sides of the heat dissipation cavity close to the air inlet hole and the air outlet hole respectively, and a plurality of ventilation holes are arranged on the grid plate.

[0012] Optionally, the box body and the cold and hot compress part are detachably connected with an extension pipeline, and a through hole is arranged in the extension pipeline; the box body is detachably connected with a first plug-in interface, the first plug-in interface comprises a first water outlet and a first water inlet, the first water outlet is communicated with the water outlet end of the water tank, and the first water inlet is communicated with the water inlet end of the air-cooled heat dissipation assembly; the first water outlet and the first water inlet of the first plug-in interface are communicated with the water inlet end and the water outlet end of the first pipeline through the through hole respectively.

[0013] Optionally, a groove for placing a human body part is arranged on the cold and hot compress side of the cold and hot compress body, and the first temperature sensor is arranged at the bottom of the groove.

[0014] Optionally, a mounting cavity extending along a direction is arranged inside the box body, the water tank and the air-cooled heat dissipation assembly are arranged side by side in the mounting cavity, and the first heat dissipation hole and the air inlet hole are arranged on the same side of the box body; the volume of the water tank is smaller than the volume of the heat dissipation grid.

[0015] Compared with the prior art, the utility model has the advantages and technical effects as follows:

[0016] The utility model discloses two kinds of working modes, be hot compress and cold compress respectively, when cold compress, make the fluid medium of pipeline flow through water pump, the cold and hot compress body in cold and hot compress part carries out cooling through first pipeline, and the cold and hot compress body contacts with the part to be cold compress and exchanges heat with the part to be cold compress, and the temperature of the fluid medium in first pipeline rises when cooling the part to be cold compress, and the fluid medium after temperature rise carries out heat dissipation through air-cooled heat dissipation assembly, and the temperature of fluid medium is reduced initially, and the fluid medium after temperature reduction flows into the water tank, and the semiconductor refrigeration assembly refrigerates, and the temperature of output end is reduced, and the output end of semiconductor refrigeration assembly contacts with the water tank and exchanges heat, and the temperature of fluid medium is reduced further, and the fluid medium after temperature reduction flows to first pipeline in cold and hot compress part, and the part to be cold compress is cooled.

[0017] When hot compress, close air-cooled heat dissipation assembly, make the fluid medium of pipeline flow through water pump, the cold and hot compress body in cold and hot compress part carries out heating through first pipeline, and the cold and hot compress body contacts with the part to be hot compress and exchanges heat with the part to be hot compress, and the temperature of the fluid medium in first pipeline reduces when heating the part to be hot compress, and the fluid medium after temperature reduction flows through air-cooled heat dissipation assembly but does not exchange heat with air-cooled heat dissipation assembly, and then flows into the water tank, and the semiconductor refrigeration assembly works, and the temperature of output end is improved, and the output end of semiconductor refrigeration assembly contacts with the water tank and exchanges heat, and the temperature of fluid medium in water tank is improved, and the fluid medium after temperature rise flows to first pipeline in cold and hot compress part, and the part to be hot compress is heated.

[0018] Meanwhile, the utility model obtains the temperature in the cold and hot compress body through first temperature sensor, and obtains the temperature of fluid medium in water tank through second temperature sensor, and the main controller in temperature control component controls the air speed of air-cooled heat dissipation assembly, controls the refrigerating capacity of semiconductor refrigeration assembly and controls the flow of water pump to pump fluid according to the temperature information of first temperature sensor and second temperature sensor, thereby the temperature and flow of fluid medium flowing into first pipeline are regulated and controlled, thereby the temperature of cold and hot compress body is controlled accurately, and there is no case of hot and cold, and stable low temperature is maintained continuously. BRIEF DESCRIPTION OF DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present application or the prior art, the drawings needed in the embodiments will be briefly introduced as follows. Obviously, the drawings in the following description only constitute some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained from these drawings without creative labor.

[0020] Figure 1 Structure diagram of the semiconductor cold and hot compress equipment of the present application;

[0021] Figure 2 Structure diagram of the semiconductor cold and hot compress equipment of the present application from another perspective;

[0022] Figure 3 Structure diagram of the box interior of the present application;

[0023] Figure 4 Structure diagram of the box interior of the present application from another perspective;

[0024] Figure 5 Structure diagram of the air-cooled heat dissipation assembly of the present application;

[0025] Figure 6 Structure diagram of the air-cooled heat dissipation assembly of the present application;

[0026] Figure 7 Structure diagram of the cold compress part of the present application;

[0027] Figure 8 Structure diagram of another cold compress part of the present application;

[0028] Figure 9 Structure diagram of another cold compress part of the present application;

[0029] 1, cold compress part, 11, cold compress body, 12, first pipeline, 13, groove, 2, box, 21, first heat dissipation hole, 22, air inlet hole, 23, air outlet hole, 3, air-cooled heat dissipation assembly, 31, heat dissipation grid, 311, shell, 312, heat dissipation cavity, 313, grid plate, 32, heat dissipation pipeline, 33, first heat dissipation fan, 4, water tank, 5, water pump, 6, semiconductor refrigeration assembly, 61, semiconductor refrigerator, 62, second heat dissipation fan, 7, extension pipeline, 8, external power supply. DETAILED DESCRIPTION

[0030] It should be noted that the embodiments in the utility model and the features in the embodiments can be combined with each other in the case of no conflict. The described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. All other embodiments obtained by the person skilled in the art without creative labor belong to the protection scope of the utility model. The utility model will be described in detail below with reference to the drawings and in combination with the embodiments.

[0031] Referring to the drawings Figures 1-9 The utility model provides a cold and hot integrated semiconductor cold and hot compress equipment, including cold compress part 1, box 2 and temperature control assembly, cold compress part 1 includes cold compress body 11, the first pipeline 12 is detachably connected in cold compress body 11, and the first temperature sensor is arranged in cold compress body 11, the inside detachably connected with air cooling heat dissipation assembly 3 and water tank 4 is arranged in box 2, and air cooling heat dissipation assembly 3 and water tank 4 are communicated through pipeline, and water pump 5 is arranged on the pipeline, the water outlet end of first pipeline 12 and the water inlet end of air cooling heat dissipation assembly 3 are detachably connected with the water outlet end of water tank 4 and are communicated, and the water tank 4 is detachably connected with semiconductor refrigeration assembly 6 on one side of box 2, the output end of semiconductor refrigeration assembly 6 is in contact with water tank 4, and the output end of semiconductor refrigeration assembly 6 is divided into heating end and refrigeration end according to the direction of current flowing through semiconductor refrigeration assembly 6, and the second temperature sensor is arranged in water tank 4.

[0032] Temperature control assembly includes main control unit, first temperature sensor, second temperature sensor, air cooling heat dissipation assembly 3, semiconductor refrigeration assembly 6 and water pump 5 are electrically connected with main control unit, and main control unit receives the temperature information fed back by first temperature sensor and second temperature sensor, controls the air velocity of air cooling heat dissipation assembly 3, controls the refrigerating capacity of semiconductor refrigeration assembly 6, and controls the flow of water pump 5. Main control unit can adopt such as STM32, ESP32, and main control unit is used to receive temperature signal, control each executor and realize logic control.

[0033] The utility model discloses two kinds of working modes, be hot compress and cold compress respectively, when cold compress, make the fluid medium in the pipeline flow through water pump 5, and the cold and hot compress body 11 in cold and hot compress part 1 carries out cooling through the first pipeline 12, and the cold and hot compress body 11 contacts with the part to be cold compress and exchanges heat with it, and the fluid medium temperature in the first pipeline 12 rises when cooling the part to be cold compress, and the fluid medium after temperature rise carries out heat dissipation through the air cooling heat dissipation subassembly 3, and the temperature of fluid medium is reduced initially, and the fluid medium after temperature reduction flows into the water tank 4, and semiconductor refrigeration subassembly 6 works, and the temperature of output end is reduced, and the output end of semiconductor refrigeration subassembly 6 contacts with the water tank 4 and exchanges heat, and the temperature of fluid medium in the water tank 4 is further reduced, and the fluid medium after temperature reduction flows to the first pipeline 12 in cold and hot compress part 1, and the part to be cold compress is cooled down.

[0034] When hot compress, close the air cooling heat dissipation subassembly, make the fluid medium in the pipeline flow through water pump 5, and the cold and hot compress body 11 in cold and hot compress part 1 carries out heating through the first pipeline 12, and the cold and hot compress body 11 contacts with the part to be hot compress and exchanges heat with it, and the fluid medium temperature in the first pipeline 12 reduces when heating the part to be hot compress, and the fluid medium after temperature reduction flows through the air cooling heat dissipation subassembly 3 but does not exchange heat with it, and then flows into the water tank 4, and semiconductor refrigeration subassembly 6 works, and the temperature of output end is improved, and the output end of semiconductor refrigeration subassembly 6 contacts with the water tank 4 and exchanges heat, and the temperature of fluid medium in the water tank 4 is improved, and the fluid medium after temperature rise flows to the first pipeline 12 in cold and hot compress part 1, and the part to be hot compress is heated up. Meanwhile, the utility model discloses the temperature inside cold and hot compress body 11 through first temperature sensor, and the temperature of fluid medium in the water tank 4 through second temperature sensor, and the main controller in temperature control component according to the temperature information of first temperature sensor and second temperature sensor feedback, control the refrigerating capacity of semiconductor refrigeration subassembly 6 and control the flow of fluid that water pump 5 pumps, thereby regulate and control the temperature and flow of fluid that flow into the first pipeline 12, thereby accurately control the temperature of cold and hot compress body 11, there is no case of hot and cold, guarantee the hot compress effect, and can continuously maintain stable temperature.

[0035] Further optimization scheme, the semiconductor refrigeration assembly 6 includes a semiconductor refrigerator 61, the semiconductor refrigerator 61 includes oppositely arranged first end face and second end face, the first end face is the output end;Semiconductor refrigerator 61 can be detachably connected and electrically connected with first electrode and second electrode, when the current flows from the first electrode to the second electrode, the first end face is the refrigeration end, and the second end face is the heating end;When the current flows from the second electrode to the first electrode, the first end face is the heating end, and the second end face is the refrigeration end;The first heat dissipation hole 21 is arranged on the side of the box body 2 away from the water tank 4, the second end face of the semiconductor refrigerator 61 is arranged opposite to the first heat dissipation hole 21, and the semiconductor refrigerator 61 is electrically connected with the main controller. In the cold compress working mode of the embodiment, the current flows from the first electrode to the second electrode, the first end face is the refrigeration end, and the second end face is the heating end, and since the first end face is the output end, the refrigeration end of the semiconductor refrigerator 61 is in contact with the water tank 4 and exchanges heat, so that the temperature of the fluid medium in the water tank 4 is reduced, and the heat of the second end face of the semiconductor refrigerator 61 is dissipated through the first heat dissipation hole 21. In the hot compress working mode of the embodiment, the current flows from the second electrode to the first electrode, the first end face is the heating end, and the second end face is the refrigeration end, and since the first end face is the output end, the heating end of the semiconductor refrigerator 61 is in contact with the water tank 4 and exchanges heat, so that the temperature of the fluid medium in the water tank 4 is increased. The semiconductor refrigerator 61 is a prior art, which refers to a device for obtaining cold energy by using the thermoelectric effect of a semiconductor, also known as a thermoelectric refrigerator. A conductor is connected between two different metals, and when a direct current is connected, the temperature at one junction is reduced, and the temperature at the other junction is increased. In the embodiment, the amount of refrigeration or heating of the semiconductor refrigerator 61 is controlled by controlling the size of the current supplied to the semiconductor refrigerator 61. Compared with the compressor refrigeration structure, the semiconductor refrigerator 61 occupies smaller space, weighs less and has faster refrigeration rate. The semiconductor refrigerator 61 uses a single thermoelectric module (such as a Peltier device) as a cold heat source, and controls the direction of the supply current by means of an H-bridge or equivalent circuit, so as to realize the role switching of the cold end and the hot end of the thermoelectric module, thereby realizing the cold and hot dual function output on the same skin surface. Compared with the traditional cold and hot end split type design, the structure is compact, the response is rapid, the cold and hot mode can be quickly switched without turning over or replacing parts, the control circuit is simple, the temperature regulation is more accurate, and the integration and portable application are convenient. The semiconductor refrigerator 61 is electrically connected with an H-bridge control circuit: the H-bridge control circuit realizes the cold and hot mode switching by changing the supply polarity.

[0036] In the utility model, in cold compress, first end surface cooling, namely output end cooling, be called refrigeration end, in hot compress, first end surface heating, namely output end heating, be called heating end. But the heating capacity and refrigeration capacity belong to the same concept, both are interchangeable, namely the refrigeration capacity or heating capacity of semiconductor refrigeration assembly 6 refers to the amount of energy transferred by semiconductor refrigeration assembly 6 per unit time, the difference between the two is that: the temperature of the first end surface is increased or decreased more clearly.

[0037] Preferably, the box 2 is detachably connected with the second heat dissipation fan 62 on the second end surface side of the semiconductor refrigerator 61, the second heat dissipation fan 62 is arranged opposite to the first heat dissipation hole 21, and the second heat dissipation fan 62 is electrically connected with the main controller. In the embodiment, the second heat dissipation fan 62 drives the air flow on the second end surface side of the semiconductor refrigerator 61, drives the heat of the second end surface of the semiconductor refrigerator 61 to be dissipated through the first heat dissipation hole 21, prevents the temperature of the second end surface of the semiconductor refrigerator 61 from being too high, ensures that the semiconductor refrigerator 61 can normally refrigerate, and the temperature of the second end surface of the semiconductor refrigerator 61 can be controlled by controlling the rotating speed of the second heat dissipation fan 62, thereby controlling the refrigeration effect of the semiconductor refrigerator 61.

[0038] Further optimization scheme, the air-cooled heat dissipation assembly 3 includes a heat dissipation grille 31, the heat dissipation grille 31 is detachably connected with a heat dissipation pipeline 32, and the heat dissipation pipeline 32 is communicated between the first pipeline 12 and the water tank 4; One side of the heat dissipation grille 31 is provided with a first heat dissipation fan 33, the first heat dissipation fan 33 is correspondingly arranged with the heat dissipation pipeline 32, and the first heat dissipation fan 33 is electrically connected with the main controller. In the embodiment, the fluid medium in the heat dissipation pipeline 32 exchanges heat with the pipeline wall, the pipeline wall exchanges heat with the surrounding air, and when the air flow around the heat dissipation pipeline 32 in the heat dissipation grille 31 is driven by the first heat dissipation fan 33, the heat of the part will be moved, thereby achieving the effect of heat dissipation, and the heat dissipation effect of the first heat dissipation fan 33 can be controlled by controlling the rotating speed of the first heat dissipation fan 33, thereby controlling the flow rate of the air flow and reducing the temperature of the fluid medium in the heat dissipation pipeline 32. In the embodiment, the heat dissipation effect of the fluid medium in the heat dissipation pipeline 32 is controlled by adjusting the rotating speed of the first heat dissipation fan 33, thereby controlling the temperature of the fluid medium in the heat dissipation pipeline 32.

[0039] Preferably, the box 2 is detachably connected with the second heat dissipation fan 62 on the second end surface side of the semiconductor refrigerator 61, the second heat dissipation fan 62 is arranged opposite to the first heat dissipation hole 21, and the second heat dissipation fan 62 is electrically connected with the main controller. In the embodiment, the second heat dissipation fan 62 drives the air flow on the second end surface side of the semiconductor refrigerator 61, drives the heat of the second end surface of the semiconductor refrigerator 61 to be dissipated through the first heat dissipation hole 21, prevents the temperature of the second end surface of the semiconductor refrigerator 61 from being too high, ensures that the semiconductor refrigerator 61 can normally refrigerate, and the temperature of the second end surface of the semiconductor refrigerator 61 can be controlled by controlling the rotating speed of the second heat dissipation fan 62, thereby controlling the refrigeration effect of the semiconductor refrigerator 61.

[0040] Further optimization scheme, the heat dissipation grid 31 comprises a shell 311, the shell 311 is internally provided with a heat dissipation cavity 312, the heat dissipation cavity 312 is arranged between the air inlet hole 22 and the air outlet hole 23;The heat dissipation pipe 32 is arranged in the heat dissipation cavity 312 in layers and meanders up and down, and the adjacent layer structure of the heat dissipation pipe 32 is staggered in the horizontal direction. The heat dissipation pipe 32 in the embodiment is arranged in the heat dissipation cavity 312 in layers and meanders up and down, and the adjacent layer structure of the heat dissipation pipe 32 is staggered in the horizontal direction, which increases the length of the heat dissipation pipe 32 in the heat dissipation cavity 312, thereby expanding the heat dissipation area of the heat dissipation pipe 32, and improving the heat dissipation effect of the first heat dissipation fan 33 on the heat dissipation pipe 32.

[0041] Preferably, the shell 311 is detachably connected with a grid plate 313 on both sides of the heat dissipation cavity 312 close to the air inlet hole 22 and the air outlet hole 23, and a plurality of ventilation holes are arranged on the grid plate 313. The heat dissipation cavity 312 is divided from other spaces of the box body 2 by the grid plate 313, so as to prevent the components in other spaces of the box body 2 from falling into the heat dissipation cavity 312 and damaging the heat dissipation pipe 32, and the ventilation holes can ensure the normal flow of air. In the embodiment, the heat dissipation pipe 32 is made of copper pipe, and the heat dissipation effect of the copper pipe is better than that of the heat dissipation pipe made of other materials. The fluid medium can be gas, liquid, etc., and the fluid medium is preferably water. Water as a fluid medium is low in price, and leakage will not affect personal safety.

[0042] Preferably, the box body 2 and the cold and hot compress part 1 are detachably connected with an extension pipe 7, and the extension pipe 7 is provided with a through hole;The box body 2 is detachably connected with a first plug-in port, and the first plug-in port comprises a first water outlet and a first water inlet, the first water outlet is communicated with the water outlet end of the water tank 4, and the first water inlet is communicated with the water inlet end of the air-cooled heat dissipation assembly 3;The first water outlet and the first water inlet of the first plug-in port are communicated with the water inlet end and the water outlet end of the first pipeline 12 through the through hole. In the embodiment, the extension pipe 7 is detachably connected and communicated between the box body 2 and the cold and hot compress part 1, the water inlet end and the water outlet end of the first pipeline 12 are communicated with the water outlet end of the water tank 4 and the water inlet end of the air-cooled heat dissipation assembly 3 through the through hole in the extension pipe 7, and the distance between the box body 2 and the cold and hot compress part 1 can be increased at the same time. When the cold and hot compress part 1 is used for cold and hot compressing different parts, the box body 2 does not need to be dragged.

[0043] Preferably, the cold compress side of the cold compress body 11 is provided with a groove 13 for placing the human body part, and the first temperature sensor is arranged at the bottom of the groove 13. In this embodiment, the cold compress part 1 can be selected in different shapes to adapt to different parts of the human body. The cold compress side of the cold compress body 11 is provided with a groove 13 for placing the human body part, so that the part to be cold compressed is more closely attached to the cold compress body 11, and the cold compress effect is better; and the first temperature sensor is arranged at the bottom of the groove 13, so that the first temperature sensor can measure more accurate temperature of the cold compress body 11.

[0044] Preferably, the box body 2 is internally provided with a mounting cavity arranged along the extending direction, the water tank 4 and the air-cooled heat dissipation assembly 3 are arranged side by side in the mounting cavity, and the first heat dissipation hole 21 and the air inlet hole 22 are arranged on the same side of the box body 2; the volume of the water tank 4 is smaller than the volume of the heat dissipation grid 31. In this embodiment, the water tank 4 is of a closed structure, and only some pipeline openings for pipeline communication are provided. In this embodiment, the volume of the water tank 4 is controlled to be smaller than the volume of the heat dissipation grid 31, so as to reduce the required volume of the box body 2, reduce the capacity of the water tank 4, and further reduce the refrigeration capacity of the semiconductor refrigeration assembly 6, so as to more easily control the temperature of the fluid medium in the water tank 4. After the volume of the box body 2 is reduced, it is more convenient to carry. In this embodiment, the cold and hot integrated semiconductor cold compress device further comprises a circuit board, the main controller is arranged on the circuit board, the circuit board is provided with a switch, and the circuit board is detachably connected with the external power supply 8 through a power line and forms electrical conduction; the water pump 5, the first heat dissipation fan 33, the semiconductor refrigerator 61, the second heat dissipation fan 62, the main controller and the like are in electrical conduction with the circuit board, and are used to supply power to the electrical components. The external power supply 8 can be a battery or a 12V power supply unit, which provides a portable low-voltage power supply required by the device.

[0045] The above description of the embodiments is only used to help understand the method and its core idea; meanwhile, for those skilled in the art, according to the idea of the present application, the specific implementation and application range can be changed, and the above description should not be understood as a limitation of the present application.

[0046] It should be understood that the term "and / or" used herein only describes the association relationship of the associated objects, which means that there can be three relationships, for example, A and / or B, which means that there are three cases of A alone, A and B together, and B alone. In addition, the character " / " herein generally represents an "or" relationship between the front and rear associated objects.

[0047] In the description of the utility model, need understanding is, the term "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and so on indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawing, just for the convenience of describing the utility model, and it is not indicated or implied that the indicated device or element must have a particular orientation, a particular orientation and operation, so it can not be understood as a limitation on the utility model.

[0048] The above-described embodiments are merely preferred modes of the utility model, and do not limit the scope of the utility model, and various modifications and improvements to the technical solutions of the utility model made by those skilled in the art without departing from the design spirit of the utility model shall fall within the protection scope of the utility model claimed.

Claims

1. A cold and hot integrated semiconductor cold and hot compress device, characterized in that, Include: Cold compress part (1), the cold compress part (1) includes cold compress body (11), the first pipeline (12) is detachably connected inside the cold compress body (11), the first temperature sensor is provided in the cold compress body (11) inside; Box (2), the box (2) is detachably connected with air cooling heat dissipation assembly (3) and water tank (4) inside, the air cooling heat dissipation assembly (3) and water tank (4) are communicated by pipeline, and the water pump (5) is arranged on the pipeline;The water inlet end and the water outlet end of the first pipeline (12) are detachably connected with the water outlet end of the water tank (4) and the water inlet end of the air cooling heat dissipation assembly (3) and are communicated;The semiconductor refrigeration assembly (6) is detachably connected on one side of the water tank (4) of the box (2), the output end of the semiconductor refrigeration assembly (6) is in contact with the water tank (4), and the output end of the semiconductor refrigeration assembly (6) is divided into heating end and refrigeration end according to the direction of current flowing through the semiconductor refrigeration assembly (6), and the second temperature sensor is arranged in the water tank (4); Temperature control assembly, the temperature control assembly includes a main controller, the first temperature sensor, the second temperature sensor, the air cooling heat dissipation assembly (3), the semiconductor refrigeration assembly (6) and the water pump (5) are electrically connected with the main controller;The main controller receives the temperature information fed back by the first temperature sensor and the second temperature sensor, controls the air speed of the air cooling heat dissipation assembly (3), controls the refrigeration capacity of the semiconductor refrigeration assembly (6), and controls the flow of the water pump (5) pumped fluid.

2. The cold and hot integrated semiconductor cold and hot compress device according to claim 1, characterized in that, The semiconductor refrigeration assembly (6) includes a semiconductor refrigerator (61), the semiconductor refrigerator (61) includes oppositely arranged first and second end faces, and the first end face is the output end;The semiconductor refrigerator (61) is detachably connected and electrically connected with the first electrode and the second electrode, when the current flows from the first electrode to the second electrode, the first end face is the refrigeration end, and the second end face is the heating end;When the current flows from the second electrode to the first electrode, the first end face is the heating end, and the second end face is the refrigeration end;The first heat dissipation hole (21) is arranged on the side of the box (2) away from the water tank (4) of the semiconductor refrigerator (61), the second end face of the semiconductor refrigerator (61) is arranged opposite to the first heat dissipation hole (21), and the semiconductor refrigerator (61) is electrically connected with the main controller.

3. The cold and hot integrated semiconductor cold and hot compress device according to claim 2, characterized in that, The second heat dissipation fan (62) is detachably connected on the side of the second end face of the semiconductor refrigerator (61) of the box (2), the second heat dissipation fan (62) is arranged opposite to the first heat dissipation hole (21), and the second heat dissipation fan (62) is electrically connected with the main controller.

4. The cold and hot integrated semiconductor cold and hot compress device according to claim 2, characterized in that, The air-cooled heat dissipation assembly (3) comprises a heat dissipation grille (31), the heat dissipation grille (31) is detachably connected with a heat dissipation pipeline (32) inside, the heat dissipation pipeline (32) is communicated between the first pipeline (12) and the water tank (4); a first heat dissipation fan (33) is arranged on one side of the heat dissipation grille (31), the first heat dissipation fan (33) is correspondingly arranged with the heat dissipation pipeline (32), and the first heat dissipation fan (33) is electrically connected with the main controller.

5. The cold and hot integrated semiconductor cold and hot compress device according to claim 4, characterized in that, The box (2) is provided with an air inlet hole (22) and an air outlet hole (23) on both sides of the air-cooled heat dissipation assembly (3), and the air inlet hole (22), the first heat dissipation fan (33), the heat dissipation pipeline (32) and the air outlet hole (23) are correspondingly arranged.

6. The cold and hot integrated semiconductor cold and hot compress device according to claim 5, characterized in that, The heat dissipation grille (31) comprises a shell (311), a heat dissipation cavity (312) is arranged in the shell (311), the heat dissipation cavity (312) is arranged between the air inlet hole (22) and the air outlet hole (23); the heat dissipation pipeline (32) is arranged in the heat dissipation cavity (312) in layers from top to bottom, and adjacent layers of the heat dissipation pipeline (32) are arranged in a staggered manner in the horizontal direction.

7. The cold and hot integrated semiconductor cold and hot compress device according to claim 6, characterized in that, The shell (311) is detachably connected with a grille plate (313) on both sides of the heat dissipation cavity (312) close to the air inlet hole (22) and the air outlet hole (23), and a plurality of ventilation holes are arranged on the grille plate (313). 8.The cold and hot integrated semiconductor cold and hot compress device according to claim 1, wherein, The box (2) and the cold and hot compress part (1) are detachably connected with an extension pipeline (7), and the extension pipeline (7) is provided with a through hole; the box (2) is detachably connected with a first plug-in interface, the first plug-in interface comprises a first water outlet and a first water inlet, the first water outlet is communicated with a water outlet end of the water tank (4), and the first water inlet is communicated with a water inlet end of the air-cooled heat dissipation assembly (3); the first water outlet and the first water inlet of the first plug-in interface are communicated with the water inlet end and the water outlet end of the first pipeline (12) through the through hole. 9.The cold and hot integrated semiconductor cold and hot compress device according to claim 1, wherein, The cold and hot compress side of the cold and hot compress body (11) is provided with a groove (13) for placing a human body part, and the first temperature sensor is arranged at the bottom of the groove (13). 10.The cold and hot integrated semiconductor cold and hot compress device according to claim 5, characterized in that, The box (2) is provided with a mounting cavity arranged in the extension direction inside, the water tank (4) and the air-cooled heat dissipation assembly (3) are arranged side by side in the mounting cavity, and the first heat dissipation hole (21) and the air inlet hole (22) are arranged on the same side of the box (2); the volume of the water tank (4) is smaller than the volume of the heat dissipation grille (31).

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