Chip sorting machine

Abstract

The utility model relates to the technical field of automation equipment, and discloses a chip sorting machine, which is characterized in that a first photoelectric sensing module is additionally arranged and is designed to directly face a placement position, so that the placement state of a chip can be monitored, that is, when no chip is detected on the placement position or the chip is obliquely placed, a sensing signal is sent out; therefore, corresponding correction measures can be taken in time. The design ensures the accuracy and reliability of the test process, effectively avoids test failure, blanking failure or chip damage caused by chip omission or improper placement, and is beneficial to smooth proceeding of the test process and stable improvement of product quality.

Description

Technical Field

[0001] This utility model relates to the field of automation equipment technology, and in particular to a chip sorting machine. Background Technology

[0002] The quality testing stage of a chip, as a core component of the entire chip production line, plays a crucial role. It not only effectively provides feedback on product quality information and offers detailed data support to production personnel, but also facilitates their timely and accurate understanding of the actual situation at each production stage, thereby ensuring the smooth operation of the entire production process. For this reason, the importance of quality testing technology in the production line is increasingly prominent, and its significance is self-evident.

[0003] In existing chip testing processes, after the testing equipment completes the chip test, the tested chip must be transferred back to a carrier. Subsequently, a conveyor mechanism is responsible for moving the carrier and the chip on it, ultimately completing the unloading operation. However, this crucial step of chip transfer presents numerous potential risks and problems.

[0004] Specifically, chips may be missed during the transfer process due to failure to be successfully picked up, accidentally dropped during transport, or misplaced when returned to the carrier and not detected in time. These situations will all result in gaps or improper placement of chips on the carrier. This series of problems will undoubtedly have a serious impact on the chip unloading process.

[0005] For example, when a sorting robot attempts to pick up chips to be unloaded, if the chips are not placed properly, the robot may fail to pick them up accurately and stably, leading to a failure. More seriously, this inaccurate picking may also damage the chips, further reducing the product yield and production efficiency.

[0006] Furthermore, if missing or misplaced chips are not detected and corrected in a timely and effective manner, it can trigger a series of chain reactions. For example, when testing the next batch of chips, the omission or abnormal fall of one or more chips from the previous batch may cause the testing equipment to malfunction, thereby affecting the efficiency and accuracy of the testing.

[0007] Therefore, these issues in the chip transfer process must be taken very seriously, and effective measures must be taken to resolve them in order to ensure the smooth operation of the entire chip production line and the stable improvement of product quality.

[0008] The above information is provided as background information only to aid in understanding this disclosure and does not constitute an assertion or admission that any of the above content can be used as prior art relative to this disclosure. Utility Model Content

[0009] This invention provides a chip sorting machine to solve the problems existing in the prior art.

[0010] To achieve the above objectives, this utility model provides the following technical solution:

[0011] A chip sorting machine includes a worktable, wherein the worktable is divided into a test area according to the processing area;

[0012] The test area includes a third conveying mechanism, a carrier, a test transfer robot, a test mechanism, and a first photoelectric sensing module;

[0013] The carrier is mounted on the third conveying mechanism and has a placement position for placing the chip.

[0014] The third conveying mechanism is used to convey the carrier and the chip to be tested located therein to the testing mechanism, and to convey the carrier and the tested chip located therein, and wait for unloading.

[0015] The test transfer robot is positioned between the third conveying mechanism and the test mechanism, and is used to transfer the chip between the carrier and the test mechanism;

[0016] The testing apparatus is used to test the chip;

[0017] The first photoelectric sensing module is positioned directly opposite the placement location and can emit a sensing signal when there is no chip at the placement location or when the chip is placed crookedly.

[0018] Furthermore, in the chip sorting machine, there are two first photoelectric sensing modules;

[0019] One of the first photoelectric sensing modules is arranged parallel to the third conveying mechanism and is directly facing the placement position in the horizontal direction. It can emit a sensing signal when there is no chip at the placement position or when the chip is placed crookedly.

[0020] Another of the first photoelectric sensing modules is arranged perpendicular to the third conveying mechanism and is directly facing the placement position in the vertical direction. It can emit a sensing signal when there is no chip at the placement position or when the chip is placed crookedly.

[0021] Furthermore, in the chip sorting machine, the first photoelectric sensing module includes a light-emitting module and a light-receiving module symmetrically arranged;

[0022] The light-emitting module is used to emit sensor light;

[0023] The light receiving module receives the sensed light emitted by the light emitting module;

[0024] When there is no chip in the placement position or the chip is tilted, the light receiving module can receive the sensing light emitted by the light emitting module;

[0025] When there is a chip in the placement position or the chip is not tilted, the light receiving module cannot receive the sensing light emitted by the light emitting module due to the obstruction of the chip.

[0026] Furthermore, in the chip sorting machine, the placement position is provided with a clearance opening through which the sensing light emitted by the light-emitting module can pass.

[0027] Furthermore, in the chip sorting machine, there are two third conveying mechanisms;

[0028] The two third transmission mechanisms are arranged side by side on both sides of the test mechanism.

[0029] Furthermore, in the chip sorting machine, the workbench is further divided into a full tray loading area, an empty tray recycling area, and a sorting and unloading area according to the processing area;

[0030] The full tray loading area is used to store several trays loaded with chips to be tested;

[0031] A chip transfer robot is provided between the full tray loading area and the testing area. The chip transfer robot is used to transfer the chip in the tray to the testing area.

[0032] The empty Tray recycling area is used to recycle the empty Tray after the chips have been transferred;

[0033] The test area is used to test the transferred chips;

[0034] A sorting robot is provided between the testing area and the sorting and unloading area. The sorting robot is used to transfer the tested chips to the sorting and unloading area.

[0035] The sorting and unloading area is used to store several empty trays, some of which are used to load chips that have passed the test and are considered good, while others are used to load chips that have failed the test.

[0036] Furthermore, the chip sorting machine also includes an empty tray transfer robot;

[0037] The empty Tray transfer robot can move within the full Tray loading area, the empty Tray recycling area, and the sorting and unloading area. It is used to transfer the empty Tray after the transferred chips are loaded from the full Tray loading area to the empty Tray recycling area for recycling and storage. It is also used to transfer the empty Tray after the transferred chips are loaded from the full Tray loading area to the sorting and unloading area to load the tested chips.

[0038] Furthermore, in the chip sorting machine, the sorting and unloading area includes a good product unloading area and a defective product unloading area;

[0039] The defective product unloading area is divided into several classification areas according to the defect type of the chip. Each classification area corresponds to an empty tray for loading chips of different defect types.

[0040] Furthermore, in the chip sorting machine, the chip transfer robot, the sorting robot, and the empty tray transfer robot are all robots with suction head pitch adjustment function.

[0041] Furthermore, in the chip sorting machine, the chip transfer robot, the sorting robot, and the empty Tray transfer robot all include a moving mechanism, a mounting frame, several pitch adjustment modules, and several suction heads;

[0042] The active mechanism is used to provide movement in multiple directions;

[0043] The mounting frame is disposed on the movable mechanism and is used to provide a mounting base for the plurality of pitch adjustment modules;

[0044] One of the suction heads is mounted on a pitch adjustment module and can move under the drive of the pitch adjustment module to adjust the distance between the suction heads.

[0045] Compared with the prior art, the present invention has the following beneficial effects:

[0046] This utility model provides a chip sorting machine that, by adding a first photoelectric sensing module and designing the first photoelectric sensing module to face the placement position, enables monitoring of the chip placement status. Specifically, when a chip is detected as missing or misaligned, a sensing signal is emitted, allowing for timely corrective measures. This design ensures the accuracy and reliability of the testing process, effectively avoiding test failures, unloading failures, or chip damage caused by missing or improperly placed chips, thus facilitating smooth testing and stable improvement in product quality.

[0047] This invention has other features and advantages that will be apparent from or will be set forth in detail in the accompanying drawings and the following detailed description, which together serve to explain the particular principles of this invention. Attached Figure Description

[0048] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0049] Figure 1 This is a top view structural diagram of a chip sorting machine provided in an embodiment of the present invention;

[0050] Figure 2 This is one of the (three-dimensional) structural schematic diagrams of a chip sorting machine provided in this embodiment of the present utility model;

[0051] Figure 3 This is the second (three-dimensional) structural schematic diagram of a chip sorting machine provided in this embodiment of the present invention;

[0052] Figure 4 This is one of the (partial) structural schematic diagrams of the test area provided in this embodiment of the utility model;

[0053] Figure 5 This is the second (partial) structural schematic diagram of the test area provided in this embodiment of the utility model;

[0054] Figure 6 This is a schematic diagram of the structure of the two first photoelectric sensing modules provided in this embodiment of the utility model;

[0055] Figure 7 This is one of the (three-dimensional) structural schematic diagrams of the full Tray loading area, empty Tray recycling area, sorting and unloading area and empty Tray transfer robot provided in this embodiment of the utility model;

[0056] Figure 8 This is the second (three-dimensional) structural schematic diagram of the full Tray loading area, empty Tray recycling area, sorting and unloading area and empty Tray transfer robot provided in this embodiment of the utility model;

[0057] Figure 9 This is a top view structural diagram of the full Tray loading area, empty Tray recycling area, sorting and unloading area, and empty Tray transfer robot provided in this embodiment of the utility model;

[0058] Figure 10 This is a three-dimensional structural diagram of the chip transfer robot, sorting robot, and empty Tray transfer robot provided in this embodiment of the utility model.

[0059] Figure label:

[0060] Workbench 1, Full Tray Loading Area 2, Empty Tray Recycling Area 3, Testing Area 4, Sorting and Unloading Area 5, Chip Transfer Robot 6, Sorting Robot 7, Tray Tray 8, Empty Tray Transfer Robot 9, First Photoelectric Sensing Module 10;

[0061] Light-emitting module 101, light-receiving module 102;

[0062] The third conveying mechanism 401, the carrier 402, the test transfer robot 403, the test mechanism 404, and the placement position 405;

[0063] Good product unloading area 501, defective product unloading area 502;

[0064] The active mechanism 601, the mounting frame 602, several pitch adjustment modules 603, and several suction heads 604. Detailed Implementation

[0065] To illustrate the possible application scenarios, technical principles, implementable specific solutions, and achievable objectives and effects of this application in detail, the following description, in conjunction with the listed specific embodiments and accompanying drawings, provides a detailed explanation. The embodiments described herein are merely illustrative of the technical solutions of this application and are therefore intended to limit the scope of protection of this application.

[0066] In this document, the term "embodiment" means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The term "embodiment" appearing in various places throughout the specification does not necessarily refer to the same embodiment, nor does it specifically limit its independence or connection with other embodiments. In principle, in this application, as long as there are no technical contradictions or conflicts, the technical features mentioned in each embodiment can be combined in any way to form corresponding implementable technical solutions.

[0067] Unless otherwise defined, the technical terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the use of related terms herein is merely for the purpose of describing particular embodiments and is not intended to limit this application.

[0068] In the description of this application, the term "and / or" is used to describe the logical relationship between objects, indicating that three relationships can exist. For example, A and / or B means: A exists, B exists, and A and B exist simultaneously. Additionally, the character " / " in this document generally indicates that the preceding and following objects have an "or" logical relationship.

[0069] In this application, terms such as “first” and “second” are used only to distinguish one entity or operation from another, and do not necessarily require or imply any actual quantity, hierarchy or order relationship between these entities or operations.

[0070] Unless otherwise specified, the use of terms such as “comprising,” “including,” “having,” or other similar expressions in this application is intended to cover non-exclusive inclusion, which does not exclude the presence of additional elements in a process, method, or product that includes the stated elements, such that a process, method, or product that includes a list of elements may include not only those defined elements but also other elements not expressly listed, or elements inherent to such a process, method, or product.

[0071] In this application, expressions such as "greater than", "less than", and "exceeding" are understood to exclude the stated number; expressions such as "above", "below", and "within" are understood to include the stated number. Furthermore, in the description of the embodiments of this application, "multiple" means two or more (including two), and similar expressions related to "multiple" are also understood in this way, such as "multiple groups" and "multiple times", unless otherwise explicitly specified.

[0072] In the description of the embodiments of this application, the space-related expressions used, such as "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "vertical," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," indicate the orientation or positional relationship based on the orientation or positional relationship shown in the specific embodiments or drawings. They are only for the purpose of describing the specific embodiments of this application or for the reader's understanding, and do not indicate or imply that the device or component referred to must have a specific position, a specific orientation, or be constructed or operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0073] Unless otherwise expressly specified or limited, the terms "installation," "connection," "linking," "fixing," and "setting," as used in the description of the embodiments of this application, should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral setting; it can be a mechanical connection, an electrical connection, or a communication connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal connection of two components or the interaction between two components. For those skilled in the art to which this application pertains, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0074] In view of the deficiencies of the existing technology, the applicant, based on years of practical experience and professional knowledge in the design and manufacturing of this field, and in conjunction with the application of theoretical principles, has actively conducted research and innovation in order to create a technology that can solve the deficiencies of the existing technology. After continuous research, design, and repeated prototype production and improvement, this utility model with practical value has finally been created.

[0075] Please refer to Figure 1-5 This utility model provides a chip sorting machine, including a workbench 1, wherein the workbench 1 is divided into a test area 4 according to the processing area;

[0076] Test area 4 is equipped with a complete testing system, which consists of key components such as the third conveying mechanism 401, carrier 402, test transfer robot 403, testing mechanism 404, and first photoelectric sensing module 10. All components work together to ensure the smooth and efficient testing process.

[0077] The carrier 402 is cleverly placed on the third transmission mechanism 401. Its structural design includes a placement position 405 for securely placing the chip, which not only ensures the stability of the chip during transmission but also facilitates subsequent testing operations.

[0078] The third conveying mechanism 401 plays a crucial role. It is responsible for accurately conveying the carrier 402 carrying the chip to be tested to the testing mechanism 404 for performance testing. After the test is completed, it also conveys the carrier 402 carrying the tested chip to the designated position to wait for the next unloading operation. The entire conveying process is efficient and orderly.

[0079] The test transfer robot 403, acting as a bridge connecting the third transfer mechanism 401 and the test mechanism 404, is precisely positioned between the two. Its main function is to enable the rapid and accurate transfer of chips between the carrier 402 and the test mechanism 404, ensuring the continuity and efficiency of the testing process.

[0080] Test chamber 404 is the core of the entire test area, responsible for conducting comprehensive performance tests on the chips sent to it to verify whether the chip's functions and performance meet the preset standards.

[0081] Of particular note is the innovative addition of a first photoelectric sensing module 10 in this embodiment. This module is carefully designed and positioned directly opposite the placement position 405 on the carrier 402. This design enables the first photoelectric sensing module 10 to monitor the status of the chip in the placement position 405 in real time. Once it detects that there is no chip in the placement position 405 or that the chip is misplaced or tilted, it immediately sends a sensing signal to remind the operator or trigger the automatic control system to take corresponding corrective measures.

[0082] The ingenuity of this design lies in its ability to significantly improve the accuracy and reliability of the testing process. It effectively avoids risks such as test failures, unloading failures, or chip damage caused by human factors or mechanical failures, such as chip omissions or improper placement. This provides a strong guarantee for the smooth progress of the testing process and lays a solid foundation for the stable improvement of product quality.

[0083] Please refer to this again. Figure 5 In one embodiment of this invention, the design of the test area 4 is further improved by adding two first photoelectric sensing modules 10. These two first photoelectric sensing modules 10 are cleverly arranged within the test area 4 to achieve comprehensive and accurate monitoring of the chip placement status.

[0084] One of the first photoelectric sensing modules 10 is positioned parallel to the third conveying mechanism 401. Horizontally, it faces the placement position 405 on the carrier 402. The main function of this first photoelectric sensing module 10 is to detect whether a chip is present in the placement position 405 and whether the chip is placed correctly and without misalignment. When the placement position 405 is empty or the chip is improperly placed, the first photoelectric sensing module 10 will immediately emit a sensing signal to indicate that there is an abnormality in the system.

[0085] Another first photoelectric sensing module 10 is positioned perpendicular to the third conveying mechanism 401. Vertically, it also faces the placement position 405. This first photoelectric sensing module 10 monitors the chip's placement status from another angle. It can not only detect the presence of the chip but also further confirm whether the chip is securely placed in the placement position 405 without tilting or falling out. Similarly, when an abnormality is detected, this first photoelectric sensing module 10 will promptly emit a sensing signal.

[0086] By setting up two first photoelectric sensing modules 10 in different directions, the test area 4 in this embodiment achieves comprehensive, three-dimensional monitoring of the chip placement status. This design ensures the accuracy and reliability of the testing process and effectively avoids test failures or equipment damage caused by improper chip placement.

[0087] When the first photoelectric sensing module 10 detects an abnormality, the system immediately receives an alarm signal and can take corresponding corrective measures. For example, the system can pause the testing process, prompting the operator to check and adjust the chip placement; or, the system can automatically adjust the position of the conveyor mechanism to correct chip placement deviations. These measures collectively ensure the smooth progress of the testing process and improve testing efficiency and accuracy.

[0088] In summary, the test area 4 in this embodiment achieves comprehensive monitoring of the chip placement status by adding two first photoelectric sensing modules 10 in different directions.

[0089] Please refer to Figure 6 This embodiment illustrates the detailed structure and design principle of the first photoelectric sensing module 10 through a specific implementation. The first photoelectric sensing module 10 adopts a symmetrical layout, cleverly integrating two core components: a light-emitting module 101 and a light-receiving module 102. These two components cooperate to achieve precise monitoring of the chip placement status.

[0090] The light-emitting module 101, acting as the "eye" of the photoelectric sensing system, is responsible for emitting stable and precise sensing light. This light, like the "line of sight" of the detector, traverses space and points to the placement position 405, providing a foundation for subsequent chip status detection.

[0091] The light receiving module 102 acts as a "receiver," located symmetrically to the light emitting module 101, and is specifically designed to receive the sensed light emitted by the light emitting module 101. The design of the light receiving module 102 ensures effective light capture, providing a reliable signal source for the system's judgment.

[0092] In actual operation, the working principle of the first photoelectric sensing module 10 is simple and efficient. When the placement position 405 is empty, i.e., there is no chip present, or the chip is misplaced or tilted, the sensing light emitted by the light-emitting module 101 will directly reach the light-receiving module 102 without obstruction and be successfully received. This change in signal is immediately recognized by the system as a state where there is no chip in the placement position 405 or the chip is tilted.

[0093] Conversely, when the chip is correctly placed in the placement position 405 and is positioned upright without any tilt, the sensing light emitted by the light-emitting module 101 will be blocked by the chip itself and will not reach the light-receiving module 102. The light-receiving module 102 therefore cannot receive the sensing light, and this signal loss is accurately identified by the system as a normal state where there is a chip in the placement position 405 and the chip is not tilted.

[0094] Through this design, the first photoelectric sensing module 10 can monitor the presence and placement status of the chip in the placement position 405 in real time and accurately, providing strong support for subsequent testing processes. Once an abnormal state is detected, the system can respond quickly and take corresponding corrective measures to ensure the smooth progress of the testing process and the stable improvement of product quality.

[0095] In one specific embodiment of this example, in order to further optimize the working efficiency and accuracy of the first photoelectric sensing module 10, the placement position 405 is carefully designed and a clearance opening is specially provided for the sensing light emitted by the light-emitting module 101 to pass through.

[0096] The design of this clearance opening takes into account the working principle of photoelectric sensing and practical application scenarios. When the light-emitting module 101 emits sensing light, this light needs to pass through a certain space without obstruction in order to accurately reach the light-receiving module 102 to complete signal transmission and reception. The placement position 405, as the area where the chip is placed, directly affects the transmission path of the sensing light due to its structural design.

[0097] By setting up a clearance opening, placement position 405 maintains its original function—securely placing the chip—while also providing a clear path for the sensing light. Thus, if there is a properly positioned chip in placement position 405, even if the sensing light passes through the clearance opening, it will be blocked by the chip and unable to reach the light-receiving module 102. Conversely, if there is no chip in placement position 405, or if the chip is tilted, the sensing light emitted by the light-emitting module 101, after passing through the clearance opening, will not be blocked by the chip and can thus reach the light-receiving module 102.

[0098] Please refer to this again. Figure 4 In one specific embodiment of this invention, the test area 4 is further optimized, wherein the number of third transmission mechanisms 401 is increased to two. These two third transmission mechanisms 401 are arranged side by side on both sides of the test mechanism 404, forming a highly efficient and parallel chip test processing system.

[0099] It should be noted that these two third transmission mechanisms 401 are identical in structure and function, both possessing the ability to smoothly and accurately transmit the carrier 402 and the chip. By being arranged in parallel, these two third transmission mechanisms 401 can operate simultaneously without interfering with each other, thereby greatly improving the overall working efficiency of the test area 4.

[0100] By setting up two parallel third transfer mechanisms 401, the test area 4 in this embodiment achieves parallel processing of chip testing. Specifically, while a chip on one third transfer mechanism 401 is being tested in the test mechanism 404, the other third transfer mechanism 401 can simultaneously perform chip loading or unloading operations. This parallel processing method not only reduces the idle time of the test mechanism 404, but also improves the continuity and smoothness of the entire testing process.

[0101] Furthermore, this parallel arrangement of the third transmission mechanism 401 facilitates future expansion of the test area 4. If further improvements in testing efficiency are required, this can be achieved by adding more third transmission mechanisms 401 and test mechanisms 404, thereby forming a larger and more efficient chip testing system.

[0102] In summary, the test area 4 in this embodiment achieves parallel processing of chip testing by setting up two parallel third transmission mechanisms 401, further improving testing efficiency. This design not only meets the chip industry's demand for efficient and automated testing, but also provides ample room for future expansion and upgrades of the test area 4.

[0103] Please refer to this again. Figure 1-3 and in conjunction with references Figure 7-9 In one embodiment of this example, the workbench 1 is further divided into a full Tray loading area 2, an empty Tray recycling area 3, and a sorting and unloading area 5 according to the processing area.

[0104] The full tray loading area 2 is the starting point of the chip testing process. It is specifically used to store trays 8 that are already loaded with chips to be tested. These trays 8 are pre-loaded with chips to be tested before being sent to the sorter, ready to enter the next stage of testing.

[0105] Between the full tray loading area 2 and the testing area 4, a chip transfer robot 6 is installed. This robot 6 plays a crucial role, responsible for accurately transferring the chips from the trays 8 in the full tray loading area 2 to the testing area 4, preparing them for subsequent testing.

[0106] The empty Tray recycling area 3 is located to one side of the full Tray loading area 2. Its main function is to recycle the empty Trays 8 that have been transferred out of the chips. Timely recycling and processing can ensure the cleanliness and orderliness of the workbench and improve overall work efficiency.

[0107] Between testing area 4 and sorting / unloading area 5, a sorting robot 7 is installed. The task of this sorting robot 7 is to sort the tested chips according to the test results and transfer them to sorting / unloading area 5. This step is a crucial part of the chip testing process, determining the final destination and fate of the chips.

[0108] The sorting and unloading area 5 is used to store several empty trays 8. These empty trays 8 will be divided into two categories according to the test results: one category is used to load chips that have passed the test, and the other category is used to load chips that have failed the test. This classified storage facilitates further processing and manufacturing of the chips.

[0109] This embodiment successfully integrates, mechanizes, and automates the chip loading, testing, and sorting processes by dividing the workbench into a full tray loading area 2, an empty tray recovery area 3, a testing area 4, and a sorting and unloading area 5. Furthermore, it coordinates these areas closely and efficiently using robotic arms. This innovative design not only significantly improves the overall efficiency of chip production, optimizes the production process, and reduces waste and delays, but also saves substantial labor costs, reduces worker workload and stress. Moreover, it injects new momentum and vitality into the sustainable development of the chip manufacturing industry, driving the progress and development of the entire sector.

[0110] Please refer to this again. Figure 7-9 In one specific embodiment of this invention, the chip sorting machine innovatively introduces an empty tray transfer robot 9 based on its original structure. This new component greatly improves the automation level and production efficiency of the chip sorting machine, realizing the automatic transfer and reuse of empty trays 8.

[0111] The empty tray transfer robot 9 is designed to move freely within the full tray loading area 2, the empty tray recovery area 3, and the sorting and unloading area 5. Its multi-axis robot structure gives it the ability to move flexibly in three-dimensional space, enabling it to accurately grasp and place trays 8.

[0112] Specifically, after completing its task in the full Tray loading area 2, the empty Tray transfer robot 9 will pick up the empty Tray disks 8 after the chips have been transferred and accurately transfer them to the empty Tray recycling area 3. In the empty Tray recycling area 3, these empty Tray disks 8 will be recycled and stored for later reuse.

[0113] Meanwhile, the empty tray transfer robot 9 also has the function of transferring empty trays 8 from the full tray loading area 2 to the sorting and unloading area 5. In the sorting and unloading area 5, these empty trays 8 will be used to load the tested chips, thereby realizing the chip sorting and unloading process.

[0114] It is worth noting that the multi-axis robotic arm structure of the empty tray transfer robot 9 is key to its ability to flexibly and accurately complete the aforementioned tasks. This structure not only ensures the stability and accuracy of the tray 8 during the transfer process, but also improves the automation level and production efficiency of the entire chip sorting machine.

[0115] By incorporating an empty tray transfer robot 9, the chip sorting machine in this embodiment achieves automatic transfer and reuse of empty trays 8, reducing manual intervention and improving production efficiency and automation levels. This innovative design not only meets the chip industry's demand for efficient and automated production but also provides new ideas and directions for the future development of chip sorting machines.

[0116] Please refer to Figure 1-3 and in conjunction with references Figure 7-9 This embodiment details an innovative design scheme for the sorting and unloading area 5. In this embodiment, the sorting and unloading area 5 is carefully divided into two main areas: a good product unloading area 501 and a defective product unloading area 502. This design aims to achieve efficient and orderly sorting and unloading of chips.

[0117] The Good Product Unloading Area 501, as the name suggests, is a dedicated area for storing chips that have passed testing and been determined to be good products. Here, the good chips are neatly arranged and stored, ready for subsequent packaging, shipping, or further processing.

[0118] The defective product unloading area 502 embodies a more detailed and professional classification concept. Considering that different defect types of chips may require different processing methods and subsequent processes, the defective product unloading area 502 is further subdivided into several classification areas. Each classification area corresponds to a specific type or category of chip defect, such as poor electrical performance, cosmetic damage, or dimensional mismatch.

[0119] Within these classification areas, empty trays 8 are pre-placed. These trays 8 are designed to securely support the chips, preventing displacement or damage during transportation or storage. When the testing facility identifies a defect in a chip, the system automatically or manually places the chip into the tray 8 within the classification area corresponding to the defect type.

[0120] This design allows for the effective classification and management of defective chips. It not only facilitates subsequent quality analysis, problem tracing, and the development of improvement measures, but also improves production efficiency and resource utilization. Simultaneously, the pre-set empty Tray 8 ensures smooth sorting and unloading, avoiding delays or chaos caused by a lack of support tools.

[0121] In summary, the sorting and unloading area 5 in this embodiment is reasonably designed and fully functional. It not only achieves effective separation of good and defective products, but also provides detailed classification and management of defective products, which provides strong support for the smooth operation of the chip production process and the continuous improvement of product quality.

[0122] In one specific embodiment of this example, the key equipment in the chip transfer process has been innovatively designed, namely, the chip transfer robot 6, the sorting robot 7, and the empty Tray transfer robot 9 are all given the function of adjusting the suction head pitch.

[0123] The introduction of this design concept greatly enhances the flexibility and adaptability of the robotic arm. In traditional chip transfer processes, robotic arms typically only have a fixed nozzle-to-pickup distance, which limits their ability to handle chips of different sizes or arrangements. However, the robotic arm in this embodiment achieves adjustable nozzle-to-pickup distance through a variable nozzle-to-pickup distance adjustment function, thus easily handling various chip transfer requirements.

[0124] Specifically, the chip transfer robot 6 is responsible for transferring chips between the testing area and the unloading area. Since different batches of chips may have different sizes or arrangements, the suction head pitch adjustment function allows the robot to adjust the spacing of the suction heads as needed, ensuring the stability and accuracy of the chips during the transfer process.

[0125] The sorting robot 7 is mainly used during the testing process to remove the tested chips from the testing mechanism and place them in a designated location. Similarly, the adjustable suction head allows the sorting robot 7 to adapt to chips of different sizes, improving sorting efficiency and accuracy.

[0126] The empty tray transfer robot 9 is responsible for transferring empty trays from the storage area to the unloading area for loading defective products or chips awaiting processing. The adjustable suction head position allows the robot to adjust the position and spacing of the suction heads as needed, ensuring stable transfer and accurate placement of the trays.

[0127] In summary, the chip transfer robot 6, sorting robot 7, and empty tray transfer robot 9 in this embodiment all have the function of adjusting the suction head pitch. This innovative design not only improves the flexibility and adaptability of the robot, but also enhances the efficiency and accuracy of the chip transfer process.

[0128] Please refer to Figure 10 In one embodiment of this invention, the chip transfer robot 6, the sorting robot 7, and the empty tray transfer robot 9 are all carefully designed to include four main components: a moving mechanism 601, a mounting frame 602, several pitch adjustment modules 603, and several suction heads 604. These four parts work together to achieve flexible transfer and precise placement of chips in three-dimensional space. Figure 10 The following is an illustration using the chip transfer robot 6 as an example.

[0129] The moving mechanism 601 is the core power source of the chip transfer robot 6, responsible for providing multi-directional movement capabilities. To achieve this function, the moving mechanism 601 can adopt a multi-axis mechanical structure. This structure not only allows for flexible movement in three-dimensional space but also ensures the accuracy and stability of the chip during the transfer process. By precisely controlling the movement trajectory and speed of the moving mechanism 601, the chip transfer robot 6 can accurately grasp and place chips, meeting various complex production needs.

[0130] The mounting frame 602 is mounted on the movable mechanism 601, providing a solid mounting base for several pitch adjustment modules 603. To ensure the lightweight and stability of the mounting frame 602, it can be made of lightweight materials while maintaining sufficient rigidity. In this way, the mounting frame 602 can reduce the weight of the entire chip transfer robot 6, while ensuring the secure mounting and stable operation of the pitch adjustment modules 603 and the suction head 604.

[0131] The variable-pitch adjustment module 603 is a key component of the chip transfer robot 6. It is responsible for driving the suction heads 604 to move and adjust the distance between them. To achieve this function, the variable-pitch adjustment module 603 can employ a precision slide rail and drive motor structure. This structure not only precisely controls the position of the suction heads 604 but also ensures the smoothness and accuracy of their movement. By adjusting the distance between the suction heads 604, the chip transfer robot 6 can accommodate chips of different sizes, improving the adaptability and flexibility of the equipment.

[0132] The suction head 604 is the component of the chip transfer robot 6 that directly contacts the chip, responsible for safely gripping and placing the chip. To achieve this function, the suction head 604 can employ a vacuum suction structure. This structure generates sufficient suction force to ensure that the chip does not detach or become damaged during the transfer process. Simultaneously, the design of the suction head 604 also considers the contact method and force with the chip surface to ensure that the chip is not damaged during gripping and placement.

[0133] In summary, the chip transfer robot 6 in this embodiment, through the ingenious design of the movable mechanism 601, mounting frame 602, variable pitch adjustment module 603, and suction head 604, achieves flexible transfer and precise placement of chips in three-dimensional space. This design improves the efficiency and accuracy of chip transfer.

[0134] Although this application frequently uses terms such as "third transmission mechanism" and "vehicle," the possibility of using other terms is not excluded. These terms are used merely for the convenience of describing and explaining the essence of this utility model; interpreting them as any additional limitation would contradict the spirit of this utility model.

[0135] This utility model provides a chip sorting machine that, by adding a first photoelectric sensing module and designing the first photoelectric sensing module to face the placement position, enables monitoring of the chip placement status. Specifically, when a chip is detected as missing or misaligned, a sensing signal is emitted, allowing for timely corrective action. This design ensures the accuracy and reliability of the testing process, effectively avoiding test failures, unloading failures, or chip damage caused by missing or improperly placed chips. This facilitates the smooth progress of the testing process and the stable improvement of product quality.

[0136] Finally, it should be noted that although the above embodiments have been described in the text and drawings of this application, this should not limit the scope of patent protection of this application. Any technical solutions that are based on the essential concept of this application and utilize the content described in the text and drawings of this application, resulting in equivalent structural or procedural substitutions or modifications, as well as the direct or indirect application of the technical solutions of the above embodiments to other related technical fields, are all included within the scope of patent protection of this application.

Claims

1. A chip handler characterized by, Includes a workbench (1), which is divided into a test area (4) according to the processing area; The test area (4) includes a third conveying mechanism (401), a carrier (402), a test transfer robot (403), a test mechanism (404), and a first photoelectric sensing module (10). The carrier (402) is disposed on the third transmission mechanism (401) and has a placement position (405) for placing the chip. The third conveying mechanism (401) is used to convey the carrier (402) and the chip to be tested located therein to the testing mechanism (404), and to convey the carrier (402) and the tested chip located therein, and wait for unloading; The test transfer robot (403) is disposed between the third transfer mechanism (401) and the test mechanism (404) for transferring chips between the carrier (402) and the test mechanism (404); The testing mechanism (404) is used to test the chip; The first photoelectric sensing module (10) is positioned directly opposite the placement position (405) and can emit a sensing signal when there is no chip on the placement position (405) or when the chip is placed crookedly.

2. The chip handler of claim 1, wherein There are two of the first photoelectric sensing modules (10); One of the first photoelectric sensing modules (10) is arranged parallel to the third transmission mechanism (401), and is directly opposite the placement position (405) in the horizontal direction. It can emit a sensing signal when there is no chip on the placement position (405) or the chip is placed crookedly. Another first photoelectric sensing module (10) is arranged perpendicular to the third transmission mechanism (401) and is directly opposite the placement position (405) in the vertical direction. It can emit a sensing signal when there is no chip on the placement position (405) or the chip is placed crookedly.

3. The chip handler of claim 2, wherein The first photoelectric sensing module (10) includes a light-emitting module (101) and a light-receiving module (102) arranged symmetrically. The light-emitting module (101) is used to emit sensor light; The light receiving module (102) receives the sensed light emitted by the light emitting module (101); When there is no chip in the placement position (405) or the chip is tilted, the light receiving module (102) can receive the sensing light emitted by the light emitting module (101); When there is a chip in the placement position (405) or the chip is not tilted, the light receiving module (102) cannot receive the sensing light emitted by the light emitting module (101) due to the obstruction of the chip.

4. The chip handler of claim 3, wherein The placement position (405) is provided with a clearance opening through which the sensing light emitted by the light-emitting module (101) can pass.

5. The chip handler of claim 1, wherein There are two third transmission mechanisms (401); The two third transmission mechanisms (401) are arranged side by side on both sides of the test mechanism (404).

6. The chip handler of claim 1, wherein The workbench (1) is further divided into a full Tray loading area (2), an empty Tray recycling area (3), and a sorting and unloading area (5) according to the processing area. The full Tray loading area (2) is used to store several Tray disks (8) loaded with chips to be tested. A chip transfer robot (6) is provided between the full tray loading area (2) and the test area (4). The chip transfer robot (6) is used to transfer the chip in the tray (8) to the test area (4). The empty Tray recycling area (3) is used to recycle the empty Tray disk (8) after the transferred chip is removed; The test area (4) is used to test the transferred chip; A sorting robot (7) is provided between the test area (4) and the sorting and unloading area (5). The sorting robot (7) is used to transfer the tested chips to the sorting and unloading area (5). The sorting and unloading area (5) is used to store several empty trays (8), some of which are empty trays (8) for loading chips that have passed the test and are of good quality, and the other part of the empty trays (8) for loading chips that have failed the test.

7. The chip handler according to claim 6, characterized in that It also includes an empty Tray transfer robot (9); The empty Tray transfer robot (9) can move within the full Tray loading area (2), the empty Tray recycling area (3), and the sorting and unloading area (5) to transfer the empty Tray disk (8) after the transferred chip is transferred from the full Tray loading area (2) to the empty Tray recycling area (3) for recycling and storage; and to transfer the empty Tray disk (8) after the transferred chip is transferred from the full Tray loading area (2) to the sorting and unloading area (5) to load the tested chip.

8. The chip handler of claim 6, wherein The sorting and unloading area (5) includes a good product unloading area (501) and a defective product unloading area (502); The defective product unloading area (502) is divided into several classification areas according to the defect type of the chip. Each classification area corresponds to an empty tray (8) for loading chips of different defect types.

9. The chip handler of claim 1, wherein The chip transfer robot (6), sorting robot (7) and empty tray transfer robot (9) are all robots with suction head pitch adjustment function.

10. The chip handler of claim 9, wherein, The chip transfer robot (6), sorting robot (7) and empty tray transfer robot (9) each include a moving mechanism (601), a mounting frame (602), several pitch adjustment modules (603) and several suction heads (604). The active mechanism (601) is used to provide movement in multiple directions; The mounting frame (602) is disposed on the movable mechanism (601) and is used to provide a mounting base for the plurality of the pitch adjustment modules (603); One of the suction heads (604) is disposed on a pitch adjustment module (603) and can be moved under the drive of the pitch adjustment module (603) to adjust the distance between the suction heads (604).

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