Pad through hole cleaning jig

Abstract

The utility model discloses a bonding pad through hole cleaning jig, and belongs to the technical field of PCB bonding pad cleaning. The jig comprises a movable carrier plate, a base, soldering iron and a positioning assembly, the movable carrier plate is installed above the base in parallel through an elastic supporting assembly, and an edge notch of the movable carrier plate is vertically aligned with a spherical groove of a soldering iron head; the solder tip is provided with a flow guide groove to balance tin suction air pressure, and the positioning assembly achieves accurate guiding through a magnetic attraction type center pointer. During working, a PCB is placed on the movable carrier plate, tin melting of the solder tip and suction removal of the solder sucker are synchronously carried out after downward pressing, and the problems of low efficiency, pad damage and negative pressure interference of traditional single-side operation are solved. According to the design, double-sided cooperative operation is achieved, the residual tin removal rate is greatly increased, compatibility is high, and the process yield and the automation level of the electronic manufacturing industry can be remarkably improved.

Description

Technical Field

[0001] This utility model relates to the field of PCB board pad cleaning technology, and more specifically, to a pad through-hole cleaning fixture. Background Technology

[0002] In PCB manufacturing and repair, through-holes of components are often clogged due to residual solder from the surface mount process. Traditional cleaning methods rely on alternating operations of a soldering iron and a desoldering pump on one side of the PCB: first heating to melt the solder, then removing the residual solder. This method has significant drawbacks: melting and desoldering must be performed in separate steps; molten solder easily re-solders during the operation interval, leading to repeated heating; continuous heating at a single point can easily cause overheating and delamination of the pads; both hands are required to operate the tools, and the lack of PCB stability makes it prone to shifting and scratching surrounding components; during desoldering, localized negative pressure forms inside the hole, hindering the effective removal of residual solder. These problems restrict the process efficiency and product yield of the electronics manufacturing industry, thus necessitating an integrated, two-sided collaborative cleaning solution. Utility Model Content

[0003] The present invention provides a fixture for cleaning through holes in solder pads, which can solve the above-mentioned problems.

[0004] To solve the above problems, the technical solution adopted by this utility model is as follows:

[0005] A through-hole cleaning fixture for solder pads includes a movable carrier board, a base, a soldering iron, and a positioning assembly;

[0006] The movable carrier plate is mounted parallel to the base via an elastic support assembly, and its edge is provided with a notch;

[0007] The soldering iron is fixed to the base, and its soldering tip extends vertically upward. The top of the soldering tip is provided with a spherical groove and a guide groove communicating with the spherical groove.

[0008] The vertical projection of the notch covers the spherical groove;

[0009] The positioning component is disposed on the movable carrier plate and is used to indicate the vertical alignment position of the notch and the spherical groove.

[0010] Specifically, the elastic support assembly includes at least three elastic support structures, each consisting of a guide post, a compression spring, and a guide post nut; the movable carrier plate has an upper guide post positioning hole, and the base has a lower guide post positioning hole; the guide post passes through the upper guide post positioning hole, the compression spring, and the lower guide post positioning hole in sequence, and the compression spring is compressed between the movable carrier plate and the base; the upper end of the guide post has a large end that is engaged with the top of the upper guide post positioning hole, and the lower end is locked to the bottom of the lower guide post positioning hole by the guide post nut.

[0011] Specifically, both the upper and lower guide post positioning holes are countersunk through holes, with the countersunk end of the upper guide post positioning hole facing upwards and the countersunk end of the lower guide post positioning hole facing downwards; the large end of the guide post is inserted into the countersunk end of the upper guide post positioning hole, and the guide post nut abuts against the countersunk end of the lower guide post positioning hole.

[0012] Specifically, the soldering iron is detachably fixed to the base via a snap-fit ​​structure; the snap-fit ​​structure includes a soldering iron positioning slot, a soldering iron pressing block, and a soldering iron pressing block screw; the soldering iron positioning slot is located on the base, and its slot is used to accommodate the soldering iron, and the soldering iron pressing block is used to lock the soldering iron in the soldering iron positioning slot via the soldering iron pressing block screw.

[0013] Specifically, the soldering iron positioning slot includes a front positioning slot and a rear positioning slot; the front section of the soldering iron is engaged with the front positioning slot, the rear section is engaged with the rear positioning slot, and the soldering iron clamp is connected to the rear positioning slot via a soldering iron clamp screw.

[0014] Specifically, the positioning component includes a magnet, a ball screw, and an L-shaped center pointer; the movable carrier plate is provided with a magnet positioning groove and a pointer positioning blind hole, and the magnet is fixed in the magnet positioning groove; the short arm of the center pointer is rotatably inserted into the pointer positioning blind hole, and the end of the long arm is provided with the pointer head; the outer wall of the short arm is provided with an axial limiting groove, and the ball screw is threaded to the movable carrier plate, with its front end extending into the pointer positioning blind hole and engaging in the limiting groove; the long arm of the center pointer is magnetically attached to the magnet so that the pointer head points to the perpendicular alignment position of the notch and the spherical groove.

[0015] Compared with the prior art, the beneficial effects of this utility model are:

[0016] 1) The soldering iron heating and desoldering operations are carried out simultaneously on both sides of the PCB, so that the melting and desoldering are completed in one go, greatly improving work efficiency and completely eliminating the risk of residual solder solidification.

[0017] 2) The positioning component, combined with the notch-spherical groove projection coverage design, achieves high-precision alignment of the pad holes, greatly reducing the probability of accidental contact with surrounding components; the flexible movable carrier board adaptively presses down to ensure full contact between the soldering iron tip and the pads, and the heat conduction efficiency is also improved.

[0018] 3) The spherical groove of the soldering iron tip increases the heating area, greatly shortening the solder melting time; the guide groove connects the internal and external air pressure, eliminating the interference of negative pressure in solder absorption, and greatly improving the residual solder removal rate.

[0019] 4) The single-handed pressing operation frees up operators, and the automatic spring reset further reduces labor intensity, making it suitable for high-density production lines.

[0020] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, embodiments of this utility model are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0021] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is an exploded structural diagram of the pad through-hole cleaning fixture described in the embodiment;

[0023] Figure 2 This is an assembly cross-sectional view of the pad through-hole cleaning fixture described in the embodiment;

[0024] Figure 3 This is a schematic diagram of PCB positioning when the pad through-hole cleaning fixture described in the embodiment is applied;

[0025] Figure 4 This is a schematic diagram of pad cleaning when the pad through-hole cleaning fixture described in the embodiment is used;

[0026] In the picture:

[0027] 1. Movable carrier plate; 1.1. Upper guide post positioning hole; 1.2. Pointer positioning blind hole; 1.3. Magnet positioning groove;

[0028] 2. Base; 2.1. Lower guide post positioning hole; 2.2. Front positioning slot seat; 2.3. Rear positioning slot seat;

[0029] 3. Soldering iron; 3.1 Soldering tip; 3.2 Spherical groove; 3.3 Flow guide groove;

[0030] 4. Guide post;

[0031] 5. Magnet;

[0032] 6. Center pointer; 6.1. Limit slot; 6.2. Pointer head;

[0033] 7. Ball screw; 8. Compression spring; 9. Soldering iron clamp; 10. Soldering iron clamp screw; 11. Guide post nut. Detailed Implementation

[0034] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are some embodiments of this utility model, but not all embodiments.

[0035] Please refer to Figure 1 This embodiment discloses a through-hole cleaning fixture for solder pads, which integrates a movable carrier plate 1, a base 2, a soldering iron 3, a guide post 4, a magnet 5, a center pointer 6, a ball screw 7, a compression spring 8, a soldering iron pressure block 9, a soldering iron pressure block screw 10, and a guide post nut 11.

[0036] The movable carrier plate 1 is provided with guide post 4 positioning holes, pointer positioning blind holes 1.2 and magnet positioning groove 1.3. The base is provided with lower guide post positioning holes 2.1, front positioning groove seat 2.2 and rear positioning groove seat 2.3. The soldering iron 3 is provided with soldering iron tip 3.1, spherical groove 3.2 and flow guide groove 3.3. The central pointer 6 is provided with limit groove 6.1 and pointer tip 6.2.

[0037] according to Figure 1 After assembling the through-hole cleaning fixture for this pad according to the assembly path indicated in the diagram, the structure is as follows: Figure 2 As shown, after assembly, the soldering iron 3 is mounted on the front positioning slot 2.2 and the rear positioning slot 2.3 on the base 2, and the soldering iron pressure block 9 is connected and locked to the rear positioning slot 2.3 by the soldering iron pressure block screw 10 to press the soldering iron 3 tightly.

[0038] Both the upper guide post positioning hole 1.1 and the lower guide post positioning hole 2.1 are countersunk holes. The head of the upper guide post positioning hole 1.1 faces upward, and the head of the lower guide post positioning hole 2.1 faces downward. The guide post 4 passes through the upper guide post positioning hole 1.1, the compression spring 8, and the lower guide post positioning hole 2.1 in sequence. The upper end of the guide post 4 is the larger end, which is locked in the head of the upper guide post positioning hole 1.1. The guide post nut 11 is connected to the lower end of the guide post 4 at the head of the lower guide post positioning hole 2.1 to prevent the guide post 4 from disengaging from the lower guide post positioning hole 2.1.

[0039] The positioning assembly includes a center pointer 6, a ball screw 7, and a magnet 5; the movable carrier plate 1 has a magnet positioning groove 1.3 and a pointer positioning blind hole 1.2; the magnet 5 is installed in the magnet positioning groove 1.3; the center pointer 6 has an L-shaped structure, with its pointer head 6.2 being the end of its long arm, and its short arm coaxially rotating and engaging with the pointer positioning blind hole 1.2; the short arm of the center pointer 6 has an axially positioned limiting groove 6.1 around the outer wall; the ball screw 7 is threaded to the movable carrier plate 1, and its front end extends radially into the pointer positioning blind hole 1.2 and is engaged in the limiting groove 6.1. The long arm of the center pointer 6 is magnetically attracted to the magnet 5, so that the pointer head 6.2 of the center pointer 6 indicates that the notch is located directly above the spherical groove 3.2, see... Figure 2and Figure 3 As shown. By overcoming the magnetic attraction and moving the long arm of the center pointer 6, the center pointer 6 can rotate with its short arm as the center.

[0040] like Figure 3 and Figure 4 As shown, during use, place the PCB board on the movable carrier 1 and align the solder pad holes to be cleaned with the pointer head 6.2. This ensures the solder pad holes are aligned with the center of the soldering iron tip 3.1. After alignment, press down on the PCB board to lower the movable carrier 1, ensuring the bottom surface of the solder pad holes is fully in contact with the soldering iron tip 3.1. The spherical groove 3.2 of the soldering iron tip 3.1 helps to melt residual solder in the solder pad holes more quickly. Next, use a desoldering pump to push the pointer head 6.2 aside and place it against the upper surface of the solder pad holes. Activating the desoldering pump, along with the guiding action of the flow channel 3.3, easily removes and cleans the residual solder from the solder pad holes. After the operation, release the pressure on the PCB board. The movable carrier 1 rises back to its original position under the return force of the compression spring 8. Simultaneously, the desoldering pump releases the center pointer 6, and the center pointer 6 is no longer moved. The center pointer 6 returns to its original position under the magnetic attraction of the magnet 5. Next, we can proceed with the solder removal process for the next solder pad hole.

[0041] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A fixture for cleaning through-holes in solder pads, characterized in that, Includes a movable carrier board (1), a base (2), a soldering iron (3), and a positioning assembly; The movable carrier plate (1) is installed parallel to the base (2) via an elastic support assembly, and its edge is provided with a notch; The soldering iron (3) is fixed to the base (2), and its soldering tip (3.1) extends vertically upward. The top of the soldering tip (3.1) is provided with a spherical groove (3.2) and a guide groove (3.3) communicating with the spherical groove (3.2). The vertical projection of the notch covers the spherical groove (3.2). The positioning component is disposed on the movable carrier plate (1) and is used to indicate the vertical alignment position of the notch and the spherical groove (3.2).

2. The pad through-hole cleaning fixture according to claim 1, characterized in that, The elastic support assembly includes at least three elastic support structures, each of which consists of a guide post (4), a compression spring (8), and a guide post nut (11). The movable carrier plate (1) has an upper guide post positioning hole (1.1), and the base (2) has a lower guide post positioning hole (2.1). The guide post (4) passes through the upper guide post positioning hole (1.1), the compression spring (8), and the lower guide post positioning hole (2.1) in sequence. The compression spring (8) is compressed between the movable carrier plate (1) and the base (2). The upper end of the guide post (4) has a large end, which is engaged with the top of the upper guide post positioning hole (1.1), and the lower end is locked to the bottom of the lower guide post positioning hole (2.1) by the guide post nut (11).

3. The through-hole cleaning fixture for solder pads according to claim 2, characterized in that, The upper guide post positioning hole (1.1) and the lower guide post positioning hole (2.1) are both countersunk through holes. The countersunk end of the upper guide post positioning hole (1.1) faces upward, and the countersunk end of the lower guide post positioning hole (2.1) faces downward. The large end of the guide post (4) is inserted into the countersunk end of the upper guide post positioning hole (1.1), and the guide post nut (11) abuts against the countersunk end of the lower guide post positioning hole (2.1).

4. The pad-through-hole cleaning fixture according to claim 1, characterized in that, The soldering iron (3) is detachably fixed to the base (2) by a snap-fit ​​structure; the snap-fit ​​structure includes a soldering iron (3) positioning slot, a soldering iron pressing block (9) and a soldering iron pressing block screw (10); the soldering iron (3) positioning slot is located on the base (2), and its slot is used to accommodate the soldering iron (3); the soldering iron pressing block (9) locks the soldering iron (3) in the soldering iron (3) positioning slot by the soldering iron pressing block screw (10).

5. The pad through-hole cleaning fixture according to claim 4, characterized in that, The soldering iron (3) positioning slot includes a front positioning slot (2.2) and a rear positioning slot (2.3); the front section of the soldering iron (3) is snapped into the front positioning slot (2.2), and the rear section is snapped into the rear positioning slot (2.3). The soldering iron pressure block (9) and the rear positioning slot (2.3) are connected by the soldering iron pressure block screw (10).

6. The through-hole cleaning fixture for solder pads according to claim 1, characterized in that the positioning component includes a magnet (5), a ball screw (7), and an L-shaped center pointer (6); the movable carrier plate (1) is provided with a magnet positioning groove (1.3) and a pointer positioning blind hole (1.2), the magnet (5) is fixed in the magnet positioning groove (1.3); the short arm of the center pointer (6) is rotatably inserted into the pointer positioning blind hole (1.2), and the end of the long arm is provided with a pointer head (6.2); the outer wall of the short arm is provided with an axial limiting groove ( 6.1) The ball screw (7) is threaded to the movable carrier plate (1), and its front end extends into the pointer positioning blind hole (1.2) and is locked into the limiting groove (6.1); the long arm of the center pointer (6) is attached to the magnet (5) by magnetic attraction so that the pointer head (6.2) points to the vertical alignment position of the notch and the spherical groove (3.2).

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