Foot pad with heating function

Abstract

The utility model relates to the technical field of foot pads, and provides a foot pad with a heating function, which comprises a foot pad main body, a filling layer is arranged on one side of the foot pad main body, a packaging layer is arranged on one side, far away from the foot pad main body, of the filling layer, and the packaging layer comprises a first packaging layer and a second packaging layer; a circuit layer and a graphene heating layer are arranged between the first packaging layer and the second packaging layer; the circuit layer and the graphene heating layer are used for performing heat distribution on the foot pad; power is supplied to the circuit layer through an external power source, the circuit layer is connected with the graphene heating layer after receiving electricity, graphene serves as a novel material with excellent performance, the conductivity of the graphene is excellent, electric energy can be converted into heat energy after the graphene is electrified, the graphene heating layer is made to evenly and rapidly heat, and the graphene heating layer is heated along with heating of the graphene heating layer. The generated heat can be quickly and uniformly transferred to the whole foot pad, so that the whole foot pad is effectively heated, and the heating effect is achieved.

Description

Technical Field

[0001] This utility model relates to the field of foot pad technology, and more specifically, to a foot pad with a heating function. Background Technology

[0002] Car floor mats are special mats designed for use inside cars, primarily placed under the driver's seat, front passenger seat, and rear passenger seats.

[0003] Currently, car floor mats on the market are made of various materials, including rubber, plastic, felt, leather, and textiles, with wool being a more high-end option.

[0004] However, regardless of the material, floor mats only provide cleaning, sound insulation, and shock absorption – these are traditional functions. Considering weather conditions, especially in northern regions, driving in cold weather means that neither air conditioning nor seat heating can warm the feet, impacting the overall experience for both passengers and drivers. Therefore, a heated floor mat is proposed to address these issues. Utility Model Content

[0005] In view of the shortcomings of the existing technology, the purpose of this utility model is to provide a foot pad with a heating function.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a foot pad with a heating function, comprising a foot pad body, a filling layer disposed on one side of the foot pad body, and an encapsulation layer disposed on the side of the filling layer away from the foot pad body, the encapsulation layer comprising a first encapsulation layer and a second encapsulation layer; a circuit layer and a graphene heating layer disposed between the first encapsulation layer and the second encapsulation layer; the circuit layer and the graphene heating layer are used to heat the foot pad.

[0007] The present invention is further configured such that: the sidewall of the filling layer is symmetrically provided with adapter holes, the sidewall of the foot pad body is symmetrically provided with countersunk holes, the countersunk seat of the countersunk hole has the same diameter as the adapter hole, and the countersunk hole and the adapter hole are connected by bolts.

[0008] The present invention is further configured such that: the sidewall of the first encapsulation layer is symmetrically provided with a first large hole, and the sidewall of the second encapsulation layer is symmetrically provided with a second large hole, and the first large hole and the second large hole are connected to the adapter hole by bolts.

[0009] The present invention is further configured such that: a first small hole is symmetrically opened on the top of the first encapsulation layer and between the two first large holes; a second small hole is symmetrically opened on the top of the second encapsulation layer and between the two second large holes; and the first small hole and the second small hole are connected by bolts.

[0010] The present invention is further configured such that: small circuit holes are symmetrically opened on the side wall of the circuit layer, the small circuit holes are corresponding to the first small hole and the second small hole, and the small circuit holes can be connected to the first small hole and the second small hole by bolts.

[0011] The present invention is further configured such that: the circuit layer is in the form of a sheet, and the circuit layer is arranged around the first encapsulation layer.

[0012] The present invention is further configured such that: one side of the foot pad body, filling layer, first encapsulation layer and second encapsulation layer is inclined; the foot pad body, filling layer, first encapsulation layer, second encapsulation layer, circuit layer and graphene heating layer are all bent, and the bending direction is consistent.

[0013] In summary, this application includes at least one of the following beneficial technical effects: the circuit layer is powered by an external power source, and the circuit layer connects to the graphene heating layer after receiving power. Graphene, as a novel material with excellent performance, has excellent conductivity and can convert electrical energy into heat energy after being powered on, so that the graphene heating layer heats up uniformly and quickly. As the graphene heating layer heats up, the heat generated can be quickly and evenly transferred to the entire foot pad, thereby effectively heating the entire foot pad to achieve the heating effect. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall structure of the foot pad with heating function in this utility model;

[0015] Figure 2 This is an exploded view of the heated foot pad of this utility model;

[0016] Figure 3 for Figure 2 Enlarged view of point A in the middle;

[0017] Figure 4 for Figure 2 Enlarged view of point B in the middle;

[0018] Figure 5 for Figure 2 Enlarged view of point C in the middle;

[0019] Explanation of reference numerals in the attached drawings: 1. Foot pad body; 11. Countersunk hole; 2. Filling layer; 21. Adapter hole; 3. Encapsulation layer; 31. First encapsulation layer; 311. First large hole; 312. First small hole; 32. Second encapsulation layer; 321. Second large hole; 322. Second small hole; 4. Circuit layer; 41. Circuit small hole; 5. Graphene heating layer. Detailed Implementation

[0020] It should be noted that, where there is no conflict, the embodiments and features described in this application can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0021] It should be noted that, unless otherwise specified, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.

[0022] Please see Figures 1-5 The present invention provides the following technical solution:

[0023] Example 1, see Figures 1-5 A foot pad with heating function includes a foot pad body 1, a filling layer 2 is provided on one side of the foot pad body 1, and an encapsulation layer 3 is provided on the side of the filling layer 2 away from the foot pad body 1. The encapsulation layer 3 includes a first encapsulation layer 31 and a second encapsulation layer 32. A circuit layer 4 and a graphene heating layer 5 are provided between the first encapsulation layer 31 and the second encapsulation layer 32. The circuit layer 4 and the graphene heating layer 5 are used to heat the foot pad.

[0024] The foot pad body 1 provides a supporting body, the filling layer 2 increases the fit between the foot pad body 1 and the encapsulation layer 3, and the encapsulation layer 3 consists of a first encapsulation layer 31 and a second encapsulation layer 32, which is used to protect the internal circuit layer 4 and graphene heating layer 5. The circuit layer 4 is used to control and manage the heating process of the graphene heating layer 5, while the graphene heating layer 5 directly generates heat by converting electrical energy into thermal energy through graphene material, thereby heating the foot pad and providing warm foot heating for the user.

[0025] The circuit layer 4 is powered by an external power source, which connects to the graphene heating layer 5, causing the graphene heating layer 5 to heat up and thus heat the entire foot pad to achieve a warming effect.

[0026] See Figures 1-5 Furthermore, the sidewall of the filling layer 2 is symmetrically provided with adapter holes 21, and the sidewall of the foot pad body 1 is symmetrically provided with countersunk holes 11. The countersunk seat of the countersunk hole 11 has the same diameter as the adapter hole 21, and the countersunk hole 11 and the adapter hole 21 are connected by bolts.

[0027] The foot pad body 1 provides bolt mounting positions through countersunk holes 11 symmetrically opened on its side wall. Its main function is to provide an installation base for the connecting parts and ensure the stability of the foot pad during installation. The side wall of the filling layer 2 provides space for bolt insertion and fixing through symmetrically opened adapter holes 21, ensuring that the foot pad can be firmly connected to the base or other installation objects. This design ensures the alignment accuracy of the bolts during installation by making the countersunk seat of the countersunk hole 11 and the adapter hole 21 have the same diameter, thereby improving the reliability of the connection.

[0028] See Figures 1-5 Furthermore, the first encapsulation layer 31 has a first large hole 311 symmetrically opened on the side wall, and the second encapsulation layer 32 has a second large hole 321 symmetrically opened on the side wall. The first large hole 311 and the second large hole 321 are both connected to the adapter hole 21 by bolts.

[0029] The first encapsulation layer 31 provides the first layer of protection inside the product. The first large hole 311 symmetrically opened on its side wall allows bolts to pass through and connect with the second encapsulation layer, thereby achieving fixation between the two layers. The second encapsulation layer 32 provides the second layer of protection outside the product, and the second large hole 321 symmetrically opened on its side wall is also used to connect with the first large hole 311 by bolts, achieving effective fixation between the two layers. The adapter hole 21 serves as the installation position for the bolts. The first encapsulation layer 31 and the second encapsulation layer 32 are tightly connected by bolts, which not only ensures the overall structural strength of the product, but also makes the layers firmly bonded together. This design not only improves the sealing and protective performance of the product, but also facilitates installation and disassembly, achieving the purpose of multiple protections and a stable connection.

[0030] See Figures 1-5 Furthermore, a first small hole 312 is symmetrically provided on the top of the first encapsulation layer 31 and between the two first large holes 311, and a second small hole 322 is symmetrically provided on the top of the second encapsulation layer 32 and between the two second large holes 321. The first small hole 312 and the second small hole 322 are connected by bolts.

[0031] The first encapsulation layer 31 provides alignment and fixation for internal components through first small holes 312 symmetrically opened on its top between two first large holes 311. The second encapsulation layer 32 also serves an alignment function through second small holes 322 symmetrically opened on its top between two second large holes 321. The design of these small holes allows the two encapsulation layers to be aligned through the small holes on the top, and then fastened together with bolts, thereby ensuring the stability of the connection between the encapsulation layers and the accuracy of the alignment.

[0032] See Figures 1-5 Furthermore, small circuit holes 41 are symmetrically provided on the side wall of the circuit layer 4. The small circuit holes 41 are correspondingly provided with the first small hole 312 and the second small hole 322. The small circuit holes 41 can be connected to the first small hole 312 and the second small hole 322 by bolts.

[0033] Symmetrical circuit holes 41 are formed on the sidewalls of the circuit layer 4 for connecting to other components via bolts, ensuring that the circuit layer can be stably installed in a predetermined position. The first hole 312 and the second hole 322 are respectively set on the corresponding structural components, corresponding to the circuit holes 41, so as to achieve connection via bolts. This design can ensure a stable connection between the circuit layer 4 and these structural components, improving the stability of the overall structure. By tightly connecting the circuit layer 4 and other structural components with bolts, force and signals can be effectively transmitted, ensuring the reliability and stability of the circuit during use, preventing loosening caused by vibration or external force, thereby improving the working efficiency and service life of the entire device.

[0034] See Figures 1-5 Furthermore, the circuit layer 4 is in the form of a sheet, and the circuit layer 4 is arranged around the first packaging layer 31.

[0035] The circuit layer 4 is designed as a sheet and is arranged around the first packaging layer 31. This design allows the circuit layer 4 to make effective use of space and improve the compactness and integration of the package. By arranging the circuit layer 4 around specific positions inside the package, good management of circuit signals and effective layout of conductive paths are achieved, thereby improving the efficiency and reliability of signal transmission. The first packaging layer 31 provides the necessary mechanical support and protection to ensure that the circuit layer 4 will not be deformed or damaged by external pressure, and also provides the necessary insulation for the circuit layer 4 to prevent short circuits.

[0036] See Figures 1-5 Furthermore, one side of the foot pad body 1, filling layer 2, first encapsulation layer 31 and second encapsulation layer 32 is inclined, and the foot pad body 1, filling layer 2, first encapsulation layer 31, second encapsulation layer 32, circuit layer 4 and graphene heating layer 5 are all bent, and the bending direction is consistent.

[0037] The consistent bending arrangement of the foot pad body 1, filling layer 2, first encapsulation layer 31, second encapsulation layer 32, circuit layer 4, and graphene heating layer 5 allows the entire foot pad to better adapt to different support surfaces, improving the flexibility and ease of use of the foot pad. The circuit layer 4 contains a temperature control circuit, while the graphene heating layer 5 is heated by the control of the circuit layer 4, providing temperature regulation and improving the heating effect on the feet.

[0038] Obviously, the embodiments described above are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of this utility model.

Claims

1. A foot pad with a heating function, characterized in that: include, A foot pad body (1) is provided with a filling layer (2) on one side of the foot pad body (1), and a sealing layer (3) is provided on the side of the filling layer (2) away from the foot pad body (1). The sealing layer (3) includes a first sealing layer (31) and a second sealing layer (32). A circuit layer (4) and a graphene heating layer (5) are provided between the first sealing layer (31) and the second sealing layer (32). The circuit layer (4) and the graphene heating layer (5) are used to heat the foot pad.

2. The foot pad with heating function according to claim 1, characterized in that: The sidewall of the filling layer (2) is symmetrically provided with adapter holes (21), and the sidewall of the foot pad body (1) is symmetrically provided with countersunk holes (11). The countersunk seat of the countersunk hole (11) has the same diameter as the adapter hole (21), and the countersunk hole (11) and the adapter hole (21) are connected by bolts.

3. The foot pad with heating function according to claim 2, characterized in that: The first encapsulation layer (31) has a first large hole (311) symmetrically opened on the side wall, and the second encapsulation layer (32) has a second large hole (321) symmetrically opened on the side wall. The first large hole (311) and the second large hole (321) are both connected to the adapter hole (21) by bolts.

4. The foot pad with heating function according to claim 3, characterized in that: A first small hole (312) is symmetrically provided on the top of the first encapsulation layer (31) and between the two first large holes (311). A second small hole (322) is symmetrically provided on the top of the second encapsulation layer (32) and between the two second large holes (321). The first small hole (312) and the second small hole (322) are connected by bolts.

5. The foot pad with heating function according to claim 4, characterized in that: The circuit layer (4) has symmetrically provided circuit holes (41) on its sidewall. The circuit holes (41) are provided in correspondence with the first hole (312) and the second hole (322). The circuit holes (41) can be connected to the first hole (312) and the second hole (322) by means of bolts.

6. The foot pad with heating function according to claim 1, characterized in that: The circuit layer (4) is sheet-like and is arranged around the first encapsulation layer (31).

7. The foot pad with heating function according to claim 1, characterized in that: The foot pad body (1), filling layer (2), first encapsulation layer (31) and second encapsulation layer (32) are inclined on one side. The foot pad body (1), filling layer (2), first encapsulation layer (31) and second encapsulation layer (32), circuit layer (4) and graphene heating layer (5) are all bent and the bending direction is consistent.

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