Chip automatic test equipment

Abstract

The utility model relates to the technical field of automation equipment, and discloses automatic chip testing equipment, which is characterized in that a feeding device and a grabbing waiting device are arranged in a full-tray feeding area, and the grabbing waiting device is designed to be used for storing a tray provided by the feeding device and laterally pushing and positioning the tray; according to the chip transfer manipulator, the chip in the Tray can be accurately grabbed and transferred to a test area, the accuracy and efficiency of chip transfer can be remarkably improved, damage to the chip is reduced, and therefore smooth operation of a whole chip production line and stable improvement of product quality are guaranteed.

Description

Technical Field

[0001] This utility model relates to the field of automation equipment technology, and in particular to an automatic chip testing device. Background Technology

[0002] The quality testing stage of a chip, as a core component of the chip production line, plays a crucial and pivotal role. This stage not only bears the heavy responsibility of comprehensively and meticulously inspecting product quality, accurately and effectively providing feedback on various quality information and offering detailed and comprehensive data support to production personnel, but it also facilitates timely and accurate monitoring of the actual operation of each production stage, enabling the prompt detection and handling of anomalies, thereby ensuring the smooth and orderly progress of the entire production process. Therefore, the importance of quality testing technology in chip production lines is increasingly prominent; its significance in ensuring product quality and improving production efficiency is self-evident, making it an indispensable key link.

[0003] In current chip testing processes, chip loading primarily utilizes trays. However, ensuring the chip transfer robot accurately picks up the chips from the tray while it awaits retrieval is crucial. The accuracy of this step directly impacts the efficiency of the entire chip testing process. Any deviation in retrieval can not only delay the testing process but also cause unnecessary damage to the chip, ultimately affecting product quality and performance.

[0004] Therefore, it is crucial to pay close attention to these issues in the chip transfer process and fully recognize their importance for the smooth operation of the entire chip production line and the stable improvement of product quality. To this end, effective measures need to be taken to optimize and improve the chip transfer process, ensuring that the robotic arm can accurately and stably grasp the chips, improving the efficiency of the testing process, and avoiding any damage to the chips. Only in this way can the smooth operation of the entire chip production line be guaranteed, providing a strong guarantee for the stable improvement of product quality.

[0005] The above information is provided as background information only to aid in understanding this disclosure and does not constitute an assertion or admission that any of the above content can be used as prior art relative to this disclosure. Utility Model Content

[0006] This invention provides an automated chip testing device to solve the problems existing in the prior art.

[0007] To achieve the above objectives, this utility model provides the following technical solution:

[0008] An automated chip testing device includes a workbench, which is divided into a full tray loading area and a testing area according to the processing area;

[0009] The full tray loading area is used to store several trays loaded with chips to be tested;

[0010] A chip transfer robot is provided between the full tray loading area and the testing area. The chip transfer robot is used to transfer the chip in the tray to the testing area.

[0011] The test area is used to test the transferred chips;

[0012] The full tray loading area includes a loading device and a gripping and waiting device;

[0013] The feeding device is used to store a plurality of the trays, which are stacked together; and to provide the trays to the gripping and waiting device.

[0014] The gripping and waiting device is used to store the tray provided by the feeding device and to position the tray by pushing it laterally, so as to wait for the chip transfer robot to transfer the chip in the tray to the test area.

[0015] Furthermore, in the automated chip testing equipment, the gripping and waiting device includes a second conveying mechanism and a side-pushing mechanism;

[0016] The second conveying mechanism is used to continue conveying the tray from the feeding device;

[0017] The side-pushing mechanism is located on one side of the second conveying mechanism and is used to push the tray laterally from the side of the tray to position the tray in the lateral direction, so as to wait for the chip transfer robot to transfer the chip in the tray to the test area.

[0018] Furthermore, in the automated chip testing equipment, the grasping and waiting device also includes a blocking mechanism;

[0019] The blocking mechanism is located at the end of the second conveying mechanism and is used to prevent the second conveying mechanism from continuing to convey the tray.

[0020] Furthermore, in the automated chip testing equipment, the gripping and waiting device also includes a positioning gripper mechanism;

[0021] The positioning gripper mechanism is disposed on both sides of the second conveying mechanism and is used to hold the tray disk positioned in the lateral direction.

[0022] Furthermore, in the automated chip testing equipment, the positioning gripper mechanism includes a mounting base, grippers, and a cylinder;

[0023] The mounting base is disposed on one side of the second conveying mechanism and is used to provide a mounting base for the pressure claw;

[0024] The pressure claw is disposed on the mounting base and connected to the telescopic rod of the cylinder, and can perform pressing or releasing actions accordingly under the drive of the telescopic rod of the cylinder.

[0025] Furthermore, in the automated chip testing equipment, the grasping and waiting device also includes a photoelectric sensing module;

[0026] The photoelectric sensing module is disposed on the second conveying mechanism and is used to detect whether the Tray is being conveyed on the second conveying mechanism. When the Tray is detected, the side pushing mechanism is triggered to start operating.

[0027] Furthermore, in the automated chip testing equipment, the feeding device includes a first conveying mechanism, a lifting mechanism, a storage slot, and a clamping mechanism;

[0028] The storage slot is used to store a plurality of stacked Tray disks;

[0029] The lifting mechanism is located at the bottom of the storage slot and is used to move up and down through the storage slot to lift or lower the tray inside the storage slot.

[0030] The clamping mechanism is located on both sides of the storage slot and is used to extend out when the lifting mechanism lifts the Tray disk in the storage slot to clamp the remaining Tray disks except for the bottommost Tray disk.

[0031] The lifting mechanism is also used to lower the bottommost tray and place it onto the first conveying mechanism when the clamping mechanism clamps the trays other than the bottommost tray.

[0032] The first conveying mechanism is connected to the second conveying mechanism and is used to convey the Tray placed thereon to the second conveying mechanism.

[0033] Furthermore, in the automated chip testing equipment, the workbench is further divided into an empty tray recovery area and a sorting and unloading area according to the processing area;

[0034] The empty Tray recycling area is used to recycle the empty Tray after the chips have been transferred;

[0035] A sorting robot is provided between the testing area and the sorting and unloading area. The sorting robot is used to transfer the tested chips to the sorting and unloading area.

[0036] The sorting and unloading area is used to store several empty trays, some of which are used to load chips that have passed the test and are considered good, while others are used to load chips that have failed the test.

[0037] Compared with the prior art, the present invention has the following beneficial effects:

[0038] This utility model provides an automatic chip testing device. By setting up a feeding device and a gripping waiting device in the full tray feeding area, and designing the gripping waiting device to store the trays provided by the feeding device and perform lateral pushing positioning on the trays, the chip transfer robot can accurately grip the chips in the trays and transfer them to the testing area. This can significantly improve the accuracy and efficiency of chip transfer, reduce damage to the chips, and thus ensure the smooth operation of the entire chip production line and the stable improvement of product quality.

[0039] This invention has other features and advantages that will be apparent from or will be set forth in detail in the accompanying drawings and the following detailed description, which together serve to explain the particular principles of this invention. Attached Figure Description

[0040] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0041] Figure 1 This is a top view structural diagram of an automated chip testing device provided in an embodiment of this utility model;

[0042] Figure 2 This is one of the (three-dimensional) structural schematic diagrams of an automatic chip testing device provided in this embodiment of the present utility model;

[0043] Figure 3 This is the second (three-dimensional) structural schematic diagram of an automatic chip testing device provided in this embodiment of the present invention;

[0044] Figure 4This is a three-dimensional structural diagram of the Tray loading area provided in this embodiment of the utility model;

[0045] Figure 5 This is a three-dimensional structural diagram of the feeding device provided in this embodiment of the utility model;

[0046] Figure 6 This is a (partial) structural schematic diagram of the feeding device provided in an embodiment of the present utility model;

[0047] Figure 7 This is a (partial) structural schematic diagram of the feeding device provided in an embodiment of the present utility model;

[0048] Figure 8 This is one of the (three-dimensional) structural schematic diagrams of the grasping and waiting device provided in this embodiment of the utility model;

[0049] Figure 9 This is the second (three-dimensional) structural schematic diagram of the grasping and waiting device provided in this embodiment of the utility model.

[0050] Figure label:

[0051] Workbench 1, Full Tray Loading Area 2, Empty Tray Recycling Area 3, Testing Area 4, Sorting and Unloading Area 5, Chip Transfer Robot 6, Sorting Robot 7, Tray Tray 8;

[0052] Feeding device 201, gripping and waiting device 202;

[0053] First conveying mechanism 2011, lifting mechanism 2012, storage slot 2013, clamping mechanism 2014, second photoelectric sensing module 2015;

[0054] Second conveying mechanism 2021, side pushing mechanism 2022, blocking mechanism 2023, positioning gripper mechanism 2024, photoelectric sensing module 2025;

[0055] Mounting base 20241, pressure claw 20242, cylinder 20243. Detailed Implementation

[0056] To illustrate the possible application scenarios, technical principles, implementable specific solutions, and achievable objectives and effects of this application in detail, the following description, in conjunction with the listed specific embodiments and accompanying drawings, provides a detailed explanation. The embodiments described herein are merely illustrative of the technical solutions of this application and are therefore intended to limit the scope of protection of this application.

[0057] In this document, the term "embodiment" means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The term "embodiment" appearing in various places throughout the specification does not necessarily refer to the same embodiment, nor does it specifically limit its independence or connection with other embodiments. In principle, in this application, as long as there are no technical contradictions or conflicts, the technical features mentioned in each embodiment can be combined in any way to form corresponding implementable technical solutions.

[0058] Unless otherwise defined, the technical terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the use of related terms herein is merely for the purpose of describing particular embodiments and is not intended to limit this application.

[0059] In the description of this application, the term "and / or" is used to describe the logical relationship between objects, indicating that three relationships can exist. For example, A and / or B means: A exists, B exists, and A and B exist simultaneously. Additionally, the character " / " in this document generally indicates that the preceding and following objects have an "or" logical relationship.

[0060] In this application, terms such as “first” and “second” are used only to distinguish one entity or operation from another, and do not necessarily require or imply any actual quantity, hierarchy or order relationship between these entities or operations.

[0061] Unless otherwise specified, the use of terms such as “comprising,” “including,” “having,” or other similar expressions in this application is intended to cover non-exclusive inclusion, which does not exclude the presence of additional elements in a process, method, or product that includes the stated elements, such that a process, method, or product that includes a list of elements may include not only those defined elements but also other elements not expressly listed, or elements inherent to such a process, method, or product.

[0062] In this application, expressions such as "greater than", "less than", and "exceeding" are understood to exclude the stated number; expressions such as "above", "below", and "within" are understood to include the stated number. Furthermore, in the description of the embodiments of this application, "multiple" means two or more (including two), and similar expressions related to "multiple" are also understood in this way, such as "multiple groups" and "multiple times", unless otherwise explicitly specified.

[0063] In the description of the embodiments of this application, the space-related expressions used, such as "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "vertical," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," indicate the orientation or positional relationship based on the orientation or positional relationship shown in the specific embodiments or drawings. They are only for the purpose of describing the specific embodiments of this application or for the reader's understanding, and do not indicate or imply that the device or component referred to must have a specific position, a specific orientation, or be constructed or operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0064] Unless otherwise expressly specified or limited, the terms "installation," "connection," "linking," "fixing," and "setting," as used in the description of the embodiments of this application, should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral setting; it can be a mechanical connection, an electrical connection, or a communication connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal connection of two components or the interaction between two components. For those skilled in the art to which this application pertains, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0065] In view of the deficiencies of the existing technology, the applicant, based on years of practical experience and professional knowledge in the design and manufacturing of this field, and in conjunction with the application of theoretical principles, has actively conducted research and innovation in order to create a technology that can solve the deficiencies of the existing technology. After continuous research, design, and repeated prototype production and improvement, this utility model with practical value has finally been created.

[0066] Please refer to Figure 1-3 This utility model provides an automatic chip testing device, including a workbench 1, which is divided into a full tray loading area 2 and a testing area 4 according to the processing area.

[0067] The full tray loading area 2 is designed to store a certain number of trays 8, each containing chips to be tested. This area serves as the initial storage point for the chips, ensuring orderly management and rapid retrieval before testing.

[0068] An innovative chip transfer robot 6 is installed between the full tray loading area 2 and the testing area 4. This robot 6 is responsible for the important task of accurately transferring the chips in the trays 8 of the full tray loading area 2 to the testing area 4. Its efficient and accurate movements are key to ensuring the smooth operation of the entire testing process.

[0069] Test Area 4 is specifically responsible for conducting comprehensive testing on the received chips. Through a series of sophisticated testing procedures, this area can quickly and accurately evaluate the chip's performance indicators, providing a strong basis for subsequent production decisions.

[0070] Furthermore, the full tray loading area 2 includes a loading device 201 and a gripping and waiting device 202; these two parts work together to achieve efficient and automated operation of the chip loading process.

[0071] The loading device 201 is one of the core components of the full tray loading area 2, and it undertakes the important task of storing and providing trays 8 loaded with chips to be tested. Specifically, the loading device 201 is designed to accommodate multiple stacked trays 8. This design greatly improves loading efficiency, reduces the frequency of manual tray replenishment, and makes the entire loading process more continuous and smooth. When a tray 8 needs to be provided to the gripping waiting device 202, the loading device 201 can quickly and accurately deliver the bottom tray 8, preparing for subsequent chip transfer.

[0072] The gripping waiting device 202 is another key component of the full tray loading area 2. It follows immediately after the loading device 201 and is used to store the trays 8 provided by the loading device 201. The gripping waiting device 202 not only stores the trays 8 but also provides lateral positioning for them. This function is designed to ensure the stability and accuracy of the trays 8 during the gripping waiting process, so that the chip transfer robot 6 can accurately and without error grip the chips in the trays 8. Through the precise positioning of the gripping waiting device 202, the success rate of the chip transfer robot 6 is significantly improved, thereby further enhancing the efficiency and stability of the entire chip testing process and effectively avoiding gripping errors or chip damage caused by inaccurate positioning.

[0073] In summary, this embodiment cleverly incorporates a loading device 201 and a gripping waiting device 202 within the full tray loading area 2, and fully utilizes the side-pushing positioning function of the gripping waiting device 202, significantly improving the accuracy and efficiency of chip transfer. Simultaneously, this design effectively reduces potential damage during chip transfer, providing a strong guarantee for the smooth operation of the entire chip production line and the continuous and stable improvement of product quality.

[0074] Please refer to Figure 4-9In one embodiment of this invention, the feeding device 201 is carefully designed to include four main components: a first conveying mechanism 2011, a lifting mechanism 2012, a storage slot 2013, and a clamping mechanism 2014. These four parts work together to achieve automatic separation and conveying of the Tray 8, significantly improving feeding efficiency and stability.

[0075] The storage slot 2013 is a basic component of the feeding device 201, used to store several stacked trays 8. The size of the storage slot 2013 matches the size of the trays 8, ensuring that it can stably accommodate multiple stacked trays 8 and prevent them from shaking or slipping during storage.

[0076] The lifting mechanism 2012, located at the bottom of the storage slot 2013, is a key component for the automatic separation of the tray 8. The lifting mechanism 2012 can move up and down through the storage slot 2013 to lift or lower the tray 8 within it. Specifically, the lifting mechanism 2012 can be a cylinder- or motor-driven lifting platform, capable of precisely controlling the lifting height to ensure the tray 8 remains stable during lifting or lowering.

[0077] The clamping mechanism 2014 is located on both sides of the storage slot 2013. It extends when the lifting mechanism 2012 lifts the tray 8 into the storage slot 2013 to clamp the trays 8 except for the bottom tray 8. The clamping mechanism 2014 can be a pneumatic gripper with adjustable clamping force, which can firmly clamp the trays 8 and prevent them from slipping or tilting during the lifting process.

[0078] While the clamping mechanism 2014 clamps all the trays 8 except the bottom one, the lifting mechanism 2012 continues to lower the bottom tray 8, separating it from the stacked trays 8 and placing it on the first conveying mechanism 2011. This cooperative working method ensures the smooth separation of the trays 8, avoiding collisions or damage during the separation process.

[0079] The first conveying mechanism 2011 is responsible for conveying the tray 8 placed on it to the grasping waiting device 202. The first conveying mechanism 2011 can adopt a belt conveyor structure, and its conveying speed is adjustable, which can smoothly convey the tray 8 to the designated position.

[0080] In summary, the feeding device 201 in this embodiment, through the ingenious design of the storage slot 2013, lifting mechanism 2012, clamping mechanism 2014, and first conveying mechanism 2011, achieves automatic separation and conveying of the Tray disk 8. This structural design not only improves feeding efficiency and stability but also provides reliable assurance for subsequent chip testing processes.

[0081] In one specific embodiment of this example, the feeding device 201 cleverly incorporates a second photoelectric sensing module 2015 on the basis of its original structure. This addition greatly enhances the intelligence and automation level of the device.

[0082] The second photoelectric sensing module 2015 is carefully positioned at the top of the storage slot 2013, and its location ensures accurate and reliable sensing of the stacking height of the trays 8 within the storage slot 2013. Photoelectric sensing technology, with its high sensitivity and non-contact measurement capabilities, plays a crucial role in this application.

[0083] Specifically, the second photoelectric sensing module 2015 monitors the stacking status of the trays 8 in the storage slot 2013 in real time by emitting and receiving light signals. When the stacking height of the trays 8 changes, such as when a tray 8 is added or removed, the photoelectric sensing module can quickly detect this change and transmit the signal to the control system.

[0084] Based on the received signals, the control system can adjust the working status of the lifting mechanism 2012 in real time to ensure that the lifting height matches the current stacking height of the trays 8. This not only avoids collisions or damage to the trays 8 that may be caused by improper lifting height, but also improves the stability and reliability of the entire loading process.

[0085] In summary, the feeding device 201 in this embodiment, by incorporating a second photoelectric sensing module 2015, achieves real-time monitoring and intelligent adjustment of the stacking height of the Tray disks 8.

[0086] In one embodiment of this invention, the grasping waiting device 202 is carefully designed to include three main components: a second conveying mechanism 2021, a side-pushing mechanism 2022, and a blocking mechanism 2023. These three parts work together to achieve precise positioning of the Tray 8, providing a stable and reliable foundation for the grasping operation of the chip transfer robot 6.

[0087] The second conveying mechanism 2021 is the starting part of the gripping and waiting device 202, and is connected to the first conveying mechanism 2011 to continue conveying the tray 8 from the first conveying mechanism 2011. To ensure the smoothness of the tray 8 during the conveying process, the second conveying mechanism 2021 can adopt the same conveying structure as the first conveying mechanism 2011, such as a belt conveyor structure. This design not only ensures the smooth conveying of the tray 8, but also simplifies the maintenance and operation of the equipment.

[0088] The side-pushing mechanism 2022, located on one side of the second conveying mechanism 2021, is a key component for achieving precise positioning of the tray 8. The side-pushing mechanism 2022 is used to push the tray 8 laterally from its side to position it in the lateral direction. Specifically, the side-pushing mechanism 2022 can employ a cylinder-driven pusher plate. By precisely controlling the stroke and thrust of the cylinder, the tray 8 can be pushed to a precise position. This design ensures that the chip transfer robot 6 can accurately align the chip in the tray 8 when grasping the chip, improving the success rate and stability of the grasping process.

[0089] A blocking mechanism 2023 is located at the end of the second conveying mechanism 2021 to prevent the second conveying mechanism 2021 from continuing to convey the tray 8. In this embodiment, the blocking mechanism 2023 can be designed as a baffle that is always raised to ensure that the tray 8 can stay stably after reaching the designated position. Of course, depending on actual needs, the blocking mechanism 2023 can also adopt a cylinder-driven baffle design so that it can be raised to block the tray 8 when needed and lowered to allow the tray 8 to pass when not needed. This flexible design meets the needs of different production scenarios.

[0090] In summary, the grasping and waiting device 202 in this embodiment achieves precise positioning and stable dwell of the Tray 8 through the ingenious design of the second conveying mechanism 2021, the side pushing mechanism 2022, and the blocking mechanism 2023. This structural design not only provides a reliable foundation for the grasping operation of the chip transfer robot 6, but also improves the efficiency and stability of the entire chip testing process.

[0091] In one specific embodiment of this example, the gripping waiting device 202 adds a positioning gripper mechanism 2024 to the original structure. This addition greatly improves the stability and accuracy of the Tray disk 8 during the positioning process.

[0092] The positioning gripper mechanism 2024 is carefully positioned on both sides of the second conveying mechanism 2021, and its position selection ensures accurate and effective gripping of the Tray disk 8, which is positioned in the lateral direction. Cylinder drive technology, with its fast response speed and high control precision, plays an important role in this application.

[0093] Specifically, the positioning gripper mechanism 2024 can adopt a cylinder-driven gripper design. When the tray 8 is pushed to the lateral positioning position by the side-pushing mechanism 2022, the cylinder of the positioning gripper mechanism 2024 is activated, driving the grippers to press down simultaneously or sequentially from both sides of the tray 8, firmly pressing it onto the second conveying mechanism 2021. This holding method not only improves the stability of the tray 8 during the positioning process but also further ensures the accuracy of its position.

[0094] By adding a positioning gripper mechanism 2024, the gripping waiting device 202 in this embodiment achieves a more secure positioning of the tray 8. This design ensures that the tray 8 remains absolutely stable when the chip transfer robot 6 grips the chip, and will not undergo slight displacement due to external factors (such as airflow, vibration, etc.), thereby improving the success rate and accuracy of gripping.

[0095] In summary, the gripping waiting device 202 in this embodiment achieves more secure and precise positioning of the Tray disk 8 by adding a positioning gripper mechanism 2024.

[0096] In a specific and detailed embodiment of this invention, the structural design of the positioning gripper mechanism 2024 is further refined and optimized to ensure its efficient and stable operation in the automated chip testing equipment. Specifically, the positioning gripper mechanism 2024 mainly consists of three core components: a mounting base 20241, grippers 20242, and a cylinder 20243.

[0097] Mounting base 20241, serving as the support structure for the positioning gripper mechanism 2024, is carefully positioned on one side of the second conveying mechanism 2021. This design not only ensures the stability of mounting base 20241 but also provides a solid mounting foundation for other components on it. The precise position and angle adjustment of mounting base 20241 provides strong support for the accurate operation of subsequent gripper 20242.

[0098] The pressure claw 20242 is a key actuator in the positioning pressure claw mechanism 2024, and it is securely mounted on the mounting base 20241. More notably, the pressure claw 20242 is tightly connected to the telescopic rod of the cylinder 20243. This connection allows the pressure claw 20242 to flexibly perform pressing or releasing actions under the drive of the telescopic rod of the cylinder 20243. When the telescopic rod of the cylinder 20243 extends, the pressure claw 20242 correspondingly presses against the tray 8, achieving accurate positioning; when the telescopic rod retracts, the pressure claw 20242 releases, allowing the tray 8 to move freely.

[0099] As the power source for the positioning gripper mechanism 2024, the performance of cylinder 20243 directly affects the operating speed and accuracy of gripper 20242. Therefore, during the selection and design, the response speed, force, and stability of cylinder 20243 were fully considered to ensure that it can meet the usage requirements of the positioning mechanism gripper 2024 in the automated chip testing equipment.

[0100] In summary, the positioning gripper mechanism 2024 in this embodiment achieves efficient and accurate positioning of the Tray 8 through the ingenious combination of the mounting base 20241, the gripper 20242, and the cylinder 20243. This design not only improves the accuracy and efficiency of chip transfer but also provides strong support for the stable operation of the entire automated chip testing equipment.

[0101] In a specific and detailed implementation of this embodiment, the design of the grasping waiting device 202 has been further improved and optimized, with the introduction of a key component, the photoelectric sensing module 2025, to enhance the automation and intelligence of the device.

[0102] The photoelectric sensing module 2025 is carefully positioned on the second conveying mechanism 2021, and its location ensures accurate and timely detection of whether the Tray disk 8 is being conveyed on the second conveying mechanism 2021. The photoelectric sensing module 2025 utilizes the photoelectric effect principle to determine the presence of objects on the conveyor belt by emitting and receiving light, and has advantages such as fast response speed, high detection accuracy, and good stability.

[0103] When the photoelectric sensing module 2025 detects the tray 8 being transported from the second conveying mechanism 2021, it immediately sends a signal to trigger the side-pushing mechanism 2022 to begin operation. Upon receiving the signal, the side-pushing mechanism 2022 quickly starts, pushing the tray 8 to a preset position for side-pushing positioning. This process achieves automatic positioning and preparation of the tray 8, providing strong support for the accurate grasping of the subsequent chip transfer robot 6.

[0104] By introducing the photoelectric sensing module 2025, the grasping and waiting device 202 achieves automatic detection and positioning of the Tray disk 8, greatly improving the automation level and production efficiency of the equipment. At the same time, this design also reduces the need for manual intervention, lowers the labor intensity of operators, and enhances the intelligence level and operational stability of the entire automated chip testing equipment.

[0105] In summary, the grasping and waiting device 202 in this embodiment, through the integration of the photoelectric sensing module 2025, realizes intelligent detection and positioning of the Tray disk 8, providing strong support for the efficient and stable operation of the chip automatic testing equipment.

[0106] Please refer to this again. Figure 1-3 In one embodiment of this example, the workbench 1 is further divided into an empty Tray recovery area 3 and a sorting and unloading area 5 according to the processing area;

[0107] The empty Tray recycling area 3 is located on one side of the full Tray loading area 2. Its main function is to recycle the empty Trays 8 that have been transferred out of the chips. Timely recycling and processing can ensure the cleanliness and orderliness of the workbench and improve overall work efficiency.

[0108] Between testing area 4 and sorting / unloading area 5, a sorting robot 7 is installed. The task of this sorting robot 7 is to sort the tested chips according to the test results and transfer them to sorting / unloading area 5. This step is a crucial part of the chip testing process, determining the final destination and fate of the chips.

[0109] The sorting and unloading area 5 is used to store several empty trays 8. These empty trays 8 will be divided into two categories according to the test results: one category is used to load chips that have passed the test, and the other category is used to load chips that have failed the test. This classified storage facilitates further processing and manufacturing of the chips.

[0110] This embodiment successfully integrates, mechanizes, and automates the chip loading, testing, and sorting processes by dividing the workbench into a full tray loading area 2, an empty tray recovery area 3, a testing area 4, and a sorting and unloading area 5. Furthermore, it coordinates these areas closely and efficiently using robotic arms. This innovative design not only significantly improves the overall efficiency of chip production, optimizes the production process, and reduces waste and delays, but also saves substantial labor costs, reduces worker workload and stress. Moreover, it injects new momentum and vitality into the sustainable development of the chip manufacturing industry, driving the progress and development of the entire sector.

[0111] Although this application uses terms such as "workbench" and "test area" frequently, the possibility of using other terms is not excluded. These terms are used merely for the convenience of describing and explaining the essence of this utility model; interpreting them as any additional limitation would contradict the spirit of this utility model.

[0112] This utility model provides an automatic chip testing device. By setting up a feeding device and a gripping waiting device in the full tray feeding area, and designing the gripping waiting device to store the trays provided by the feeding device and perform lateral pushing positioning on the trays, the chip transfer robot can accurately grip the chips in the trays and transfer them to the testing area. This can significantly improve the accuracy and efficiency of chip transfer, reduce damage to the chips, and thus ensure the smooth operation of the entire chip production line and the stable improvement of product quality.

[0113] Finally, it should be noted that although the above embodiments have been described in the text and drawings of this application, this should not limit the scope of patent protection of this application. Any technical solutions that are based on the essential concept of this application and utilize the content described in the text and drawings of this application, resulting in equivalent structural or procedural substitutions or modifications, as well as the direct or indirect application of the technical solutions of the above embodiments to other related technical fields, are all included within the scope of patent protection of this application.

Claims

1. An automated chip testing device, characterized in that, Includes a workbench (1), which is divided into a full tray loading area (2) and a testing area (4) according to the processing area. The full Tray loading area (2) is used to store several Tray disks (8) loaded with chips to be tested. A chip transfer robot (6) is provided between the full tray loading area (2) and the test area (4). The chip transfer robot (6) is used to transfer the chip in the tray (8) to the test area (4). The test area (4) is used to test the transferred chip; The full tray loading area (2) includes a loading device (201) and a gripping and waiting device (202). The feeding device (201) is used to store a plurality of the trays (8), the plurality of trays (8) being stacked; and to provide the trays (8) to the gripping waiting device (202). The gripping waiting device (202) is used to store the tray (8) provided by the feeding device (201) and to perform side-pushing positioning on the tray (8) to wait for the chip transfer robot (6) to transfer the chip in the tray (8) to the test area (4).

2. The automatic chip testing equipment according to claim 1, characterized in that, The grabbing and waiting device (202) includes a second conveying mechanism (2021) and a side pushing mechanism (2022). The second conveying mechanism (2021) is used to continue conveying the tray (8) from the loading device (201); The side-pushing mechanism (2022) is located on one side of the second transfer mechanism (2021) and is used to push the Tray (8) laterally from the side of the Tray (8) to position the Tray (8) in the lateral direction, so as to wait for the chip transfer robot (6) to transfer the chip in the Tray (8) to the test area (4).

3. The automatic chip testing equipment according to claim 2, characterized in that, The grabbing waiting device (202) also includes a blocking mechanism (2023); The blocking mechanism (2023) is located at the end of the second transmission mechanism (2021) and is used to block the second transmission mechanism (2021) from continuing to transmit the Tray disk (8).

4. The automated chip testing equipment according to claim 2, characterized in that, The grasping waiting device (202) also includes a positioning pressure claw mechanism (2024). The positioning gripper mechanism (2024) is disposed on both sides of the second conveying mechanism (2021) and is used to press the Tray disk (8) positioned in the lateral direction.

5. The automatic chip testing equipment according to claim 4, characterized in that, The positioning gripper mechanism (2024) includes a mounting base (20241), a gripper (20242), and a cylinder (20243). The mounting base (20241) is disposed on one side of the second conveying mechanism (2021) and is used to provide a mounting base for the pressure claw (20242); The pressure claw (20242) is disposed on the mounting base (20241) and connected to the telescopic rod of the cylinder (20243), and can perform pressing or releasing actions accordingly under the drive of the telescopic rod of the cylinder (20243).

6. The automatic chip testing equipment according to claim 2, characterized in that, The grabbing waiting device (202) also includes a photoelectric sensing module (2025); The photoelectric sensing module (2025) is disposed on the second conveying mechanism (2021) and is used to detect whether the Tray disk (8) is being conveyed on the second conveying mechanism (2021). When the Tray disk (8) is detected, the side pushing mechanism (2022) is triggered to start operating.

7. The automated chip testing equipment according to claim 2, characterized in that, The feeding device (201) includes a first conveying mechanism (2011), a lifting mechanism (2012), a storage tank (2013), and a clamping mechanism (2014). The storage slot (2013) is used to store several stacked Tray disks (8); The lifting mechanism (2012) is located at the bottom of the storage slot (2013) and is used to move up and down through the storage slot (2013) to lift or lower the tray (8) in the storage slot (2013); The clamping mechanism (2014) is located on both sides of the storage slot (2013) and is used to extend out when the lifting mechanism (2012) lifts the Tray disk (8) in the storage slot (2013) to clamp the remaining Tray disks (8) except for the bottommost Tray disk (8); The lifting mechanism (2012) is also used to lower the bottom Tray disk (8) to place it onto the first conveying mechanism (2011) when the clamping mechanism (2014) clamps the remaining Tray disks (8) except for the bottommost Tray disk (8). The first transmission mechanism (2011) is connected to the second transmission mechanism (2021) for transmitting the Tray disk (8) placed thereon to the second transmission mechanism (2021).

8. The automated chip testing equipment according to claim 1, characterized in that, The workbench (1) is further divided into an empty Tray recovery area (3) and a sorting and unloading area (5) according to the processing area. The empty Tray recycling area (3) is used to recycle the empty Tray disk (8) after the transferred chip is removed; A sorting robot (7) is provided between the test area (4) and the sorting and unloading area (5). The sorting robot (7) is used to transfer the tested chips to the sorting and unloading area (5). The sorting and unloading area (5) is used to store several empty trays (8), some of which are empty trays (8) for loading chips that have passed the test and are of good quality, and the other part of the empty trays (8) for loading chips that have failed the test.

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