Automatic equipment for chip testing

Abstract

The utility model relates to the technical field of automation equipment, and discloses automation equipment for chip testing, which is characterized in that an alignment floating assembly is additionally arranged to enable an alignment pin column to move relative to an alignment hole in the horizontal direction, so that the alignment pin column can be accurately inserted into the alignment hole, and the chip testing efficiency is improved. Therefore, the probe module can be accurately contacted with the chip on the test carrier plate. The design effectively solves the problem of inaccurate contact between the probe module and the chip in the existing chip test equipment, and significantly improves the precision and reliability of chip test. Meanwhile, the introduction of the alignment floating assembly also enhances the adaptability of the device to chips of different sizes, reduces the test error and chip damage risk caused by inaccurate alignment, and further improves the test efficiency and the stability of the device.

Description

Technical Field

[0001] This utility model relates to the field of automation equipment technology, and in particular to an automated device for chip testing. Background Technology

[0002] Semiconductor materials refer to a category of materials with special properties, whose electrical conductivity lies between that of conductors and insulators under normal temperature conditions. Due to their unique electrical properties, semiconductor materials have shown broad application prospects in many key fields. Specifically, they play an indispensable role in the manufacturing process of integrated circuits, the booming development of the consumer electronics industry, the construction of communication systems, the innovative application of photovoltaic power generation technology, the optimization and upgrading of lighting projects, and the research and development of high-power power conversion technologies.

[0003] Take chips as an example. These microelectronic devices, which occupy a core position in modern electronic devices, are meticulously manufactured through the ingenious application of semiconductor materials. As highly integrated and precise electronic components, the manufacturing process of chips requires extremely high technical levels and rigorous processes. After the manufacturing process is completed, the chips must undergo a series of strict and meticulous testing procedures to ensure that all performance indicators meet the design requirements before they can successfully pass acceptance, officially roll off the production line, and be released into the vast market.

[0004] Currently, with the rapid development of science and technology, the application of automated testing equipment in chip performance testing has become increasingly widespread. These advanced testing devices not only greatly improve testing efficiency but also effectively enhance testing accuracy, providing strong support for chip quality control.

[0005] However, it is worth noting that in the current mainstream testing equipment, how to scientifically and rationally design the probe modules in the testing device to ensure accurate contact with the chip on the test substrate, thereby ensuring the smooth progress of chip testing, has become a major technical challenge that urgently needs to be overcome in this field. Solving this problem not only relates to improving chip testing efficiency but also directly affects the quality and reliability of chip products, thus possessing extremely important practical significance and research value.

[0006] The above information is provided as background information only to aid in understanding this disclosure and does not constitute an assertion or admission that any of the above content can be used as prior art relative to this disclosure. Utility Model Content

[0007] This invention provides an automated device for chip testing to solve the problems existing in the prior art.

[0008] To achieve the above objectives, this utility model provides the following technical solution:

[0009] An automated chip testing device includes a testing apparatus, which comprises a pressure head mechanism and a testing mechanism.

[0010] The pressure head mechanism has a pressed state that abuts against the testing mechanism and a separated state that is separated from the testing mechanism, so as to cooperate with the testing mechanism to perform testing;

[0011] The testing facility is used to test the transferred chips;

[0012] The top of the testing mechanism is provided with a test carrier board for placing chips;

[0013] The pressure head mechanism includes a lifting module, a fixing plate, and a pressing module;

[0014] The lifting module is used to output lifting driving force;

[0015] The pressing module is mounted on the lifting module via the fixing plate and is used to press down the chip placed on the test carrier to cooperate with the test mechanism for testing.

[0016] The pressing module includes a pressing cover assembly and a clamping assembly;

[0017] The clamping assembly is used to release the clamped lower cap assembly to place the lower cap assembly onto the test carrier plate; and to clamp the lower cap assembly placed on the test carrier plate to separate the lower cap assembly from the test carrier plate.

[0018] The lower pressure cover assembly includes a lower pressure seat, a probe module, an alignment pin, and an alignment floating assembly;

[0019] The probe module is disposed on the side of the pressure seat facing the test carrier plate;

[0020] The alignment pin is disposed on the side of the probe module facing the test carrier plate;

[0021] The test carrier plate has an alignment hole on the side facing the probe module, into which the alignment pin can be inserted;

[0022] The alignment floating component is disposed between the probe module and the pressure seat, so that the alignment pin can move relative to the alignment hole in the horizontal direction, so that the alignment pin can be accurately inserted into the alignment hole, thereby enabling the probe module to accurately contact the chip on the test carrier.

[0023] Furthermore, in the automated equipment for chip testing, the alignment floating component is a double-layer planar bearing structure, including a base, two bearing rings, and balls;

[0024] The base is T-shaped, including a cylindrical part at the upper end and a disc part at the lower end;

[0025] The two bearing rings are sequentially fitted onto the cylindrical portion, and each is provided with a plurality of receiving grooves along the circumferential direction;

[0026] Each of the receiving slots is provided with one of the ball bearings.

[0027] Furthermore, in the automated equipment for chip testing, the lower pressure cover assembly also includes a pair of magnets;

[0028] The magnet pair comprises two magnets;

[0029] One of the magnets is embedded in the side of the lower pressure seat facing the probe module;

[0030] Another magnet is embedded in the side of the probe module facing the lower pressure seat;

[0031] The two magnets are attracted to each other to reset the alignment pin after it has disengaged from the alignment hole.

[0032] Furthermore, the automated equipment for chip testing also includes a material sorting and unloading device;

[0033] The loading and unloading sorting device is used to load the trays containing the chips to be tested; and after the test is completed, the tested chips are classified according to the test results and stored in the corresponding trays, and then the trays containing the tested chips are unloaded.

[0034] A first chip transfer robot is provided between the testing device and the loading and unloading sorting device. The first chip transfer robot is used to transfer chips from the loading tray to the testing device.

[0035] Furthermore, in the automated equipment for chip testing, the loading and unloading sorting device includes a loading and unloading sorting module;

[0036] The loading and unloading sorting module includes a loading mechanism, an unloading mechanism, a first shuttle mechanism, and a second chip transfer robot.

[0037] The feeding mechanism is used to feed the tray containing the chips to be tested.

[0038] The second chip transfer robot is used to transfer chips from the loading tray to the first shuttle mechanism; and to transfer tested chips from the first shuttle mechanism to the unloading mechanism;

[0039] The first shuttle mechanism is used to transport the chip, waiting for the first chip transfer robot to transfer the chip to the testing device; and to receive the tested chip transferred by the first chip transfer robot and transport it, waiting for the second chip transfer robot to transfer the tested chip from the first shuttle mechanism to the unloading mechanism;

[0040] The feeding mechanism is used to feed the tray containing the tested chips.

[0041] Furthermore, in the automated equipment for chip testing, the number of testing devices is two;

[0042] The two testing devices are symmetrically arranged on both sides of the loading and unloading sorting device, and the two testing devices have the same structure.

[0043] Furthermore, in the automated chip testing equipment, the number of loading and unloading sorting modules is two;

[0044] The two loading and unloading sorting modules are arranged symmetrically on the left and right, and each is paired with a corresponding testing device, and the two loading and unloading sorting modules have the same structure.

[0045] Furthermore, in the automated equipment for chip testing, the testing device further includes a second shuttle mechanism and a third chip transfer robot.

[0046] The second shuttle mechanism is used to transport the chips transferred by the first chip transfer robot.

[0047] The third chip transfer robot is used to transfer the chip conveyed by the second shuttle mechanism to the testing mechanism.

[0048] Furthermore, in the automated equipment for chip testing, the fixture assembly includes a clamping seat, two grippers, a first cylinder, a gear, and two racks;

[0049] The clamping seat is fixed to the fixing plate;

[0050] The two grippers are arranged facing each other on the gripping seat and can move in directions that bring them closer to each other and away from each other in order to grip the lower cover assembly;

[0051] The first cylinder is fixed on the clamping seat and is used to provide clamping power to the two grippers;

[0052] The gear is rotatably connected to the clamping seat, and the axial direction of the gear is perpendicular to the movement direction of the gripper.

[0053] The two racks are located on both sides of the gear, and when the gear rotates, the sliding direction of the racks is parallel to the movement direction of the gripper;

[0054] Each of the racks is fixedly connected to a corresponding gripper, and one of the racks is fixedly connected to the piston rod of the first cylinder.

[0055] Furthermore, in the automated equipment for chip testing, the lower pressure cover assembly also includes a knob, a locking component, a linkage component, and two snap hooks;

[0056] The two latch hooks are arranged facing each other on the lower pressure seat and can move in directions that bring them closer together and away from each other in order to latch and fix or separate them from the test carrier plate.

[0057] The knob is rotatably mounted on the lower pressure seat and is connected to the two buckle hooks respectively through the linkage;

[0058] One end of the engaging component is connected to the central shaft of the gear, and the other end can engage with the knob.

[0059] When the pressure seat contacts the test plate, the first cylinder drives the rack to move, causing the gear to rotate in one direction, thereby driving the two grippers to release the pressure seat. At the same time, the gear drives the knob to rotate in one direction through its central shaft and the engaging member, thereby driving the two latch hooks to be locked to the test plate through the linkage member.

[0060] When the pressure seat needs to be separated from the test carrier plate, the first cylinder drives the rack to move in the opposite direction, causing the gear to rotate in another direction, thereby driving the two grippers to clamp the pressure seat. At the same time, the gear drives the knob to rotate in another direction through its central shaft and the locking member, thereby driving the two latch hooks to separate from the test carrier plate through the linkage member.

[0061] Compared with the prior art, the present invention has the following beneficial effects:

[0062] This invention provides an automated chip testing device that, by adding a floating alignment component, allows the alignment pin to move horizontally relative to the alignment hole, ensuring accurate insertion of the alignment pin and precise contact between the probe module and the chip on the test substrate. This design effectively solves the problem of inaccurate contact between the probe module and the chip in existing chip testing equipment, significantly improving the accuracy and reliability of chip testing. Furthermore, the introduction of the floating alignment component enhances the device's adaptability to chips of different sizes, reduces testing errors and chip damage risks caused by inaccurate alignment, and further improves testing efficiency and equipment stability.

[0063] This invention has other features and advantages that will be apparent from or will be set forth in detail in the accompanying drawings and the following detailed description, which together serve to explain the particular principles of this invention. Attached Figure Description

[0064] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0065] Figure 1 This is a three-dimensional structural diagram of an automated chip testing device provided in an embodiment of the present invention;

[0066] Figure 2 This is one of the top view structural schematic diagrams of an automated chip testing equipment provided in this embodiment of the present invention;

[0067] Figure 3 This is a three-dimensional structural diagram of the loading and unloading sorting device provided in this embodiment of the utility model;

[0068] Figure 4 This is a three-dimensional structural diagram of the testing device provided in this embodiment of the utility model;

[0069] Figure 5 This is a side view structural schematic diagram of the testing device provided in this embodiment of the utility model;

[0070] Figure 6 This is a partial three-dimensional structural diagram of the testing device provided in this embodiment of the utility model;

[0071] Figure 7This is one of the three-dimensional structural schematic diagrams of the pressure head mechanism provided in this embodiment of the utility model;

[0072] Figure 8 This is one of the three-dimensional structural schematic diagrams of the pressing module provided in this embodiment of the utility model;

[0073] Figure 9 This is one of the (three-dimensional) structural schematic diagrams of the lower pressure cover assembly provided in this utility model embodiment;

[0074] Figure 10 This is the second (three-dimensional) structural schematic diagram of the lower pressure cover assembly provided in this embodiment of the utility model;

[0075] Figure 11 This is one of the (three-dimensional) structural schematic diagrams of the probe module, alignment pin, and alignment floating assembly provided in this embodiment of the utility model;

[0076] Figure 12 This is the second (three-dimensional) structural schematic diagram of the probe module, alignment pin, and alignment floating assembly provided in this embodiment of the utility model;

[0077] Figure 13 This is one of the (three-dimensional) structural schematic diagrams of the alignment floating component provided in this utility model embodiment;

[0078] Figure 14 This is the second (three-dimensional) structural schematic diagram of the alignment floating component provided in this embodiment of the utility model;

[0079] Figure 15 This is a top view structural schematic diagram of the loading and unloading sorting device provided in this embodiment of the utility model;

[0080] Figure 16 This is a three-dimensional structural schematic diagram of the clamp assembly provided in this embodiment of the utility model;

[0081] Figure 17 This is one of the (three-dimensional) structural schematic diagrams of the lower pressure cover assembly provided in this utility model embodiment;

[0082] Figure 18 This is the second (three-dimensional) structural schematic diagram of the lower pressure cover assembly provided in this embodiment of the utility model;

[0083] Figure label:

[0084] 1. Loading and unloading sorting device; 2. Testing device; 3. First chip transfer robot.

[0085] Material sorting module 101;

[0086] Feeding mechanism 1011, unloading mechanism 1012, first shuttle mechanism 1013, second chip transfer robot 1014;

[0087] Second shuttle mechanism 201, third chip transfer robot 202, pressure head mechanism 203, testing mechanism 204, testing carrier board 205;

[0088] Lifting module 2031, fixing plate 2032, pressing module 2033;

[0089] Lower pressure cover assembly 20331, clamp assembly 20332, lower pressure floating assembly 20333;

[0090] Clamping seat 203321, gripper 203322, cylinder 203323, gear 203324, rack 203325;

[0091] 203311, 203312, 203313, 203314, 203315, 203316, 203317, 203318, 203319.

[0092] Base 2033181, bearing ring 2033182, ball bearing 2033183. Detailed Implementation

[0093] To illustrate the possible application scenarios, technical principles, implementable specific solutions, and achievable objectives and effects of this application in detail, the following description, in conjunction with the listed specific embodiments and accompanying drawings, provides a detailed explanation. The embodiments described herein are merely illustrative of the technical solutions of this application and are therefore intended to limit the scope of protection of this application.

[0094] In this document, the term "embodiment" means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The term "embodiment" appearing in various places throughout the specification does not necessarily refer to the same embodiment, nor does it specifically limit its independence or connection with other embodiments. In principle, in this application, as long as there are no technical contradictions or conflicts, the technical features mentioned in each embodiment can be combined in any way to form corresponding implementable technical solutions.

[0095] Unless otherwise defined, the technical terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the use of related terms herein is merely for the purpose of describing particular embodiments and is not intended to limit this application.

[0096] In the description of this application, the term "and / or" is used to describe the logical relationship between objects, indicating that three relationships can exist. For example, A and / or B means: A exists, B exists, and A and B exist simultaneously. Additionally, the character " / " in this document generally indicates that the preceding and following objects have an "or" logical relationship.

[0097] In this application, terms such as “first” and “second” are used only to distinguish one entity or operation from another, and do not necessarily require or imply any actual quantity, hierarchy or order relationship between these entities or operations.

[0098] Unless otherwise specified, the use of terms such as “comprising,” “including,” “having,” or other similar expressions in this application is intended to cover non-exclusive inclusion, which does not exclude the presence of additional elements in a process, method, or product that includes the stated elements, such that a process, method, or product that includes a list of elements may include not only those defined elements but also other elements not expressly listed, or elements inherent to such a process, method, or product.

[0099] In this application, expressions such as "greater than", "less than", and "exceeding" are understood to exclude the stated number; expressions such as "above", "below", and "within" are understood to include the stated number. Furthermore, in the description of the embodiments of this application, "multiple" means two or more (including two), and similar expressions related to "multiple" are also understood in this way, such as "multiple groups" and "multiple times", unless otherwise explicitly specified.

[0100] In the description of the embodiments of this application, the space-related expressions used, such as "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "vertical," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," indicate the orientation or positional relationship based on the orientation or positional relationship shown in the specific embodiments or drawings. They are only for the purpose of describing the specific embodiments of this application or for the reader's understanding, and do not indicate or imply that the device or component referred to must have a specific position, a specific orientation, or be constructed or operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0101] Unless otherwise expressly specified or limited, the terms "installation," "connection," "linking," "fixing," and "setting," as used in the description of the embodiments of this application, should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral setting; it can be a mechanical connection, an electrical connection, or a communication connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal connection of two components or the interaction between two components. For those skilled in the art to which this application pertains, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0102] In view of the deficiencies of the existing technology, the applicant, based on years of practical experience and professional knowledge in the design and manufacturing of this field, and in conjunction with the application of theoretical principles, has actively conducted research and innovation in order to create a technology that can solve the deficiencies of the existing technology. After continuous research, design, and repeated prototype production and improvement, this utility model with practical value has finally been created.

[0103] Please refer to Figure 1-12 This utility model provides an automated chip testing device, including a testing device 2, which is further subdivided into two major functional modules: a pressure head mechanism 203 and a testing mechanism 204. The two work together to achieve efficient and accurate chip testing.

[0104] The pressure head mechanism 203 is designed to have two working states: one is a pressed state in close contact with the test mechanism 204, and the other is a separated state completely separated from the test mechanism 204. This design allows the pressure head mechanism 203 to flexibly cooperate with the test mechanism 204 to complete the chip testing process according to the testing requirements.

[0105] The testing unit 204, as the core execution unit for chip testing, is responsible for performing comprehensive performance testing on the received chips. To facilitate chip placement and testing, a test carrier board 205 is specially provided on the top of the testing unit 204, providing a stable and reliable testing platform for the chips.

[0106] The pressure head mechanism 203 has a sophisticated internal structure and clearly defined functions, mainly consisting of three components: a lifting module 2031, a fixing plate 2032, and a pressing module 2033. The lifting module 2031 serves as the power source, responsible for outputting lifting driving force to provide power support for the up-and-down movement of the pressing module 2033. The pressing module 2033 is securely mounted on the lifting module 2031 via the fixing plate 2032. Its main function is to press down on the chip placed on the test carrier board 205 to cooperate with the test mechanism 204 in completing the testing task.

[0107] The pressure module 2033 is further subdivided into two parts: the pressure cap assembly 20331 and the clamping assembly 20332. The clamping assembly 20332 has a dual function: on the one hand, it is responsible for clamping the pressure cap assembly 20331 and accurately releasing it onto the test carrier plate 205; on the other hand, after the test is completed, the clamping assembly 20332 will also clamp and separate the pressure cap assembly 20331 from the test carrier plate 205 for the next test operation.

[0108] The design of the lower pressure cap assembly 20331 is equally ingenious, comprising several key components such as the lower pressure seat 203311, the probe module 203316, the alignment pin 203317, and the alignment floating assembly 203318. The probe module 203316 is mounted on the side of the lower pressure seat 203311 facing the test carrier 205, responsible for establishing an electrical connection with the chip during testing and transmitting test signals. The alignment pin 203317 is located on the side of the probe module 203316 facing the test carrier 205, used to achieve precise alignment between the lower pressure cap assembly 20331 and the test carrier 205.

[0109] To facilitate the alignment function of the alignment pin 203317, the test carrier 205 has a specially designed alignment hole on the side facing the probe module 203316 for the alignment pin 203317 to be inserted. The alignment floating component 203318 is cleverly positioned between the probe module 203316 and the lower pressure seat 203311, allowing the alignment pin 203317 to move horizontally relative to the alignment hole. This design greatly improves the flexibility and accuracy of alignment, ensuring that the alignment pin 203317 can be accurately inserted into the alignment hole, thereby enabling the probe module 203316 to precisely contact the chip on the test carrier 205 for effective testing.

[0110] It is worth mentioning that this embodiment, through the innovative addition of the alignment floating component 203318, not only effectively solves the problem of inaccurate contact between the probe module 203316 and the chip in existing chip testing equipment, but also significantly improves the accuracy and reliability of chip testing. Simultaneously, the introduction of the alignment floating component 203318 enhances the equipment's adaptability to chips of different sizes, enabling it to more flexibly meet various testing needs. This design greatly reduces testing errors and the risk of chip damage caused by inaccurate alignment, further improving testing efficiency and equipment stability, bringing revolutionary technological innovation to the chip testing industry.

[0111] Please refer to Figure 13-14In one specific embodiment proposed in this example, the alignment floating component 203318 adopts a double-layer planar bearing structure design. This component mainly consists of a base 2033181, two bearing rings 2033182, and balls 2033183, etc., and its structure is ingenious and highly functional.

[0112] Specifically, the base 2033181 is designed in a T-shape, and its structure includes a cylindrical part at the upper end and a disc part at the lower end. This design not only ensures the stability of the base 2033181, but also facilitates connection and fixation with other components.

[0113] Furthermore, the two bearing rings 2033182 are sequentially fitted onto the cylindrical portion, and each ring has a plurality of receiving grooves along the circumferential direction. The design of these receiving grooves provides accurate positioning for the installation of the balls 2033183, ensuring that the balls 2033183 can be stably embedded therein.

[0114] Each of the accommodating slots contains a ball bearing 2033183. These balls 2033183 can roll freely within the bearing ring 2033182, thereby enabling the alignment floating assembly to float flexibly and be precisely positioned in the plane. Through this structural design, the alignment floating assembly 203318 not only has high load-bearing capacity and stability, but also effectively reduces frictional resistance, improving the overall operating efficiency and accuracy of the mechanism.

[0115] Please refer to this again. Figure 11-12 In one specific embodiment shown in this example, the lower pressure cap assembly 20331 also cleverly integrates a magnet pair design. This magnet pair consists of two magnets 203319, which play a crucial role in the assembly.

[0116] Specifically, one magnet 203319 is carefully embedded on the side of the lower pressure base 203311 facing the probe module 203316. The other magnet 203319 is correspondingly embedded on the side of the probe module 203316 facing the lower pressure base 203311. This arrangement ensures that the two magnets are in a directly opposite position.

[0117] After the aligning pin 203317 completes its alignment function and disengages from the aligning hole, the two opposing magnets 203319 come into play. They attract each other magnetically, providing a stable restoring force to the aligning pin 203317, allowing it to accurately return to its initial position. This design not only improves the automation level of the component but also ensures the stability and reliability of the entire system. Therefore, it can be said that the introduction of the magnet pair provides strong support for the functional realization of the lower pressure cap assembly 20331.

[0118] Please refer to Figure 1-4 In one specific embodiment shown in this example, the automated chip testing equipment is further equipped with a loading and unloading sorting device 1, which plays a crucial role in the entire testing process.

[0119] The main function of the loading and unloading sorting device 1 is to load the trays containing the chips to be tested. At the beginning of the testing process, the device accurately delivers the trays to the designated positions so that subsequent equipment or robots can pick up the chips.

[0120] More importantly, after the testing is completed, the loading and unloading sorting device 1 will also classify the tested chips according to the test results. In this process, it will store chips with different test results in the corresponding trays according to the preset classification criteria, ensuring accurate chip classification and convenient subsequent processing.

[0121] After sorting, the loading and unloading sorting device 1 will also unload the trays containing the tested chips and send them to the designated storage area or the next process for subsequent processing or packaging.

[0122] To facilitate the operation of the loading and unloading sorting device 1, a first chip transfer robot 3 is specially installed between the testing device 2 and the loading and unloading sorting device 1. This robot is ingeniously designed and powerfully functional; it is responsible for accurately and quickly transferring the chips from the loading tray to the testing device 2 for subsequent testing operations.

[0123] Through the coordinated operation of the loading and unloading sorting device 1 and the first chip transfer robot 3, the entire chip testing process achieves a high degree of automation and intelligence, greatly improving testing efficiency and accuracy while reducing the cost and risk of manual intervention. This implementation not only demonstrates the technological innovation of this invention but also lays a solid foundation for its widespread application in practice.

[0124] Please refer to Figure 15In a specific embodiment described in detail in this example, the loading and unloading sorting device 1 is carefully designed as a complex and efficient system including the loading and unloading sorting module 101.

[0125] The loading and unloading sorting module 101 is the core component of the entire loading and unloading sorting device 1. It integrates multiple key mechanisms to realize the loading, unloading and sorting functions in the chip testing process.

[0126] Specifically, the loading mechanism 1011 is responsible for accurately feeding the trays containing the chips to be tested into the system. This mechanism, through precise positioning and conveying mechanisms, ensures that the trays can reach the designated positions stably and quickly, preparing for subsequent chip transfer operations.

[0127] Next, the second chip transfer robot 1014 comes into play. It is responsible for accurately transferring the chips from the tray delivered by the feeding mechanism 1011 to the first shuttle mechanism 1013. During this process, the robot uses highly precise motion control and positioning technology to ensure that the chips are not damaged during the transfer, while maintaining an efficient working rhythm.

[0128] The first shuttle mechanism 1013 plays a crucial role in chip delivery. It not only temporarily stores and transports chips delivered by the second chip transfer robot 1014, awaiting the first chip transfer robot 3 to transfer the chips to the testing device 2 for testing; but also, after testing, it receives the tested chips transferred back by the first chip transfer robot 3 and continues to transport them, awaiting the second chip transfer robot 1014 to transfer the tested chips to the unloading mechanism 1012.

[0129] Finally, the unloading mechanism 1012 is responsible for unloading the trays containing the tested chips. By accurately and quickly feeding the trays out of the system, it ensures that the tested chips can receive timely processing or packaging.

[0130] In summary, the loading / unloading sorting module 101, through the close cooperation and coordinated operation of the loading mechanism 1011, the unloading mechanism 1012, the first shuttle mechanism 1013, and the second chip transfer robot 1014, achieves efficient loading / unloading and sorting functions in the chip testing process. This design not only improves testing efficiency and accuracy but also reduces the cost and risk of manual intervention, providing strong support for the widespread application of automated equipment for chip testing.

[0131] Please refer to Figure 1-4 In a specific embodiment shown in this example, the arrangement of the testing device 2 and the loading / unloading sorting module 101 has been carefully designed.

[0132] Specifically, the number of testing devices 2 is determined to be two. These two testing devices 2 are symmetrically arranged on both sides of the loading and unloading sorting device 1, forming a balanced and efficient layout. It is worth noting that the two testing devices 2 have identical structures, which means that they have the same testing capabilities and testing procedures, and can perform chip testing in parallel, thereby greatly improving testing efficiency.

[0133] Meanwhile, the number of loading / unloading sorting modules 101 is also determined to be two. These two loading / unloading sorting modules 101 are also arranged symmetrically on the left and right, and each is closely matched with a corresponding testing device 2. This one-to-one matching method ensures efficient collaborative work between the loading / unloading sorting modules and the testing devices, making the entire chip testing process smoother and more efficient.

[0134] It is worth mentioning that the two loading and unloading sorting modules 101 are structurally identical. This means they have the same loading, unloading, and sorting capabilities, and can process chip loading, post-testing unloading, and sorting in parallel. This structural similarity not only simplifies equipment maintenance and management but also improves equipment reliability and stability.

[0135] In summary, this embodiment, by symmetrically arranging two testing devices 2 and two loading / unloading sorting modules 101, forms an efficient, balanced, and reliable automated equipment layout for chip testing. This layout not only improves testing efficiency and equipment utilization but also provides strong support for batch chip testing.

[0136] Please refer to Figure 5-6 In one specific embodiment described in detail in this example, the testing device 2 is further designed as an advanced system including a second shuttle mechanism 201 and a third chip transfer manipulator 202.

[0137] The second shuttle mechanism 201 plays a crucial role in the testing device 2. Its main function is to receive the chips transferred by the first chip transfer robot 3 and efficiently transport them. Through precise mechanical design and control, the second shuttle mechanism 201 ensures the stability and accuracy of the chips during transport, providing a reliable guarantee for subsequent testing operations.

[0138] Next, the third chip transfer robot 202 plays a crucial role. It is responsible for accurately transferring the chips delivered by the second shuttle mechanism 201 to the testing mechanism 204. During this process, the third chip transfer robot 202 uses highly precise motion control and positioning technology to ensure that the chips are accurately placed in the designated positions of the testing mechanism 204, providing accurate initial conditions for chip testing.

[0139] In summary, by integrating the second shuttle mechanism 201 and the third chip transfer robot 202, the testing device 2 achieves efficient and accurate transfer of chips from the first chip transfer robot 3 to the testing mechanism 204. This design not only improves the automation level and testing efficiency of the testing device 2 but also ensures the stability and reliability of the chips during the testing process. This advanced testing device 2 provides strong support for automated equipment for chip testing, meeting the requirements for efficient and accurate chip testing.

[0140] Please refer to Figure 16 In one specific embodiment shown in this example, the clamp assembly 20332 is carefully designed as a complex and efficient mechanical structure including a clamping seat 203321, two grippers 203322, a first cylinder 203323, a gear 203324, and two racks 203325.

[0141] The clamping base 203321 serves as the base of the clamping assembly and is firmly fixed to the fixing plate 2032, providing stable support for the entire clamping assembly.

[0142] Two grippers 203322 are positioned facing each other on the gripper base 203321, and they can move towards and away from each other. This design allows the grippers 203322 to flexibly grip and release the lower pressure cap assembly 20331, meeting the needs of automated production lines for fast and accurate workpiece gripping.

[0143] The first cylinder 203323, serving as the power source for the grippers 203322, is fixed to the clamping seat 203321. When the first cylinder 203323 operates, it provides clamping power to the two grippers 203322 through the movement of the piston rod, enabling them to tightly clamp the lower pressure cap assembly 20331.

[0144] Gear 203324 is rotatably connected to clamping base 203321, and its axis is perpendicular to the movement direction of jaw 203322. This arrangement allows the rotation of gear 203324 to be converted into the linear motion of jaw 203322, achieving a clever conversion of mechanical transmission.

[0145] Two racks 203325 are located on either side of gear 203324 and mesh with it. When gear 203324 rotates, racks 203325 slide in a direction parallel to the direction of movement of gripper 203322. This sliding motion is transmitted to gripper 203322 through the fixed connection between racks 203325 and gripper 203322, thus realizing the gripping and releasing action of gripper 203322.

[0146] Specifically, one of the racks 203325 is fixedly connected to the piston rod of the first cylinder 203323. Thus, when the first cylinder 203323 operates, its piston rod drives the rack 203325 to move. This, in turn, through the rotation of the gear 203324 and the sliding of the other rack 203325, causes the two grippers 203322 to move simultaneously, thereby clamping and releasing the lower pressure cap assembly 20331.

[0147] In summary, the clamping assembly 20332, through the ingenious cooperation of the clamping seat 203321, two grippers 203322, the first cylinder 203323, the gear 203324, and two racks 203325, achieves efficient and accurate clamping of the lower pressure cap assembly 20331. This design not only improves the production efficiency of the automated production line but also ensures the stability and reliability of workpiece clamping.

[0148] Please refer to Figure 17-18 In one specific embodiment described in detail in this example, the lower pressure cover assembly 20331 is designed as a complex and ingenious mechanical structure including a knob 203312, a locking component 203313, a linkage component 203314, and two snap hooks 203315, which works in conjunction with the previous clamp assembly 20332 to achieve the fixing and release of the test carrier plate 205.

[0149] Two latching hooks 203315 are positioned facing each other on the lower pressure seat 203311, and they can move towards each other and away from each other. This design allows the latching hooks 203315 to be flexibly secured or detached from the test carrier plate 205, ensuring the stability and reliability of the test carrier plate 205 during the testing process.

[0150] The knob 203312 is rotatably mounted on the lower pressure seat 203311 and is connected to two latch hooks 203315 via a linkage 203314. This connection method allows the rotation of the knob 203312 to be converted into the linear motion of the latch hooks 203315, achieving a clever conversion of mechanical transmission.

[0151] One end of the engaging component 203313 is connected to the central shaft of the gear 203324, and the other end can engage with the knob 203312. This design allows the rotation of the gear 203324 to be transmitted to the knob 203312 through the engaging component 203313, which in turn controls the movement of the latch hook 203315 through the linkage component 203314.

[0152] When the lower pressure seat 203311 contacts the test carrier plate 205, the first cylinder 203323 drives the rack 203325 to move, causing the gear 203324 to rotate in one direction. This rotation not only causes the two grippers 203322 to release the lower pressure seat 203311, but also drives the knob 203312 to rotate in one direction through the central axis of the gear 203324 and the engaging component 203313. The rotation of the knob 203312 then drives the two latches 203315 to engage and fix with the test carrier plate 205 through the linkage component 203314, ensuring the stability of the test carrier plate 205 during the test.

[0153] Conversely, when the lower pressure seat 203311 needs to separate from the test carrier plate 205, the first cylinder 203323 drives the rack 203325 to move in the opposite direction, causing the gear 203324 to rotate in the other direction. This rotation not only causes the two grippers 203322 to clamp the lower pressure seat 203311, but also drives the knob 203312 to rotate in the other direction through the central axis of the gear 203324 and the engaging part 203313. The rotation of the knob 203312 then drives the two latch hooks 203315 to separate from the test carrier plate 205 through the linkage part 203314, so that the lower pressure seat 203311 can be smoothly removed from the test carrier plate 205.

[0154] In summary, the lower pressure cap assembly 20331, through the ingenious cooperation of the knob 203312, the locking component 203313, the linkage component 203314, and the two latching hooks 203315, achieves efficient and accurate fixing and release with the test carrier plate 205. This design not only improves the flexibility and reliability of automated testing equipment but also ensures the stability and safety of the test carrier plate 205 during testing.

[0155] Although this application uses terms such as testing device and robotic arm frequently, the possibility of using other terms is not excluded. These terms are used merely for the convenience of describing and explaining the essence of this utility model; interpreting them as any additional limitation would contradict the spirit of this utility model.

[0156] This invention provides an automated chip testing device that, by adding a floating alignment component, allows the alignment pin to move horizontally relative to the alignment hole. This ensures the alignment pin is accurately inserted into the alignment hole, enabling the probe module to precisely contact the chip on the test substrate. This design effectively solves the problem of inaccurate contact between the probe module and the chip in existing chip testing equipment, significantly improving the accuracy and reliability of chip testing. Furthermore, the introduction of the floating alignment component enhances the device's adaptability to chips of different sizes, reduces testing errors and the risk of chip damage caused by inaccurate alignment, and further improves testing efficiency and device stability.

[0157] Finally, it should be noted that although the above embodiments have been described in the text and drawings of this application, this should not limit the scope of patent protection of this application. Any technical solutions that are based on the essential concept of this application and utilize the content described in the text and drawings of this application, resulting in equivalent structural or procedural substitutions or modifications, as well as the direct or indirect application of the technical solutions of the above embodiments to other related technical fields, are all included within the scope of patent protection of this application.

Claims

1. An automated device for chip testing, characterized in that, The test device (2) includes a pressure head mechanism (203) and a test mechanism (204). The pressure head mechanism (203) has a pressed state that abuts against the test mechanism (204) and a separated state that is separated from the test mechanism (204) to cooperate with the test mechanism (204) for testing; The testing mechanism (204) is used to test the transferred chip; The top of the test mechanism (204) is provided with a test carrier board (205) for placing chips. The pressure head mechanism (203) includes a lifting module (2031), a fixing plate (2032), and a pressing module (2033). The lifting module (2031) is used to output lifting driving force; The pressing module (2033) is mounted on the lifting module (2031) via the fixing plate (2032) and is used to press down the chip placed on the test carrier (205) to cooperate with the test mechanism (204) for testing; The pressing module (2033) includes a pressing cover assembly (20331) and a clamping assembly (20332); The clamping assembly (20332) is used to release the clamped lower pressure cap assembly (20331) to place the lower pressure cap assembly (20331) onto the test carrier plate (205); And for gripping the lower pressure cap assembly (20331) placed on the test carrier plate (205) to separate the lower pressure cap assembly (20331) from the test carrier plate (205). The lower pressure cap assembly (20331) includes a lower pressure seat (203311), a probe module (203316), an alignment pin (203317), and an alignment floating assembly (203318). The probe module (203316) is disposed on the side of the pressure seat (203311) facing the test carrier plate (205); The alignment pin (203317) is disposed on the side of the probe module (203316) facing the test carrier plate (205); The test carrier plate (205) has an alignment hole on the side facing the probe module (203316) for inserting the alignment pin (203317); The alignment floating component (203318) is disposed between the probe module (203316) and the pressure seat (203311) to enable the alignment pin (203317) to move relative to the alignment hole in the horizontal direction, so that the alignment pin (203317) can be accurately inserted into the alignment hole, thereby enabling the probe module (203316) to accurately contact the chip on the test carrier board (205).

2. The automated chip testing equipment according to claim 1, characterized in that, The alignment floating assembly (203318) is a double-layer planar bearing structure, including a base (2033181), two bearing rings (2033182) and balls (2033183). The base (2033181) is T-shaped, including a cylindrical part at the upper end and a disc part at the lower end; The two bearing rings (2033182) are sequentially fitted onto the cylindrical portion, and each is provided with a plurality of receiving grooves along the circumferential direction; Each of the aforementioned receiving slots is provided with one of the aforementioned ball bearings (2033183).

3. The automated chip testing equipment according to claim 1, characterized in that, The lower pressure cap assembly (20331) also includes a pair of magnets; The magnet pair includes two magnets (203319). One of the magnets (203319) is embedded in the side of the lower pressure seat (203311) facing the probe module (203316); Another magnet (203319) is embedded in the side of the probe module (203316) facing the lower pressure seat (203311); The two magnets (203319) are attracted to each other to reset the alignment pin (203317) after the alignment pin (203317) is disengaged from the alignment hole.

4. The automated chip testing equipment according to claim 1, characterized in that, It also includes a material sorting and unloading device (1); The loading and unloading sorting device (1) is used to load the tray containing the chip to be tested; and after the test is completed, the tested chip is classified according to the test results and stored in the corresponding tray, and then the tray containing the tested chip is unloaded. A first chip transfer robot (3) is provided between the testing device (2) and the loading and unloading sorting device (1). The first chip transfer robot (3) is used to transfer the chips in the loading tray to the testing device (2).

5. The automated chip testing equipment according to claim 4, characterized in that, The loading and unloading sorting device (1) includes a loading and unloading sorting module (101). The loading and unloading sorting module (101) includes a loading mechanism (1011), an unloading mechanism (1012), a first shuttle mechanism (1013), and a second chip transfer robot (1014). The feeding mechanism (1011) is used to feed the tray containing the chips to be tested; The second chip transfer robot (1014) is used to transfer chips from the loading tray to the first shuttle mechanism (1013); and to transfer tested chips from the first shuttle mechanism (1013) to the unloading mechanism (1012). The first shuttle mechanism (1013) is used to transport the chip to wait for the first chip transfer robot (3) to transfer the chip to the testing device (2); and to receive the tested chip transferred by the first chip transfer robot (3) and transport it to wait for the second chip transfer robot (1014) to transfer the tested chip from the first shuttle mechanism (1013) to the unloading mechanism (1012). The feeding mechanism (1012) is used to feed the tray containing the tested chips.

6. The automated chip testing equipment according to claim 5, characterized in that, The number of test devices (2) is two; The two test devices (2) are symmetrically arranged on both sides of the loading and unloading sorting device (1), and the two test devices (2) have the same structure.

7. The automated chip testing equipment according to claim 6, characterized in that, The number of loading and unloading sorting modules (101) is two; The two loading and unloading sorting modules (101) are arranged symmetrically on the left and right, and are respectively matched with one of the corresponding testing devices (2), and the two loading and unloading sorting modules (101) have the same structure.

8. The automated chip testing equipment according to claim 4, characterized in that, The testing device (2) also includes a second shuttle mechanism (201) and a third chip transfer robot (202). The second shuttle mechanism (201) is used to transport the chip transferred by the first chip transfer robot (3); The third chip transfer robot (202) is used to transfer the chip conveyed by the second shuttle mechanism (201) to the testing mechanism (204).

9. The automated chip testing equipment according to claim 1, characterized in that, The clamp assembly (20332) includes a clamping seat (203321), two jaws (203322), a first cylinder (203323), a gear (203324), and two racks (203325); The clamping seat (203321) is fixed to the fixing plate (2032); The two grippers (203322) are arranged facing each other on the clamping base (203321) and can move in directions that are closer to each other and further away from each other to grip the lower pressure cap assembly (20331); The first cylinder (203323) is fixed on the clamping seat (203321) and is used to provide clamping power to the two grippers (203322); The gear (203324) is rotatably connected to the clamping seat (203321), and the axial direction of the gear (203324) is perpendicular to the movement direction of the jaw (203322). The two racks (203325) are located on both sides of the gear (203324). When the gear (203324) rotates, the sliding direction of the racks (203325) is parallel to the movement direction of the gripper (203322). One of the racks (203325) is fixedly connected to a corresponding gripper (203322), and one of the racks (203325) is fixedly connected to the piston rod of the first cylinder (203323).

10. The automated chip testing equipment according to claim 9, characterized in that, The lower pressure cap assembly (20331) also includes a knob (203312), a locking component (203313), a linkage component (203314), and two snap hooks (203315). The two latch hooks (203315) are arranged facing each other on the lower pressure seat (203311) and can move in directions that are close to each other and far away from each other to be latched and fixed or separated from the test carrier plate (205); The knob (203312) is rotatably mounted on the lower pressure seat (203311) and is connected to the two buckle hooks (203315) respectively through the linkage (203314); One end of the engaging component (203313) is connected to the central shaft of the gear (203324), and the other end can engage with the knob (203312); When the lower pressure seat (203311) contacts the test carrier plate (205), the first cylinder (203323) drives the rack (203325) to move, so that the gear (203324) rotates in one direction, thereby driving the two grippers (203322) to release the lower pressure seat (203311). At the same time, the gear (203324) drives the knob (203312) to rotate in one direction through its central shaft and the engaging member (203313), thereby driving the two latch hooks (203315) to be locked with the test carrier plate (205) through the linkage member (203314). When the lower pressure seat (203311) needs to be separated from the test carrier plate (205), the first cylinder (203323) drives the rack (203325) to move in the opposite direction, so that the gear (203324) rotates in the other direction, thereby driving the two jaws (203322) to clamp the lower pressure seat (203311). At the same time, the gear (203324) drives the knob (203312) to rotate in the other direction through its central shaft and the engaging member (203313), thereby driving the two latch hooks (203315) to separate from the test carrier plate (205) through the linkage member (203314).

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