Heat dissipation device and electronic equipment

Abstract

The utility model provides a heat dissipation device and electronic equipment, the heat dissipation device comprises an air inlet and a fan, a dustproof structure is arranged between the air inlet and the fan, the dustproof structure comprises a fixing assembly and a baffle plate, the fixing assembly is provided with a center shaft and a dust collecting groove, and the dust collecting groove is arranged at the bottom of the inner wall of the fixing assembly; the air inlet and the fan are connected through a fixing assembly, and the fan is communicated with an inner cavity of the fixing assembly; the baffle is arranged at the air inlet and rotationally connected with the center shaft, and the baffle is configured to overcome gravity to be rotationally opened in the direction of the fan under the action of airflow formed by operation of the fan. According to the heat dissipation device and the electronic equipment, when the fan stops running, dust can be effectively prevented from entering the heat dissipation device from the air inlet, and pollution of the dust to the fan and other parts is reduced; when the fan runs, the baffle can be automatically opened under the action of airflow, the distance between the baffle and the air inlet is automatically adjusted according to the rotating speed of the fan, and enough air inflow is ensured.

Description

Technical Field

[0001] This disclosure relates to the field of heat dissipation technology for electronic products, and in particular to a heat dissipation device and electronic equipment. Background Technology

[0002] In the use of electronic products, especially laptops, the fan is a key component for heat dissipation, and its operation directly affects computer performance. Due to the high-speed rotation of the fan and the presence of dust and other impurities in the environment, the fan easily draws in dust. Over time, dust accumulates on the fan blades and vents, reducing the fan's cooling efficiency, causing the computer temperature to rise, thus affecting computer performance, potentially shortening the fan's lifespan, and increasing the computer's failure rate. While measures such as adding dust filters to reduce dust entry exist, their effectiveness is limited, and dust filters are prone to clogging, requiring frequent cleaning and causing considerable inconvenience to users. Utility Model Content

[0003] This disclosure provides a heat dissipation device and an electronic device to at least solve the above-mentioned technical problems existing in the prior art.

[0004] According to a first aspect of this disclosure, a heat dissipation device is provided, including an air inlet and a fan, wherein a dustproof structure is disposed between the air inlet and the fan, the dustproof structure comprising:

[0005] A fixed assembly is provided with a central shaft and a dust collection groove, the dust collection groove being disposed at the bottom of the inner wall of the fixed assembly. The air inlet and the fan are connected through the fixed assembly, and the fan is in communication with the inner cavity of the fixed assembly; and

[0006] A baffle is provided at the air inlet and is rotatably connected to the central shaft. The baffle has multiple slits and is configured to rotate and open in the direction of the fan under the action of the airflow generated by the fan.

[0007] In one embodiment, the dustproof structure further includes a dust separation channel formed on the inner wall of the fixing component and arranged in a ring along the inner wall of the fixing component, and the dust collection groove is connected to the dust separation channel.

[0008] In one embodiment, the surface of the dust separation channel has a plurality of protrusions, and the plurality of protrusions are continuously distributed on the surface of the dust separation channel.

[0009] In one embodiment, the dustproof structure further includes an electrostatic adsorption component, which is connected to the inner wall of the fixing component and disposed above the dust collection tank. The electrostatic adsorption component can generate an electrostatic field to adsorb dust.

[0010] In one embodiment, the baffle has an initial state and a first suspended state. When the baffle is in the initial state, it is supported on the air inlet. When the baffle is in the first suspended state, it is located above the air inlet, and the weight of the baffle is the same as the wind pressure generated by the air inlet.

[0011] In one embodiment, the dustproof structure further includes an elastic element sleeved on the central shaft, one end of which is fixed to the end of the central shaft away from the baffle.

[0012] In one embodiment, the baffle has an initial state, a first suspended state, and a second suspended state. When the baffle is in the initial state, it rests on the air inlet. When the baffle is in the first suspended state, it is located above the air inlet and has a distance between it and the elastic element. The weight of the baffle is the same as the wind pressure generated by the air inlet. When the baffle is in the second suspended state, it is located above the air inlet and contacts the elastic element to generate an elastic force. The sum of the weight of the baffle and the elastic force is the same as the wind pressure generated by the air inlet.

[0013] In one embodiment, the fixing component is provided with a sound insulation layer at the location of the air inlet.

[0014] In one embodiment, the dust collection tank is detachably connected to the dust separation channel.

[0015] According to a second aspect of this disclosure, an electronic device is provided, including a heat dissipation device as described in any of the above embodiments.

[0016] In this disclosure, the heat dissipation device includes a baffle mounted on the central shaft. When the fan stops running, the baffle closes under gravity, effectively preventing dust from entering the heat dissipation device from the air inlet, reducing dust contamination of the fan and other components, and lowering the risk of malfunctions caused by dust accumulation. When the fan is running, the baffle automatically opens under airflow, automatically adjusting the distance between itself and the air inlet according to the fan speed to ensure sufficient air intake without affecting heat dissipation performance. In addition, the dustproof structure's fasteners and baffle are designed simply, making installation and disassembly convenient. The dust collection groove is located at the bottom of the inner wall of the fixed component, facilitating dust collection. Users can clean the dust collection groove regularly, reducing maintenance costs and improving the ease of use of the heat dissipation device.

[0017] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of this disclosure, nor is it intended to limit the scope of this disclosure. Other features of this disclosure will become readily apparent from the following description. Attached Figure Description

[0018] The above and other objects, features, and advantages of this disclosure will become readily apparent from the following detailed description of exemplary embodiments, taken in conjunction with the accompanying drawings. Several embodiments of this disclosure are illustrated in the drawings by way of example and not limitation, in which:

[0019] In the accompanying drawings, the same or corresponding reference numerals indicate the same or corresponding parts.

[0020] Figure 1 A cross-sectional view of the overall structure of a heat dissipation device according to an exemplary embodiment of the present disclosure is shown. Figure 1 ;

[0021] Figure 2 A cross-sectional view of the overall structure of a heat dissipation device according to an exemplary embodiment of the present disclosure is shown. Figure 2 ;

[0022] Figure 3 A cross-sectional view of the baffle of a heat dissipation device according to an exemplary embodiment of the present disclosure is shown in its initial state.

[0023] Figure 4 A cross-sectional view of a heat dissipation device baffle in a first suspended state, according to an exemplary embodiment of the present disclosure, is shown.

[0024] Figure 5 A cross-sectional view of a heat dissipation device baffle in a second suspended state, according to an exemplary embodiment of the present disclosure, is shown.

[0025] The following are the labels in the diagram: 1. Air inlet; 2. Fan; 3. Fixing component; 4. Baffle; 5. Electrostatic adsorption component; 6. Elastic component; 31. Central shaft; 32. Dust collection trough; 33. Dust separation channel; 34. Sound insulation layer; 41. Gap. Detailed Implementation

[0026] To make the objectives, features, and advantages of this disclosure more apparent and understandable, the technical solutions in the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this disclosure, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0027] The embodiments of this disclosure will now be described in detail with reference to the accompanying drawings.

[0028] Reference Figure 1 and Figure 2As shown, a heat dissipation device according to an exemplary embodiment of the present disclosure includes an air inlet 1 and a fan 2. A dustproof structure is provided between the air inlet 1 and the fan 2. The dustproof structure includes a fixing component 3 and a baffle 4. The fixing component 3 is provided with a central shaft 31 and a dust collection groove 32. The dust collection groove 32 is provided at the bottom of the inner wall of the fixing component 3. The air inlet 1 and the fan 2 are connected through the fixing component 3, and the fan 2 is connected to the inner cavity of the fixing component 3. The baffle 4 is provided at the air inlet 1 and is rotatably connected to the central shaft 31. The baffle 4 has multiple slits 41. The baffle 4 is configured to be able to rotate and open in the direction of the fan 2 under the action of the airflow generated by the operation of the fan 2, overcoming gravity.

[0029] In this embodiment, the dust collection trough 32 is located at the bottom of the inner wall of the fixed component 3. When dusty air enters the air inlet 1, larger dust particles are blocked by the baffle 4, while smaller dust particles enter the inner cavity of the fixed component 3 under the action of airflow. Since the dust collection trough 32 is located at the bottom of the inner wall of the fixed component 3, the dust will separate from the air under the action of centrifugal force and naturally settle into the dust collection trough 32 under the action of gravity, preventing dust from entering the fan 2. The dust collection trough 32 can be integrally formed with the fixed component 3, or it can be detachably connected to the fixed component 3 through structures including but not limited to snaps or slides. The fixed component 3 connects the air inlet 1 and the fan 2, ensuring that airflow can enter the fan 2 from the air inlet 1 through the inner cavity of the fixed component 3. The baffle 4 is composed of multiple fan-shaped blades, with gaps 41 formed between adjacent blades. The width of these gaps 41 can be adaptively adjusted according to actual needs, as long as the design of the gaps 41 can allow airflow to pass through while effectively blocking larger dust particles. The rotation of baffle 4 is achieved through airflow. When fan 2 is not working, baffle 4 blocks the air inlet 1 under the influence of gravity, effectively preventing some dust from entering directly from the air inlet 1. When fan 2 starts working, due to the airflow, baffle 4 automatically rotates and opens along the central axis 31 away from the air inlet 1, allowing air to enter. It is understandable that the rotation angle of baffle 4 is related to the speed of fan 2; the higher the speed of fan 2, the larger the opening angle of baffle 4, ensuring sufficient air intake.

[0030] In summary, the heat dissipation device disclosed herein includes a baffle 4 fitted onto the central shaft 31. When the fan 2 stops running, the baffle 4 closes under gravity, effectively preventing dust from entering the heat dissipation device from the air inlet 1, reducing dust contamination of the fan 2 and other components, and lowering the risk of malfunctions caused by dust accumulation. When the fan 2 is running, the baffle 4 automatically opens under airflow, automatically adjusting the distance between itself and the air inlet 1 according to the fan 2's speed, ensuring sufficient air intake without affecting heat dissipation performance. Furthermore, the dustproof structure's fixing components and baffle 4 are designed simply, making installation and disassembly convenient. The dust collection groove 32 is located at the bottom of the inner wall of the fixing component 3, facilitating dust collection. Users can periodically clean the dust collection groove 32, reducing maintenance costs and improving the ease of use of the heat dissipation device.

[0031] In one embodiment, the dustproof structure further includes a dust separation channel 33, which is formed on the inner wall of the fixing component 3 and arranged in a ring along the inner wall of the fixing component 3. The dust collection groove 32 is connected to the dust separation channel 33.

[0032] In this embodiment, the surface of the dust separation channel 33 has a certain roughness and inclination. When dusty air enters the air inlet 1, the dust will separate from the air under the action of centrifugal force and friction as the airflow passes through the dust separation channel 33. The dust will slide down along the surface of the dust separation channel 33 and finally fall into the dust collection tank 32 connected to it at the bottom, achieving efficient separation and collection of dust and further enhancing the dust prevention effect. Since the baffle 4 blocks dust when the fan 2 stops, the dust separation channel 33, together with the dust collection tank 32, performs secondary treatment on the incoming dusty air. The dual dust prevention mechanism greatly reduces the probability of dust entering the fan 2, effectively protecting the fan 2 and reducing the risk of failure caused by dust.

[0033] Specifically, in one embodiment, the surface of the dust separation channel 33 has a plurality of protrusions, which are continuously distributed on the surface of the dust separation channel 33.

[0034] In this embodiment, the protrusions on the surface of the dust separation channel 33 change the flow state of the dust-laden air in the channel. When the dust-laden air flows through the dust separation channel 33, the protrusions increase the probability of dust colliding with the surface of the dust separation channel 33, making it easier for the dust to be separated from the air and slide down the inner wall of the dust separation channel 33 to the dust collection tank 32, thereby improving the dust separation efficiency.

[0035] In one embodiment, the dustproof structure further includes an electrostatic adsorption component 5, which is connected to the inner wall of the fixing component 3 and disposed above the dust collection tank 32. The electrostatic adsorption component 5 can generate an electrostatic field to adsorb dust.

[0036] In this embodiment, the electrostatic adsorption component 5 obtains charge from the computer battery or other power source by contacting charged components, generating an electrostatic field. When dusty air enters the air inlet 1, the dust enters the inner cavity of the fixing component 3 under the action of airflow. Due to the electrostatic field of the electrostatic adsorption component 5, the dust is adsorbed onto the surface of the electrostatic adsorption component 5, and some dust will naturally settle into the dust collection tank 32 under the action of gravity. This further reduces the possibility of dust re-entering the airflow circulation, entering the fan 2, or accumulating on other components, thereby improving the dustproof performance of the entire heat dissipation device.

[0037] Reference Figure 3 and Figure 4 As shown, in one embodiment, the baffle 4 has an initial state and a first suspended state. When the baffle 4 is in the initial state, the baffle 4 is supported on the air inlet 1. When the baffle 4 is in the first suspended state, the baffle 4 is located above the air inlet 1, and the weight of the baffle 4 is the same as the wind pressure generated by the air inlet 1.

[0038] In this embodiment, when the fan 2 stops running, the baffle 4 is in its initial position, resting on the air inlet 1 and tightly fitting against it, effectively preventing dust from entering the heat dissipation device. After the fan 2 starts running, the air inlet 1 generates airflow. As the wind speed gradually increases, when the wind pressure generated by the air inlet 1 is the same as the weight of the baffle 4, the baffle 4 remains in the first suspended state, at which time the baffle 4 is located above the air inlet 1.

[0039] In one embodiment, the dustproof structure further includes an elastic member 6 sleeved on the central shaft 31, with one end of the elastic member 6 fixed to the end of the central shaft 31 away from the baffle 4.

[0040] Specifically, refer to Figures 3-5 As shown, in one embodiment, the baffle 4 has an initial state, a first suspended state, and a second suspended state. When the baffle 4 is in the initial state, the baffle 4 is supported on the air inlet 1. When the baffle 4 is in the first suspended state, the baffle 4 is located above the air inlet 1 and has a distance between it and the elastic member 6. The weight of the baffle 4 is the same as the wind pressure generated by the air inlet 1. When the baffle 4 is in the second suspended state, the baffle 4 is located above the air inlet 1 and is in contact with the elastic member 6 to generate elastic force. The sum of the weight of the baffle 4 and the elastic force is the same as the wind pressure generated by the air inlet 1.

[0041] In this embodiment, when the fan 2 is running, as the baffle 4 rotates and opens, the distance between the baffle 4 and the free end of the elastic member 6 gradually shortens until the elastic member 6 is compressed by the baffle 4. When the fan 2 stops running, the baffle 4 is in its initial position, supported on the air inlet 1, tightly fitting the air inlet 1, effectively preventing dust from entering the heat dissipation device. When the fan 2 starts running, the air inlet 1 generates airflow. As the wind speed gradually increases, when the wind pressure generated by the air inlet 1 is the same as the weight of the baffle 4, the baffle 4 rises above the air inlet 1, maintaining a distance from the elastic member 6. At this time, the baffle 4 remains in a first suspended state. As the fan 2 speed further increases, the wind speed increases, and the wind pressure also increases. When the wind pressure is greater than the weight of the baffle 4, the baffle 4 continues to rise until it contacts and compresses the elastic member 6, generating elastic force. When the sum of the weight of the baffle 4 and the elastic force generated by the elastic member 6 is the same as the wind pressure of the air inlet 1, the baffle 4 remains in a second suspended state. The elastic deformation of the elastic element 6 can ensure that the baffle 4 will not come into contact with the uppermost part of the fixed component 3 and close the air outlet of the fan 2 due to excessive air pressure at the air inlet 1.

[0042] In one embodiment, a sound insulation layer 34 is provided at the location of the fixing component 3 at the air inlet 1.

[0043] In this embodiment, the sound insulation layer 34 is made of a material with good sound insulation properties, such as sound-absorbing cotton or sound-insulating felt. The baffle 4 is in contact with the sound insulation layer 34 in the initial state to prevent abnormal noise caused by the overall vibration of the heat dissipation device in the initial state. In addition, the sound insulation layer 34 can effectively reduce the transmission of noise to the outside, thereby reducing the noise level of the entire heat dissipation device.

[0044] In one embodiment, the dust collection trough 32 and the dust separation channel 33 are detachably connected.

[0045] In this embodiment, the dust collection tank 32 and the dust separation channel 33 are detachably connected, for example, by means of snap-fit, slot engagement, or threaded connection. This design allows the user to easily disassemble the dust collection tank 32 for cleaning when dust accumulates to a certain level, and then easily reinstall it in its original position after cleaning.

[0046] This disclosure also provides an electronic device including a heat dissipation device as described in any of the above embodiments.

[0047] In this embodiment, since the electronic device includes a heat dissipation device, which includes a baffle 4 sleeved on the central shaft 31, when the fan 2 stops running, the baffle 4 closes under gravity, effectively preventing dust from entering the heat dissipation device from the air inlet 1, reducing dust contamination of the fan 2 and other components, and lowering the risk of failure due to dust accumulation. When the fan 2 is running, the baffle 4 can automatically open under airflow, automatically adjusting the distance between itself and the air inlet 1 according to the fan speed, ensuring sufficient air intake without affecting heat dissipation performance. In addition, the dustproof structure's fixing components and baffle 4 are designed simply, making installation and disassembly convenient. The dust collection groove 32 is located at the bottom of the inner wall of the fixing component 3, facilitating dust collection. Users can clean the dust collection groove 32 regularly, reducing maintenance costs and improving the ease of use of the heat dissipation device.

[0048] In the description of this disclosure, it should be understood that the orientation or positional relationship indicated by directional terms is usually based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing this disclosure and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this disclosure; the directional terms "inner" and "outer" refer to the inner and outer contours relative to the outline of each component itself.

[0049] For ease of description, spatial relative terms such as "above," "over," "on the upper surface of," and "above" are used herein to describe the spatial positional relationship between one or more components or features shown in the figures and other components or features. It should be understood that spatial relative terms include not only the orientation of the component as depicted in the figures but also different orientations during use or operation. For example, if the components in the figures are inverted as a whole, "above" or "above other components or features" will include cases where the component is "below" or "under" other components or features. Thus, the exemplary term "above" can include both "above" and "below." Furthermore, these components or features may also be positioned at other different angles (e.g., rotated 90 degrees or other angles), and this document intends to include all such cases.

[0050] It should be noted that the terminology used herein is for the purpose of describing particular implementations only and is not intended to limit the exemplary implementations according to this disclosure. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms “comprising” and / or “including” are used in this specification, they indicate the presence of features, steps, operations, parts, components, and / or combinations thereof.

[0051] It should be noted that the terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this disclosure are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this disclosure described herein can be implemented in sequences other than those illustrated or described herein.

[0052] This disclosure has been described through the above embodiments; however, it should be understood that the above embodiments are for illustrative purposes only and are not intended to limit this disclosure to the described embodiments. Furthermore, those skilled in the art will understand that this disclosure is not limited to the above embodiments, and many more variations and modifications can be made based on the teachings of this disclosure, all of which fall within the scope of protection claimed by this disclosure. The scope of protection of this disclosure is defined by the appended claims and their equivalents.

Claims

1. A heat dissipation device, comprising an air inlet (1) and a fan (2), characterized in that, A dustproof structure is provided between the air inlet (1) and the fan (2), the dustproof structure comprising: A fixing component (3) is provided with a central shaft (31) and a dust collection groove (32), the dust collection groove (32) being disposed at the bottom of the inner wall of the fixing component (3), the air inlet (1) and the fan (2) being connected through the fixing component (3), and the fan (2) communicating with the inner cavity of the fixing component (3); and A baffle (4) is provided at the air inlet (1) and is rotatably connected to the central shaft (31). The baffle (4) has multiple slits (41) and is configured to be able to rotate and open in the direction of the fan (2) under the action of the airflow generated by the operation of the fan (2).

2. The heat dissipation device according to claim 1, characterized in that, The dustproof structure also includes a dust separation channel (33), which is formed on the inner wall of the fixing component (3) and arranged in a ring along the inner wall of the fixing component (3). The dust collection groove (32) is connected to the dust separation channel (33).

3. The heat dissipation device according to claim 2, characterized in that, The surface of the dust separation channel (33) has a plurality of protrusions, which are continuously distributed on the surface of the dust separation channel (33).

4. The heat dissipation device according to claim 1, characterized in that, The dustproof structure also includes an electrostatic adsorption component (5), which is connected to the inner wall of the fixing component (3) and is located above the dust collection tank (32). The electrostatic adsorption component (5) can generate an electrostatic field to adsorb dust.

5. The heat dissipation device according to claim 1, characterized in that, The baffle (4) has an initial state and a first floating state. When the baffle (4) is in the initial state, the baffle (4) is supported on the air inlet (1). When the baffle (4) is in the first floating state, the baffle (4) is located above the air inlet (1), and the weight of the baffle (4) is the same as the wind pressure generated by the air inlet (1).

6. The heat dissipation device according to claim 1, characterized in that, The dustproof structure also includes an elastic element (6) sleeved on the central shaft (31), one end of which is fixed to the end of the central shaft (31) away from the baffle (4).

7. The heat dissipation device according to claim 6, characterized in that, The baffle (4) has an initial state, a first suspended state, and a second suspended state. When the baffle (4) is in the initial state, the baffle (4) is supported on the air inlet (1). When the baffle (4) is in the first suspended state, the baffle (4) is located above the air inlet (1) and has a distance between it and the elastic member (6). The weight of the baffle (4) is the same as the wind pressure generated by the air inlet (1). When the baffle (4) is in the second suspended state, the baffle (4) is located above the air inlet (1) and is in contact with the elastic member (6) to generate elastic force. The sum of the weight of the baffle (4) and the elastic force is the same as the wind pressure generated by the air inlet (1).

8. The heat dissipation device according to claim 1, characterized in that, The fixing component (3) is provided with a sound insulation layer (34) at the location of the air inlet (1).

9. The heat dissipation device according to claim 2, characterized in that, The dust collection tank (32) is detachably connected to the dust separation channel (33).

10. An electronic device, characterized in that, It includes a heat dissipation device as described in any one of claims 1-9.

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