Integrally-packaged flat type SSD card circuit board with high heat dissipation and signal transmission performance

Abstract

The utility model discloses an integrally packaged flat type SSD card circuit board with high heat dissipation and signal transmission performance, which comprises a circuit board installation casing, and a detachable circuit board main body is arranged in the circuit board installation casing. A circuit board mounting frame used for placing the circuit board main body is arranged in the circuit board mounting machine shell and corresponds to the circuit board main body, and clamping fixing assemblies used for fixing the circuit board main body are mounted on the two sides of the top of the circuit board mounting frame. According to the utility model, the circuit board main body is conveniently clamped and fixed on the circuit board mounting rack by arranging the clamping and fixing assembly, so that the circuit board main body is convenient to disassemble and assemble and convenient to replace or maintain, and the circuit board main body is convenient to replace or maintain under the interaction of the overhead mounted circuit board main body and the heat dissipation fan, so that the heat dissipation efficiency is improved. Air flow around the circuit board body is increased, good heat dissipation of the circuit board body is achieved, and stable signal transmission of the circuit board body is guaranteed.

Description

Technical Field

[0001] This utility model belongs to the field of circuit board technology, specifically relating to an integrated packaged flat SSD card circuit board with high heat dissipation and signal transmission performance. Background Technology

[0002] The SSD card circuit board is one of the core components of a solid-state drive, responsible for data transmission and control. It not only has excellent stability and reliability to ensure the safe storage of data, but also needs to undergo rigorous testing and optimization.

[0003] Chinese patent CN211404062U discloses a solid-state drive module, including a circuit board. The circuit board includes a power chip, a power protection chip, a main controller, and a storage chip. The circuit board also includes slots and pads. The advantages of this invention are its wide applicability and strong suitability; users can solder and encapsulate it themselves. It can be used as a conventional SSD or for special purposes. The storage chip packaging cost is lower, and the production yield is higher.

[0004] However, the existing solid-state drive (SSD) circuit boards are not easy to disassemble and assemble, making it inconvenient to maintain them. In addition, the heat dissipation of the SSD circuit boards is poor during installation, which affects their transmission performance. Utility Model Content

[0005] The purpose of this invention is to provide an integrated flat SSD card circuit board with high heat dissipation and signal transmission performance, in order to solve the technical problems of existing solid-state drive circuit boards being inconvenient to disassemble and assemble, difficult to maintain, and having poor heat dissipation during installation, which affects the transmission performance of the solid-state drive circuit board.

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] A flat SSD card circuit board with high heat dissipation and signal transmission performance is provided, including a circuit board mounting housing. The circuit board mounting housing has a removable circuit board body inside. The circuit board mounting housing has a circuit board mounting bracket for placing the circuit board body inside and corresponding to the position of the circuit board body. Both sides of the top of the circuit board mounting bracket are equipped with snap-fit ​​fixing components for fixing the circuit board body.

[0008] As a further embodiment of this utility model, the snap-fit ​​fixing assembly includes a mounting plate fixedly connected to a circuit board mounting bracket. A mounting base is fixedly connected to one side of the top of the mounting plate. A mounting lug is rotatably mounted on the mounting base via a connecting bearing. A rotating locking rod is fixedly connected to the top of the mounting lug. A positioning locking block is fixedly connected to the top of one side of the rotating locking rod. A connecting spring is fixedly connected to the other side of the rotating locking rod, and the other end of the connecting spring is fixedly connected to the top of the mounting plate.

[0009] As a further embodiment of this utility model, mounting brackets are fixedly connected to both sides of the bottom of the circuit board mounting bracket, and the bottom of the mounting bracket is fixedly connected to the bottom of the inner wall of the circuit board mounting housing. A heat dissipation vent is provided at the bottom of the circuit board mounting bracket and at the position corresponding to the main body of the circuit board.

[0010] As a further embodiment of this utility model, a cooling fan for cooling the main body of the circuit board is installed at the bottom of the inner wall of the circuit board mounting housing and at the position corresponding to the heat dissipation vent. Heat dissipation holes are provided on both sides of the circuit board mounting housing.

[0011] As a further embodiment of this utility model, a pop-up component for popping up the circuit board body is also installed on the top of the circuit board mounting bracket and at the position corresponding to the circuit board body.

[0012] As a further embodiment of this utility model, the pop-out component includes a sliding spring rod slidably connected to the circuit board mounting bracket. A spring block is fixedly connected to the top of the sliding spring rod, and a connecting block is fixedly connected to the bottom of the sliding spring rod. A spring is sleeved on the sliding spring rod located between the circuit board mounting bracket and the connecting block. One end of the spring is fixedly connected to the bottom of the circuit board mounting bracket, and the other end of the spring is fixedly connected to the top of the connecting block.

[0013] As a preferred embodiment of this utility model, a protective pad is fixedly connected to the top of the spring block.

[0014] Compared with existing technologies, the integrated flat SSD card circuit board with high heat dissipation and signal transmission performance provided by this utility model has the following advantages: By setting up a snap-fit ​​fixing component, the circuit board body can be easily snapped and fixed on the circuit board mounting bracket, thereby facilitating the disassembly and assembly of the circuit board body, and making it easy to replace or maintain the circuit board body. Moreover, by mounting the circuit board body in a suspended manner, and with the interaction of the cooling fan, the airflow around the circuit board body is increased, achieving good heat dissipation of the circuit board body and ensuring stable signal transmission from the circuit board body. Attached Figure Description

[0015] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only examples of embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the structure of an embodiment of the present utility model;

[0017] Figure 2 This is a cross-sectional structural diagram of an embodiment of the present utility model;

[0018] Figure 3 for Figure 2 A magnified view of the structure at point A in the middle;

[0019] Figure 4 This is a schematic diagram of the snap-fit ​​fixing component in an embodiment of the present invention;

[0020] Figure 5 This is a schematic diagram of the pop-up component in an embodiment of this utility model.

[0021] Figure label:

[0022] 1. Circuit board mounting housing; 2. Circuit board body;

[0023] 201. Circuit board mounting bracket; 2011. Mounting bracket; 2012. Heat dissipation vent;

[0024] 202. Cooling fan; 2021. Heat dissipation holes;

[0025] 203. Snap-fit ​​fixing component; 2031. Mounting plate; 2032. Mounting base; 2033. Mounting lug; 2034. Rotating lever; 2035. Positioning block; 2036. Connecting spring;

[0026] 204. Pop-up component; 2041. Sliding spring bar; 2042. Spring block; 20421. Protective pad; 2043. Connecting block; 2044. Spring sleeve. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the embodiments of this utility model will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are only used to explain this utility model and are not intended to limit this utility model.

[0028] In the description of the embodiments of this utility model, it should be understood that the terms "upper", "lower", "front", "rear", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing the embodiments of this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this utility model.

[0029] In the description of the embodiments of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation", "connection" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, an integral connection, or a detachable connection; they can refer to the internal connection of two components; they can refer to a direct connection or an indirect connection through an intermediate medium. For those skilled in the art, the specific meaning of the above terms in the embodiments of this utility model can be understood according to the specific circumstances.

[0030] See Figure 1-5 As shown, this utility model embodiment has an integrated packaged flat SSD card circuit board with high heat dissipation and signal transmission performance, including a circuit board mounting housing 1. The circuit board mounting housing 1 has a detachable circuit board body 2 inside. The circuit board mounting housing 1 has a circuit board mounting bracket 201 for placing the circuit board body 2 inside the circuit board mounting housing 1 and at the position corresponding to the circuit board body 2. The top two sides of the circuit board mounting bracket 201 are equipped with snap-fit ​​fixing components 203 for fixing the circuit board body 2.

[0031] The aforementioned technical solution provides an integrated flat SSD card circuit board with high heat dissipation and signal transmission performance. It not only facilitates the mounting of the circuit board body 2 onto the circuit board mounting bracket 201 via the snap-fit ​​fixing component 203, making it easy to disassemble, replace, or maintain the circuit board body 2, but also, through the interaction of the overhead mounting circuit board body 2 and the cooling fan 202, increases airflow around the circuit board body 2, thereby achieving good heat dissipation and ensuring stable signal transmission from the circuit board body 2.

[0032] See Figure 4As shown, the snap-fit ​​fixing assembly 203 includes a mounting plate 2031 fixedly connected to the circuit board mounting bracket 201. A mounting base 2032 is fixedly connected to one side of the top of the mounting plate 2031. A mounting lug 2033 is rotatably mounted on the mounting base 2032 via a connecting bearing. A rotating locking rod 2034 is fixedly connected to the top of the mounting lug 2033. A positioning locking block 2035 is fixedly connected to the top of one side of the rotating locking rod 2034. A connecting spring 20 is fixedly connected to the other side of the rotating locking rod 2034. 36, and the other end of the connecting spring 2036 is fixedly connected to the top of the mounting plate 2031. When the circuit board body 2 is placed on the circuit board mounting bracket 201, the side of the circuit board body 2 presses against the inclined surface of the positioning block 2035, causing the rotating rod 2034 to rotate around the mounting base 2032. When the circuit board body 2 moves past the positioning block 2035, the positioning block 2035 can be easily snapped and fixed to the circuit board body 2 under the elastic force of the connecting spring 2036.

[0033] See Figure 2 As shown, mounting brackets 2011 are fixedly connected to both sides of the bottom of the circuit board mounting bracket 201, and the bottom of the mounting bracket 2011 is fixedly connected to the bottom of the inner wall of the circuit board mounting housing 1. A heat dissipation vent 2012 is provided at the bottom of the circuit board mounting bracket 201 and at the position corresponding to the circuit board body 2. The air flow at the bottom of the circuit board body 2 is increased by setting the heat dissipation vent 2012.

[0034] See Figure 1 , 2 As shown, a cooling fan 202 for cooling the circuit board body 2 is installed at the bottom of the inner wall of the circuit board mounting housing 1 and at the position corresponding to the heat dissipation vent 2012. Heat dissipation holes 2021 are provided on both sides of the circuit board mounting housing 1. By setting up the cooling fan 202, the interaction between the heat dissipation holes 2021 and the heat dissipation vent 2012 can increase the airflow around the circuit board body 2, thereby ensuring good heat dissipation of the circuit board body 2 and thus ensuring stable data transmission of the circuit board body 2.

[0035] See Figure 5As shown, a pop-out component 204 for popping up the circuit board body 2 is also installed on the top of the circuit board mounting bracket 201 and at the position corresponding to the circuit board body 2. The pop-out component 204 includes a sliding spring rod 2041 slidably connected to the circuit board mounting bracket 201. A spring block 2042 is fixedly connected to the top of the sliding spring rod 2041, and a connecting block 2043 is fixedly connected to the bottom of the sliding spring rod 2041. A sleeve spring 2044 is sleeved on the sliding spring rod 2041 located between the circuit board mounting bracket 201 and the connecting block 2043. One end of the sleeve spring 2044 is fixedly connected to the bottom of the circuit board mounting bracket 201, and the other end of the sleeve spring 2044 is fixedly connected to the top of the connecting block 2043. When the positioning block 2035 disengages from the circuit board body 2, the spring block 2042 can be moved upward under the elastic force of the sleeve spring 2044, thereby popping up the circuit board body 2, thus increasing the convenience of disassembling the circuit board body 2.

[0036] See Figure 5 As shown, a protective pad 20421 is fixedly connected to the top of the spring block 2042. The protective pad 20421 protects the bottom of the circuit board body 2, preventing the spring block 2042 from directly contacting the circuit board body 2 and causing damage to the bottom of the circuit board body 2.

[0037] When installing the circuit board body 2, simply place the circuit board body 2 on the circuit board mounting bracket 201 and press down on the circuit board body 2. At the same time as the circuit board body 2 is pressed down, the side of the circuit board body 2 presses against the inclined surface of the positioning block 2035, causing the rotating rod 2034 to rotate around the mounting base 2032. When the circuit board body 2 moves past the positioning block 2035, the positioning block 2035 can be easily snapped and fixed to the circuit board body 2 under the elastic force of the connecting spring 2036.

[0038] During disassembly, simply turn the rotating lever 2034, causing the positioning block 2035 to disengage from the circuit board body 2. Under the elastic force of the sleeve spring 2044, the spring block 2042 moves upward, thereby lifting the circuit board body 2 upward. This increases the ease of disassembly of the circuit board body 2. Furthermore, the overhead installation of the circuit board body 2, combined with the interaction of the cooling fan 202, increases the airflow around the circuit board body 2, thereby achieving good heat dissipation for the circuit board body 2. This ensures stable signal transmission from the circuit board body 2.

[0039] The foregoing has shown and described the basic principles of the present invention. The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. The above embodiments and descriptions in the specification are only illustrative of the principles of the present invention. Any modifications, equivalent substitutions, and improvements made within the scope of the present invention without departing from the scope of the present invention should be included within the protection scope of the present invention.

Claims

1. An integrated package flat SSD card circuit board with high heat dissipation and signal transmission performance, comprising a circuit board mounting shell (1), characterized in that: The inside of the circuit board mounting case (1) is provided with a detachable circuit board body (2), the inside of the circuit board mounting case (1) and the position corresponding to the circuit board body (2) are provided with a circuit board mounting rack (201) for placing the circuit board body (2), and both sides of the top of the circuit board mounting rack (201) are provided with a clamping fixing assembly (203) for fixing the circuit board body (2). ​ 2. The integrated packaging flat SSD card circuit board with high heat dissipation and signal transmission performance according to claim 1, characterized in that: The clamping fixing assembly (203) comprises a mounting plate (2031) fixedly connected to the circuit board mounting rack (201), one side of the top of the mounting plate (2031) is fixedly connected with a mounting seat (2032), the mounting seat (2032) is rotatably connected with a mounting rotating lug (2033) through a connecting bearing, the top of the mounting rotating lug (2033) is fixedly connected with a rotating clamping rod (2034), one side of the top of the rotating clamping rod (2034) is fixedly connected with a positioning clamping block (2035), the other side of the rotating clamping rod (2034) is fixedly connected with a connecting spring (2036), and the other end of the connecting spring (2036) is fixedly connected with the top of the mounting plate (2031).

3. The integrated packaging flat SSD card circuit board with high heat dissipation and signal transmission performance according to claim 2, characterized in that: Both sides of the bottom of the circuit board mounting rack (201) are fixedly connected with mounting supports (2011), the bottom of the mounting support (2011) is fixedly connected to the bottom of the inner wall of the circuit board mounting case (1), and the bottom of the circuit board mounting rack (201) and the position corresponding to the circuit board body (2) are provided with a heat dissipation opening (2012).

4. The integrated packaging flat SSD card circuit board with high heat dissipation and signal transmission performance according to claim 3, characterized in that: The bottom of the inner wall of the circuit board mounting case (1) and the position corresponding to the heat dissipation opening (2012) are provided with a heat dissipation fan (202) for heat dissipation of the circuit board body (2), and both sides of the circuit board mounting case (1) are provided with heat dissipation holes (2021).

5. The integrated packaging flat SSD card circuit board with high heat dissipation and signal transmission performance according to claim 4, characterized in that: The top of the circuit board mounting rack (201) and the position corresponding to the circuit board body (2) are further provided with a pop-up assembly (204) for popping up the circuit board body (2).

6. The integrated packaging flat SSD card circuit board with high heat dissipation and signal transmission performance according to claim 5, characterized in that: The pop-up assembly (204) comprises a sliding elastic rod (2041) slidably connected to the circuit board mounting rack (201), the top of the sliding elastic rod (2041) is fixedly connected with an elastic block (2042), the bottom of the sliding elastic rod (2041) is fixedly connected with a connecting block (2043), a sleeve spring (2044) is arranged on the sliding elastic rod (2041) between the circuit board mounting rack (201) and the connecting block (2043), one end of the sleeve spring (2044) is fixedly connected with the bottom of the circuit board mounting rack (201), and the other end of the sleeve spring (2044) is fixedly connected with the top of the connecting block (2043).

7. The integrated packaging flat SSD card circuit board with high heat dissipation and signal transmission performance according to claim 6, characterized in that: The top of the elastic block (2042) is fixedly connected with a protective pad (20421).

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