Aluminum substrate with high heat dissipation performance

Abstract

The utility model relates to an aluminum substrate with high heat dissipation performance, which comprises a circuit layer mechanism, an insulating layer mechanism fixedly mounted on the lower end face of the circuit layer mechanism, a metal base layer mechanism fixedly mounted on the lower end face of the insulating layer mechanism, and a connecting shell fixedly mounted on the outer sides of the circuit layer mechanism, the insulating layer mechanism and the metal base layer mechanism. A plurality of connecting screw holes are formed in the upper end face of the connecting shell, a plurality of clamping holes are formed in the upper end face of the connecting shell, heat dissipation holes are formed in the front end face and the rear end face of the connecting shell, and a dustproof mechanism is fixedly connected to the upper end face of the connecting shell in a clamped mode; a plurality of heat collection blocks are fixedly installed in the heat collection shell, and two cooling fans are fixedly installed between every two heat collection blocks. The aluminum substrate has the advantages of being good in heat dissipation performance and long in service life.

Description

Technical Field

[0001] This utility model relates to the field of aluminum substrate technology, specifically to an aluminum substrate with high heat dissipation performance. Background Technology

[0002] Aluminum substrate is a metal-based copper-clad laminate with good heat dissipation function. Generally, a single-sided board consists of three layers: a circuit layer, an insulating layer, and a metal base layer.

[0003] Currently, most aluminum substrates on the market are made by drilling holes in the aluminum substrate to dissipate heat. However, this method has poor heat dissipation performance, and drilling holes also affects the mechanical properties of the aluminum substrate, reducing its service life. In addition, most existing aluminum substrates are not equipped with dustproof mechanisms, and dust accumulated on the surface of the aluminum substrate after long-term use will affect the normal operation of the aluminum substrate. Utility Model Content

[0004] In view of the shortcomings of the prior art, the present invention provides an aluminum substrate with high heat dissipation performance, which has the advantages of good heat dissipation performance and long service life, and solves the problems mentioned in the background art.

[0005] This utility model provides the following technical solution: an aluminum substrate with high heat dissipation performance, including a circuit layer mechanism, an insulating layer mechanism fixedly installed on the lower end face of the circuit layer mechanism, a metal base layer mechanism fixedly installed on the lower end face of the insulating layer mechanism, a connecting shell fixedly installed on the outer side of the circuit layer mechanism, the insulating layer mechanism, and the metal base layer mechanism, a plurality of connecting screw holes and a plurality of snap-fit ​​holes opened on the upper end face of the connecting shell, heat dissipation holes opened on both the front and rear end faces of the connecting shell, a dustproof mechanism snap-fitted and fixed on the upper end face of the connecting shell, the metal base layer mechanism including a metal base body, a heat collection shell fixedly installed inside the metal base body, a plurality of heat collection blocks fixedly installed inside the heat collection shell, and two cooling fans fixedly installed between each pair of the plurality of heat collection blocks.

[0006] As a preferred embodiment of the present invention, the dustproof mechanism includes a dustproof shell, a filter screen is fixedly installed on the upper surface of the dustproof shell, and multiple snap-fit ​​blocks are fixedly installed on the lower surface of the dustproof shell.

[0007] As a preferred embodiment of this utility model, the circuit layer mechanism includes a circuit layer body, a reinforcing rib is fixedly installed on the lower end face of the circuit layer body, and a plurality of limiting rods are fixedly installed on the lower end face of the circuit layer body.

[0008] As a preferred embodiment of the present invention, the insulating layer mechanism includes an insulating layer body, a groove is formed on the upper end surface of the insulating layer body, and a plurality of limiting grooves are formed on the upper end surface of the insulating layer body.

[0009] As a preferred embodiment of this utility model, a second filter screen is fixedly installed on the front and back sides of each pair of the multiple heat collection blocks.

[0010] Compared with the prior art, the present invention has the following beneficial effects:

[0011] 1. This high heat dissipation aluminum substrate transfers the heat generated by the circuit layer structure to the metal base layer structure through the insulating layer structure. Then, the heat collection shell and heat collection block concentrate the heat on the surface of the metal base layer structure. The cooling fan drives the air circulation to dissipate heat from the inner wall of the heat collection shell and both sides of the heat collection block, thereby completing the heat dissipation and cooling of the aluminum substrate.

[0012] 2. This high heat dissipation aluminum substrate has a dustproof mechanism that is snapped onto the upper end of the connecting shell, which prevents dust from accumulating directly on the surface of the circuit layer mechanism and affecting the normal operation of the aluminum substrate. Attached Figure Description

[0013] Figure 1 This is a perspective view of a preferred embodiment of the present invention;

[0014] Figure 2 for Figure 1 A three-dimensional schematic diagram of some mechanisms in the illustrated embodiment;

[0015] Figure 3 for Figure 1 A three-dimensional schematic diagram of the aluminum substrate body in the illustrated embodiment;

[0016] Figure 4 for Figure 1 A three-dimensional schematic diagram of the dust collection mechanism in the illustrated embodiment;

[0017] Figure 5 for Figure 1 A three-dimensional schematic diagram of the circuit layer mechanism in the illustrated embodiment;

[0018] Figure 6 for Figure 1 A three-dimensional schematic diagram of the insulating layer mechanism in the illustrated embodiment;

[0019] Figure 7 for Figure 1 A cross-sectional schematic diagram of the metal base structure in the illustrated embodiment.

[0020] In the diagram: 1. Connecting shell; 2. Connecting screw hole; 3. Dustproof mechanism; 4. Heat dissipation hole; 5. Snap-fit ​​hole; 6. Circuit layer mechanism; 7. Insulation layer mechanism; 8. Metal base mechanism; 301. Dustproof shell; 302. Filter No. 1; 303. Snap-fit ​​block; 601. Circuit layer body; 602. Reinforcing rib; 603. Limiting rod; 701. Insulation layer body; 702. Groove; 703. Limiting groove; 801. Metal base body; 802. Heat collection block; 803. Heat collection shell; 804. Cooling fan; 805. Filter No. 2. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] Please see Figures 1-7 A high heat dissipation aluminum substrate includes a circuit layer mechanism 6, an insulating layer mechanism 7 fixedly installed on the lower end face of the circuit layer mechanism 6, a metal base layer mechanism 8 fixedly installed on the lower end face of the insulating layer mechanism 7, a connecting shell 1 fixedly installed on the outside of the circuit layer mechanism 6, the insulating layer mechanism 7 and the metal base layer mechanism 8, a plurality of connecting screw holes 2 and a plurality of snap-fit ​​holes 5 on the upper end face of the connecting shell 1, heat dissipation holes 4 on both the front and rear end faces of the connecting shell 1, and a dustproof mechanism 3 snap-fitted and fixed on the upper end face of the connecting shell 1.

[0023] In the above structure, the insulating layer mechanism 7 is used to connect the circuit layer mechanism 6 and the metal base layer mechanism 8. At the same time, it can quickly transfer the heat generated by the operation of the circuit layer mechanism 6 to the metal base layer mechanism 8. The metal base layer mechanism 8 can dissipate heat quickly, thereby protecting the aluminum substrate and preventing heat accumulation that could damage the aluminum substrate. The connecting screw hole 2 on the connecting housing 1 is used to attach bolts to fix the aluminum substrate. The snap-fit ​​hole 5 at the upper end of the connecting housing 1 is used to snap-fit ​​and fix the dustproof mechanism 3. The dustproof mechanism 3 is used to isolate dust and prevent dust from accumulating on the surface of the circuit layer mechanism 6, which would affect the normal operation of the aluminum substrate.

[0024] like Figure 4 As shown, in a preferred embodiment, the dustproof mechanism 3 includes a dustproof housing 301, a filter screen 302 is fixedly installed on the upper end face of the dustproof housing 301, and a plurality of snap-fit ​​blocks 303 are fixedly installed on the lower end face of the dustproof housing 301.

[0025] In the above structure, by snapping the snap-fit ​​block 303 into the snap-fit ​​hole 5, the dustproof mechanism 3 is fixed to the upper end of the connecting housing 1. The dustproof housing 301 can prevent dust from entering the dustproof mechanism 3 from the side. The first filter 302 can filter dust, thereby preventing dust from accumulating on the surface of the circuit layer mechanism 6 and affecting the normal operation of the aluminum substrate, thus increasing the service life of the aluminum substrate. At the same time, the first filter 302 can also allow air circulation, thereby providing initial heat dissipation for the circuit layer mechanism 6 and preventing heat accumulation.

[0026] like Figure 5 As shown, in a preferred embodiment, the circuit layer mechanism 6 includes a circuit layer body 601, a reinforcing rib 602 is fixedly installed on the lower end face of the circuit layer body 601, and a plurality of limiting rods 603 are fixedly installed on the lower end face of the circuit layer body 601.

[0027] In the above-mentioned mechanism, the reinforcing rib 602 installed at the lower end of the circuit layer body 601 can increase the rigidity of the circuit layer body 601, thereby increasing the compressive strength of the circuit layer body 601, preventing the aluminum substrate from being broken and damaged by pressure during use, and thus increasing the service life of the aluminum substrate.

[0028] like Figure 6 As shown, in a preferred embodiment, the insulating layer mechanism 7 includes an insulating layer body 701, a groove 702 is formed on the upper end surface of the insulating layer body 701, and a plurality of limiting grooves 703 are formed on the upper end surface of the insulating layer body 701. The reinforcing ribs 602 on the circuit layer body 601 are adapted to the limiting grooves 703.

[0029] In the above-mentioned mechanism, the insulating layer body 701 has good thermal conductivity, which can transfer the heat generated by the operation of the circuit layer mechanism 6 to the metal base layer mechanism 8, thereby avoiding the accumulation of heat on the surface of the circuit layer mechanism 6 and affecting its operation.

[0030] like Figure 7 As shown, in a preferred embodiment, the metal base structure 8 includes a metal base body 801, a heat collection shell 803 is fixedly installed inside the metal base body 801, a plurality of heat collection blocks 802 are fixedly installed inside the heat collection shell 803, two cooling fans 804 are fixedly installed between each pair of the plurality of heat collection blocks 802, and a second filter screen 805 is fixedly installed on the front and rear sides between each pair of the plurality of heat collection blocks 802.

[0031] In the above structure, after the insulating layer body 701 transfers heat to the metal base structure 8, the heat collection block 802 and heat collection shell 803 inside the metal base body 801 will collect the heat. Then, the cooling fan 804 increases the air circulation inside the heat collection shell 803, thereby dissipating heat from the inner wall of the heat collection shell 803 and both sides of the heat collection block 802, thus completing the heat dissipation of the aluminum substrate.

[0032] The working principle is as follows: by interlocking the snap-fit ​​block 303 and the snap-fit ​​hole 5, the dustproof mechanism 3 is snapped and fixed to the upper end of the connecting shell 1. The dustproof mechanism 3 is used to prevent dust from accumulating directly on the upper end of the circuit layer mechanism 6, thereby increasing the service life of the aluminum substrate. A reinforcing rib 602 is installed on the lower end face of the circuit layer mechanism 6. The reinforcing rib 602 can increase the overall rigidity of the circuit layer mechanism 6, thereby increasing the compressive strength of the aluminum substrate and preventing the aluminum substrate from breaking or being damaged due to pressure during use, thus increasing the service life of the aluminum substrate. When the circuit layer mechanism 6 generates heat during operation, the insulating layer mechanism 7 will transfer the heat to the metal base layer mechanism 8. Then, the heat collection shell 803 and the heat collection block 802 can concentrate the heat generated by the circuit layer mechanism 6 and dissipate the heat by driving air circulation through the cooling fan 804.

[0033] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An aluminum substrate with high heat dissipation performance, comprising a circuit layer structure (6), characterized in that: An insulating layer mechanism (7) is fixedly installed on the lower end face of the circuit layer mechanism (6). A metal base mechanism (8) is fixedly installed on the lower end face of the insulating layer mechanism (7). A connecting shell (1) is fixedly installed on the outside of the circuit layer mechanism (6), the insulating layer mechanism (7), and the metal base mechanism (8). A plurality of connecting screw holes (2) are opened on the upper end face of the connecting shell (1). A plurality of snap-fit ​​holes (5) are opened on the upper end face of the connecting shell (1). Heat dissipation holes (4) are opened on both the front and rear end faces of the connecting shell (1). A dustproof mechanism (3) is snap-fitted and fixed on the upper end face of the connecting shell (1). The metal base mechanism (8) includes a metal base body (801). A heat collection shell (803) is fixedly installed inside the metal base body (801). A plurality of heat collection blocks (802) are fixedly installed inside the heat collection shell (803). Two cooling fans (804) are fixedly installed between each pair of the plurality of heat collection blocks (802).

2. The aluminum substrate with high heat dissipation performance according to claim 1, characterized in that: The dustproof mechanism (3) includes a dustproof shell (301), a filter screen (302) is fixedly installed on the upper end face of the dustproof shell (301), and multiple snap-fit ​​blocks (303) are fixedly installed on the lower end face of the dustproof shell (301).

3. The aluminum substrate with high heat dissipation performance according to claim 1, characterized in that: The circuit layer mechanism (6) includes a circuit layer body (601), a reinforcing rib (602) is fixedly installed on the lower end face of the circuit layer body (601), and a plurality of limiting rods (603) are fixedly installed on the lower end face of the circuit layer body (601).

4. The aluminum substrate with high heat dissipation performance according to claim 1, characterized in that: The insulating layer mechanism (7) includes an insulating layer body (701), the upper end face of the insulating layer body (701) is provided with a groove (702), and the upper end face of the insulating layer body (701) is provided with a plurality of limiting grooves (703).

5. The aluminum substrate with high heat dissipation performance according to claim 1, characterized in that: Each of the multiple heat collection blocks (802) has a second filter screen (805) fixedly installed on the front and back sides between each pair of them.

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