Light guide structure of optical coupler
By incorporating a light guide and a reflective layer into the optical coupler, the problem of low optical signal transmission efficiency is solved, achieving efficient guidance and fixation of the optical signal, thereby improving optical signal transmission efficiency and product stability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-05-27
- Publication Date
- 2026-04-14
AI Technical Summary
Existing planar optical couplers have low optical signal transmission efficiency, and insufficient light sources lead to unstable transmission.
A light guide, which can be a rigid transparent body or an optical fiber, is placed between the PT chip and the IR chip. Combined with a reflective layer and a fixing component, it enables efficient guidance and fixation of light, thereby improving the efficiency of optical signal transmission.
This improves the transmission efficiency of optical signals to the photosensitive surface of the PT chip, enhances the stability of optical signals and product yield, and reduces light loss.
Smart Images

Figure CN224124515U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of optical coupler technology, specifically to a light guide structure for an optical coupler. Background Technology
[0002] In the current technological field, the light guiding process of planar optical couplers mainly relies on the light emitted by an infrared emitting chip (IR chip). When the photosensitive part of the infrared receiving chip (PT chip) is illuminated by light, a current change is generated inside the PT chip, thereby realizing the conversion of electrical signals. The transmission of optical signals within the optical coupler mainly falls into two categories: one is that the photosensitive surface of the PT chip directly receives the light emitted from the IR chip; the other is that the light emitted by the IR chip is reflected to the photosensitive surface of the PT chip after passing through the internal reflection structure of the planar optical coupler. However, in both of these methods of transmitting optical signals, the amount of light illuminating the photosensitive surface of the PT chip is usually relatively small, which leads to a reduction in optical signal transmission efficiency. Utility Model Content
[0003] To address the shortcomings of existing technologies, this invention provides a light-guiding structure for an optical coupler, which solves the problem of low optical signal transmission efficiency in current planar optical couplers.
[0004] To achieve the above objectives, the present invention provides the following technical solution: a light guide structure for an optical coupler, comprising a package, wherein a PT bracket pin and an IR bracket pin are disposed on the package, one end of which is located inside the package, a spacer is disposed on the IR bracket pin, an IR chip for emitting light is mounted on the spacer, a PT chip is disposed on the PT bracket pin, and a light guide component for guiding the light emitted by the IR chip to the photosensitive surface of the PT chip is disposed between the PT chip and the IR chip.
[0005] Preferably, the light guide is a rigid transparent body with both ends fixed, and a first reflective layer is provided on the rigid transparent body to reflect the light inside back into its interior.
[0006] Preferably, the package is used to reflect the light emitted by the IR chip back into its interior while blocking external light.
[0007] Preferably, the encapsulation body is a titanium dioxide epoxy resin layer.
[0008] Preferably, the light guide is an optical fiber.
[0009] Preferably, the light guide further includes a fixing member for rigidly connecting the PT chip and the IR chip.
[0010] Compared with the prior art, the present invention provides a light guiding structure for an optical coupler, which has the following beneficial effects:
[0011] 1. By setting a light guide between the PT chip and the IR chip to direct the light emitted by the IR chip to the photosensitive surface of the PT chip, a portion of the light emitted by the IR chip can be more efficiently guided to the photosensitive surface of the PT chip, thereby greatly improving the efficiency of this portion of light propagating to the photosensitive surface of the PT chip. This improves the overall efficiency of the light from the IR chip being transmitted to the photosensitive surface of the PT chip, ensuring the stability of optical signal transmission between the PT chip and the IR chip.
[0012] 2. By setting the light guide as a rigid transparent body with both ends fixed, and coating its surface with a layer of titanium dioxide as the first reflective layer, it is possible to both guide the propagation of light and fix the PT chip and IR chip relatively, thereby improving the yield of the product in the production process.
[0013] 3. By setting the light guide to an optical fiber and using a fixing component for rigidly connecting the PT chip and IR chip, it is possible to both guide the propagation of light and fix the PT chip and IR chip relatively, and the propagation efficiency of light is relatively higher. Attached Figure Description
[0014] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:
[0015] Figure 1 This is a schematic diagram of the internal structure of this utility model;
[0016] Figure 2 This is a cross-sectional schematic diagram of the present invention;
[0017] Figure 3 This is a schematic diagram of the first reflective layer of this utility model;
[0018] Figure 4 This is a schematic diagram of the fastener of this utility model.
[0019] In the diagram: 1. Package; 2. PT bracket pin; 3. IR bracket pin; 4. Gasket; 5. IR chip; 6. PT chip; 7. Light guide; 8. First reflective layer; 11. Fixing component. Detailed Implementation
[0020] The following will describe in detail the implementation of this application with reference to the accompanying drawings and embodiments, so that the implementation process of how this application uses technical means to solve technical problems and achieve technical effects can be fully understood and implemented accordingly.
[0021] Example 1
[0022] To address the low optical signal transmission efficiency of current planar optical couplers, this application provides a light-guiding structure for the optical coupler, such as... Figure 1 As shown, the package 1 has a PT bracket pin 2 and an IR bracket pin 3, one end of which is located inside the package. The other end of the PT bracket pin 2 and the IR bracket pin 3 is used to connect to the circuit. A spacer 4 is provided on the IR bracket pin 3, and an IR chip 5 for emitting light is mounted on the spacer 4. A PT chip 6 is provided on the PT bracket pin 2. A light guide 7 is provided between the PT chip 6 and the IR chip 5 to guide the light emitted by the IR chip 5 to the photosensitive surface of the PT chip 6. This ensures that almost all of the light signal can be transmitted to the photosensitive surface of the PT chip 6. Although there is some loss in this part of the light, the energy utilization rate is higher than that of the existing technology where the light enters the package 1 and then propagates to the photosensitive surface of the PT chip 6. Therefore, the overall light signal transmission efficiency is greatly improved. There are many possible positions for the light guide 7. For example, the light guide 7 can be placed between the IR chip 5 and the spacer 4, or the light guide 7 can be placed on the side of the IR chip 5, as long as it can receive as much light emitted by the IR chip 5 as possible.
[0023] As a medium for guiding and propagating optical signals, the light guide 7 is described below as an easily implemented structure, such as... Figure 3 As shown, the light guide 7 is a rigid transparent body with both ends fixed, such as glass. Due to its rigid structure, the rigid transparent body can also achieve relative fixation of the IR chip 5 and the PT chip 6, avoiding relative displacement of the IR chip 5 and the PT chip 6 during wire bonding and filling of the package 1, thereby reducing the probability of gold wire breakage. The rigid transparent body is provided with a first reflective layer 8 for reflecting its internal light back into its interior. The first reflective layer 8 can be achieved by coating with titanium dioxide, thereby forming a path for light propagation.
[0024] In order to allow more light to be contained within the light guide 7, the package 1 is used to reflect the light emitted by the IR chip 5 back into its interior while blocking external light. The package 1 can be formed by encapsulating a mixture of titanium dioxide and epoxy resin, so that some of the reflected light can be reflected back to the light guide 7 and collected inside the light guide 7, thereby further increasing the intensity of the light propagated to the photosensitive surface of the PT chip 6, while preventing external ambient light from entering and interfering with the PT chip 6, thereby improving the stability of product performance.
[0025] Example 2
[0026] The following provides another structure for the light guide at point 7, which has the same technical effect as the first embodiment, such as... Figure 4 As shown.
[0027] Compared with Example 1, Example 2 differs in that the light guide 7 is an optical fiber, which can further reduce the loss of light propagation within the light guide 7. In order to achieve relative fixation between the PT chip 6 and the IR chip 5 and improve the stability of the PT chip 6 and the IR chip 5 during the processing, the light guide 7 also includes a fixing member 11 for rigidly connecting the PT chip 6 and the IR chip 5, thereby achieving relative fixation between the two and improving the yield.
[0028] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.
[0029] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A light guiding structure for an optical coupler, comprising a package (1), wherein a PT bracket pin (2) and an IR bracket pin (3) are disposed on the package, one end of which is located inside the package, characterized in that, A pad (4) is provided on the IR bracket pin (3), and an IR chip (5) for emitting light is installed on the pad (4). A PT chip (6) is provided on the PT bracket pin (2), and a light guide (7) is provided between the PT chip (6) and the IR chip (5) for guiding the light emitted by the IR chip (5) to the photosensitive surface of the PT chip (6).
2. The light guiding structure of the optical coupler according to claim 1, characterized in that, The light guide (7) is a rigid transparent body with both ends fixed, and a first reflective layer (8) is provided on the rigid transparent body to reflect the light inside back into its interior.
3. The light guiding structure of the optical coupler according to claim 1, characterized in that, The package (1) is used to reflect the light emitted by the IR chip (5) back into its interior, while blocking external light.
4. The light guiding structure of the optical coupler according to claim 3, characterized in that, The encapsulation body (1) is a titanium dioxide epoxy resin layer.
5. The light guiding structure of the optical coupler according to claim 1, characterized in that, The light guide (7) is an optical fiber.
6. The light guiding structure of the optical coupler according to claim 5, characterized in that, The light guide (7) also includes a fixing member (11) for rigidly connecting the PT chip (6) and the IR chip (5).