Semiconductor wafer vacuum adsorption plate

Abstract

The utility model discloses a semiconductor wafer vacuum adsorption plate, which relates to the technical field of semiconductor wafers and comprises a shell, a cleaning mechanism capable of cleaning a wafer is arranged in the shell and comprises a fixing plate fixedly connected with the inner side of the shell, a first suction pump is fixedly connected to the upper surface of the fixing plate, and a second suction pump is fixedly connected to the lower surface of the fixing plate. An inlet of the first suction pump is fixedly communicated with a first connecting pipe, an inlet of the first connecting pipe is fixedly communicated with a liquid storage tank, and an outlet of the first suction pump is fixedly communicated with a liquid spraying pipe. According to the vacuum adsorption plate, through cooperative use of the cleaning mechanism, the fixing plate, the first suction pump, the first connecting pipe, the liquid storage tank, the liquid inlet pipe, the liquid spraying pipe, the second suction pump, the second connecting pipe and the gas storage tank, after a wafer is machined, cutting chippings can be left on the wafer, the chippings on the surface of the wafer can be cleaned through the cleaning mechanism, and the cleaning efficiency is improved. The use effect of the wafer can be improved, and the wafer can be cleaned.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor wafer technology, specifically to a semiconductor wafer vacuum adsorption plate. Background Technology

[0002] A wafer is a silicon wafer used to manufacture silicon semiconductor circuits; its raw material is silicon. High-purity polycrystalline silicon is dissolved, doped with silicon crystal seeds, and then slowly pulled out to form a cylindrical single-crystal silicon ingot. After grinding, polishing, and slicing, the silicon ingot is formed into a silicon wafer. Domestic wafer production lines mainly produce 8-inch and 12-inch wafers.

[0003] A search revealed a wafer vacuum chuck published by Chinese Patent Publication No. CN218849449U, comprising a mounting base and a disk made of PEEK material. The disk has vacuum suction holes, several annular vacuum suction grooves, and a connecting groove. The vacuum suction grooves are arranged in a circular array along the vacuum suction holes, and the connecting grooves communicate with the vacuum suction holes and vacuum suction grooves. A connecting post is located below the disk. This invention provides a wafer vacuum chuck with a simple structure, convenient production, high yield rate, good adsorption force, uniform adsorption, and easy installation.

[0004] While the above solutions offer convenient production, high yield, good and uniform adsorption, and easy installation, the vacuum chucks in the aforementioned patents are difficult to clean the adsorbed wafers. If the cleaning agent or process liquid is not completely removed, it may corrode the wafer surface or change the material properties, leading to local performance failure. Therefore, we provide a semiconductor wafer vacuum adsorption plate to solve the above problems. Utility Model Content

[0005] The purpose of this invention is to provide a semiconductor wafer vacuum adsorption plate to solve the problems raised in the prior art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a semiconductor wafer vacuum adsorption plate, comprising a housing, wherein a cleaning mechanism for cleaning the wafer is disposed inside the housing, the cleaning mechanism comprising a fixing plate fixedly connected to the inner side of the housing, a first pump fixedly connected to the upper surface of the fixing plate, the inlet of the first pump fixedly connected to a first connecting pipe, the inlet of the first connecting pipe fixedly connected to a liquid storage tank, the outlet of the first pump fixedly connected to a spray pipe, a second pump fixedly connected to the upper surface of the fixing plate, the inlet of the second pump fixedly connected to a second connecting pipe, the inlet of the second connecting pipe fixedly connected to a gas storage tank, and the outlet of the second pump fixedly connected to a jet pipe.

[0007] Preferably, the inlet of the liquid storage tank is fixedly connected to a liquid inlet pipe, and one side of the liquid storage tank is fixedly connected to one side of the outer shell. The inlet of the gas storage tank is fixedly connected to an air inlet pipe, and one side of the gas storage tank is fixedly connected to one side of the outer shell. Compressed gas can be delivered to the gas storage tank through the air inlet pipe, and clean liquid can be provided to the liquid storage tank through the liquid inlet pipe.

[0008] Preferably, the first connecting pipe passes through the outer shell and is fixedly connected to the outer shell, and the second connecting pipe passes through the outer shell and is fixedly connected to the outer shell. Both the first connecting pipe and the second connecting pipe are fixed to the outer shell, thus playing a fixing role.

[0009] Preferably, a groove is provided on the inner side of the outer casing, and a slider is slidably connected inside the groove. A first electric telescopic rod is fixedly connected to one side of the slider, and the fixed end of the first electric telescopic rod is fixedly connected to the inside of the groove. The groove provided inside the outer casing allows the slider to slide inside the groove.

[0010] Preferably, a second electric telescopic rod is fixedly connected to the upper surface of the slider, and a lower adsorption disk is fixedly connected to the telescopic end of the second electric telescopic rod. A ventilation groove is formed on the upper surface of the lower adsorption disk. The upper adsorption disk and the lower adsorption disk can be pushed by the second electric telescopic rod to move the wafer.

[0011] Preferably, an upper adsorption disk is fixedly connected to the outer surface of the lower adsorption disk, and an air suction hole is provided on the inner wall of the upper adsorption disk. The air suction hole provided on the upper adsorption disk can adsorb the wafer and prevent the wafer from becoming loose during movement.

[0012] Preferably, a retractable hose is fixedly connected inside the second electric telescopic rod. The air inlet of the retractable hose is fixedly connected to the lower surface of the lower adsorption plate, and the air outlet of the retractable hose is fixedly connected to a third pump. The air outlet of the third pump is fixedly connected to a fourth connecting pipe. The retractable hose is installed inside the second electric telescopic rod and can retract according to the extension and retraction of the second electric telescopic rod.

[0013] Preferably, the upper surface of the third pump is fixedly connected to the lower surface of the slider, the retractable hose passes through the slider and is fixedly connected to the slider, the third pump is installed on the slider, and the slider can drive the third pump to move, thus playing a fixing role.

[0014] Compared with the prior art, the beneficial effects of this utility model are:

[0015] 1. The vacuum adsorption plate of this application uses a cleaning mechanism, a fixing plate, a first pump, a first connecting pipe, a liquid storage tank, a liquid inlet pipe, a liquid spraying pipe, a second pump, a second connecting pipe, and a gas storage tank in combination. After the wafer is processed, there will be cutting debris remaining on the wafer. The cleaning mechanism can clean the debris on the surface of the wafer, which is beneficial to improving the use effect of the wafer and achieving the cleaning of the wafer.

[0016] 2. The vacuum adsorption plate of this application uses a combination of a first electric telescopic rod, a slider, a second electric telescopic rod, a lower adsorption plate, a ventilation groove, an upper adsorption plate, a suction hole, a telescopic hose, and a third pump. The upper adsorption plate adsorbs the wafer to prevent it from loosening during movement. The third pump extracts gas to improve the adsorption force on the wafer. The first and second electric telescopic rods can move the adsorbed wafer. Attached Figure Description

[0017] Figure 1 This is a frontal three-dimensional structural diagram of the present invention;

[0018] Figure 2 This is a schematic diagram of the overall three-dimensional structure of the present invention from the rear view.

[0019] Figure 3 This is a three-dimensional structural diagram of the cleaning mechanism of this utility model;

[0020] Figure 4 This is a three-dimensional structural diagram of the adsorption mechanism of this utility model;

[0021] Figure 5 This is a cross-sectional three-dimensional structural diagram of the adsorption mechanism of this utility model.

[0022] Labels in the diagram: 1. Outer shell;

[0023] 2. Cleaning mechanism; 201. Fixing plate; 202. First pump; 203. First connecting pipe; 204. Liquid storage tank; 205. Liquid inlet pipe; 206. Spray pipe; 207. Second pump; 208. Second connecting pipe; 209. Air storage tank; 210. Air jet pipe; 211. Air inlet pipe;

[0024] 3. Slide groove; 4. First electric telescopic rod; 5. Slider; 6. Second electric telescopic rod; 7. Lower adsorption plate; 8. Ventilation groove; 9. Upper adsorption plate; 10. Suction hole; 11. Telescopic hose; 12. Third pump; 13. Fourth connecting pipe. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0026] like Figure 5 As shown, this utility model provides a technical solution for a semiconductor wafer vacuum adsorption plate, including a housing 1. A groove 3 is formed on the inner side of the housing 1. A slider 5 is slidably connected inside the groove 3. A second electric telescopic rod 6 is fixedly connected to the upper surface of the slider 5. A retractable hose 11 is fixedly connected inside the second electric telescopic rod 6. The air inlet of the retractable hose 11 is fixedly connected to the lower surface of the lower adsorption plate 7, and the air outlet of the retractable hose 11 is fixedly connected to a third pump 12. The upper surface of the third pump 12 is fixedly connected to the lower surface of the slider 5. The retractable hose 11 passes through the slider 5 and is fixedly connected to it. The third pump 12 is mounted on the slider 5. When the slider 5 moves, it can drive the third pump 12 to... The retractable hose 11 passes through the slider 5, which can fix the outer shell 1 to prevent loosening during operation. The outlet of the third pump 12 is fixedly connected to the fourth connecting pipe 13. The retractable hose 11 is installed inside the second electric telescopic rod 6. When the second electric telescopic rod 6 extends and retracts, the retractable hose 11 can retract accordingly. The second electric telescopic rod 6 is installed on the lower adsorption plate 7, and the gas diffuses inside the lower adsorption plate 7. The retractable hose 11 is installed on the third pump 12, which can extract gas. The fourth connecting pipe 13 is connected to the third pump 12 and can discharge the extracted gas.

[0027] like Figure 4As shown, the telescopic end of the second electric telescopic rod 6 is fixedly connected to the lower adsorption plate 7, and the outer surface of the lower adsorption plate 7 is fixedly connected to the upper adsorption plate 9. The inner wall of the upper adsorption plate 9 is provided with a suction hole 10. The upper adsorption plate 9 is installed on the lower adsorption plate 7. When adsorbing the wafer, it is discharged through the upper adsorption plate 9 installed on the lower adsorption plate 7. The wafer can be adsorbed through the suction hole 10 provided on the upper adsorption plate 9, which has a good adsorption force. The upper surface of the lower adsorption plate 7 is provided with a ventilation groove 8. The second electric telescopic rod 6 is installed on the slider 5, and the lower adsorption plate 7 is installed on the second electric telescopic rod 6, which plays a fixing role. The ventilation groove 8 provided inside the lower adsorption plate 7 helps to improve the adsorption force. The first electric telescopic rod 4 is fixedly connected to one side of the slider 5. The fixed end of the first electric telescopic rod 4 is fixedly connected to the inside of the slide groove 3. The slide groove 3 provided inside the outer shell 1 allows the slider 5 to slide in the slide groove 3. The first electric telescopic rod 4 is installed on the slider 5. The first electric telescopic rod 4 can push the slider 5 to slide, thereby driving the wafer to move.

[0028] like Figure 1 As shown, the interior of the housing 1 is equipped with a cleaning mechanism 2 for cleaning wafers. The cleaning mechanism 2 includes a fixing plate 201 fixedly connected to the inner side of the housing 1. A first pump 202 is fixedly connected to the upper surface of the fixing plate 201. A first connecting pipe 203 is fixedly connected to the inlet of the first pump 202. The first connecting pipe 203 passes through the housing 1 and is fixedly connected to the housing 1. A second connecting pipe 208 passes through the housing 1 and is fixedly connected to the housing 1. Both the first connecting pipe 203 and the second connecting pipe 208 are installed on the housing 1. The housing 1 can fix the first connecting pipe 203 and the second connecting pipe 208 to prevent them from loosening during use.

[0029] like Figure 2 As shown, the inlet of the first connecting pipe 203 is fixedly connected to the liquid storage tank 204, and the inlet of the liquid storage tank 204 is fixedly connected to the liquid inlet pipe 205. One side of the liquid storage tank 204 is fixedly connected to one side of the outer shell 1. The inlet of the gas storage tank 209 is fixedly connected to the gas inlet pipe 211, and one side of the gas storage tank 209 is fixedly connected to one side of the outer shell 1. The liquid inlet pipe 205 is installed on the liquid storage tank 204, and the gas inlet pipe 211, which can provide clean liquid to the liquid inlet pipe 205, is installed on the gas storage tank 209. Gas can be provided to the gas storage tank 209 through the gas inlet pipe 211. Both the liquid storage tank 204 and the gas storage tank 209 are installed on the outer shell 1 for a fixed purpose.

[0030] like Figure 3As shown, the outlet of the first pump 202 is fixedly connected to a spray pipe 206, the upper surface of the fixed plate 201 is fixedly connected to a second pump 207, the inlet of the second pump 207 is fixedly connected to a second connecting pipe 208, the inlet of the second connecting pipe 208 is fixedly connected to a gas storage tank 209, and the outlet of the second pump 207 is fixedly connected to a jet pipe 210. The surface of the adsorbed wafer will have residual impurities from the cutting process. The cleaning mechanism 2 can clean the wafer, which is beneficial to improving the utilization efficiency of the wafer.

[0031] The first pump 202, the second pump 207, the air storage tank 209, the first electric telescopic rod 4, the second electric telescopic rod 6, and the telescopic hose 11 in this application are all common electrical devices in the prior art, and their models or specific structures will not be described in detail in this application.

[0032] Working principle: After dicing, the wafer is placed on the upper adsorption plate 9, and the device adsorbs the wafer. The third pump 12 draws air, and the gas is adsorbed onto the wafer through the air suction hole 10 on the upper adsorption plate 9. The second electric telescopic rod 6 can push the lower adsorption plate 7 to move up and down. The telescopic hose 11 can be extended and retracted according to the extension and retraction of the second electric telescopic rod 6, which helps to improve the adsorption force. The first electric telescopic rod 4 can push the slider 5 to move inside the slide groove 3, which facilitates the position adjustment of the wafer. Then, the adsorbed wafer can be cleaned by the cleaning mechanism 2. First, the first pump 202 draws the cleaning liquid from the liquid storage tank 204, and then sprays the cleaning liquid onto the wafer through the spray pipe 206. Then, the second pump 207 draws the gas from the gas storage tank 209, and sprays the gas onto the wafer through the air jet pipe 210, which can remove the cleaning liquid and impurities on the wafer, which helps to improve the use effect of the wafer and achieves wafer cleaning.

[0033] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A semiconductor wafer vacuum adsorption plate, comprising a housing (1), characterized in that: The interior of the outer casing (1) is provided with a cleaning mechanism (2) for cleaning wafers. The cleaning mechanism (2) includes a fixing plate (201) fixedly connected to the inner side of the outer casing (1). A first pump (202) is fixedly connected to the upper surface of the fixing plate (201). The inlet of the first pump (202) is fixedly connected to a first connecting pipe (203). The inlet of the first connecting pipe (203) is fixedly connected to a liquid storage tank (204). The outlet of the first pump (202) is fixedly connected to a spray pipe (206). A second pump (207) is fixedly connected to the upper surface of the fixing plate (201). The inlet of the second pump (207) is fixedly connected to a second connecting pipe (208). The inlet of the second connecting pipe (208) is fixedly connected to a gas storage tank (209). The outlet of the second pump (207) is fixedly connected to a jet pipe (210).

2. The semiconductor wafer vacuum adsorption plate according to claim 1, characterized in that: The inlet of the liquid storage tank (204) is fixedly connected to the liquid inlet pipe (205), and one side of the liquid storage tank (204) is fixedly connected to one side of the outer shell (1). The inlet of the gas storage tank (209) is fixedly connected to the gas inlet pipe (211), and one side of the gas storage tank (209) is fixedly connected to one side of the outer shell (1).

3. The semiconductor wafer vacuum adsorption plate according to claim 1, characterized in that: The first connecting pipe (203) penetrates the outer shell (1) and is fixedly connected to the outer shell (1), and the second connecting pipe (208) penetrates the outer shell (1) and is fixedly connected to the outer shell (1).

4. The semiconductor wafer vacuum adsorption plate according to claim 1, characterized in that: The inner side of the outer shell (1) is provided with a sliding groove (3), and a slider (5) is slidably connected inside the sliding groove (3). A first electric telescopic rod (4) is fixedly connected to one side of the slider (5), and the fixed end of the first electric telescopic rod (4) is fixedly connected to the inside of the sliding groove (3).

5. The semiconductor wafer vacuum adsorption plate according to claim 4, characterized in that: The upper surface of the slider (5) is fixedly connected to a second electric telescopic rod (6), and the telescopic end of the second electric telescopic rod (6) is fixedly connected to a lower adsorption plate (7). The upper surface of the lower adsorption plate (7) is provided with a ventilation groove (8).

6. The semiconductor wafer vacuum adsorption plate according to claim 5, characterized in that: The upper adsorption disk (9) is fixedly connected to the outer surface of the lower adsorption disk (7), and the inner wall of the upper adsorption disk (9) is provided with an air suction hole (10).

7. The semiconductor wafer vacuum adsorption plate according to claim 6, characterized in that: The second electric telescopic rod (6) is internally fixedly connected to a telescopic hose (11). The air inlet of the telescopic hose (11) is fixedly connected to the lower surface of the lower adsorption plate (7). The air outlet of the telescopic hose (11) is fixedly connected to a third pump (12). The air outlet of the third pump (12) is fixedly connected to a fourth connecting pipe (13).

8. The semiconductor wafer vacuum adsorption plate according to claim 7, characterized in that: The upper surface of the third pump (12) is fixedly connected to the lower surface of the slider (5), and the retractable hose (11) passes through the slider (5) and is fixedly connected to the slider (5).

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