Wafer transfer equipment

Abstract

The utility model provides wafer transfer equipment which comprises a machine table body, a suction nozzle seat and a buffer structure, the suction nozzle seat comprises a first end used for being connected with the machine table body and a second end used for being in contact with a chip, the buffer structure comprises an elastic layer and a wear-resistant layer, one face of the elastic layer is connected to the surface of the second end of the suction nozzle seat, and the other face of the elastic layer is connected to the wear-resistant layer. The wear-resistant layer is located on the other side of the elastic layer, the elastic layer and the wear-resistant layer comprise a plurality of air holes, and the air holes of the elastic layer are aligned with the air holes of the wear-resistant layer. According to the wafer transfer equipment, the chip can be adsorbed to the surface of the buffer structure through the air holes, the elastic layer in the buffer structure can utilize the elasticity of the elastic layer for buffering, damage to the chip caused by too large force in the contact process of the chip and the substrate is avoided, and the abrasion-resistant layer in the buffer structure can reduce the abrasion degree of the suction nozzle. Chip damage caused by abrasion of the suction nozzle is avoided, the material throwing rate is reduced, the production efficiency is improved, the service life of the suction nozzle can be prolonged, the replacement frequency of the suction nozzle is reduced, and the production efficiency is further improved.

Description

Technical Field

[0001] This application relates to the field of microelectronics, and in particular to a wafer transfer device. Background Technology

[0002] In packaging technology, it is often necessary to move chips or wafers to designated positions on substrates (such as printed circuit boards, lead frames, etc.). However, during the contact process between the chip and the substrate, the chip is easily damaged, and the nozzles of the packaging machine will wear down over time, which can also damage the chip, leading to an increased chip rejection rate. Therefore, there is an urgent need to provide a packaging machine that can reduce chip damage, lower the rejection rate, and improve production efficiency.

[0003] It should be noted that the above introduction to the technical background is only for the purpose of providing a clear and complete explanation of the technical solutions of this application and facilitating understanding by those skilled in the art. It should not be assumed that these technical solutions are known to those skilled in the art simply because they have been described in the background section of this application. Utility Model Content

[0004] In view of the shortcomings of the prior art described above, the purpose of this application is to provide a wafer transfer device to solve the problem that chips are easily damaged in the prior art, resulting in an increased chip rejection rate.

[0005] Firstly, to achieve the above-mentioned and other related objectives, this application provides a wafer transfer device, the wafer transfer device comprising:

[0006] Machine body;

[0007] The nozzle holder includes a first end for connecting to the machine body and a second end for contacting the chip;

[0008] A buffer structure includes an elastic layer and a wear-resistant layer, one side of the elastic layer is connected to the second end surface of the nozzle seat, and the wear-resistant layer is located on the other side of the elastic layer;

[0009] The elastic layer and the wear-resistant layer each include a plurality of pores, and the pores of the elastic layer and the wear-resistant layer are aligned with each other.

[0010] In one embodiment, the wafer transfer device further includes:

[0011] A groove is located on the surface of the wear-resistant layer that contacts the chip; wherein the depth of the groove is less than or equal to the thickness of the wear-resistant layer.

[0012] In one embodiment, the groove includes:

[0013] Multiple strip-shaped grooves extend from the center of the wear-resistant layer surface to the edge of the wear-resistant layer surface.

[0014] In one embodiment, the shape of the groove includes:

[0015] Multiple annular grooves, wherein the multiple annular grooves are multiple concentric rings with the center of the wear-resistant layer surface as the center.

[0016] In one embodiment, the nozzle holder includes:

[0017] A nozzle bracket is used to connect to the machine body;

[0018] A snap fastener, located on the side of the nozzle bracket, is used to engage with the machine body;

[0019] The nozzle handle is connected to the nozzle bracket and is used to contact the chip.

[0020] In one embodiment, the cross-sectional shape of the nozzle handle includes either a rectangle or a circle.

[0021] In one embodiment, the nozzle handle further includes:

[0022] A limiting member is located on the outer edge of the nozzle handle near the surface of the chip and protrudes from the surface of the nozzle handle.

[0023] In one embodiment, the elastic layer comprises a polyimide layer and a copper foil; wherein the polyimide layer is located on the second end surface of the nozzle seat, and the copper foil is located on the surface of the polyimide layer.

[0024] In one embodiment, the elastic layer comprises a polytetrafluoroethylene (PTFE) material layer; wherein the PTFE material layer is located on the second end surface of the nozzle seat.

[0025] In one embodiment, the machine body includes a robotic arm, and the wafer transfer equipment further includes:

[0026] A protection circuit, connected to the machine body, is used to lock the robotic arm or control the lifting of the robotic arm.

[0027] As described above, the wafer transfer device of this application has the following beneficial effects:

[0028] The wafer transfer equipment of this application includes: a machine body, a nozzle holder, and a buffer structure. The nozzle holder includes a first end for connecting to the machine body and a second end for contacting the chip. The buffer structure includes an elastic layer and a wear-resistant layer. One side of the elastic layer is connected to the surface of the second end of the nozzle holder, and the wear-resistant layer is located on the other side of the elastic layer. Both the elastic layer and the wear-resistant layer include multiple pores, and the pores of the elastic layer and the wear-resistant layer are aligned with each other. The wafer transfer equipment can create a vacuum or negative pressure through the airflow flowing through the pores, adsorbing the chip onto the surface of the buffer structure. The elastic layer in the buffer structure can use its own elasticity to buffer, avoiding excessive force during chip-substrate contact and preventing damage to the chip. Furthermore, the wear-resistant layer in the buffer structure can reduce the wear of the nozzle, preventing chip damage due to nozzle wear, reducing the rejection rate and improving production efficiency. It can also extend nozzle life, reduce nozzle replacement frequency, and further improve production efficiency. Attached Figure Description

[0029] The accompanying drawings, which form part of this specification, are used to provide a further understanding of the embodiments of this application and to illustrate the implementation of this application, together with the textual description, to explain the principles of this application. Obviously, the drawings described below are merely some embodiments of this application.

[0030] Figure 1 This is a schematic diagram of the structure of a suction nozzle provided in one embodiment;

[0031] Figure 2 This is a schematic diagram of the structure of a wafer transfer device provided in one embodiment;

[0032] Figure 3 This is a schematic diagram of the groove structure provided in one embodiment;

[0033] Figure 4 This is a schematic diagram of the nozzle holder provided in one embodiment;

[0034] Figure 5 This is a schematic diagram of the protection circuit provided in one embodiment.

[0035] Component designation explanation

[0036] 101 Vent

[0037] 102 Air Guide Channel

[0038] 201 Suction Mouth Holder

[0039] 202 Elastic Layer

[0040] 203 Wear-resistant layer

[0041] 210 Buffer Structure

[0042] 301 Strip-shaped groove

[0043] 302 pores

[0044] 401 nozzle holder

[0045] 402 buckle

[0046] 403 Suction Mouth Handle

[0047] 404 connector

[0048] 405 limit component

[0049] 501 Cylinder Relay Switch

[0050] 502 Cylinder Relay Coil

[0051] 503 Pressure Sensor

[0052] 504 self-locking switch Detailed Implementation

[0053] The following specific examples illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.

[0054] It should be emphasized that the term "including / comprises" as used herein refers to the presence of a feature, whole, step, or component, but does not exclude the presence or addition of one or more other features, wholes, steps, or components.

[0055] Features described and / or illustrated for one embodiment may be used in the same or similar manner in one or more other embodiments, combined with features in other embodiments, or substituted for features in other embodiments.

[0056] In the detailed description of embodiments of the present invention, for ease of explanation, the cross-sectional views illustrating the device structure may be partially enlarged and not to scale. Furthermore, the schematic diagrams are merely examples and should not limit the scope of protection of the present invention. In actual fabrication, the three-dimensional spatial dimensions of length, width, and depth should be included.

[0057] It is understood that the terms “first,” “second,” etc., used in this application may be used herein to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish the first element from another element.

[0058] Spatial relation terms such as “below,” “under,” “below,” “under,” “above,” “above,” etc., are used herein to describe the relationship between one element or feature shown in the figure and other elements or features. It should be understood that, in addition to the orientation shown in the figure, spatial relation terms also include different orientations of the device in use and operation. For example, if the device in the figure is flipped, the element or feature described as “below,” “under,” or “below” will be oriented “above” the other element or feature. Therefore, the exemplary terms “below” and “under” can include both above and below orientations. Furthermore, the device may also include other orientations (e.g., rotated 90 degrees or other orientations), and the spatial descriptive terms used herein will be interpreted accordingly.

[0059] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0060] When used herein, the singular forms of “a,” “an,” and “the” may also include the plural forms unless the context clearly indicates otherwise. It should also be understood that terms such as “comprising / including” or “having” specify the presence of the stated features, wholes, components, parts, or combinations thereof, but do not preclude the possibility of the presence or addition of one or more other features, wholes, components, parts, or combinations thereof. Meanwhile, the term “and / or” as used in this specification includes any and all combinations of the associated listed items.

[0061] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intermediate element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intermediate element present. Where applicable, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation. It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of the invention. Therefore, the illustrations only show components relevant to the invention and are not drawn according to the actual number, shape, and size of components in implementation. In actual implementation, the type, quantity, and proportion of each component can be arbitrarily changed, and the component layout may be more complex.

[0062] As described in the background section, in packaging technology, it is often necessary to move chips or wafers to designated positions on substrates (such as printed circuit boards, lead frames, etc.). However, during the contact process between the chip and the substrate, the chip is easily damaged, and the suction nozzles of the machine are prone to wear due to long-term use. Worn nozzles can also damage the chip, leading to an increased chip rejection rate. Therefore, there is an urgent need to provide a machine that can reduce chip damage, lower the rejection rate, and improve production efficiency. Furthermore, in general technology, please refer to... Figure 1 The suction nozzle of the wafer transfer equipment includes a vent 101 and a guide groove 102 connected to the vent 101. When the chip size cannot completely cover the vent 101 and the guide groove 102, the guide groove 102 will leak air, resulting in the inability to adsorb the chip. Therefore, it is not suitable for chips of different sizes and the structure of the suction nozzle needs to be customized according to the chip size. The wafer transfer equipment has a narrow range of applications.

[0063] For the reasons mentioned above, please refer to Figure 2 This application provides a wafer transfer device, including: a machine body (not shown), a nozzle holder 201, and a buffer structure 210.

[0064] The nozzle holder 201 includes a first end for connecting to the machine body and a second end for contacting the chip.

[0065] The nozzle holder 201 serves as a connector and can be connected to the machine body.

[0066] The buffer structure 210 includes an elastic layer 202 and a wear-resistant layer 203. One side of the elastic layer 202 is connected to the second end surface of the nozzle seat 201, and the wear-resistant layer 203 is located on the other side of the elastic layer 202.

[0067] The elastic layer 202 is an elastic film layer used to buffer the applied force, while the wear-resistant layer 203 is used to reduce friction damage to the nozzle and prevent wear. Both the elastic layer 202 and the wear-resistant layer 203 include multiple pores (not shown). When the wear-resistant layer 203 covers the other side of the elastic layer 202, the pores of the elastic layer 202 are aligned with the pores of the wear-resistant layer 203, allowing gas to flow through the pores.

[0068] As an example, the machine body and the nozzle holder 201 may include a cavity connected to the pores of the elastic layer 202 and the pores of the wear-resistant layer 203 for guiding airflow. By regulating the airflow in the pores, a negative pressure can be formed to generate an adsorption force on the chip, adsorbing the chip onto the wafer transfer equipment. At this time, the chip is in contact with the wear-resistant layer 203. When the wafer transfer equipment moves the chip onto the substrate by a robotic arm, the elastic layer 202 can use its own elasticity to buffer the force generated by the contact between the chip and the substrate, avoiding damage to the chip.

[0069] In the above embodiments, the wafer transfer equipment includes a machine body, a nozzle holder, and a buffer structure. The nozzle holder includes a first end for connecting to the machine body and a second end for contacting the chip. The buffer structure includes an elastic layer and a wear-resistant layer. One side of the elastic layer is connected to the surface of the second end of the nozzle holder, and the wear-resistant layer is located on the other side of the elastic layer. Both the elastic layer and the wear-resistant layer include multiple pores, and the pores of the elastic layer and the wear-resistant layer are aligned with each other. The wafer transfer equipment can create a vacuum or negative pressure through the airflow flowing through the pores to adsorb the chip onto the surface of the buffer structure. The elastic layer in the buffer structure can use its own elasticity to buffer the chip, avoiding excessive force during the chip-substrate contact process and preventing damage to the chip. The wear-resistant layer in the buffer structure can reduce the wear of the nozzle, preventing chip damage due to nozzle wear, reducing the rejection rate and improving production efficiency. It can also extend the nozzle life, reduce the nozzle replacement frequency, and further improve production efficiency.

[0070] In some embodiments, the wafer transfer device further includes a groove located on the surface of the wear-resistant layer that contacts the chip; wherein the depth of the groove is less than or equal to the thickness of the wear-resistant layer.

[0071] As an example, the depth of the groove can be 10% of the wear-resistant layer thickness, 20% of the wear-resistant layer thickness, 30% of the wear-resistant layer thickness, 40% of the wear-resistant layer thickness, 50% of the wear-resistant layer thickness, 60% of the wear-resistant layer thickness, 70% of the wear-resistant layer thickness, 80% of the wear-resistant layer thickness, 90% of the wear-resistant layer thickness, 100% of the wear-resistant layer thickness, etc. Those skilled in the art can set the depth of the groove according to actual needs.

[0072] In the above embodiments, the groove can be connected to some of the pores, allowing airflow to pass through the groove. This reduces the area of ​​direct contact between the chip and the wear-resistant layer while adsorbing the chip or wafer, thus avoiding damage to the chip. Furthermore, due to the large size of the groove, the adsorption force of the airflow on the chip is weakened when the airflow passes through the groove, causing the chip to float in contact with the wear-resistant layer. This further avoids friction between the chip and the wear-resistant layer, reducing damage to the chip and preventing wear on the wear-resistant layer, thereby extending the service life of the wafer transfer equipment.

[0073] In some embodiments, please refer to Figure 3 The groove includes: a plurality of strip-shaped grooves 301, which extend from the center of the surface of the wear-resistant layer 203 to the edge of the surface of the wear-resistant layer 203.

[0074] As an example, please continue to refer to Figure 3 The strip-shaped grooves 301 are connected to some of the air holes 302. There are 8 strip-shaped grooves 301, and the spacing between each strip-shaped groove 301 is uniform, thus forming a "rice" shaped groove structure. This disperses the stress generated by the chip due to the adsorption force and avoids stress concentration in a certain area, which may cause the chip to break. Of course, the spacing between each strip-shaped groove 301 may also be uneven. The number of strip-shaped grooves 301 may also include 2, 3, 4, 5, 6, 7, 8, 9, 10, etc. There is no specific limitation here.

[0075] The adsorption force is related to the width and length of the strip-shaped groove 301. With a constant airflow from the machine body, a larger groove results in a weaker adsorption force on the chip. The adsorption force can be adjusted by setting the width and length of the strip-shaped groove 301. The length of the strip-shaped groove 301 is also related to the chip size. Preferably, the length of the strip-shaped groove 301 extends to the edge of the chip coverage area to prevent air leakage due to exceeding the chip coverage area, which would affect the adsorption force. It also evenly distributes the stress from the chip center to the edge, preventing cracking due to a large contact area between the chip edge and the wear-resistant layer. This application does not limit the width and length of the strip-shaped groove 301; they can be set according to actual needs.

[0076] In some embodiments, the shape of the groove includes: a plurality of annular grooves, wherein the plurality of annular grooves are a plurality of concentric rings with the center of the wear-resistant layer surface as the center.

[0077] As an example, the spacing between multiple annular grooves can be uniform or non-uniform. The adsorption force is related to the spacing distance and width of the annular grooves. When the air flow rate output by the machine body remains constant, the larger the shape of the groove, the weaker the adsorption force on the chip. The adsorption force on the chip can be adjusted by setting the width and spacing distance of the annular grooves.

[0078] As an example, the number of annular grooves may include 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, etc. This application does not impose a specific limit on the number of annular grooves, which can be set according to actual needs.

[0079] In the above embodiments, by setting the shape of the groove to a plurality of annular structures, the annular structure can improve the uniformity of stress distribution from the chip center to the chip edge, compared to a structure with a plurality of strip-shaped grooves. In other embodiments, the shape of the groove may also include other shapes that can disperse stress.

[0080] In some embodiments, the shape of the vent may include a circle, which is beneficial for processing and arrangement and is less prone to clogging. Of course, the vent may also be other shapes, such as rectangles, triangles, or irregular shapes. By adjusting the shape of the vent, the gas flow rate through the vent can be adjusted, thereby changing the magnitude of the adsorption force on the chip. This application does not impose specific limitations on the shape of the vent.

[0081] As an example, please continue to refer to Figure 3 The vents 302 are arrayed in the buffer structure. The number and arrangement of the vents 302 can be set according to the shape of the chip, so as to be suitable for chips of different sizes. Compared with the general technology that includes a vent and a connecting air guide groove connected to the vent, this application includes multiple vents 302, and the air source of multiple vents 302 can be set independently. For chips of different sizes, there will be no air leakage due to the chip not being able to completely cover the vents 302, which would prevent the chip from being adsorbed. This expands the applicability of the wafer transfer equipment and reduces the production cost.

[0082] In some embodiments, please refer to Figure 4 The nozzle holder includes: a nozzle bracket 401, a snap fastener 402, and a nozzle handle 403; wherein, the nozzle bracket 401 is connected to the machine body, the snap fastener 402 is located on the side of the nozzle bracket 401 and is used to snap onto the machine body; the nozzle handle 403 is connected to the nozzle bracket 401 and is used to contact the chip.

[0083] As an example, please continue to refer to Figure 4 The shape of the nozzle bracket 401 can correspond to the shape of the machine body, so that the nozzle bracket 4041 can fit into the machine body for better fixation. The nozzle handle 403 can be connected to the nozzle bracket through the connector 404, so that the nozzle handle 403 is detachable, thereby facilitating the replacement of the nozzle handle 403 and the buffer structure 210 located on the surface of the nozzle handle 403.

[0084] As an example, the cross-sectional shape of the nozzle handle 403 may be rectangular or circular.

[0085] In some embodiments, please refer to Figure 4 The nozzle handle 403 also includes a limiting member 405, which is located on the outer edge of the nozzle handle 403 near the surface of the chip and protrudes from the surface of the nozzle handle 403.

[0086] As an example, please continue to refer to Figure 4 The limiting member 405 surrounds part of the outer edge of the nozzle handle 403, thereby facilitating the replacement of the wear-resistant layer and the elastic layer, and preventing the limiting member 405 from completely covering the outer edge of the nozzle handle 403, which would prevent the buffer structure 210 from being removed.

[0087] In some embodiments, the elastic layer includes a polyimide layer and a copper foil; wherein the polyimide layer is located on the second end surface of the nozzle seat, and the copper foil is located on the surface of the polyimide layer.

[0088] As an example, the polyimide layer of copper-clad foil has good dielectric properties (dielectric constant 2.8), dimensional stability (1.5 mm / m dimensional change after etching), and high temperature resistance (resistant to at least 260°C for floating soldering). It can also withstand thermal cycling and mechanical bending, and has high peel strength (1.1 N / mm) and good fatigue resistance (4000 bending cycles). By including the polyimide layer of copper-clad foil in the elastic layer, it can be better matched to the packaging environment.

[0089] In some embodiments, the elastic layer comprises a polytetrafluoroethylene (PTFE) material layer; wherein the PTFE material layer is located on the second end surface of the nozzle seat.

[0090] As an example, the PTFE vinyl material layer has high purity, corrosion resistance, and high temperature resistance (suitable for processes above 200°C). By including the PTFE vinyl material layer in the elastic layer, positional deviations between the nozzle and the chip can be compensated.

[0091] In some embodiments, the machine body includes a robotic arm, and the wafer transfer equipment further includes a protection circuit connected to the machine body for locking the robotic arm or controlling the lifting of the robotic arm.

[0092] For example, please refer to Figure 5The robotic arm includes a cylinder relay switch 501 and a cylinder relay coil 502. The protection circuit may include a pressure sensor 503 and a self-locking switch 504. The first end of the pressure sensor 503 is connected to the first end of the power supply and the first end of the self-locking switch 504. The second end of the pressure sensor is connected to the second end of the self-locking switch 504 and the first end of the cylinder relay switch 501. The second end of the cylinder relay switch 501 is connected to the first end of the cylinder relay coil 502, and the second end of the cylinder relay coil 502 is connected to the second end of the power supply. As an example, the self-locking switch 504 is a normally open switch. When the pressure sensor 503 detects that the force on the end of the wafer transfer device in contact with the chip exceeds the pressure threshold, the cylinder relay switch 501 closes, the cylinder relay coil 502 is energized, and the robotic arm lifts up to prevent excessive force on the chip from damaging it. When the self-locking switch 504 closes, the cylinder relay switch 501 closes, the cylinder relay coil 502 is energized, and the robotic arm self-locks.

[0093] In the above embodiments, the protection circuit can be combined with the buffer structure to achieve dual protection for the chip, avoiding protection failure due to voltage fluctuations and protection failure due to damage to the buffer structure, thereby improving the reliability of the wafer transfer equipment in protecting the chip.

[0094] In summary, the wafer transfer equipment of this application includes: a machine body, a nozzle holder, and a buffer structure. The nozzle holder includes a first end for connecting to the machine body and a second end for contacting the chip. The buffer structure includes an elastic layer and a wear-resistant layer. One side of the elastic layer is connected to the surface of the second end of the nozzle holder, and the wear-resistant layer is located on the other side of the elastic layer. Both the elastic layer and the wear-resistant layer include multiple pores, and the pores of the elastic layer and the wear-resistant layer are aligned with each other. The wafer transfer equipment can create a vacuum or negative pressure through the airflow flowing through the pores, adsorbing the chip onto the surface of the buffer structure. The elastic layer in the buffer structure can utilize its own elasticity to buffer, preventing excessive force during chip-substrate contact and thus avoiding damage to the chip. Furthermore, the wear-resistant layer in the buffer structure can reduce the wear of the nozzle, preventing chip damage due to nozzle wear, reducing the rejection rate and improving production efficiency. It can also extend nozzle life, reduce nozzle replacement frequency, and further improve production efficiency.

[0095] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in the present invention should still be covered by the claims of the present invention.

Claims

1. A wafer transfer device, characterized in that, The wafer transfer equipment includes: Machine body; The nozzle holder includes a first end for connecting to the machine body and a second end for contacting the chip; A buffer structure includes an elastic layer and a wear-resistant layer, one side of the elastic layer is connected to the second end surface of the nozzle seat, and the wear-resistant layer is located on the other side of the elastic layer; The elastic layer and the wear-resistant layer each include a plurality of pores, and the pores of the elastic layer and the wear-resistant layer are aligned with each other.

2. The wafer transfer equipment according to claim 1, characterized in that, The wafer transfer equipment also includes: A groove is located on the surface of the wear-resistant layer that contacts the chip; wherein the depth of the groove is less than or equal to the thickness of the wear-resistant layer.

3. The wafer transfer equipment according to claim 2, characterized in that, The groove includes: Multiple strip-shaped grooves extend from the center of the wear-resistant layer surface to the edge of the wear-resistant layer surface.

4. The wafer transfer equipment according to claim 2, characterized in that, The shape of the groove includes: Multiple annular grooves, wherein the multiple annular grooves are multiple concentric rings with the center of the wear-resistant layer surface as the center.

5. The wafer transfer equipment according to claim 1, characterized in that, The suction nozzle seat includes: A nozzle bracket is used to connect to the machine body; A snap fastener, located on the side of the nozzle bracket, is used to engage with the machine body; The nozzle handle is connected to the nozzle bracket and is used to contact the chip.

6. The wafer transfer equipment according to claim 5, characterized in that, The cross-sectional shape of the nozzle handle includes: rectangular or circular.

7. The wafer transfer equipment according to claim 5, characterized in that, The suction nozzle handle also includes: A limiting member is located on the outer edge of the nozzle handle near the surface of the chip and protrudes from the surface of the nozzle handle.

8. The wafer transfer equipment according to claim 1, characterized in that, The elastic layer includes a polyimide layer and a copper foil; wherein the polyimide layer is located on the second end surface of the nozzle seat, and the copper foil is located on the surface of the polyimide layer.

9. The wafer transfer equipment according to claim 1, characterized in that, The elastic layer includes a polytetrafluoroethylene (PTFE) material layer; wherein the PTFE material layer is located on the second end surface of the nozzle seat.

10. The wafer transfer equipment according to claim 1, characterized in that, The machine body includes a robotic arm, and the wafer transfer equipment further includes: A protection circuit, connected to the machine body, is used to lock the robotic arm or control the lifting of the robotic arm.

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