Semiconductor bonding sample jig

Abstract

The utility model discloses a semiconductor bonding sample jig, and relates to the technical field of semiconductor processing. A plurality of grabbing grooves are formed in the top surface of the jig body; the two ends of the grabbing groove extend out of the side face of the jig body correspondingly. Sample stations for bearing samples are formed in the positions, on the two sides of the grabbing groove, of the top face of the jig body; a plurality of visual positioning structures are arranged in the grabbing groove or on the top surface of the jig body; a light absorption material layer is arranged on the top face of the jig body. The design can meet the placing requirements of samples of various sizes, the jig does not need to be replaced, the equipment cost and the jig management complexity are reduced, the production preparation time is shortened, the production efficiency is improved, part of the bottom structure of the sample is prevented from making contact with the jig body, and the bottom of the sample is prevented from being damaged due to contact. Moreover, the problem that a traditional jig lacks an effective visual positioning structure is solved, and a visual camera on the grabbing manipulator can accurately identify the positioning mark, so that the sample is more accurately placed.

Description

Technical Field

[0001] This application relates to the field of semiconductor processing technology, and in particular to semiconductor bonding sample fixtures. Background Technology

[0002] In the field of semiconductor bonding technology, bonding is a crucial step in achieving mechanical fixation and electrical connection between chips and substrates or between chips. As a vital carrier unit in the bonding process, the performance of the sample fixture directly affects bonding accuracy and efficiency. Traditional sample fixtures, such as the semiconductor wafer pre-bonding fixture and its usage method disclosed in Chinese Patent CN120388899A, typically have fixed-size positioning grooves on their wafer carrier units for placing the semiconductor wafer and the substrate. While this design based on fixed-size grooves can stably support samples of specific sizes, it has limitations: First, it lacks versatility and cannot adapt to the bonding requirements of samples of different sizes. When processing wafers or substrates of different specifications, a fixture with a corresponding groove size must be replaced, which not only increases equipment costs and fixture management complexity but also prolongs production preparation time and reduces production efficiency. Second, it lacks sufficient positioning assistance. Existing sample fixtures generally lack effective visual positioning structures, making it difficult to provide intuitive and reliable positioning guidance for the precise placement of samples on the fixture. This may lead to sample placement deviations, thereby affecting the alignment accuracy and bonding quality of subsequent bonding.

[0003] Therefore, developing a sample fixture that is compatible with samples of multiple sizes and has good positioning assistance function has become an urgent technical problem to be solved in the field of semiconductor bonding. Utility Model Content

[0004] In view of this, the purpose of this application is to provide a semiconductor bonding sample fixture that is compatible with samples of multiple sizes and has good positioning assistance function.

[0005] To achieve the above-mentioned technical objectives, this application provides a semiconductor bonding sample fixture, including a fixture body;

[0006] The top surface of the fixture body is provided with several gripping grooves;

[0007] The two ends of the gripping groove extend out of the sides of the fixture body;

[0008] The top surface of the fixture body forms sample stations for carrying samples on both sides of the gripping groove;

[0009] The gripping groove or the top surface of the fixture body is provided with several visual positioning structures;

[0010] The top surface of the fixture body is provided with a light-absorbing material layer.

[0011] Furthermore, the bottom surface of the fixture body is provided with a positioning groove.

[0012] Furthermore, the fixture body is a square plate;

[0013] The positioning groove is a square groove;

[0014] The four corners of the positioning groove are provided with clearance grooves;

[0015] The other end of the clearance groove extends out from the side of the fixture body.

[0016] Furthermore, the four corners of the fixture body are all chamfered.

[0017] Furthermore, the visual positioning structure is integrally formed with the fixture body and is a recessed structure or a raised structure.

[0018] Furthermore, the visual positioning structure is a triangular recessed structure or a square recessed structure.

[0019] Furthermore, the visual positioning structure is a triangular protrusion structure or a square protrusion structure.

[0020] Furthermore, the visual positioning structure is detachably connected to the fixture body and is a positioning block structure.

[0021] Furthermore, the visual positioning structure is symmetrically provided with abutment portions;

[0022] The abutting part can contact and abut against the two sides of the gripping groove respectively.

[0023] Furthermore, the light-absorbing material layer is a black oxide layer.

[0024] As can be seen from the above technical solutions, the semiconductor bonding sample fixture designed in this application has the following beneficial effects:

[0025] 1. The open-type bearing method (the sample is placed on the gripping slot to achieve suspended placement) is adopted, which abandons the traditional fixed-size groove design. It can adapt to the placement needs of samples of various sizes without the need to change the fixture, which reduces equipment costs and fixture management complexity, shortens production preparation time, improves production efficiency, and avoids contact between part of the bottom structure of the sample and the fixture body, thus preventing damage to the bottom of the sample.

[0026] 2. Several visual positioning structures (as positioning targets for the visual camera) are set in the gripping slot or on the top surface of the fixture body. This solves the problem of traditional fixtures lacking effective visual positioning structures, enabling the visual camera on the gripping robot to accurately identify the positioning targets, thereby placing the sample more precisely, reducing sample placement deviation, and improving the alignment accuracy and bonding quality of subsequent bonding.

[0027] 3. The openings extending from both ends of the gripping slot to the sides of the fixture body facilitate the robotic arm to grip and place samples through the gripping slot, and also facilitate fixture processing, thereby improving sample gripping efficiency and fixture processing convenience.

[0028] 4. A light-absorbing material layer is set on the top surface of the fixture body, which reduces the reflection on the top surface, enabling the vision camera to more clearly identify the visual positioning structure in the gripping slot, and further improving the accuracy of sample placement. Attached Figure Description

[0029] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0030] Figure 1 A first perspective view of the semiconductor bonding sample fixture with a square recess provided in this application;

[0031] Figure 2 A second perspective view of the semiconductor bonding sample fixture provided in this application, featuring a triangular recess;

[0032] Figure 3 This is a third perspective view of the semiconductor bonding sample fixture provided in this application;

[0033] In the diagram: 1. Fixture body; 11. Gripping groove; 12. Positioning groove; 13. Clearance groove; 14. Chamfered part; 2. Visual positioning structure. Detailed Implementation

[0034] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the embodiments of this application.

[0035] In the description of the embodiments of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application. In addition, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0036] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a replaceable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application based on the specific circumstances.

[0037] This application discloses a semiconductor bonding sample fixture.

[0038] Please see Figure 1 One embodiment of the semiconductor bonding sample fixture provided in this application includes:

[0039] The fixture body 1 has several gripping grooves 11 on its top surface; the two ends of the gripping grooves 11 extend to the sides of the fixture body 1; the top surface of the fixture body 1 forms sample stations for carrying samples at the positions on both sides of the gripping grooves 11; several visual positioning structures 2 are provided in the gripping grooves 11 or on the top surface of the fixture body 1; and a light-absorbing material layer is provided on the top surface of the fixture body 1.

[0040] The semiconductor bonding sample fixture designed in this application has the following beneficial effects:

[0041] 1. An open-type bearing method is adopted (the sample is placed on the gripping groove 11 to achieve suspended placement), abandoning the traditional fixed-size groove design. It can adapt to the placement needs of samples of various sizes without the need to change the fixture, which reduces equipment costs and fixture management complexity, shortens production preparation time, improves production efficiency, and avoids contact between part of the bottom structure of the sample and the fixture body 1, preventing damage to the bottom of the sample.

[0042] 2. Several visual positioning structures 2 (as positioning targets for the visual camera) are set in the gripping slot 11 or on the top surface of the fixture body 1. This solves the problem that traditional fixtures lack effective visual positioning structures 2, enabling the visual camera on the gripping robot to accurately identify the positioning targets, thereby placing the sample more precisely, reducing sample placement deviation, and improving the alignment accuracy and bonding quality of subsequent bonding.

[0043] 3. The openings extending from both ends of the gripping groove 11 to the sides of the fixture body 1 facilitate the robotic arm to grip and place samples through the gripping groove 11, and also facilitate fixture processing, thereby improving sample gripping efficiency and fixture processing convenience.

[0044] 4. A light-absorbing material layer is provided on the top surface of the fixture body 1 to reduce top surface reflection, enabling the vision camera to more clearly identify the visual positioning structure 2 in the gripping slot 11, further improving the accuracy of sample placement.

[0045] The above is Embodiment 1 of the semiconductor bonding sample fixture provided in this application. The following is Embodiment 2 of the semiconductor bonding sample fixture provided in this application. Please refer to the following for details. Figures 1 to 3 .

[0046] Based on the solution of Embodiment 1 above:

[0047] Furthermore, such as Figure 3 As shown, the bottom surface of the fixture body 1 is provided with a positioning groove 12. The positioning groove 12 can cooperate with the corresponding positioning block to realize the positioning and installation of the fixture body 1, ensuring the accuracy and stability of the fixture's position in the bonding equipment, avoiding sample placement deviation due to fixture displacement, and providing a reliable foundation for subsequent high-precision bonding operations. The setting of this positioning groove 12 makes the installation and replacement of the fixture more convenient and efficient, enabling rapid and precise docking of the fixture with the equipment, further optimizing the production process.

[0048] Furthermore, such as Figure 3 As shown, taking a square plate (disc) as an example, the positioning groove 12 can be a square groove. The four corners of the positioning groove 12 are provided with clearance grooves 13, the other end of which extends outwards from the side of the fixture body 1. The clearance grooves 13 can be 45° grooves, designed to avoid the four sharp corners of the positioning groove 12, preventing damage to the fixture or positioning block due to rigid collisions between the positioning block and the sharp corners of the positioning groove 12 during fixture processing or installation. This also reduces stress concentration during processing, improving the structural stability and service life of the fixture. Furthermore, the extension of the clearance grooves 13 to the side of the fixture body 1 facilitates chip removal during the processing of the positioning groove 12, improving processing efficiency and accuracy.

[0049] Furthermore, such as Figures 1 to 3As shown, taking a square plate (tray) design as an example, the four corners of the fixture body 1 are all provided with 45° chamfered portions 14. The design of the chamfered portions 14 can effectively eliminate the sharp edges and corners, on the one hand, to prevent operators from being scratched by sharp edges and corners when picking up and placing the fixture or performing sample operations, thus improving the safety of operation; on the other hand, it can also prevent the fixture from being damaged by edge and corner collisions during transportation and storage, thus protecting the fixture itself, and making the overall appearance of the fixture more regular and beautiful; of course, the chamfering angle of the chamfered portion 14 is not limited to 45°, and the chamfering angle can be adjusted according to the specific equipment to adapt to the requirements of different equipment placement platforms.

[0050] There are various designs for the visual positioning structure 2, and there are also various ways to connect it to the fixture body 1:

[0051] One method is as follows:

[0052] The visual positioning structure 2 can be integrally formed with the fixture body 1, and can be a recessed structure or a raised structure, for example... Figure 2 The (right-angled) triangular concave structure shown or as... Figure 1 The square recessed structure shown is formed by milling or stamping on the bottom surface of the gripping groove 11. Its edge contour is clear, and its visual contrast is high, facilitating rapid capture and recognition by the visual camera. Alternatively, it can be a triangular or square protruding structure, formed by local stamping or welding on the bottom surface of the gripping groove 11. This creates a significant height difference in visual imaging, providing reliable reference features for visual positioning. The one-piece molding design ensures a firm connection between the visual positioning structure 2 and the fixture body 1, resulting in good structural stability and preventing loosening or detachment during long-term use. It also simplifies the fixture's manufacturing process and reduces production costs.

[0053] Of course, it is not limited to the shapes mentioned above; it can also be other regular shapes such as pentagons, or irregular shapes, without any restrictions.

[0054] Another way is as follows:

[0055] The visual positioning structure 2 is detachably connected to the fixture body 1, and can be designed as a positioning block structure. The positioning block structure can be made of materials such as metal, ceramic, or engineering plastics, and its shape can be flexibly designed into various forms such as round, square, and cross-shaped according to actual positioning needs. To achieve a detachable connection, taking the positioning block installed in the gripping groove 11 as an example, threaded holes can be pre-set on the bottom surface of the gripping groove 11, and the positioning block can be fixed to the fixture body 1 by screws; or a slot can be set on the inner wall of the gripping groove 11, and the positioning block can be embedded and installed by snap-fit. Alternatively, the visual positioning structure 2 can be symmetrically provided with abutment parts, which can respectively contact and abut against the two sides of the gripping groove 11; the abutment parts can provide an interference fit when installing the positioning block, achieving embedded installation and fixation. The design of the abutment parts eliminates the need for extensive processing of the fixture body 1, and the interference fit method for fixation results in lower manufacturing costs and better economic efficiency.

[0056] The detachable connection design allows for easy replacement of the positioning block when the visual positioning structure 2 is worn, damaged, or requires replacement with different types of positioning marks, without having to replace the entire fixture body 1, effectively reducing maintenance costs and the frequency of fixture replacement.

[0057] Taking the design of the visual positioning structure 2 as a protruding structure or positioning block structure and set in the gripping groove 11 as an example, the thickness of the visual positioning structure 2 can be designed to be less than the depth of the gripping groove 11 to avoid contact with the sample.

[0058] Taking the design of the visual positioning structure 2 as a protruding structure or positioning block structure and set on the top surface of the fixture body 1 as an example, the visual positioning structure 2 can be set on the top surface of the fixture body 1 on both sides of the gripping groove 11, which can not only be used as a visual identifier, but also as a support platform to support the sample.

[0059] Furthermore, the light-absorbing material layer is a black oxide layer, formed by oxidizing the top surface of the fixture body 1. This black oxide layer possesses excellent light-absorbing properties, significantly absorbing ambient light and reflected light from the equipment's light source, thereby reducing the reflectivity of the top surface. This oxide layer not only has stable light absorption but also high hardness and wear resistance, maintaining its light-absorbing performance and surface integrity during long-term use. It is not easily worn off due to friction from sample handling or cleaning operations. Simultaneously, the uniform surface color of the black oxide layer does not cause additional interference to the imaging of the vision camera, ensuring clear and high-contrast images of the visual positioning structure 2, providing strong support for the accurate recognition of the vision system. Compared to other light-absorbing material coating methods, the black oxide layer bonds tightly to the fixture body 1, is less prone to peeling, and the process is mature and cost-effective, making it an economical and practical light-absorbing solution.

[0060] In this application, the number of gripping slots 11 can be one or more, and the specific number can be designed according to the actual number of samples to be placed; similarly, the number of visual positioning structures 2 can also be one or more, and one visual positioning structure 2 can serve as a visual positioning target for a placement station. The specific number can be designed according to the actual number of planned placement stations and is not limited.

[0061] The semiconductor bonding sample fixture provided in this application has been described in detail above. For those skilled in the art, there may be changes in the specific implementation and application scope based on the ideas of the embodiments of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A semiconductor bonding sample fixture, characterized in that, Including the fixture body (1); The top surface of the fixture body (1) is provided with several gripping grooves (11). The two ends of the gripping groove (11) extend out of the side of the fixture body (1); The top surface of the fixture body (1) forms a sample station for carrying the sample on both sides of the gripping groove (11); Several visual positioning structures (2) are provided in the gripping groove (11) or on the top surface of the fixture body (1). The top surface of the fixture body (1) is provided with a light-absorbing material layer.

2. The semiconductor bonding sample fixture according to claim 1, characterized in that, The bottom surface of the fixture body (1) is provided with a positioning groove (12).

3. The semiconductor bonding sample fixture according to claim 2, characterized in that, The fixture body (1) is a square plate; The positioning groove (12) is a square groove; The four corners of the positioning groove (12) are provided with clearance grooves (13); The other end of the clearance groove (13) extends out of the side of the fixture body (1).

4. The semiconductor bonding sample fixture according to claim 2, characterized in that, The fixture body (1) has chamfered corners (14) at all four corners.

5. The semiconductor bonding sample fixture according to claim 1, characterized in that, The visual positioning structure (2) is integrally formed with the fixture body (1) and is a recessed structure or a raised structure.

6. The semiconductor bonding sample fixture according to claim 5, characterized in that, The visual positioning structure (2) is a triangular recessed structure or a square recessed structure.

7. The semiconductor bonding sample fixture according to claim 5, characterized in that, The visual positioning structure (2) is a triangular protrusion structure or a square protrusion structure.

8. The semiconductor bonding sample fixture according to claim 1, characterized in that, The visual positioning structure (2) is detachably connected to the fixture body (1) and is a positioning block structure.

9. The semiconductor bonding sample fixture according to claim 8, characterized in that, The visual positioning structure (2) is symmetrically provided with abutment parts; The abutting part can contact and abut against the two sides of the gripping groove (11).

10. The semiconductor bonding sample fixture according to claim 1, characterized in that, The light-absorbing material layer is a black oxide layer.

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