High-protection transistor

Abstract

The utility model discloses a high protection transistor, which comprises a transistor body and a bearing seat, the back of the bearing seat is provided with a reusable heat dissipation mechanism for heat dissipation, and the front of the transistor body is provided with a front protection mechanism for protecting the front of the transistor body. Mounting holes are formed in the transistor body, the bearing seat, the heat dissipation mechanism and the front protection mechanism, and locking screw rods for fixing the transistor body are inserted into the mounting holes. The heat dissipation mechanism is arranged behind the bearing seat, the transistor body is detachably arranged, the heat dissipation mechanism can be reused conveniently, the front protection mechanism can protect the front and the top of the transistor body, the transistor body can be prevented from being collided and damaged, and the service life of the transistor body is prolonged. And then the locking screw rod can penetrate through the interior of the mounting hole to complete the mounting of the whole device.

Description

Technical Field

[0001] This utility model relates to the field of transistor technology, specifically to a high-protection transistor. Background Technology

[0002] A transistor is a semiconductor device widely used for amplifying and switching electronic signals. It is one of the core components of modern electronics and is crucial for the operation of various electronic devices. Based on their operating principles and structures, transistors are mainly divided into two categories: bipolar junction transistors (BJTs) and field-effect transistors (FETs).

[0003] When installing transistors, locking screws are used to install them in the appropriate positions. However, most existing transistor installations simply use locking screws for fixation. Such a simple installation method can easily damage the transistor if it is bumped. Furthermore, direct fixation cannot guarantee rapid heat dissipation of the transistor. Therefore, we propose a high-protection transistor. Utility Model Content

[0004] The purpose of this invention is to provide a high-protection transistor to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a high-protection transistor, comprising a transistor body, multiple sets of pins fixedly mounted on the lower part of the transistor body, a carrier fixedly mounted on the back of the transistor body, a reusable heat dissipation mechanism for heat dissipation provided on the back of the carrier, a front protection mechanism for protecting the front of the transistor body provided on the front of the transistor body, and mounting holes provided on the transistor body, carrier, heat dissipation mechanism and front protection mechanism, with locking screws for fixing the transistor body inserted into the mounting holes.

[0006] Furthermore, the front protection mechanism includes a first positioning groove, a second positioning groove, a top fixing groove, a front protection plate, and a first positioning block. The transistor body has two sets of first positioning grooves and second positioning grooves. The support seat has a top fixing groove on one side. The front protection plate has a first positioning block and a second positioning block that are fixedly connected to each other on one side and at positions corresponding to the first and second positioning grooves. The top protection plate, which is inserted into the top fixing groove, is fixedly installed on the top side of the front protection plate.

[0007] Furthermore, the heat dissipation mechanism includes a heat sink, a mounting slot, and a mounting block. Multiple sets of mounting slots are provided at the four corners of the heat sink. The back of the support is fixedly connected to a mounting block that is inserted into the mounting slot. One side of the heat sink is in contact with the support.

[0008] Furthermore, the heat sink is made of aluminum, and a first gasket made of rubber is fixedly connected to one side of the heat sink.

[0009] Furthermore, a second gasket made of rubber material is fitted onto the outside of the locking screw.

[0010] Furthermore, the lengths of the first positioning block and the second positioning block are greater than the opening depths of the first positioning groove and the second positioning groove.

[0011] Compared with the prior art, the present invention has the following advantages: the pins set at the bottom of the transistor body can be soldered and fixed to the external circuit board, and then the heat dissipation mechanism is set behind the carrier. The transistor body is detachable, which facilitates the reuse of the heat dissipation mechanism. The front protection mechanism can protect the front and top of the transistor body. This setting can prevent the transistor body from being damaged by external collisions. Then the locking screw can be passed through the mounting hole to complete the installation of the entire device.

[0012] Furthermore, the gap between the transistor body and the front protection mechanism facilitates faster heat dissipation from the transistor body. Attached Figure Description

[0013] Figure 1 This is a three-dimensional structural schematic diagram of the present utility model;

[0014] Figure 2 This is a first perspective view of the heat dissipation mechanism of this utility model, which is a schematic diagram of the installation structure.

[0015] Figure 3 This is a second perspective view of the installation structure of the heat dissipation mechanism of this utility model;

[0016] Figure 4 This is a three-dimensional structural diagram of the front protection mechanism of this utility model.

[0017] In the figure: 1. Transistor body, 2. Pin, 3. Support, 4. Heat dissipation mechanism, 5. Mounting hole, 6. Locking screw, 7. First positioning groove, 8. Second positioning groove, 9. Top fixing groove, 10. Front protection plate, 11. First positioning block, 12. Second positioning block, 13. Top protection plate, 14. Heat sink, 15. Mounting groove, 16. Mounting block, 17. First gasket, 18. Second gasket, 19. Front protection mechanism. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0019] Please see Figures 1-4 This utility model provides a technical solution: a high-protection transistor, including a transistor body 1, with multiple sets of pins 2 fixedly installed on the lower part of the transistor body 1, a carrier 3 fixedly installed on the back of the transistor body 1, a reusable heat dissipation mechanism 4 for heat dissipation provided on the back of the carrier 3, and a front protection mechanism 19 for protecting the front of the transistor body 1 provided on the front of the transistor body 1. Mounting holes 5 are provided on the transistor body 1, the carrier 3, the heat dissipation mechanism 4 and the front protection mechanism 19, and locking screws 6 for fixing the transistor body 1 are inserted into the mounting holes 5.

[0020] The pins 2 located at the bottom of the transistor body 1 can be soldered to an external circuit board. The heat dissipation mechanism 4 is then located behind the support 3. The transistor body 1 is detachable, making it easy to reuse the heat dissipation mechanism 4. The front protection mechanism 19 can protect the front and top of the transistor body 1, preventing damage to the transistor body 1 from external impacts. Then, the locking screw 6 can pass through the mounting hole 5 to complete the installation of the entire device.

[0021] Please see Figure 1 , Figure 2 and Figure 4 The front protection mechanism 19 includes a first positioning groove 7, a second positioning groove 8, a top fixing groove 9, a front protection plate 10, and a first positioning block 11. The transistor body 1 has two sets of first positioning grooves 7 and second positioning grooves 8. The support base 3 has a top fixing groove 9 on one side. The front protection plate 10 has a first positioning block 11 and a second positioning block 12 fixedly connected on one side and corresponding to the positions of the first positioning grooves 7 and the second positioning grooves 8. The top protection plate 13, which is inserted into the top fixing groove 9, is fixedly installed on the top side of one side of the front protection plate 10. The length of the first positioning block 11 and the second positioning block 12 is greater than the opening depth of the first positioning groove 7 and the second positioning groove 8.

[0022] During the installation of the front protection plate 10, the first positioning block 11 and the second positioning block 12 are inserted into the first positioning groove 7 and the second positioning groove 8. This arrangement can prevent the front protection plate 10 from shifting to the left or right and can protect the front of the transistor body 1. The top protection plate 13 can contact and be positioned with the top fixing groove 9 to protect the top of the transistor body 1. The length of the first positioning block 11 and the second positioning block 12 is greater than the opening depth of the first positioning groove 7 and the second positioning groove 8 to ensure that there is a gap between the transistor body 1 and the front protection mechanism 19, which facilitates the rapid heat dissipation of the transistor body 1.

[0023] Please see Figure 2 and Figure 3 The heat dissipation mechanism 4 includes a heat sink 14, a mounting groove 15, and a mounting block 16. The heat sink 14 is made of aluminum. Multiple mounting grooves 15 are provided at the four corners of the heat sink 14. The mounting block 16, which is inserted into the mounting groove 15, is fixedly connected to the back of the support base 3. One side of the heat sink 14 is in contact with the support base 3.

[0024] During the installation of the transistor body 1, the mounting slot 15 on the heat sink 14 is aligned with the mounting block 16, which then allows the heat sink 14 to easily fit against the back of the carrier 3, thus enabling the heat sink 14, made of aluminum material, to dissipate heat quickly.

[0025] Please see Figure 1 and Figure 3 A first gasket 17 made of rubber material is fixedly connected to one side of the heat sink 14. The first gasket 17 made of rubber material can provide a buffer space for movement when the locking screw 6 is rotated and fixed, and prevent the transistor body 1 from being damaged by excessive compression.

[0026] Please see Figure 1 The locking screw 6 is fitted with a second gasket 18 made of rubber material, which can prevent the locking screw 6 from being excessively squeezed against the front protection plate 10.

[0027] In use, firstly, the pins 2 located at the bottom of the transistor body 1 can be soldered and fixed to an external circuit board. Then, the heat dissipation mechanism 4 is positioned behind the support base 3. The transistor body 1 is detachable, facilitating the reuse of the heat dissipation mechanism 4. The front protection mechanism 19 protects the front and top of the transistor body 1, preventing damage from external impacts. Then, the locking screw 6 passes through the mounting hole 5 to complete the installation of the entire device. When installing the front protection plate 10, the first positioning block 11 and the second positioning block 12 are inserted into the first positioning groove 7 and the second positioning groove 8. This prevents the front protection plate 10 from malfunctioning. The transistor body 1 is offset to the right, and the front protection plate 10 can be used to protect the front of the transistor body 1. The top protection plate 13 can contact and position with the top fixing groove 9, thereby protecting the top of the transistor body 1. The length of the first positioning block 11 and the second positioning block 12 is greater than the opening depth of the first positioning groove 7 and the second positioning groove 8, which can ensure that there is a gap between the transistor body 1 and the front protection mechanism 19, making it easier for the transistor body 1 to dissipate heat quickly. When installing the transistor body 1, the mounting groove 15 on the heat sink 14 is aligned with the mounting block 16, and then the heat sink 14 can be easily attached to the back of the carrier 3. This allows the heat sink 14 made of aluminum material to dissipate heat quickly.

[0028] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A high-protection transistor, comprising a transistor body (1), wherein a plurality of pins (2) are fixedly mounted on the lower part of the transistor body (1), and a carrier (3) is fixedly mounted on the back side of the transistor body (1), characterized in that: The back of the support (3) is provided with a reusable heat dissipation mechanism (4) for heat dissipation. The front of the transistor body (1) is provided with a front protection mechanism (19) for protecting the front of the transistor body (1). Mounting holes (5) are provided on the transistor body (1), support (3), heat dissipation mechanism (4) and front protection mechanism (19). A locking screw (6) for fixing the transistor body (1) is inserted into the mounting hole (5).

2. The high-protection transistor according to claim 1, characterized in that: The front protection mechanism (19) includes a first positioning groove (7), a second positioning groove (8), a top fixing groove (9), a front protection plate (10), and a first positioning block (11). The transistor body (1) is provided with two sets of first positioning grooves (7) and second positioning grooves (8). The support seat (3) is provided with a top fixing groove (9) on one side. The front protection plate (10) is fixedly connected with a first positioning block (11) and a second positioning block (12) arranged in an alternating manner on one side and corresponding to the positions of the first positioning groove (7) and the second positioning groove (8). The top protection plate (13) inserted into the top fixing groove (9) is fixedly installed on the top side of the front protection plate (10).

3. A high-protection transistor according to claim 2, characterized in that: The heat dissipation mechanism (4) includes a heat sink (14), a mounting groove (15) and a mounting block (16). Multiple mounting grooves (15) are provided at the four corners of the heat sink (14). The mounting block (16) inserted into the mounting groove (15) is fixedly connected to the back of the support (3). One side of the heat sink (14) is in contact with the support (3).

4. A high-protection transistor according to claim 3, characterized in that: The heat sink (14) is made of aluminum, and a first gasket (17) made of rubber is fixedly connected to one side of the heat sink (14).

5. A high-protection transistor according to claim 4, characterized in that: The locking screw (6) is fitted with a second gasket (18) made of rubber material.

6. A high-protection transistor according to claim 5, characterized in that: The lengths of the first positioning block (11) and the second positioning block (12) are greater than the opening depths of the first positioning groove (7) and the second positioning groove (8).

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