Current adjusting device for circuit board electroplating

Abstract

The utility model relates to the technical field of circuit board processing, in particular to a current adjusting device for circuit board electroplating, which comprises an electroplating box, a portal frame is mounted in the middle of the top of the electroplating box, an electric cylinder is mounted in the middle of the top of the portal frame, and the output end of the electric cylinder is fixedly mounted in the middle of the top of a transverse plate. A rotating shaft is rotatably mounted on the side, away from the anode, of the transverse plate, a clamping assembly is arranged at the bottom of the rotating shaft, a conductive slip ring connected with the cathode of the current regulator is mounted at the top of the rotating shaft, a stirring shaft is rotatably mounted on the other side of the transverse plate, and a plurality of stirring rods are mounted below the outer side wall of the stirring shaft. The electric cylinder drives the transverse plate to ascend, the U-shaped plate can be driven to ascend, the U-shaped plate drives a circuit board to ascend to leave electroplating liquid in the electroplating box, when a worker takes the circuit board, fingers do not need to stretch into the electroplating liquid, and harm to the fingers is reduced.

Description

Technical Field

[0001] This utility model relates to the field of circuit board processing technology, specifically to a current regulating device for circuit board electroplating. Background Technology

[0002] During the production of circuit boards, electroplating is required to increase their hardness and resistance to wear, as well as improve their conductivity and smoothness. When electroplating circuit boards of different quantities and sizes, different currents are needed to apply the plating layers in order to increase the efficiency of electroplating.

[0003] Chinese Utility Model Announcement No. CN215251281U includes a power supply box. Partitions are fixedly connected to both the left and right sides of the inner wall of the power supply box, dividing the inner wall into three cavities from top to bottom. A first constant current power supply, a second constant current power supply, and a third constant current power supply are sequentially fixedly installed on the bottom walls of the three cavities. A hinged door is fixedly connected to the front of the power supply box. By adjusting the current regulating device, the first, second, and third constant current power supplies can provide different currents for circuit board electroplating. The current is controlled by an on / off switch. Under the influence of the current, the plating metal and the electroplating solution allow the plating metal cations to form a metal plating layer on the outer surface of the circuit board. This device allows for adjustment of the electroplating current, increasing the electroplating efficiency.

[0004] The applicant discovered some shortcomings in the use of the patent: the circuit board is placed in the plating tank, and since the circuit board needs to be completely immersed in the electroplating solution, after the electroplating is completed, fingers need to be inserted into the electroplating solution to take out the circuit board, which can cause some damage to the fingers. At the same time, there is no function to stir the electroplating solution during the electroplating process, and the diffusion effect of metal ions in the electroplating solution is not good enough.

[0005] Therefore, this utility model designs a current regulating device for circuit board electroplating to solve the problems existing in the prior art. Utility Model Content

[0006] The purpose of this invention is to provide a current regulating device for circuit board electroplating to solve the problems mentioned in the background art.

[0007] To achieve the above objectives, this utility model provides the following technical solution: a current regulating device for circuit board electroplating, comprising: an electroplating tank, a current regulator installed on one side of the electroplating tank, an anode connected to the positive terminal of the current regulator installed on the inner wall of one side of the electroplating tank, a gantry frame installed at the top center of the electroplating tank, an electric cylinder installed at the top center of the gantry frame, the output end of the electric cylinder being fixedly installed at the top center of a horizontal plate, a rotating shaft rotatably installed on the side of the horizontal plate away from the anode, a clamping assembly provided at the bottom of the rotating shaft, a conductive slip ring connected to the negative terminal of the current regulator installed at the top of the rotating shaft, a stirring shaft rotatably installed on the other side of the horizontal plate, and several stirring rods installed below the outer side wall of the stirring shaft.

[0008] Preferably, the clamping assembly includes a U-shaped plate, the top of which is fixedly installed to the bottom of the rotating shaft, and a bidirectional lead screw is rotatably installed between the two sides of the U-shaped plate. Clamping plates are slidably installed on the outer side walls of both sides of the bidirectional lead screw through threads. By rotating the bidirectional lead screw, the two clamping plates are brought closer to each other, thereby clamping and fixing the circuit board.

[0009] Preferably, a handle is installed on one side of the bidirectional lead screw, which facilitates the operator to rotate the bidirectional lead screw.

[0010] Preferably, a guide rod that is slidably connected to the clamping plate is fixedly installed between the two sides of the U-shaped plate, and the guide rod can limit the clamping plate.

[0011] Preferably, a first transmission wheel and a second transmission wheel are respectively installed on the upper outer side wall of the stirring shaft and the rotating shaft. The first transmission wheel and the second transmission wheel are driven by a belt. The top of the stirring shaft is connected to the output end of the reduction motor. Through the transmission of the transmission wheels and the belt, the stirring shaft and the rotating shaft can rotate simultaneously, saving the use of one motor.

[0012] Preferably, the diameter of the second transmission wheel is larger than that of the first transmission wheel. The smaller wheel drives the larger wheel to reduce the speed of the shaft, thereby preventing the circuit board from rotating too fast and splashing water.

[0013] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0014] 1. This utility model uses an electric cylinder to drive the horizontal plate to rise, which in turn drives the U-shaped plate to rise. The U-shaped plate then lifts the circuit board away from the electroplating solution in the electroplating tank. When workers pick up the circuit board, their fingers do not need to be inserted into the electroplating solution, thus reducing the harm to their fingers.

[0015] 2. This invention uses a rotating stirring shaft to drive a stirring rod, which stirs the electroplating solution, making the ion distribution in the solution more uniform, accelerating ion diffusion and transmission, reducing concentration polarization, and helping to obtain a uniform and dense plating layer. At the same time, the rotating shaft drives the circuit board to rotate, which allows metal ions in the surrounding electroplating solution to be transported to the surface of the circuit board more quickly. During the electroplating process, metal ions need to diffuse from the main body of the electroplating solution to the surface of the circuit board to undergo a deposition reaction. Rotating the circuit board can break up the static liquid layer near the surface of the circuit board, making it easier for ions to overcome this obstacle and increasing the rate at which ions reach the surface of the circuit board, thus helping to improve electroplating efficiency and the deposition speed of the plating layer. Attached Figure Description

[0016] Figure 1 This is a front view schematic diagram of the present invention;

[0017] Figure 2 This is a schematic diagram of the horizontal plate structure of this utility model;

[0018] Figure 3 This is a schematic diagram of the clamping component structure of this utility model.

[0019] In the diagram: 1. Electroplating tank; 2. Current regulator; 3. Anode; 4. Gantry frame; 5. Electric cylinder; 6. Horizontal plate; 7. Rotating shaft; 8. Clamping assembly; 9. Conductive slip ring; 10. Stirring shaft; 11. Stirring rod; 12. Transmission wheel one; 13. Transmission wheel two; 14. Belt; 15. Gear motor; 801. U-shaped plate; 802. Double-acting lead screw; 803. Clamping plate. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0021] Please see Figure 1-3An embodiment of this utility model provides a current regulating device for circuit board electroplating, comprising: an electroplating tank 1, a current regulator 2 installed on one side of the electroplating tank 1, an anode 3 connected to the positive terminal of the current regulator 2 installed on the inner wall of one side of the electroplating tank 1, a gantry frame 4 installed at the top center of the electroplating tank 1, an electric cylinder 5 installed at the top center of the gantry frame 4, the output end of the electric cylinder 5 being fixedly installed at the top center of a horizontal plate 6, a rotating shaft 7 being rotatably installed on the side of the horizontal plate 6 away from the anode 3, a clamping assembly 8 being provided at the bottom of the rotating shaft 7, a conductive slip ring 9 connected to the negative terminal of the current regulator 2 being installed at the top of the rotating shaft 7, a stirring shaft 10 being rotatably installed on the other side of the horizontal plate 6, and several stirring rods 11 being installed below the outer side wall of the stirring shaft 10.

[0022] Please see Figure 1-3 In this embodiment: the clamping assembly 8 includes a U-shaped plate 801, the top of the U-shaped plate 801 is fixedly installed with the bottom of the rotating shaft 7, a bidirectional lead screw 802 is rotatably installed between the two sides of the U-shaped plate 801, and a clamping plate 803 is slidably installed on both outer side walls of the bidirectional lead screw 802 through threads. The U-shaped plate 801, the bidirectional lead screw 802 and the clamping plate 803 are all made of metal.

[0023] Please see Figure 1-3 In this embodiment: a handle is installed on one side of the bidirectional lead screw 802.

[0024] Please see Figure 1-3 In this embodiment: a guide rod that is slidably connected to the clamping plate 803 is fixedly installed between the two sides of the U-shaped plate 801.

[0025] Please see Figure 1-3 In this embodiment: a first transmission wheel 12 and a second transmission wheel 13 are respectively installed on the upper outer side wall of the stirring shaft 10 and the rotating shaft 7. The first transmission wheel 12 and the second transmission wheel 13 are driven by the belt 14. The top of the stirring shaft 10 is connected to the output end of the reduction motor 15. An L-shaped motor frame is installed on the horizontal plate 6, and the reduction motor 15 is installed on the L-shaped motor frame.

[0026] Please see Figure 1-3 In this embodiment, the diameter of transmission wheel 2 13 is greater than the diameter of transmission wheel 1 12.

[0027] Working principle: The current regulator 2 is connected to the power supply. The current regulator 2 controls the magnitude of the electroplating current. The negative terminal of the current regulator 2 is connected to the conductive slip ring 9. Through the conductivity of the rotating shaft 7, U-shaped plate 801, bidirectional lead screw 802, and clamping plate 803, the circuit board acts as the cathode. After the positive terminal of the current regulator 2 and the metal anode 3 are energized, the circuit board can be electroplated in the electroplating tank 1 filled with electroplating solution. During the electroplating process, the geared motor 15 can be started to make the stirring shaft 10 drive the stirring rod 11 to rotate and stir the electroplating solution, so that the ion distribution in the electroplating solution is more uniform, accelerating the diffusion and transfer of ions, reducing concentration polarization, and helping to obtain a uniform and dense coating. At the same time, through the transmission wheel... The meshing of the transmission wheel 12, transmission wheel 13, and belt 14 causes the rotating shaft 7 to rotate. The conductive slip ring 9 prevents the wires from getting tangled. The rotating shaft 7 drives the U-shaped plate 801 to rotate, which in turn causes the circuit board to rotate. The rotation of the circuit board allows metal ions in the surrounding electroplating solution to be transported to the surface of the circuit board more quickly. During the electroplating process, metal ions need to diffuse from the main body of the electroplating solution to the surface of the circuit board to undergo a deposition reaction. Rotating the circuit board can break up the static liquid layer near the surface of the circuit board, making it easier for ions to overcome this obstacle and increasing the rate at which ions reach the surface of the circuit board. This helps to improve the electroplating efficiency and the deposition speed of the coating. The contents not described in detail in this specification are prior art known to those skilled in the art.

[0028] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A current regulating device for circuit board electroplating, comprising: An electroplating tank (1) is characterized in that: a current regulator (2) is installed on one side of the electroplating tank (1), an anode (3) connected to the positive electrode of the current regulator (2) is installed on the inner wall of one side of the electroplating tank (1), a gantry frame (4) is installed at the middle of the top of the electroplating tank (1), an electric cylinder (5) is installed at the middle of the top of the gantry frame (4), the output end of the electric cylinder (5) is fixedly installed at the middle of the top of the horizontal plate (6), a rotating shaft (7) is rotatably installed on the side of the horizontal plate (6) away from the anode (3), a clamping assembly (8) is provided at the bottom of the rotating shaft (7), a conductive slip ring (9) connected to the negative electrode of the current regulator (2) is installed at the top of the rotating shaft (7), a stirring shaft (10) is rotatably installed on the other side of the horizontal plate (6), and several stirring rods (11) are installed below the outer side wall of the stirring shaft (10).

2. The current regulating device for circuit board electroplating according to claim 1, characterized in that: The clamping assembly (8) includes a U-shaped plate (801), the top of which is fixedly installed with the bottom of the rotating shaft (7), and a bidirectional lead screw (802) is rotatably installed between the two sides of the U-shaped plate (801). Clamping plates (803) are slidably installed on both outer walls of the bidirectional lead screw (802) through threads.

3. The current regulating device for circuit board electroplating according to claim 2, characterized in that: A handle is installed on one side of the bidirectional lead screw (802).

4. The current regulating device for circuit board electroplating according to claim 2, characterized in that: A guide rod that is slidably connected to the clamping plate (803) is fixedly installed between the two sides of the U-shaped plate (801).

5. The current regulating device for circuit board electroplating according to claim 1, characterized in that: The upper outer walls of the stirring shaft (10) and the rotating shaft (7) are respectively equipped with a first transmission wheel (12) and a second transmission wheel (13). The first transmission wheel (12) and the second transmission wheel (13) are driven by a belt (14). The top of the stirring shaft (10) is connected to the output end of the reduction motor (15).

6. The current regulating device for circuit board electroplating according to claim 5, characterized in that: The diameter of the second transmission wheel (13) is greater than the diameter of the first transmission wheel (12).

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