Soldering tin dipping tool for superconducting assembly

Abstract

The utility model discloses a soldering tin dipping tool used for a superconducting assembly, the superconducting assembly is a multidirectional bending assembly formed by stacking a plurality of superconducting strips, the soldering tin dipping tool comprises a superconducting strip supporting piece, the shape of the superconducting strip supporting piece is matched with that of the superconducting assembly, and the superconducting strip supporting piece is provided with a containing groove used for containing the superconducting strips. The soldering tin inlet and the soldering tin outlet are communicated with the containing groove; the first isolating layer is arranged on the outer side of the superconducting tape supporting piece and covers the opening of the accommodating groove; the sealing layer is arranged on the outer side of the first isolation layer and seals the containing groove to form a sealed containing cavity; during soldering tin dipping, liquid soldering tin can enter through the soldering tin inlet, flows through the sealed containing cavity and then flows out through the soldering tin outlet, and sufficient soldering tin dipping can be carried out on the superconducting assembly of the multidirectional bending structure.

Description

Technical Field

[0001] This application relates to the field of superconducting technology, and more specifically to solder dipping fixtures for superconducting components. Background Technology

[0002] Superconducting technology, as an important branch of modern physics and materials science, is widely used in fields such as magnetic levitation trains, nuclear magnetic resonance imaging (MRI), high-efficiency power transmission systems, and controlled nuclear fusion. Among these applications, superconducting coils and superconducting cables are core components, and their performance directly determines the efficiency and stability of the entire system.

[0003] In the manufacturing process of superconducting coils, solder impregnation is a key technology. It not only enhances the electrical connections between components but also effectively improves the overall mechanical strength and thermal stability. Therefore, there are some solder impregnation devices specifically designed for superconducting coils.

[0004] Superconducting components, such as superconducting cables or superconducting coil current leads, which are made of multiple superconducting strips stacked together, also need to be properly soldered. This not only improves the structural strength but also ensures the continuity and uniformity of the current during transmission, avoiding local overheating or increased resistance due to poor contact.

[0005] However, due to the requirements of the application environment, superconducting components such as current leads often need to be designed with multi-directional bending structures. This makes it difficult for existing soldering devices for superconducting coils to effectively and uniformly solder superconducting components such as current leads with multi-directional bending structures. This not only affects the performance of these superconducting components, but also increases the manufacturing difficulty.

[0006] Therefore, how to effectively solder superconducting components with multi-directional bending structures has become an urgent technical problem to be solved. Utility Model Content

[0007] In view of this, this application provides a soldering fixture for superconducting components to solve the technical problem of how to effectively solder superconducting components with multi-directional bending structures.

[0008] This application provides a soldering fixture for a superconducting assembly, wherein the superconducting assembly is a multi-directional curved assembly formed by stacking multiple superconducting strips. The soldering fixture includes: a superconducting strip support member adapted to the shape of the superconducting assembly, having a receiving groove for accommodating the superconducting strip, and a solder inlet and a solder outlet communicating with the receiving groove; a first isolation layer disposed outside the superconducting strip support member and covering the opening of the receiving groove; and a sealing layer disposed outside the first isolation layer to seal the receiving groove and form a sealed receiving cavity. During soldering, liquid solder can enter through the solder inlet, flow through the sealed receiving cavity, and then flow out through the solder outlet.

[0009] In one embodiment, the first insulating layer comprises a Teflon layer or a polyimide layer.

[0010] In one embodiment, the sealing layer comprises at least one epoxy resin wet-wound layer.

[0011] In one embodiment, the epoxy resin wet wrapping layer includes a glass fiber cloth coated with epoxy resin that is cured on the outside of the first insulating layer.

[0012] In one embodiment, the first insulating layer comprises a Teflon layer or a polyimide layer, and the sealing layer comprises three to five layers of the epoxy resin wet-wound layer.

[0013] In one embodiment, a second insulating layer is applied to the inner wall of the receiving groove.

[0014] In one embodiment, the receiving groove is formed between the two ends of the superconducting strip support; the solder inlet and the solder outlet are located at the two ends of the superconducting strip support.

[0015] In one embodiment, the solder immersion fixture for a superconducting component further includes: a solder receiving device having a solder filling port and an air inlet port, wherein the solder filling port is connected to the solder inlet and / or the solder outlet; an air passage assembly connected to the air inlet port to apply positive pressure to the solder receiving device; and a heating device for housing the solder receiving device and the superconducting strip support.

[0016] In one embodiment, the solder receiving device includes: a first solder can, including a first gas port and a first solder filling port, the first gas port being connected to the gas circuit assembly, the first solder filling port being connected to the solder inlet, and an openable and closable exhaust channel between the first gas port and the gas circuit assembly; and a second solder can, including a second gas port and a second solder filling port, the second gas port being connected to the gas circuit assembly, the second solder filling port being connected to the solder outlet, and an openable and closable exhaust channel between the second gas port and the gas circuit assembly.

[0017] In one embodiment, the gas path assembly includes: a first valve body, a second valve body, a third valve body, a fourth valve body, and a fifth valve body, wherein a first end of the first valve body is connected to a positive pressure gas source, a second end of the first valve body is connected to the first ends of the third valve body and the fourth valve body respectively, and a second end of the third valve body is connected to the first gas path port of the first solder can; a second end of the fourth valve body is connected to the first ends of the second valve body and the fifth valve body respectively, a second end of the second valve body is connected to the second gas path port of the second solder can, and a second end of the fifth valve body is connected to a vacuum pump.

[0018] This application has at least the following technical effects:

[0019] The superconducting tape support can be a superconducting tape stacking fixture, designed and manufactured according to the design shape of the superconducting component. This fixture has stacking slots (receiving slots for the superconducting tape support). The stacking fixture is modified by adding solder inlets and outlets communicating with the stacking slots to form the superconducting tape support. For example, the stacking fixture can be a multi-directionally curved cylindrical or square column. The receiving slots can be formed on the side of the column of the stacking fixture, and the solder inlets and outlets can be located at both ends of the stacking fixture to form the superconducting tape support. Multiple superconducting tapes are stacked and embedded in the receiving slots of the superconducting tape support according to a set number of stacking layers and a set stacking method. A first isolation layer is sealed at the opening of the receiving slot, and a sealing layer is set outside the first isolation layer. The first isolation layer isolates the sealing layer from the surface of the superconducting tape support, preventing the sealing layer from bonding to the surface of the superconducting tape support during sealing. The sealing layer also seals the receiving slot, forming a sealed receiving cavity. During solder impregnation, the solder is heated to a liquid state. The liquid solder enters the sealed receiving cavity through the solder inlet, fills the gaps between the stacked superconducting strips, and then flows out through the solder outlet. After the solder cools, the first isolation layer and the sealing layer are peeled off, completing the solder impregnation of the superconducting component composed of multiple superconducting strips. In this application, the stacking fixture of the superconducting strips is modified to serve as a solder impregnation mold. The receiving groove of the superconducting strips on the stacking fixture is sealed by the first isolation layer and the sealing layer to provide a sealed space for solder impregnation of the superconducting strips. This enables solder impregnation of superconducting components with complex shapes. It can achieve good impregnation results for non-standard circular superconducting components, especially for superconducting cables or current leads of superconducting magnets with complex multi-directional bending structures. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the specific embodiments of this application or the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the solder immersion fixture for a superconducting component according to an embodiment of this application;

[0022] Figure 2 This is a schematic diagram of another solder immersion fixture for a superconducting component according to an embodiment of this application.

[0023] Figure label:

[0024] 10. Superconducting strip support; 11. Receiving tank; 12. Solder inlet; 13. Solder outlet; 14. First isolation layer; 15. Sealing layer; 100. Solder receiving device; 110. First solder can; 111. First gas port; 112. First solder filling port; 120. Second solder can; 121. Second gas port; 122. Second solder filling port; 200. Heating device; 300. Gas circuit assembly; 310. First valve body; 320. Second valve body; 330. Third valve body; 340. Fourth valve body; 350. Fifth valve body. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0026] According to an embodiment of this application, a soldering fixture for a superconducting component is provided. The superconducting component is a multi-directionally bent component formed by stacking multiple superconducting strips. The superconducting component can be a superconducting cable or a current lead of a superconducting magnet. In this embodiment, the soldering fixture includes:

[0027] A superconducting tape support 10 is adapted to the shape of the superconducting assembly and has a receiving groove 11 for accommodating the superconducting tape, as well as a solder inlet 12 and a solder outlet 13 communicating with the receiving groove 11; a first isolation layer 14 is disposed on the outside of the superconducting tape support 10 and covers the opening of the receiving groove 11; a sealing layer 15 is disposed on the outside of the first isolation layer 14 and seals the receiving groove 11 to form a sealed receiving cavity. During solder immersion, liquid solder can enter through the solder inlet 12, flow through the sealed receiving cavity, and then flow out through the solder outlet 13 to fill the sealed receiving cavity with solder.

[0028] The superconducting component is a multi-directionally curved component, such as a superconducting cable with a complex curved structure or a current lead of a superconducting magnet. When impregnating a superconducting component with a complex curved structure, it is difficult to achieve uniform and effective solder impregnation using existing superconducting impregnation equipment. Therefore, in this embodiment, the superconducting strip support 10 can be a superconducting strip stacking fixture. This stacking fixture is designed and manufactured according to the design shape of the superconducting component. The stacking fixture has stacking grooves for the superconducting strip (accommodating grooves 11 of the superconducting strip support 10). The stacking fixture is modified by creating solder inlets 12 and solder outlets 13 that communicate with the stacking grooves, thus forming the superconducting strip support 10. For example, the stacking fixture can be a multi-directionally curved cylindrical or square column. The receiving groove 11 can be formed on the side of the column of the stacking fixture, and the solder inlet 12 and solder outlet 13 can be located at both ends of the stacking fixture to form the superconducting strip support 10.

[0029] Multiple superconducting tapes are stacked and embedded in the receiving groove 11 of the superconducting tape support 10 according to a set number of stacking layers and a set stacking method. A first isolation layer 14 is sealed at the opening of the receiving groove 11. A sealing layer 15 is provided outside the first isolation layer 14. The sealing layer 15 is isolated from the surface of the superconducting tape support 10 by the first isolation layer 14 to prevent the sealing layer 15 from combining with the surface of the superconducting tape support 10 when sealing. The receiving groove 11 is sealed by the sealing layer 15 to form a sealed receiving cavity.

[0030] During the solder impregnation process, the solder is heated to liquid state. The liquid solder enters the sealed receiving cavity through solder inlet 12, fills the gaps between the stacked superconducting strips, and then flows out through solder outlet 13. After the solder cools, the first isolation layer 14 and the sealing layer 15 are peeled off, completing the solder impregnation of the superconducting component composed of multiple superconducting strips. In this application, the stacking fixture of the superconducting strips is modified to serve as a solder impregnation mold. The receiving groove 11 of the superconducting strips on the stacking fixture is sealed by the first isolation layer 14 and the sealing layer 15 to provide a sealed space for solder impregnation of the superconducting strips. This enables the solder impregnation of complex-shaped superconducting components. For non-standard circular superconducting components, especially for superconducting cables or current leads of superconducting magnets with complex multi-directional bending structures, a good impregnation effect can be achieved.

[0031] In one embodiment, the first insulating layer 14 can be made of Teflon tape or polyimide tape. In this embodiment, polyimide tape is used as an example. After the superconducting tape is stacked and placed in the receiving groove 11, polyimide tape is wound around the outside of the superconducting tape support 10. Adjacent turns of polyimide tape have overlapping portions to enhance the insulating effect of the first insulating layer 14, until one layer of polyimide tape is wound to form the first insulating layer 14.

[0032] At least one epoxy resin wet-wound layer is provided on the outside of the first isolation layer 14. This epoxy resin wet-wound layer can be formed by wet-winding glass fiber cloth and epoxy resin. Specifically, an epoxy resin layer is applied to the outside of the polyimide layer, and then a glass fiber cloth layer is wound around it to form an epoxy resin wet-wound layer. Depending on the different structures of different superconducting components and the different sealing requirements, different numbers of epoxy resin wet-wound layers can be selected. Generally, 3-5 layers of epoxy resin wet-wound layer can be wound. For different types of epoxy resin, after curing under the corresponding curing conditions, a sealing layer 15 is formed, which completes the sealing of the receiving groove on the superconducting tape support.

[0033] In one embodiment, if it is necessary to demold the superconducting component in the superconducting support 10 after impregnation, a second isolation layer can be applied to the inner side of the receiving groove 11. The second isolation layer can also be made of materials with low bonding rate with solder, such as polyimide or Teflon, to facilitate demolding after solder impregnation.

[0034] In one embodiment, such as Figure 2 As shown, during solder impregnation, a solder container 100 can be used to hold the solder. A heating device 200 heats the solder in the solder container 100 into liquid solder. The liquid solder fills the sealed cavity through the solder inlet 12 to impregnate the superconducting component. A solder outlet 13 is provided on the superconducting strip support 10 to ensure that the superconducting component is fully impregnated with solder after the liquid solder enters the sealed cavity through the solder inlet 12 and fills the cavity.

[0035] In one embodiment, the solder receiving device 100 may have a solder filling port that is connected to the solder inlet 12 in the superconducting strip support 10. After the solder in the solder receiving device 100 is heated to liquid solder, the liquid solder flows from the solder filling port and the solder inlet 12 into the sealed receiving cavity to impregnate the superconducting component.

[0036] In one embodiment, the solder receiving device 100 also has an air inlet port that is connected to the gas path assembly 300. When the heating device 200 heats the solder into liquid solder, the gas path assembly 300 provides gas pressure to press the liquid solder from the solder receiving device 100 into the sealed receiving cavity in the superconducting strip support 10 to immerse the superconducting component in solder.

[0037] In one embodiment, the solder receiving device 100 may include a first solder can 110 and a second solder can 120. The first solder can 110 includes a first air passage port 111 and a first solder filling port 112. The first air passage port 111 is connected to the air passage assembly 300, and the first solder filling port 112 is connected to the solder inlet 12. An openable and closable exhaust channel is provided between the first air passage port 111 and the air passage assembly 300. The second solder can 120 includes a second air passage port 121 and a second solder filling port 122. The second air passage port 121 is connected to the air passage assembly 300, and the second solder filling port 122 is connected to the solder outlet 13. An openable and closable exhaust channel is provided between the second air passage port 121 and the air passage assembly 300.

[0038] The heating device 110 heats the solder in the first solder can 110 and the second solder can 120 into liquid solder. Under the gas pressure provided by the gas path assembly 300, the liquid solder flows out from one of the first solder can 110 and the second solder can 120, flows through the sealed receiving cavity to impregnate the superconducting component, and then flows into the other solder can 110 and the second solder can 120.

[0039] During the impregnation of the coil, the air circuit assembly 300 can be closed and opened at different times to ensure that the solder can flow fully between the first solder pot 110, the sealed receiving cavity and the second solder pot 120.

[0040] The gas path assembly 300 may include a first valve body 310, a second valve body 320, a third valve body 330, a fourth valve body 340, and a fifth valve body 350. The first end of the first valve body 310 is connected to a positive pressure gas source, and the second end of the first valve body 310 is connected to the first ends of the third valve body 330 and the fourth valve body 340, respectively. The second end of the third valve body 330 is connected to the first gas path port 111 of the first solder can 110. The second end of the fourth valve body 340 is connected to the first ends of the second valve body 320 and the fifth valve body 350, respectively. The second end of the second valve body 320 is connected to the second gas path port 121 of the second solder can 120, and the second end of the fifth valve body 350 is connected to a vacuum pump.

[0041] During solder impregnation, the solder inlet 12 of the superconducting strip support 10 is connected to the first solder filling port 112 of the first solder can 110, and the solder outlet 13 of the superconducting strip support 10 is connected to the second solder filling port 122 of the second solder can 120. The solder is located inside the first solder can 110, and the second solder can 120 is hollow. The first valve body 310, the third valve body 330 and the fourth valve body 340 are closed, and the second valve body 320 and the fifth valve body 350 are opened. The vacuum pump is started to perform vacuuming. After vacuuming is completed, the second valve body 320 and the fifth valve body 350 are closed, and the heating device 200 is started for heating. After the solder is heated to liquid solder, the first valve body 310 and the third valve body 330 are opened. The positive pressure gas source applies positive pressure to the first solder can 110 through the first valve body 310 and the third valve body 330. The liquid solder in the first solder can 110 flows into the sealed cavity under gravity and positive pressure. After the sealed cavity is filled with solder, the liquid solder flows into the second solder can 120. The second solder can 120 has a one-way gas outlet between it and the second valve body 320. During vacuuming, the one-way gas outlet is closed under atmospheric pressure. When filling the sealed cavity with solder, the one-way gas outlet is opened to exhaust gas under the action of gas pressure in the pipeline, which can ensure that the liquid solder smoothly fills the sealed cavity and enters the second solder can 120.

[0042] After the heating device 200 is turned off and positive pressure is maintained for a period of time, the liquid solder cools down, completing the impregnation process. The above is only a preferred embodiment of this application. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of this application, and these improvements and modifications should also be considered within the scope of protection of this application.

[0043] In the above embodiments of this application, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0044] The above are merely preferred embodiments of this application. It should be noted that those skilled in the art can make several improvements and modifications without departing from the principles of this application, and these improvements and modifications should also be considered within the scope of protection of this application.

Claims

1. A solder dip tooling for a superconducting assembly, characterized by, The superconducting component is a multi-directional bending component formed by stacking multiple superconducting strips, and the solder immersion fixture includes: A superconducting tape support is adapted to the shape of the superconducting assembly, and has a receiving groove for accommodating the superconducting tape, as well as a solder inlet and a solder outlet communicating with the receiving groove; A first isolation layer is disposed on the outside of the superconducting strip support and covers the opening of the receiving groove; A sealing layer is disposed outside the first isolation layer to seal the receiving groove and form a sealed receiving cavity; During solder immersion, liquid solder can enter through the solder inlet, flow through the sealed cavity, and then flow out through the solder outlet.

2. The solder dip tooling for a superconducting assembly of claim 1, wherein, The first isolation layer includes a Teflon layer or a polyimide layer.

3. The solder dip tooling for a superconducting assembly of claim 2, wherein, The sealing layer includes at least one epoxy resin wet-wound layer.

4. The solder dipping fixture for superconducting components as described in claim 3, characterized in that, The epoxy resin wet wrapping layer includes a glass fiber cloth coated with epoxy resin that is cured on the outside of the first isolation layer.

5. The solder dip tooling for a superconducting assembly of claim 3 or 4, wherein, The first isolation layer comprises a Teflon layer or a polyimide layer, and the sealing layer comprises three to five layers of the epoxy resin wet-wound layer.

6. The solder dip tooling for superconducting assemblies of claim 1, wherein, The inner wall of the receiving tank is covered with a second isolation layer.

7. The solder dip tooling for superconducting assemblies of claim 1, wherein, The receiving groove is formed between the two ends of the superconducting strip support; the solder inlet and the solder outlet are located at the two ends of the superconducting strip support.

8. The solder dip tooling for superconducting assemblies of claim 1, wherein, Also includes: A solder receiving device has a solder filling port and an air inlet port, wherein the solder filling port is connected to the solder inlet and / or the solder outlet; The air passage assembly is connected to the air inlet port and applies positive pressure to the solder receiving device; A heating device that houses the solder receiving device and the superconducting strip support.

9. The solder dip tooling for a superconducting assembly of claim 8, wherein, The solder receiving device includes: The first solder can includes a first gas passage port and a first solder filling port. The first gas passage port is connected to the gas passage assembly, and the first solder filling port is connected to the solder inlet. An openable and closable exhaust channel is provided between the first gas passage port and the gas passage assembly. The second solder can includes a second gas passage port and a second solder filling port. The second gas passage port is connected to the gas passage assembly, and the second solder filling port is connected to the solder outlet. An openable and closable exhaust channel is provided between the second gas passage port and the gas passage assembly.

10. The solder dip tooling for a superconducting assembly of claim 9, wherein, The pneumatic circuit assembly includes: a first valve body, a second valve body, a third valve body, a fourth valve body, and a fifth valve body, wherein, The first end of the first valve body is connected to a positive pressure gas source, the second end of the first valve body is connected to the first end of the third valve body and the first end of the fourth valve body, the second end of the third valve body is connected to the first gas port of the first solder can; the second end of the fourth valve body is connected to the first end of the second valve body and the first end of the fifth valve body, the second end of the second valve body is connected to the second gas port of the second solder can, and the second end of the fifth valve body is connected to a vacuum pump.

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