HDI plate structure

Abstract

The utility model discloses an HDI plate structure, and relates to the technical field of HDI plate production and design. The device comprises a plate body, the plate body is formed by splicing and combining a plurality of sets of supporting plates, a stepped transmission unit electrically connected between the supporting plates is arranged in the plate body, blind holes in the stepped transmission unit are formed in the supporting plates and distributed in a stepped mode, and the hole diameters of the blind holes are gradually reduced from top to bottom; the opening depth of the blind hole is gradually increased from top to bottom; the copper layer is arranged in the blind hole, the thickness of the copper layer is gradually increased from top to bottom, and the copper layer is connected with the blind hole; and the transmission line is arranged in the blind hole. According to the device, different apertures and depths are adopted among different layers, stepped transition is formed, reflection of signals at the blind holes is effectively reduced, impedance matching is optimized, loss and reflection in signal transmission are further reduced by conducting gradient design on the thickness of the copper layer, a fillet structure is adopted at the stepped transition position, the parasitic effect is reduced, and the performance of the device is improved. And requirements of users are met.

Description

Technical Field

[0001] This utility model relates to the field of HDI board production and design technology, specifically to an HDI board structure. Background Technology

[0002] HDI boards, or high-density interconnect boards, are an advanced PCB technology. HDI boards are typically composed of multiple independent circuit layers stacked together and interconnected through electrical connections to form a multi-layered printed circuit board.

[0003] In the design of HDI boards for high-frequency signal transmission, traditional blind via structures suffer from signal reflection and impedance mismatch problems. This is especially true in multilayer boards, where the depth and diameter design of blind vias have a significant impact on signal integrity and present limitations.

[0004] The reason for this problem is that blind vias are a vertical interconnect technology that connects circuits of different layers. Due to the physical characteristics of the blind via structure, signals are easily reflected when passing through the blind via, especially in multilayer boards. When the signal passes through the blind via, it will be reflected due to the impedance change, resulting in loss. Moreover, the existing blind vias adopt a through-hole design, which introduces parasitic capacitance and inductance inside. These parasitic effects will aggravate signal reflection in high-frequency signal transmission, which has limitations. Therefore, we propose an HDI board structure to solve the above problems. Utility Model Content

[0005] To address the shortcomings of existing technologies, this utility model provides an HDI board structure that solves the problems of signal reflection and impedance mismatch in the design of HDI boards for high-frequency signal transmission, especially in multilayer boards where the depth and diameter design of blind vias have a significant impact on signal integrity and present limitations.

[0006] To achieve the above objectives, this utility model is implemented through the following technical solution: an HDI board structure, including a board body, the board body being assembled from multiple sets of support plates, and a stepped transmission unit electrically connected between the support plates being provided inside the board body, the stepped transmission unit including blind vias, copper layers and transmission lines;

[0007] The blind holes are formed inside the support plate. The blind holes are distributed in a stepped manner, with the diameter of the blind holes gradually decreasing from top to bottom and the opening depth gradually increasing from top to bottom. The copper layer is disposed inside the blind holes, and the thickness of the copper layer gradually increases from top to bottom. The copper layer is connected to the blind holes. The transmission line is disposed inside the blind holes and is used for electrical connection between adjacent sets of support plates.

[0008] Preferably, the plate is divided into a single layer, a double layer, a triple layer, and a quadruple layer, and the plates are tightly fitted together.

[0009] Preferably, the transmission line includes a first transmission line and a second transmission line;

[0010] One end of the first transmission line is electrically connected to a first layer board, and the other end of the first transmission line is electrically connected to a second layer board; one end of the second transmission line is electrically connected to a second layer board, and the other end of the second transmission line is electrically connected to a third layer board.

[0011] Preferably, the transmission line further includes a third transmission line;

[0012] One end of the third transmission line is electrically connected to the three-layer board, and the other end of the third transmission line is electrically connected to the four-layer board.

[0013] Preferably, the four-layer plate has through holes inside, and the third transmission line is disposed inside the through holes.

[0014] Preferably, the plate body is provided with structural components, the structural components including protrusions and elastic rings;

[0015] The protrusions are disposed on the plate and arranged in a rectangular array; the elastic ring is disposed inside the plate and the end of the elastic ring is fixedly assembled with the protrusions.

[0016] Preferably, the structural component further includes a shaped block and a heat sink;

[0017] The irregularly shaped blocks are placed at the four corners of the board to protect the edges and corners of the board; the heat sink is placed at the bottom of the board to transfer heat from the board and achieve rapid cooling of the board.

[0018] This utility model discloses an HDI board structure, which has the following beneficial effects: the device uses different apertures and depths between different layers to form a stepped transition, effectively reducing signal reflection at blind vias and optimizing impedance matching. By also designing the thickness of the copper layer in a gradient manner, the loss and reflection in signal transmission are further reduced. Furthermore, the use of rounded corners at the stepped transition reduces parasitic effects and meets user needs. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0021] Figure 2 This is a schematic diagram of the exploded structure of the plate body of this utility model;

[0022] Figure 3 This is a schematic diagram of the stepped transmission unit structure of this utility model;

[0023] Figure 4 This is a schematic diagram of the structural component of this utility model.

[0024] In the diagram: 1. Board body; 11. First layer board; 12. Second layer board; 13. Third layer board; 14. Fourth layer board; 2. Stepped transmission unit; 21. Blind via; 22. Copper layer; 23. Transmission line; 231. First transmission line; 232. Second transmission line; 233. Third transmission line; 24. Through hole; 3. Structural component; 31. Bump; 32. Elastic ring; 33. Irregular block; 34. Heat sink. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions in the embodiments of this utility model are described clearly and completely. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0026] This application provides an HDI board structure that solves the problems of signal reflection and impedance mismatch in the traditional blind via structure in the design of HDI boards for high-frequency signal transmission. In particular, in multilayer boards, the depth and diameter design of blind vias have a significant impact on signal integrity and have limitations.

[0027] To better understand the above technical solutions, the following will provide a detailed explanation of the technical solutions in conjunction with the accompanying drawings and specific implementation methods.

[0028] Example 1

[0029] This utility model discloses an HDI board structure. According to the appendix... Figure 1-3 As shown, it includes a board body 1, which is composed of multiple sets of support plates spliced ​​together. Inside the board body 1, there is a stepped transmission unit 2 that is electrically connected between the support plates. The stepped transmission unit 2 includes a blind hole 21, a copper layer 22 and a transmission line 23.

[0030] Blind holes 21 are formed inside the support plate. The blind holes 21 are distributed in a stepped manner, with the diameter of the blind holes 21 gradually decreasing from top to bottom and the opening depth of the blind holes 21 gradually increasing from top to bottom. A copper layer 22 is disposed inside the blind holes 21, and the thickness of the copper layer 22 gradually increases from top to bottom. The copper layer 22 and the blind holes 21 are connected. A transmission line 23 is disposed inside the blind holes 21 and is used for electrical connection between two adjacent sets of support plates.

[0031] The board 1 is divided into a first layer board 11, a second layer board 12, a third layer board 13, and a fourth layer board 14, and the boards are tightly fitted together. The transmission line 23 includes a first transmission line 231 and a second transmission line 232. One end of the first transmission line 231 is electrically connected to the first layer board 11, and the other end of the first transmission line 231 is electrically connected to the second layer board 12. One end of the second transmission line 232 is electrically connected to the second layer board 12, and the other end of the second transmission line 232 is electrically connected to the third layer board 13. The transmission line 23 also includes a third transmission line 233. One end of the third transmission line 233 is electrically connected to the third layer board 13, and the other end of the third transmission line 233 is electrically connected to the fourth layer board 14. The fourth layer board 14 has a through hole 24, and the third transmission line 233 is disposed inside the through hole 24.

[0032] In this embodiment, the device sequentially opens blind vias 21 at the bottom of the first layer 11, the second layer 12, and the third layer 13. The diameter of the blind vias 21 gradually decreases from top to bottom, and the depth of the blind vias 21 gradually increases from top to bottom, forming a stepped transition of the blind vias 21. The copper layer 22 disposed inside the blind vias 21 has a thickness that gradually increases from top to bottom, achieving a smooth transition of impedance and significantly reducing signal reflection. Moreover, the stepped transition adopts a rounded corner structure to reduce parasitic effects. The transmission line 23 disposed inside the blind vias 21 is used for electrical connection between layers. The through-hole 24 expands the flexibility of the signal transmission path to meet user needs.

[0033] Example 2

[0034] This utility model discloses an HDI board structure. More specifically, based on Embodiment 1, it is provided according to the appendix... Figure 1 , 4 As shown, it includes a board body 1, which is composed of multiple sets of support plates spliced ​​together. Inside the board body 1, there is a stepped transmission unit 2 that is electrically connected between the support plates. The stepped transmission unit 2 includes a blind hole 21, a copper layer 22 and a transmission line 23.

[0035] Blind vias 21 are formed inside the support plate. The blind vias 21 are distributed in a stepped manner, with the diameter of the blind vias 21 gradually decreasing from top to bottom and the opening depth of the blind vias 21 gradually increasing from top to bottom. A copper layer 22 is set inside the blind vias 21, and the thickness of the copper layer 22 gradually increases from top to bottom. The copper layer 22 and the blind vias 21 are connected. A transmission line 23 is set inside the blind vias 21 and is used for electrical connection between two adjacent sets of support plates.

[0036] The plate 1 is provided with a structural component 3, which includes a protrusion 31 and an elastic ring 32. The protrusion 31 is provided on the plate 1 and is arranged in a rectangular array. The elastic ring 32 is provided inside the plate 1, and the end of the elastic ring 32 is fixedly assembled with the protrusion 31. The structural component 3 also includes a shaped block 33 and a heat sink 34. The shaped block 33 is provided at the four corners of the plate 1 and is used to protect the corners of the plate 1. The heat sink 34 is provided at the bottom of the plate 1 and is used to transfer the heat of the plate 1 to achieve rapid cooling of the plate 1.

[0037] In this embodiment, a fixing hole is provided inside the plate 1, and an elastic ring 32 is engaged inside the fixing hole to prevent the plate 1 from being damaged when the bolts are used to fix the plate 1. The irregularly shaped block 33 is sleeved on the four corners of the plate 1 and fixed together with the plate 1 to protect the four corners of the plate 1 from wear or bending. The heat sink 34 at the bottom of the plate 1 is used to transfer the heat of the plate 1 and achieve rapid cooling of the plate 1 to meet the needs of the user.

[0038] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. An HDI board structure comprising a board body (1) which is combined by a plurality of groups of support plates, characterized in that, The plate (1) is provided with a stepped transmission unit (2) electrically connected between the support plates, the stepped transmission unit (2) includes; Blind holes (21) are formed inside the support plate. The blind holes (21) are distributed in a stepped manner. The diameter of the blind holes (21) gradually decreases from top to bottom, and the opening depth of the blind holes (21) gradually increases from top to bottom. A copper layer (22) is disposed inside a blind hole (21), the thickness of which gradually increases from top to bottom, and the copper layer (22) and the blind hole (21). A transmission line (23) is disposed inside a blind hole (21) for electrically connecting two adjacent sets of support plates.

2. The HDI board structure of claim 1, wherein: The board (1) is divided into a first layer (11), a second layer (12), a third layer (13) and a fourth layer (14), and the boards are tightly fitted together.

3. The HDI board structure of claim 2, wherein: The transmission line (23) includes; The first transmission line (231) has one end electrically connected to the first layer plate (11) and the other end electrically connected to the second layer plate (12); The second transmission line (232) is electrically connected at one end to the second layer board (12) and at the other end to the third layer board (13).

4. The HDI board structure of claim 3, wherein: The transmission line (23) also includes; The third transmission line (233) is electrically connected at one end to the three-layer board (13) and at the other end to the four-layer board (14).

5. The HDI board structure of claim 4, wherein: The four-layer plate (14) has a through hole (24) inside, and the third transmission line (233) is disposed inside the through hole (24).

6. The HDI board structure of claim 1, wherein: The plate (1) is provided with a structural component (3), the structural component (3) including: The protrusions (31) are arranged on the plate (1) in a rectangular array; An elastic ring (32) is disposed inside the plate (1), and the end of the elastic ring (32) is fixedly assembled with a protrusion (31).

7. The HDI board structure of claim 6, wherein: The structural component (3) also includes; The irregularly shaped blocks (33) are set at the four corners of the plate (1) and are used to protect the corners of the plate (1); A heat sink (34) is provided at the bottom of the plate (1). The heat sink (34) is used to transfer the heat of the plate (1) and achieve rapid cooling of the plate (1).

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