Sintering welding jig for power module

Abstract

The utility model discloses a sintering welding jig for a power module. The sintering welding jig comprises a tray, a bottom plate and a positioning frame. The tray comprises a carrying disc, and supporting blocks protruding upwards are arranged on the carrying disc. The bottom plate is used for placing a copper substrate, and the bottom plate is detachably connected with the carrying disc; the positioning frame is used for placing a plastic package body and is detachably connected with the supporting block. The copper substrate is placed on the bottom plate, the plastic package body is placed on the positioning frame, the positioning frame is detachably connected with the supporting block, the bottom plate is detachably connected with the carrying disc, and the supporting block is arranged on the carrying disc and protrudes upwards, so that a certain distance is formed between the positioning frame and the bottom plate, the copper substrate and the plastic package body can be separated, and reducing gas can fully enter the plastic package body. Sintering cavities can be avoided, and finally the service life of the power module can be prolonged. According to the utility model, heat and pressure cannot be transmitted to the sintering medium when the copper substrate is preheated, so that the sintering yield can be effectively improved.

Description

Technical Field

[0001] This utility model relates to manufacturing fixtures for power modules, and in particular to a sintering and welding fixture for power modules. Background Technology

[0002] In existing technologies, sintering power modules involves first uniformly coating a sintering medium onto a copper ceramic substrate at the bottom of the molding compound, and then bonding the molding compound and the copper substrate together under high temperature and pressure. Because the copper ceramic substrate and sintering medium at the bottom of the molding compound are highly susceptible to oxidation, reducing gases are needed during sintering to remove the oxide layer. However, since the molding compound, sintering medium, and copper substrate are already stacked together, the reducing gas cannot fully penetrate the interior for reduction, leading to sintering voids and reduced reliability of the power module. Furthermore, in existing technologies, the sintering medium is directly bonded to the unpreheated copper substrate, and pressure is applied before the sintering medium is activated, which can also easily lead to sintering abnormalities. Summary of the Invention

[0003] Purpose of the utility model: The purpose of this utility model is to provide a sintering and welding fixture for power modules that can avoid sintering voids and improve sintering yield, thereby solving the problems existing in the prior art.

[0004] Technical solution: The sintering and welding fixture for power modules described in this utility model includes a tray, a base plate, and a positioning frame; the tray includes a carrier plate with an upwardly protruding support block; the base plate is used to place a copper substrate, and the base plate is detachably connected to the carrier plate; the positioning frame is used to place a plastic encapsulation body, and the positioning frame is detachably connected to the support block.

[0005] Furthermore, the carrier plate has a first groove, and the side of the base plate has a first positioning post that matches the first groove. This allows for a detachable connection between the base plate and the carrier plate.

[0006] Furthermore, the positioning frame includes a frame with a fixing block at the bottom of the frame, a slide rail between the frame and the fixing block, and a sliding support strip within the slide rail. This allows for the support and release of the encapsulated body by sliding the support strip.

[0007] Furthermore, the support block is provided with a second groove, and the side of the frame is provided with a second positioning post that matches the second groove. This enables a detachable connection between the positioning frame and the support block.

[0008] Furthermore, the bottom of the frame is provided with a downwardly protruding positioning pin. This enables the copper substrate to be positioned, thereby achieving precise positioning between the molding compound and the copper substrate.

[0009] Furthermore, the frame is provided with third positioning posts at both ends for positioning the support blocks. This enables the positioning frame to be positioned relative to the tray.

[0010] Furthermore, the base plate includes a plate body with honeycomb holes. The honeycomb holes can both avoid the protrusions on the copper substrate and accelerate heat transfer.

[0011] Furthermore, the plate is provided with upwardly protruding guide pins and positioning blocks. This allows for convenient and rapid placement of the copper substrate.

[0012] Furthermore, the carrier disk is provided with a first handle at both ends, and the plate is provided with a second handle at both ends.

[0013] Furthermore, it also includes a pressure strip, which is located above the positioning frame. This can hold the sintered film in place and prevent the sintered welding fixture from falling off during movement.

[0014] Beneficial effects: Compared with the prior art, this utility model has the following beneficial effects:

[0015] 1. This utility model places a copper substrate on a base plate and a plastic encapsulation body on a positioning frame. Since the positioning frame and the support block are detachably connected, and the base plate and the carrier are detachably connected, and the support block is located on the carrier and protrudes upward, a certain distance is placed between the positioning frame and the base plate, thereby separating the copper substrate and the plastic encapsulation body. The reducing gas can fully enter, which can avoid sintering voids and ultimately improve the life of the power module.

[0016] 2. This utility model places the copper substrate on the base plate and the molding compound on the positioning frame, separating the copper substrate from the molding compound. This ensures that the copper substrate will not transfer heat and pressure to the sintering medium during preheating, thereby effectively improving the sintering yield. Attached Figure Description

[0017] Figure 1 This is a structural diagram of the sintering and welding fixture in a specific embodiment of this utility model;

[0018] Figure 2 This is a top view of the sintering and welding fixture in a specific embodiment of this utility model;

[0019] Figure 3 for Figure 2 Sectional view along axis AA;

[0020] Figure 4 This is a structural diagram of the tray in a specific embodiment of the present utility model;

[0021] Figure 5 This is a structural diagram of the base plate in a specific embodiment of the present utility model;

[0022] Figure 6 This is a structural diagram of the positioning frame in a specific embodiment of the present utility model;

[0023] Figure 7This is a schematic diagram of the sliding process of the support bar in a specific embodiment of this utility model;

[0024] Figure 8 This is a structural diagram of the pressure strip in a specific embodiment of this utility model. Detailed Implementation

[0025] This specific embodiment discloses a sintering and welding fixture for power modules, such as... Figure 1-3 As shown, it includes a tray 1, a base plate 2, a positioning frame 3, and a pressure strip 4.

[0026] like Figure 4 As shown, the tray 1 includes a carrier tray 11, on which a first groove 111 is provided. The carrier tray 11 has an upwardly protruding support block 12, on which a second groove 121 is provided. The shape of the second groove 121 can be V-shaped or other shapes. First handles 13 are provided at both ends of the carrier tray 11.

[0027] like Figure 3 and Figure 5 As shown, the base plate 2 is used to place the copper substrate 7, and includes a plate body 21. The plate body 21 has second handles 24 at both ends and honeycomb holes 211. The plate body 21 also has upwardly protruding guide pins 22 and positioning blocks 23. The side of the base plate 2 has first positioning posts 25 that fit into the first groove 111, enabling a detachable connection between the base plate 2 and the carrier plate 11.

[0028] like Figure 3 and Figure 6 As shown, the positioning frame 3 is used to place the plastic sealant 6, including a frame 31, a fixing block 33 at the bottom of the frame 31, a slide rail between the frame 31 and the fixing block 33, and a sliding support strip 32 inside the slide rail. Figure 7 As shown, the support bar 32 can slide within the slide rail. When it slides below the plastic sealant 6, it can support the plastic sealant 6. When it slides into the gap of the plastic sealant 6, it can release the plastic sealant 6. The side of the frame 31 is provided with a second positioning post 311 that matches the second groove 121, which enables a detachable connection between the positioning frame 3 and the support block 12. The two ends of the frame 31 are provided with third positioning posts 35 for positioning the support block 12, and the bottom of the frame 31 is provided with a downwardly protruding positioning pin 34.

[0029] like Figure 1 and Figure 8 As shown, the pressure strip 4 is located above the positioning frame 3 and includes a body 41. The body 41 is provided with a positioning part 42 and a magnet 43. The positioning part 42 is used to position the positioning frame 3, and the magnet 43 is used to increase the pressure.

[0030] By engaging the first positioning post 25 of the base plate 2 with the first groove 111 of the tray 1, and by engaging the second positioning post 311 of the positioning frame 3 with the second groove 121 of the tray 1, coarse positioning of the copper substrate 7 placed on the base plate 2 and the encapsulated body 6 placed in the positioning frame 3 can be achieved. Fine positioning of the encapsulated body 6 and the copper substrate 7 can be achieved by using the positioning pin 34 at the bottom of the frame 31.

[0031] The working process of the sintering and welding fixture in this specific embodiment is as follows:

[0032] First, place the copper substrate 7 on the base plate 2, then place the base plate 2 into the tray 1, and then place the positioning frame 3 into the tray 1. Adjust the position of the support strip 32, and then place three molding compounds 6 into the positioning frame 3 in sequence. At this time, the bottom of the molding compounds 6 is supported by the support strip 32, so that the molding compounds 6 will not fall onto the copper substrate 7. Next, cover the surface of the molding compounds 6 with the sintering film 5, and finally press the sintering film 5 with the pressure strip 4 and send it into the sintering machine for sintering. During the cooling process after sintering, the molding compounds 6 and the copper substrate 7 have now combined into a single product. Push the support strip 32 aside, and the entire product will fall onto the base plate 2. After cooling, first remove the positioning frame 3 along with the pressure strip 4 and the sintering film 5, then remove the base plate 2, and finally remove the sintered product from the base plate 2.

[0033] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present utility model should be included within the protection scope of the present utility model.

Claims

1. A sintering and welding fixture for power modules, characterized in that: It includes a tray (1), a base plate (2) and a positioning frame (3); the tray (1) includes a carrier plate (11) with an upwardly protruding support block (12) on the carrier plate (11); the base plate (2) is used to place a copper substrate (7) and is detachably connected to the carrier plate (11); the positioning frame (3) is used to place a plastic sealant (6) and is detachably connected to the support block (12).

2. The sintering fixture for power modules according to claim 1, characterized in that: The carrier plate (11) is provided with a first groove (111), and the side of the bottom plate (2) is provided with a first positioning post (25) that is adapted to the first groove (111).

3. The sintering fixture for power modules of claim 1, wherein: The positioning frame (3) includes a frame (31), a fixing block (33) at the bottom of the frame (31), a slide between the frame (31) and the fixing block (33), and a sliding support bar (32) in the slide.

4. The sintering fixture for power modules according to claim 3, characterized in that: The support block (12) is provided with a second groove (121), and the side of the frame (31) is provided with a second positioning post (311) that is adapted to the second groove (121).

5. The sintering fixture for power modules of claim 3, wherein: The bottom of the frame (31) is provided with a downward protruding positioning pin (34).

6. The sintering fixture for power modules of claim 3, wherein: The frame (31) has third positioning posts (35) at both ends for positioning support blocks (12).

7. The sintering fixture for power modules of claim 1, wherein: The base plate (2) includes a plate body (21) with honeycomb holes (211) on the plate body (21).

8. The sintering and welding fixture for a power module according to claim 7, characterized in that: The plate (21) is provided with an upwardly protruding guide pin (22) and a positioning block (23).

9. The sintering fixture for power modules of claim 7, characterized in that: The carrier plate (11) has a first handle (13) at both ends, and the plate (21) has a second handle (24) at both ends.

10. The sintering and welding fixture for a power module according to claim 1, characterized in that: It also includes a pressure strip (4), which is located above the positioning frame (3).

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