Welding device capable of automatically injecting tin

Abstract

The utility model relates to the technical field of soldering tin processing, in particular to a welding device capable of automatically injecting tin. According to the utility model, the element is clamped and positioned on the heating platform through the clamping mechanism, and the element is heated and welded by the heating platform after the tin injection mechanism injects tin into the welded element, so that the positioning effect of the element is effectively ensured, the welding is more convenient and faster, and the operation is easier; and meanwhile, the lifting mechanism can adjust the relative position between the clamping mechanism and the heating platform, so that the clamping mechanism is adjusted to move to a proper position according to the specifications of different elements, the element clamping precision can be guaranteed, and the application range is wide.

Description

Technical Field

[0001] This utility model relates to the field of soldering technology, and specifically to a soldering device capable of automatically applying solder. Background Technology

[0002] In the process of assembling and using electronic components, it is necessary to solder electronic components such as resistors by applying tin. The traditional soldering method is to bring the tip of a heated soldering iron into contact with the tin and move the tin to the resistor connection point that needs to be soldered. This is time-consuming and labor-intensive for large products. Existing soldering equipment can only solder large products of a single specification. It can improve the soldering efficiency, but it cannot automatically apply tin and requires manual application, which is inefficient and has poor practicality. Utility Model Content

[0003] The technical problem to be solved by this utility model is to provide a welding device that can automatically apply solder, which effectively ensures the positioning effect of components, makes welding more convenient and easier to operate, and has a wide range of applications.

[0004] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is as follows:

[0005] A soldering apparatus capable of automatically applying solder includes:

[0006] A support frame, on which a support platform is mounted;

[0007] A clamping mechanism is disposed above the support platform, and the clamping mechanism is used to clamp and position the component;

[0008] A heating platform is provided on the support platform. A processing station is provided on the heating platform. The processing station is arranged opposite to the clamping mechanism. The processing station is used to heat and weld the components on the clamping mechanism.

[0009] A soldering mechanism is provided on the clamping mechanism, and the soldering mechanism is used to perform soldering operations on the welding components;

[0010] A lifting mechanism is mounted on the support frame and is drivenly connected to the clamping mechanism. The lifting mechanism is used to adjust the relative position between the clamping mechanism and the heating platform.

[0011] In one embodiment of the present invention, the clamping mechanism includes a clamping frame and an adjustment component. Two clamping plates are arranged in parallel on the clamping frame, and a clamping gap for clamping elements is provided between the two clamping plates. The adjustment component is disposed on the two clamping plates and is used to adjust the clamping gap between the two clamping plates.

[0012] In one embodiment of this utility model, the adjustment assembly includes an adjustment screw, and adjustment nuts are provided on both clamping plates. The adjustment screw passes through the adjustment nuts on the two clamping plates, and an adjustment knob is provided at one end of the adjustment screw. The adjustment knob drives the adjustment screw to rotate, causing the two clamping plates to move closer or further apart.

[0013] In one embodiment of this utility model, the two ends of the adjusting screw have threaded surfaces with opposite directions of rotation, the adjusting nuts on the two clamps have the same direction of rotation, and both ends of the adjusting screw are provided with adjusting knobs.

[0014] In one embodiment of the present invention, the heating platform includes a processing plate, the processing plate having multiple mounting slots inside, heating wires being disposed in the mounting slots, and a heat insulation layer being disposed between the processing plate and the support platform, the multiple mounting slots being evenly disposed on the processing plate.

[0015] In one embodiment of the present invention, the soldering mechanism includes a fixing block, a hopper for loading solder paste is provided on the fixing block, the discharge port of the hopper is connected to a conveying pipe, a control valve is provided on the discharge port, and a telescopic tube is provided at the free end of the conveying pipe.

[0016] In one embodiment of this utility model, a vacuum cover is provided on the opening above the hopper, and a connecting pipe is provided on the hopper. The connecting pipe is connected to a hydraulic pump, and the hydraulic pump is used to pressurize the hopper so that the solder paste in the hopper is extruded quantitatively through the telescopic tube.

[0017] In one embodiment of this utility model, the lifting mechanism includes a lifting rod, a lifting frame is slidably mounted on the lifting rod, the clamping frame is connected to the lifting frame, a fixing bolt is provided on the lifting frame, the lifting frame is connected to the lifting rod by the fixing bolt, and a scale line is provided on the lifting rod.

[0018] In one embodiment of this utility model, the support frame is provided with a slot, the lifting rod is inserted into the slot, the slot is provided with buckles on both sides, the lifting rod is provided with a sliding groove that matches the buckles, and the buckles are engaged in the sliding groove.

[0019] In one embodiment of the present invention, the clamping frame is provided with a guide groove, one of the two clamping plates is fixed to the clamping frame, and the other clamping plate is provided with a guide block that matches the guide groove, and the guide block is slidably disposed in the guide groove.

[0020] The beneficial effects of this utility model are:

[0021] This invention uses a clamping mechanism to clamp and position components on a heating platform. After the soldering mechanism applies solder to the components, the heating platform heats and solders them, effectively ensuring the positioning of the components. This makes soldering more convenient and easier to operate. At the same time, the lifting mechanism can adjust the relative position between the clamping mechanism and the heating platform, allowing the clamping mechanism to move to a suitable position according to the specifications of different components. This ensures the clamping accuracy of the components and has a wide range of applications. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of a soldering device that can automatically apply solder according to this utility model.

[0023] Figure 2 This is a side view of the present invention.

[0024] The following are the labels in the diagram: 1. Support frame; 11. Heating platform; 2. Clamping mechanism; 21. Clamping frame; 22. Clamping plate; 23. Adjusting screw; 24. Adjusting knob; 25. Guide block; 3. Soldering mechanism; 31. Fixing block; 32. Hopper; 33. Conveying pipe; 34. Control valve; 35. Telescopic pipe; 36. Vacuum hood; 37. Connecting pipe; 38. Hydraulic pump; 4. Lifting rod; 41. Fixing bolt; 42. Buckle; 43. Slide groove. Detailed Implementation

[0025] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, so that those skilled in the art can better understand and implement the present invention. However, the embodiments are not intended to limit the present invention.

[0026] Reference Figure 1-2 As shown, a soldering device capable of automatically applying solder includes:

[0027] Support frame 1, on which a support platform is mounted;

[0028] A clamping mechanism 2 is disposed above the support platform, and the clamping mechanism 2 is used to clamp and position the component;

[0029] A heating platform 11 is disposed on the support platform. A processing station is provided on the heating platform 11. The processing station is disposed opposite to the clamping mechanism 2. The processing station is used to heat and weld the components on the clamping mechanism 2.

[0030] Soldering mechanism 3 is disposed on clamping mechanism 2, and soldering mechanism 3 is used to perform soldering operation on welding components;

[0031] A lifting mechanism is provided on the support frame 1. The lifting mechanism is driven to connect with the clamping mechanism 2. The lifting mechanism is used to adjust the relative position between the clamping mechanism 2 and the heating platform 11.

[0032] This invention uses a clamping mechanism 2 to clamp and position components on a heating platform 11. After the soldering mechanism 3 applies solder to the components, the heating platform 11 heats and solders the components, effectively ensuring the positioning effect of the components. This makes soldering more convenient and easier to operate. At the same time, the lifting mechanism can adjust the relative position between the clamping mechanism 2 and the heating platform 11, allowing the clamping mechanism 2 to be moved to a suitable position according to the specifications of different components. This ensures the clamping accuracy of the components and has a wide range of applications.

[0033] In one embodiment of the present invention, the clamping mechanism 2 includes a clamping frame 21 and an adjustment component. Two clamping plates 22 are arranged in parallel on the clamping frame 21, and a clamping gap for clamping the element is provided between the two clamping plates 22. The adjustment component is disposed on the two clamping plates 22 and is used to adjust the clamping gap between the two clamping plates 22.

[0034] In one embodiment of the present invention, the adjustment assembly includes an adjustment screw 23, and adjustment nuts are provided on both clamping plates 22. The adjustment screw 23 passes through the adjustment nuts of the two clamping plates 22. An adjustment knob 24 is provided at one end of the adjustment screw 23. The adjustment knob 24 drives the adjustment screw 23 to rotate, causing the two clamping plates 22 to move closer or further away.

[0035] Specifically, the component to be welded is placed on the heating platform 11, and the adjustment knob 24 drives the adjustment screw 23 to rotate, causing the two clamping plates 22 to move closer or further away to clamp and fix the component. This clamps the component to be welded, effectively ensuring the clamping effect of the clamping plates 22 on the component and improving the welding accuracy.

[0036] In one embodiment of the present invention, the two ends of the adjusting screw 23 have threaded surfaces with opposite directions of rotation, the adjusting nuts on the two clamping plates 22 have the same direction of rotation, and both ends of the adjusting screw 23 are provided with adjusting knobs 24.

[0037] In one embodiment of this utility model, the heating platform 11 includes a processing plate, the processing plate has multiple mounting slots inside, heating wires are installed in the mounting slots, and a heat insulation layer is provided between the processing plate and the support platform. The multiple mounting slots are evenly arranged on the processing plate, and the heating wires installed in the mounting slots heat the processing plate, so that it can heat the components with its own heating platform 11, making welding more convenient and easier to operate.

[0038] In one embodiment of the present invention, the soldering mechanism 3 includes a fixing block 31, which is provided with a loading device for solder paste. The discharge port of the hopper 32 is connected to the conveying pipe 33, and a control valve 34 is provided on the discharge port. A telescopic pipe 35 is provided at the free end of the conveying pipe 33.

[0039] Specifically, the solder paste is squeezed onto the components to be soldered through the telescopic tube 35 set at the free end of the delivery tube 33. It can automatically inject solder, and the moving solder injection port can inject solder into the components at multiple angles, which is very practical.

[0040] In one embodiment of this utility model, a vacuum cover 36 is provided on the opening above the hopper 32. The vacuum cover 36 works in conjunction with the hopper 32 to facilitate pressurization of the hopper 32, allowing solder paste to be extruded smoothly. A connecting pipe 37 is provided on the hopper 32, and the connecting pipe 37 is connected to a hydraulic pump 38. The hydraulic pump 38 is used to pressurize the hopper 32 so that the solder paste in the hopper 32 is extruded quantitatively through the telescopic tube 35, and the solder paste is squeezed onto the component to be soldered. It can automatically inject solder and move the solder injection port.

[0041] In one embodiment of the present invention, the lifting mechanism includes a lifting rod 4, a lifting frame is slidably mounted on the lifting rod 4, the clamping frame 21 is connected to the lifting frame, a fixing bolt 41 is provided on the lifting frame, the lifting frame and the lifting rod 4 are connected by the fixing bolt 41, and a scale line is provided on the lifting rod 4.

[0042] Specifically, after adjusting the clamping plate 22 on the clamping frame 21 to a suitable position according to the specifications of different components, the lifting frame and the lifting rod 4 are connected by fixing bolts 41, so that the vertical position of the clamping plate 22 can be slidably adjusted to ensure the clamping accuracy of the components.

[0043] In one embodiment of this utility model, the support frame 1 is provided with a slot, the lifting rod 4 is inserted into the slot, the slot is provided with buckles 42 on both sides, the lifting rod 4 is provided with a sliding groove 43 that matches the buckles 42, the buckles 42 are engaged in the sliding groove 43, which can quickly assemble the lifting mechanism, facilitate the overall assembly and disassembly of the device, and has good practicality.

[0044] In one embodiment of the present invention, the clamping frame 21 is provided with a guide groove, one of the two clamping plates 22 is fixed to the clamping frame 21, and the other clamping plate 22 is provided with a guide block 25 that matches the guide groove, and the guide block 25 is slidably disposed in the guide groove.

[0045] Specifically, by sliding the guide block 25 in the guide groove, the two clamping plates 22 can be brought closer or further apart, effectively ensuring the clamping effect of the clamping plates 22 on the components and improving the welding accuracy.

[0046] Usage process

[0047] The component to be soldered is placed on the heating platform 11. Adjusting the knob 24 drives the adjusting screw 23 to rotate, causing the two clamping plates 22 to move closer or further away to clamp and fix the component. A heating wire in the mounting slot heats the processing board while the hydraulic pump 38 pressurizes the hopper 32, causing solder paste in the hopper 32 to be extruded quantitatively through the telescopic tube 35. The solder paste is then squeezed onto the component to be soldered through the telescopic tube 35 at the free end of the conveying pipe 33. This makes soldering large electronic components more convenient and easier to operate. The entire device is a small soldering machine, compact in size, highly efficient, and easy to move.

[0048] The above-described embodiments are merely preferred embodiments provided to fully illustrate the present invention, and the scope of protection of the present invention is not limited thereto. Equivalent substitutions or modifications made by those skilled in the art based on the present invention are all within the scope of protection of the present invention. The scope of protection of the present invention is defined by the claims.

Claims

1. A soldering apparatus capable of automatic tin injection, characterized by comprising: include: A support frame, on which a support platform is mounted; A clamping mechanism is disposed above the support platform, and the clamping mechanism is used to clamp and position the component; A heating platform is provided on the support platform. A processing station is provided on the heating platform. The processing station is arranged opposite to the clamping mechanism. The processing station is used to heat and weld the components on the clamping mechanism. A soldering mechanism is provided on the clamping mechanism, and the soldering mechanism is used to perform soldering operations on the welding components; A lifting mechanism is mounted on the support frame and is drivenly connected to the clamping mechanism. The lifting mechanism is used to adjust the relative position between the clamping mechanism and the heating platform.

2. The soldering apparatus capable of automatic tin injection according to claim 1, wherein The clamping mechanism includes a clamping frame and an adjustment component. Two clamping plates are arranged in parallel on the clamping frame, and a clamping gap for clamping the element is provided between the two clamping plates. The adjustment component is disposed on the two clamping plates and is used to adjust the clamping gap between the two clamping plates.

3. The soldering apparatus capable of automatic tin injection according to claim 2, wherein The adjustment assembly includes an adjustment screw, and adjustment nuts are provided on both clamping plates. The adjustment screw passes through the adjustment nuts on the two clamping plates. An adjustment knob is provided at one end of the adjustment screw. The adjustment knob drives the adjustment screw to rotate, causing the two clamping plates to move closer or further apart.

4. The soldering apparatus capable of automatic tin injection according to claim 3, wherein The adjusting screw has threaded surfaces with opposite directions of rotation at both ends, and the adjusting nuts on the two clamps have the same direction of rotation. Both ends of the adjusting screw are equipped with adjusting knobs.

5. The soldering apparatus capable of automatic tin injection according to claim 1, wherein The heating platform includes a processing plate, the processing plate has multiple mounting slots inside, heating wires are installed in the mounting slots, and a heat insulation layer is provided between the processing plate and the support platform. The multiple mounting slots are evenly arranged on the processing plate.

6. The soldering apparatus capable of automatic tin injection according to claim 1, wherein The soldering mechanism includes a fixed block with a hopper for loading solder paste. The hopper's discharge port is connected to a conveying pipe, and a control valve is provided on the discharge port. A telescopic tube is provided at the free end of the conveying pipe.

7. The soldering apparatus capable of automatic tin injection according to claim 6, wherein A vacuum cover is provided on the opening above the hopper. A connecting pipe is provided on the hopper and is connected to a hydraulic pump. The hydraulic pump is used to pressurize the hopper so that the solder paste in the hopper is extruded quantitatively through the telescopic tube.

8. The soldering apparatus capable of automatic tin injection according to claim 2, wherein The lifting mechanism includes a lifting rod, a lifting frame is slidably mounted on the lifting rod, the clamping frame is connected to the lifting frame, the lifting frame is provided with fixing bolts, the lifting frame is connected to the lifting rod by fixing bolts, and the lifting rod is provided with scale lines.

9. The soldering apparatus capable of automatic tin injection according to claim 8, wherein The support frame is provided with a slot, the lifting rod is inserted into the slot, the slot is provided with buckles on both sides, the lifting rod is provided with a sliding groove that matches the buckles, and the buckles are engaged in the sliding groove.

10. The soldering apparatus capable of automatic tin injection according to claim 2, wherein The clamping frame is provided with a guide groove. One of the two clamping plates is fixed to the clamping frame, and the other clamping plate is provided with a guide block that matches the guide groove. The guide block slides in the guide groove.

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