Electromagnetic shielding structure and electronic equipment

Abstract

The utility model discloses an electromagnetic shielding structure and an electronic device, and relates to the technical field of electromagnetic shielding, and the electromagnetic shielding structure comprises a shielding member and a grounding connecting member. The shielding piece comprises at least two shielding layers, the at least two shielding layers comprise an insulating layer and a conducting layer which are sequentially arranged in a stacked mode, at least one insulating layer is located on the outer side of the conducting layer, and the shielding piece is used for conducting electromagnetic shielding on electronic components in an electromagnetic shielding area in a supporting plate of the electronic equipment; the grounding connecting piece is arranged on the shielding piece and used for connecting the shielding piece to the supporting plate and enabling the conductive layer to be grounded with the supporting plate through the grounding connecting piece. According to the technical scheme provided by the utility model, the electromagnetic shielding structure is low in manufacturing cost, and various functions such as conduction, insulation, fastening and grounding can be realized at the same time.

Description

Technical Field

[0001] This utility model relates to the field of electromagnetic shielding technology, and in particular to an electromagnetic shielding structure and electronic device. Background Technology

[0002] In the electrical system of new energy vehicles, the electronic components in the motor controller generate a strong magnetic field during operation, and the electromagnetic waves can interfere with other circuit components, so they need to be shielded.

[0003] In related technologies, current industry devices for achieving this shielding function include metal shielding covers, outer shells with conductive components, and flexible shielding covers, to reduce the generation and propagation of electromagnetic waves and ensure the safety and reliability of electronic equipment. However, when using metal shielding covers, different shapes of shielding covers need to be designed for different shielding space requirements, and each structural form of shielding cover requires different stamping dies, resulting in high manufacturing costs. When using outer shells with conductive components, additional components such as electrostatic foam and spring clips are needed to achieve the conductivity between the shielding cavity and the electronic component support plate, which also leads to high manufacturing costs. When using flexible shielding covers, for different electromagnetic shielding areas, their outer contours must be tightly attached to the outer surface of the electronic components, increasing the complexity of the crimping tooling and also leading to high manufacturing costs. Utility Model Content

[0004] The main purpose of this invention is to propose an electromagnetic shielding structure and electronic device, aiming to provide an electromagnetic shielding structure with low manufacturing cost, while achieving multiple functions such as conductivity, insulation, fastening and grounding.

[0005] To achieve the above objectives, this utility model proposes an electromagnetic shielding structure, comprising:

[0006] A shielding component, comprising at least two shielding layers, wherein the at least two shielding layers comprise an insulating layer and a conductive layer stacked sequentially, wherein at least one insulating layer is located outside the conductive layer, and the shielding component is used to provide electromagnetic shielding for electronic components within the electromagnetic shielding area of ​​the support plate of an electronic device.

[0007] A grounding connector is provided on the shielding component, used to connect the shielding component to the support plate, and to ground the conductive layer to the support plate through the grounding connector.

[0008] In one embodiment, the shielding element is a shielding film.

[0009] In one embodiment, the insulating layer is an engineering plastic film;

[0010] And / or, the conductive layer is a metal film.

[0011] In one embodiment, at least one insulating layer is provided on both the inner and outer sides of the conductive layer.

[0012] In one embodiment, the insulating layer disposed inside the conductive layer is a polypropylene film;

[0013] And / or, the conductive layer is an aluminum film;

[0014] And / or, the insulating layer located outside the conductive layer is a polyethylene terephthalate (PET) plastic film.

[0015] In one embodiment, the thickness of the shielding element is defined as D, which satisfies: 100μm≤D≤200μm;

[0016] And / or, if the thickness of the insulating layer located inside the conductive layer is defined as d1, then d1 > 30 μm;

[0017] And / or, if the thickness of the conductive layer is defined as d2, then the following condition is satisfied: 30μm≤d2≤60μm;

[0018] And / or, if the thickness of the insulating layer outside the conductive layer is defined as d3, then d3 > 10 μm.

[0019] In one embodiment, the grounding connector is a mechanical connector or a chemical connector.

[0020] In one embodiment, the grounding connector is a conductive adhesive, one side of which is connected to the conductive layer, and the other side of which is used to connect to the support plate.

[0021] In one embodiment, the conductive adhesive includes a plurality of conductive adhesive blocks, which are distributed at circumferential intervals along the shielding member.

[0022] In one embodiment, when the insulating layer is provided inside the conductive layer, the insulating layer provided inside the conductive layer has a plurality of through holes that penetrate the conductive layer, and a conductive adhesive block is provided in one of the through holes so that the conductive layer is grounded to the support plate through the plurality of conductive adhesive blocks.

[0023] In one embodiment, the distance between the centers of two adjacent conductive adhesive blocks is defined as k, which satisfies the condition: k > 30 mm;

[0024] And / or, if the length of the conductive adhesive block is defined as a, then a > 5 mm;

[0025] And / or, if the width of the conductive adhesive block is defined as b, then b > 5 mm.

[0026] In one embodiment, the shielding member has a shielding cavity.

[0027] In one embodiment, the shielding element includes:

[0028] Cover plate;

[0029] A surrounding panel is provided around the periphery of the cover plate and together with the cover plate to form the shielding cavity. The side edge of the surrounding panel away from the cover plate is provided with a flange, which extends in a direction away from the shielding cavity. The grounding connector is provided on the side of the flange away from the cover plate.

[0030] To achieve the above objectives, this utility model also proposes an electronic device, comprising:

[0031] A support plate having an electromagnetic shielding area;

[0032] Electronic components, wherein at least one of the electronic components is provided within the electromagnetic shielding area;

[0033] As described above, the electromagnetic shielding structure is disposed over the electromagnetic shielding area so that the electromagnetic shielding structure provides electromagnetic shielding for the electronic components within the electromagnetic shielding area.

[0034] The technical solution of this utility model uses at least two layers of insulating and conductive layers stacked sequentially to create a shielding component. The insulating layer is designed to shape the shielding component and provide sufficient strength, while the conductive layer provides electromagnetic shielding, enabling electromagnetic shielding of electronic components within the shielding area. Furthermore, by using a grounding connector to connect the shielding component to the support plate of the electronic device, the electromagnetic shielding structure is secured; and the conductive layer of the shielding component can also be grounded to the support plate via the grounding connector, thus achieving the grounding function of the electromagnetic shielding structure.

[0035] In addition, compared with traditional metal shielding covers, the electromagnetic shielding structure provided by this solution does not require the design of different stamping dies according to different shape requirements, the assembly process is simple, and the manufacturing cost is low.

[0036] Compared with traditional shell enclosures and conductive components, the electromagnetic shielding structure provided by this solution does not require the formation of a shielding cavity on the shell, reducing the complexity of shell forming, and also eliminates the need to introduce conductive grounding structures such as conductive foam, resulting in low manufacturing costs.

[0037] Compared with traditional flexible shielding covers, the electromagnetic shielding structure provided by this solution does not require the composite film to be tightly attached to the outer surface of electronic components, which reduces the manufacturing complexity of the shielding cover and reduces the manufacturing cost.

[0038] Therefore, this solution provides an electromagnetic shielding structure with low manufacturing cost, while also achieving multiple functions such as conductivity, insulation, fastening, and grounding. Attached Figure Description

[0039] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0040] Figure 1 A schematic diagram of an embodiment of the electromagnetic shielding structure provided by this utility model from one perspective;

[0041] Figure 2 for Figure 1 A magnified view of a section at point A in the middle;

[0042] Figure 3 A schematic diagram of another perspective of an embodiment of the electromagnetic shielding structure provided by this utility model;

[0043] Figure 4 A schematic diagram of the electronic device provided by this utility model during the installation of the electromagnetic shielding structure;

[0044] Figure 5 A schematic diagram of the electronic device provided by this utility model before the installation of the electromagnetic shielding structure;

[0045] Figure 6 A schematic diagram of the electronic device provided by this utility model after the installation of the electromagnetic shielding structure.

[0046] Explanation of icon numbers:

[0047] label name label name 1000 electronic devices 12 Enclosure 100 Electromagnetic shielding structure 13 Flip-edge 10 Shielding 20 Grounding connector 1a Shielding cavity 21 Conductive adhesive block 10a Insulation layer 200 support plate 10b conductive layer 2b Electromagnetic shielding area 11 cover plate 300 Electronic components

[0048] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0049] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0050] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0051] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0052] In the electrical system of new energy vehicles, the electronic components in the motor controller generate a strong magnetic field during operation, and the electromagnetic waves can interfere with other circuit components, so they need to be shielded.

[0053] In related technologies, current industry devices for achieving this shielding function include metal shielding covers, outer shells with conductive components, and flexible shielding covers, to reduce the generation and propagation of electromagnetic waves and ensure the safety and reliability of electronic equipment. However, when using metal shielding covers, different shapes of shielding covers need to be designed for different shielding space requirements, and each structural form of shielding cover requires different stamping dies, resulting in high manufacturing costs. When using outer shells with conductive components, additional components such as electrostatic foam and spring clips are needed to achieve the conductivity between the shielding cavity and the electronic component support plate, which also leads to high manufacturing costs. When using flexible shielding covers, for different electromagnetic shielding areas, their outer contours must be tightly attached to the outer surface of the electronic components, increasing the complexity of the crimping tooling and also leading to high manufacturing costs.

[0054] Based on the above problems, this utility model proposes an electromagnetic shielding structure 100, which aims to provide an electromagnetic shielding structure 100 with low manufacturing cost, while realizing multiple functions such as conductivity, insulation, fastening and grounding.

[0055] Please see Figures 1 to 4In one embodiment of this utility model, the electromagnetic shielding structure 100 includes a shielding member 10 and a grounding connector 20. The shielding member 10 includes at least two shielding layers, each including an insulating layer 10a and a conductive layer 10b stacked sequentially. At least one insulating layer 10a is located outside the conductive layer 10b. The shielding member 10 is used to electromagnetically shield the electronic components 300 within the electromagnetic shielding region 2b of the support plate 200 of the electronic device 1000. The grounding connector 20 is disposed on the shielding member 10 and is used to connect the shielding member 10 to the support plate 200, and to ground the conductive layer 10b to the support plate 200 through the grounding connector 20.

[0056] The technical solution of this utility model uses at least two layers of insulating layer 10a and conductive layer 10b stacked sequentially to form the shielding component 10. The design of the insulating layer 10a can realize the shaping function of the shielding component 10 and provide sufficient strength for the shielding component 10, while the design of the conductive layer 10b can realize the electromagnetic shielding function, which can electromagnetically shield the electronic components 300 located in the electromagnetic shielding area 2b. In addition, by using a grounding connector 20 to connect the shielding component 10 to the support plate 200 of the electronic device 1000, the electromagnetic shielding structure 100 can be fastened; and the conductive layer 10b of the shielding component 10 can also be grounded to the support plate 200 through the grounding connector 20, thereby realizing the grounding function of the electromagnetic shielding structure 100.

[0057] In addition, compared with traditional metal shielding covers, the electromagnetic shielding structure 100 provided by this solution does not require the design of different stamping dies according to different shape requirements, the assembly process is simple and the manufacturing cost is low.

[0058] Compared with traditional shell housings and conductive components, the electromagnetic shielding structure 100 provided by this solution does not require the shielding cavity 1a to be formed on the shell, which reduces the complexity of shell forming and also eliminates the need to introduce conductive grounding structures such as conductive foam, resulting in low manufacturing costs.

[0059] Compared with traditional flexible shielding covers, the electromagnetic shielding structure 100 provided by this solution does not require the composite film to be tightly attached to the outer surface of the electronic components 300, which reduces the manufacturing complexity of the shielding cover and reduces the manufacturing cost.

[0060] Therefore, this solution provides an electromagnetic shielding structure 100 with low manufacturing cost, which can achieve multiple functions such as conductivity, insulation, fastening and grounding.

[0061] It should be noted that the inner side of the conductive layer 10b refers to the side closer to the electronic component 300 that needs to be electromagnetically shielded, while the outer side of the conductive layer 10b refers to the side farther away from the electronic component 300 that needs to be electromagnetically shielded.

[0062] In practical applications, the shielding layer can have two layers, or three or more layers. When the shielding layer has two layers, the two shielding layers can be a conductive layer 10b and an insulating layer 10a, respectively, with the insulating layer 10a stacked on the outside of the conductive layer 10b. When the shielding layer has three or more layers, the three or more shielding layers can be a conductive layer 10b and at least two insulating layers 10a, with at least one insulating layer 10a stacked on both the inner and outer sides of the conductive layer 10b.

[0063] Furthermore, the shielding member 10 can be used to electromagnetically shield the electronic components 300 within the electromagnetic shielding region 2b of the support plate 200 of the electronic device 1000 in various ways. For example, the shielding member 10 can electromagnetically shield the electronic components 300 in ways including but not limited to shell shielding, shielding cavity 1a, cable shielding, component-level shielding, etc.

[0064] In practical applications, the shielding component 10, which includes at least two shielding layers, can be a thin film structure or a plate structure. Furthermore, the insulating layer 10a can be made of materials with insulating properties, including but not limited to plastics and wood. The conductive layer 10b can be made of materials with electromagnetic shielding properties, including but not limited to metals and graphite.

[0065] In practical applications, the grounding connector 20 connects the shield 10 to the support plate 200 in ways including but not limited to mechanical connection, chemical connection, etc.

[0066] Furthermore, the grounding connection 20 can achieve grounding in ways including but not limited to direct grounding, indirect grounding, and floating grounding. Direct grounding includes but is not limited to metal-to-metal direct connection structures; indirect grounding includes but is not limited to resistance grounding, reactance grounding, and arc suppression coil grounding; and floating grounding includes but is not limited to high-impedance isolation structures.

[0067] Furthermore, the conductivity between the grounding connector 20 and the conductive layer 10b can be either contact conductivity or non-contact conductivity. Contact conductivity structures include, but are not limited to, rubber conductive structures, adhesive layer conductive structures, coating conductive structures, etc.; non-contact conductivity structures include, but are not limited to, quantum conductive structures, superconducting conductive structures, etc.

[0068] Please see Figures 1 to 3 In one embodiment of this utility model, the shielding component 10 is a shielding film.

[0069] With this configuration, by using a membrane material to prepare the shielding component 10, the electromagnetic shielding structure 100, including the shielding component 10 and the grounding connector 20, has better ductility. This allows the membrane material to be bent into shielding spaces of different shapes and sizes according to the outer contour requirements of the shielding space corresponding to the electromagnetic shielding region 2b, using a robotic arm or other methods. This facilitates the covering of the electromagnetic shielding structure 100 onto the electronic components 300 that require electromagnetic shielding, thereby achieving the electromagnetic shielding function. Therefore, it is not necessary to design different stamping dies to prepare the electromagnetic shielding structure 100 according to different shape requirements, which simplifies the preparation process and effectively reduces manufacturing costs.

[0070] It should be noted that the shielding component 10 is a shielding film, which means that each shielding layer of the shielding component 10 is a film layer, that is, the conductive layer 10b and the insulating layer 10a are both film layers.

[0071] In practical applications, adjacent shielding layers can be fixed together by welding, bonding, pressing, or other methods.

[0072] Please see Figures 1 to 3 In one embodiment of this utility model, the insulating layer 10a is an engineering plastic film; and / or, the conductive layer 10b is a metal film.

[0073] This configuration, using an engineering plastic film as the insulating layer 10a, has the following advantages: corrosion resistance, light weight, high strength, and easy molding. As a result, the insulating layer 10a has a better shaping effect on the shielding component 10 and can provide sufficient strength for the shielding component 10.

[0074] By using a metal film as the conductive layer 10b, the following advantages are available: strong electrical and thermal conductivity, stable properties, high mechanical strength, good durability, excellent dimensional stability, and easy recycling. As a result, the conductive layer 10b has better conductivity and can achieve a better electromagnetic shielding effect.

[0075] In practical applications, the materials used in engineering plastic films can include, but are not limited to, materials capable of achieving insulation effects such as PP (polypropylene), PET (polyethylene terephthalate), PC (polycarbonate), and PTFE (polytetrafluoroethylene).

[0076] In practical applications, the materials used for metal films can include, but are not limited to, materials that can achieve electromagnetic shielding, such as aluminum, copper, and steel.

[0077] Please see Figures 1 to 3In one embodiment of the present invention, at least one insulating layer 10a is provided on both the inner and outer sides of the conductive layer 10b.

[0078] This configuration, using at least three shielding layers to fabricate the shielding component 10, sandwiches the conductive layer 10b between at least two insulating layers 10a. This enhances the insulation effect of the conductive layer 10b, effectively preventing the inner or outer side of the conductive layer 10b from conducting electricity with other components of the electronic device 1000, thus affecting the electromagnetic shielding effect of the conductive layer 10b and consequently improving the electromagnetic shielding effect of the electromagnetic shielding structure 100. Furthermore, the design employing at least three film sandwich structures also increases the tensile strength of the shielding film, eliminating the need for additional metal wires within the sandwich structure and saving manufacturing costs for the electromagnetic shielding structure 100.

[0079] In practical applications, the inner side of the conductive layer 10b may be provided with one or two or more insulating layers 10a; similarly, the outer side of the conductive layer 10b may also be provided with one or two or more insulating layers 10a.

[0080] Furthermore, the number of layers, materials, thicknesses, and other parameters of the insulating layers 10a corresponding to the inner and outer sides of the conductive layer 10b can be the same or different, depending on the actual application.

[0081] Please see Figures 1 to 3 In one embodiment of the present invention, the insulating layer 10a disposed inside the conductive layer 10b is a polypropylene film; and / or, the conductive layer 10b is an aluminum film; and / or, the insulating layer 10a disposed outside the conductive layer 10b is a polyethylene terephthalate plastic film.

[0082] This configuration, using a polypropylene film as the insulating layer 10a located inside the conductive layer 10b, offers the following advantages: light weight, corrosion resistance, low cost, good mechanical properties, high heat resistance, good chemical properties, and good electrical insulation. As a result, the insulating layer 10a located inside the conductive layer 10b has superior electrical insulation properties, while also providing excellent shaping effect for the shielding component 10 and good ductility.

[0083] Using aluminum film as the conductive layer 10b has the following advantages: low density, strong corrosion resistance, strong plasticity, good electrical and thermal conductivity, stable chemical properties, easy processing, high strength, good casting performance, and high reusability. As a result, the conductive layer 10b has better conductivity and can achieve a better electromagnetic shielding effect.

[0084] Using a polyterephthalic acid plastic film as the insulating layer 10a disposed on the outside of the conductive layer 10b has the following advantages: good mechanical properties, strong chemical resistance, good temperature resistance, strong barrier properties, high transparency, high electrical insulation, and easy molding and processing. As a result, the insulating layer 10a disposed on the outside of the conductive layer 10b has better electrical insulation, and at the same time, it has a good shaping effect on the shielding component 10 and good ductility.

[0085] Please see Figure 2 In one embodiment of this utility model, the thickness of the shielding component 10 is defined as D, which satisfies: 100μm≤D≤200μm; specifically, the thickness D of the shielding component 10 may include, but is not limited to, 100μm, 110μm, 120μm, 130μm, 140μm, 150μm, 160μm, 170μm, 180μm, 190μm, 200μm, etc.

[0086] With this configuration, if the total thickness D of the shielding component 10 is too small, the thickness of each shielding layer will be too small, which will not only affect the function of each shielding layer, but also result in insufficient strength of the shielding component 10, making it difficult to bend to the required shape. Conversely, if the total thickness D of the shielding component 10 is too large, the overall size of the electromagnetic shielding structure 100 will be too large, and the required material cost will be high, leading to high manufacturing costs. Therefore, this solution controls the thickness D of the shielding component 10 within the range of 100μm to 200μm, which can ensure the functionality of each shielding layer while reducing manufacturing costs.

[0087] Of course, in other embodiments, without considering the functionality and manufacturing cost of the shielding component 10, the thickness D of the shielding component 10 can also be in other ranges. For example, the thickness D of the shielding component 10 can be 30μm, 40μm, 50μm, 60μm, 70μm, 80μm, 90μm, 210μm, 220μm, 230μm, 240μm, 250μm, 260μm, 270μm, etc. As long as the thickness D of the shielding component 10 is not 0, it falls within the protection scope of this application.

[0088] Please see Figure 2 In one embodiment of this utility model, the thickness of the insulating layer 10a disposed inside the conductive layer 10b is defined as d1, which satisfies: d1>30μm; specifically, the thickness d1 of the insulating layer 10a disposed inside the conductive layer 10b may include, but is not limited to, 31μm, 32μm, 33μm, 34μm, 35μm, 36μm, 37μm, 38μm, etc.

[0089] With this configuration, if the thickness d1 of the insulating layer 10a located inside the conductive layer 10b is too small, the insulating layer 10a will not provide a good shaping effect on the shielding member 10 and will not provide sufficient strength to the shielding member 10. Therefore, this solution can effectively ensure the shaping function of the insulating layer 10a on the shielding member 10 and provide sufficient strength to the shielding member 10 by controlling the thickness d1 of the insulating layer 10a located inside the conductive layer 10b to a range greater than 30μm.

[0090] Of course, in other embodiments, without considering the shaping effect of the insulating layer 10a on the shielding member 10, the thickness d1 of the insulating layer 10a inside the conductive layer 10b can also be in other ranges. For example, the thickness d1 of the insulating layer 10a inside the conductive layer 10b can also be 1μm, 2μm, 3μm, 4μm, 5μm, 6μm, 7μm, 8μm, 9μm, 10μm, 15μm, 20μm, 25μm, 30μm, etc. As long as the thickness d1 of the insulating layer 10a inside the conductive layer 10b is not 0, it falls within the protection scope of this application.

[0091] Please see Figure 2 In one embodiment of this utility model, the thickness of the conductive layer 10b is defined as d2, which satisfies the following condition: 30μm≤d2≤60μm. Specifically, the thickness d2 of the conductive layer 10b may include, but is not limited to, 30μm, 32μm, 36μm, 40μm, 43μm, 45μm, 50μm, 52μm, 57μm, 60μm, etc.

[0092] With this configuration, if the thickness d2 of the conductive layer 10b is too small, its electromagnetic shielding effect will be poor; conversely, if the thickness d2 of the conductive layer 10b is too large, its ductility will be poor, and the required material cost will be high, leading to high manufacturing costs. Therefore, this solution controls the thickness d2 of the conductive layer 10b within the range of 30μm to 60μm, ensuring that the conductive layer 10b has a superior electromagnetic shielding effect while reducing manufacturing costs.

[0093] Of course, in other embodiments, without considering the shielding effect and ductility of the conductive layer 10b, the thickness d2 of the conductive layer 10b can also be in other ranges. For example, the thickness d2 of the conductive layer 10b can also be 1μm, 5μm, 10μm, 15μm, 20μm, 25μm, 65μm, 70μm, 75μm, 80μm, etc. As long as the thickness d2 of the conductive layer 10b is not 0, it falls within the protection scope of this application.

[0094] Please see Figure 2In one embodiment of this utility model, the thickness of the insulating layer 10a disposed outside the conductive layer 10b is defined as d3, which satisfies: d3>10μm; specifically, the thickness d3 of the insulating layer 10a disposed outside the conductive layer 10b may include, but is not limited to, 11μm, 12μm, 13μm, 14μm, 15μm, 16μm, 17μm, 18μm, 19μm, 20μm, etc.

[0095] With this configuration, if the thickness d3 of the insulating layer 10a located outside the conductive layer 10b is too small, the insulating layer 10a will not provide a good shaping effect on the shielding component 10 and will not provide sufficient strength to the shielding component 10. Therefore, this solution can effectively ensure the shaping function of the insulating layer 10a on the shielding component 10 and provide sufficient strength to the shielding component 10 by controlling the thickness d3 of the insulating layer 10a located outside the conductive layer 10b to a range greater than 10μm.

[0096] Of course, in other embodiments, without considering the shaping effect of the insulating layer 10a on the shield 10, the thickness d3 of the insulating layer 10a outside the conductive layer 10b can also be in other ranges. For example, the thickness d3 of the insulating layer 10a outside the conductive layer 10b can also be 1μm, 2μm, 3μm, 4μm, 5μm, 6μm, 7μm, 8μm, 9μm, 10μm, etc. As long as the thickness d3 of the insulating layer 10a outside the conductive layer 10b is not 0, it falls within the protection scope of this application.

[0097] Please see Figure 3 In one embodiment of this utility model, the grounding connector 20 is a mechanical connector or a chemical connector.

[0098] With this configuration, by using mechanical or chemical connectors as grounding connectors 20, the electromagnetic shielding structure 100 can be securely fastened to the support plate 200 of the electronic device 1000, while the conductive layer 10b is electrically connected to the support plate 200 through the mechanical or chemical connectors to achieve the grounding function.

[0099] In practical applications, the connection methods used for mechanical connectors can include, but are not limited to, screw fastening, riveting, snap-fit ​​connection, and pin / sewing connection. Specifically, screw fastening corresponds to a bolt fastening structure; riveting corresponds to a hot riveting or spin riveting structure; snap-fit ​​connection corresponds to a snap-fit ​​structure; and pin / sewing connection corresponds to a pin / sewing structure.

[0100] In practical applications, the connection methods used for chemical connectors can include, but are not limited to, adhesive bonding, solvent bonding, hot melt adhesive bonding, and welding. Specifically, adhesive bonding can correspond to a dispensing groove structure; solvent bonding can correspond to a melting surface structure; hot melt adhesive bonding can correspond to a sol-gel tank structure; and welding can correspond to a weld bead structure.

[0101] Please see Figure 3 In one embodiment of this utility model, the grounding connector 20 is a conductive adhesive. One side of the conductive adhesive is connected to the conductive layer 10b, and the other side of the conductive adhesive is used to connect to the support plate 200.

[0102] This configuration, by directly bonding conductive adhesive to the conductive layer 10b and then to the support plate 200, facilitates the secure fastening of the electromagnetic shielding structure 100 to the support plate 200. It also makes it easier to achieve a conductive connection between the conductive layer 10b and the support plate 200 via the conductive adhesive, thus enabling grounding. Furthermore, the conductive adhesive is less expensive and has a simpler manufacturing process.

[0103] In practical applications, the conductive adhesive can be a strip of adhesive extending circumferentially along the shielding component 10; or, the conductive adhesive can be multiple spaced adhesive blocks, as long as it can connect the electromagnetic shielding structure 100 to the support plate 200 and enable the conductive layer 10b to be electrically connected to the support plate 200 through the conductive adhesive to achieve the grounding function.

[0104] Please see Figure 3 In one embodiment of the present invention, the conductive adhesive includes a plurality of conductive adhesive blocks 21, which are distributed at intervals along the circumference of the shielding member 10.

[0105] This configuration allows for the use of multiple non-continuous conductive adhesive blocks 21 to achieve both fastening and grounding functions. When the electromagnetic shielding structure 100 is fastened to the support plate 200 using multiple non-continuous conductive adhesive blocks 21, gaps can be formed between adjacent conductive adhesive blocks 21 and the support plate 200. This creates multiple spaced gaps between the electromagnetic shielding structure 100 and the support plate 200, allowing the electromagnetic shielding structure 100 to dissipate heat through these gaps. Consequently, there is no need to create additional heat dissipation holes on the electromagnetic shielding structure 100, reducing the manufacturing complexity of the electromagnetic shielding structure 100.

[0106] Please see Figure 3In one embodiment of the present invention, when an insulating layer 10a is provided on the inner side of the conductive layer 10b, the insulating layer 10a provided on the inner side of the conductive layer 10b is provided with a plurality of through holes penetrating to the conductive layer 10b, and a conductive adhesive block 21 is provided in one of the through holes so that the conductive layer 10b is grounded to the support plate 200 through the plurality of conductive adhesive blocks 21.

[0107] With this configuration, when an insulating layer 10a is provided on the inner side of the conductive layer 10b, in order to enable the conductive adhesive block 21 to be smoothly bonded to the middle conductive layer 10b, multiple through holes are provided in the insulating layer 10a located on the inner side of the conductive layer 10b. Multiple conductive adhesive blocks 21 are respectively installed in multiple through holes, so that multiple conductive adhesive blocks 21 can be smoothly bonded to the conductive layer 10b through multiple through holes, and the conductive layer 10b can be smoothly grounded to the support plate 200 through multiple conductive adhesive blocks 21.

[0108] In some embodiments, multiple perforations can be formed on the insulating layer 10a located inside the conductive layer 10b by laser ablation.

[0109] Of course, in other embodiments, when the inner side of the conductive layer 10b is not provided with an insulating layer 10a, the inner side of the conductive layer 10b can be exposed. In this case, one side of the conductive adhesive block 21 can be directly bonded to the inner side of the conductive layer 10b.

[0110] Please see Figure 3 In one embodiment of this utility model, the distance between the centers of two adjacent conductive adhesive blocks 21 is defined as k, which satisfies: k>30mm; specifically, the distance k between the centers of two adjacent conductive adhesive blocks 21 can be including but not limited to 31mm, 32mm, 33mm, 34mm, 35mm, 36mm, 37mm, 38mm, 39mm, 40mm, etc.

[0111] With this configuration, if the distance k between the centers of two adjacent conductive adhesive blocks 21 is too small, the gap between the two adjacent conductive adhesive blocks 21 will be too small, resulting in a small gap between the electromagnetic shielding structure 100 and the support plate 200. Consequently, the electromagnetic shielding structure 100 cannot dissipate heat sufficiently through this gap. Therefore, this solution controls the distance k between the centers of two adjacent conductive adhesive blocks 21 to be greater than 30mm, which can effectively increase the size of the gap between the electromagnetic shielding structure 100 and the support plate 200, allowing the electromagnetic shielding structure 100 to dissipate heat sufficiently through this gap.

[0112] Of course, in other embodiments, without considering the heat dissipation effect, the distance k between two adjacent conductive adhesive blocks 21 can also be other ranges. For example, the distance k between two adjacent conductive adhesive blocks 21 can also be 0mm, 5mm, 10mm, 15mm, 20mm, 25mm, 30mm, etc.

[0113] Please see Figure 3 In one embodiment of this utility model, the length of the conductive adhesive block 21 is defined as a, which satisfies the condition that a > 5 mm. Specifically, the length a of the conductive adhesive block 21 may include, but is not limited to, 6 mm, 7 mm, 8 mm, 9 mm, 10 mm, 11 mm, 12 mm, 13 mm, 14 mm, etc.

[0114] With this configuration, if the length a of the conductive adhesive block 21 is too small, the bonding strength between the conductive adhesive block 21 and the conductive layer 10b and the support plate 200 will be reduced, thereby affecting the fastening and grounding effect of the conductive adhesive block 21. Therefore, this solution can effectively ensure the bonding strength between the conductive adhesive block 21 and the conductive layer 10b and the support plate 200 by controlling the length a of the conductive adhesive block 21 to be greater than 5mm, thereby improving the fastening and grounding effect of the conductive adhesive block 21.

[0115] Of course, in other embodiments, without considering the bonding strength of the conductive adhesive block 21, the length a of the conductive adhesive block 21 can also be in other ranges. For example, the length a of the conductive adhesive block 21 can also be 1mm, 2mm, 3mm, 4mm, 5mm, etc. As long as the length a of the conductive adhesive block 21 is not 0, it falls within the protection scope of this application.

[0116] Please see Figure 3 In one embodiment of this utility model, the width of the conductive adhesive block 21 is defined as b, which satisfies the condition that b > 5 mm. Specifically, the width b of the conductive adhesive block 21 may include, but is not limited to, 6 mm, 7 mm, 8 mm, 9 mm, 10 mm, 11 mm, 12 mm, 13 mm, 14 mm, etc.

[0117] With this configuration, if the width b of the conductive adhesive block 21 is too small, the bonding strength between the conductive adhesive block 21 and the conductive layer 10b and the support plate 200 will also be affected, thus affecting the fastening and grounding effect of the conductive adhesive block 21. Therefore, this solution controls the width b of the conductive adhesive block 21 to be greater than 5mm, which can also effectively ensure the bonding strength between the conductive adhesive block 21 and the conductive layer 10b and the support plate 200, thereby improving the fastening and grounding effect of the conductive adhesive block 21.

[0118] Of course, in other embodiments, without considering the bonding strength of the conductive adhesive block 21, the width b of the conductive adhesive block 21 can also be in other ranges. For example, the width b of the conductive adhesive block 21 can also be 1mm, 2mm, 3mm, 4mm, 5mm, etc. As long as the width b of the conductive adhesive block 21 is not 0, it falls within the protection scope of this application.

[0119] Please see Figure 3 In one embodiment of the present invention, the shielding member 10 has a shielding cavity 1a.

[0120] With this setup, the shielding component 10 can be bent into a shielding cavity 1a of different shapes and sizes by using a robotic arm or other means, according to the outer contour requirements of the shielding space corresponding to the electromagnetic shielding area 2b. The electromagnetic shielding structure 100 can then be placed over the electronic component 300 that needs electromagnetic shielding, so that the electronic component 300 that needs electromagnetic shielding can be contained within the shielding cavity 1a, thereby improving the electromagnetic shielding effect on the electronic component 300.

[0121] In practical applications, the shielding cavity 1a can be a closed cavity or a semi-closed cavity.

[0122] Please see Figure 1 , Figure 3 In one embodiment of the present invention, the shielding member 10 includes a cover plate 11 and a surrounding plate 12; the surrounding plate 12 surrounds the periphery of the cover plate 11 and forms a shielding cavity 1a with the cover plate 11; the side edge of the surrounding plate 12 away from the cover plate 11 is provided with a flange 13, the flange 13 extends in a direction away from the shielding cavity 1a, and the grounding connector 20 is provided on the side of the flange 13 away from the cover plate 11.

[0123] With this configuration, the cover plate 11 and the surrounding plate 12 can be used to enclose and form a shielding cavity 1a of the required shape and size. The design of the flange 13 makes it easier to connect the grounding connector 20 to the shielding member 10, and at the same time facilitates the fastening and grounding functions of the grounding connector 20. Furthermore, when the side of the shielding member 10 with the flange 13 is connected to the support plate 200 through the grounding connector 20, a relatively closed cavity can be formed between the electromagnetic shielding structure and the support plate 200 to achieve the conductive function of the closed cavity, thereby realizing the electromagnetic shielding function of the inner and outer sides of the electromagnetic shielding structure 100.

[0124] Please see Figures 4 to 6The present invention also proposes an electronic device 1000, which includes a support plate 200, electronic components 300 and an electromagnetic shielding structure 100. The specific structure of the electromagnetic shielding structure 100 is as described in the above embodiments. Since the electronic device 1000 adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here.

[0125] The support plate 200 has an electromagnetic shielding region 2b; at least one electronic component 300 is provided in the electromagnetic shielding region 2b; and an electromagnetic shielding structure 100 is provided over the electromagnetic shielding region 2b so that the electromagnetic shielding structure 100 provides electromagnetic shielding for the electronic component 300 in the electromagnetic shielding region 2b.

[0126] The above description is merely an exemplary embodiment of the present utility model and does not limit the patent scope of the present utility model. Any equivalent structural transformations made based on the technical concept of the present utility model and the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. An electromagnetic shielding structure, characterized by, include: A shielding component, comprising at least two shielding layers, wherein the at least two shielding layers comprise an insulating layer and a conductive layer stacked sequentially, wherein at least one insulating layer is located outside the conductive layer, and the shielding component is used to provide electromagnetic shielding for electronic components within the electromagnetic shielding area of ​​the support plate of an electronic device. A grounding connector is provided on the shielding component, used to connect the shielding component to the support plate, and to ground the conductive layer to the support plate through the grounding connector.

2. The electromagnetic shielding structure of claim 1, wherein, The shielding component is a shielding film.

3. The electromagnetic shield structure of claim 2, wherein, The insulating layer is an engineering plastic film; And / or, the conductive layer is a metal film.

4. The electromagnetic shield structure of claim 3, wherein, At least one insulating layer is provided on both the inner and outer sides of the conductive layer.

5. The electromagnetic shield structure of claim 4, wherein, The insulating layer located inside the conductive layer is a polypropylene film; And / or, the conductive layer is an aluminum film; And / or, the insulating layer located outside the conductive layer is a polyethylene terephthalate (PET) plastic film.

6. The electromagnetic shield structure of claim 4, wherein, The thickness of the shielding component is defined as D, which satisfies the following condition: 100μm≤D≤200μm; And / or, if the thickness of the insulating layer located inside the conductive layer is defined as d1, then d1 > 30 μm; And / or, if the thickness of the conductive layer is defined as d2, then the following condition is satisfied: 30μm≤d2≤60μm; And / or, if the thickness of the insulating layer outside the conductive layer is defined as d3, then d3 > 10 μm.

7. The electromagnetic shielding structure according to any one of claims 1 to 6, wherein The grounding connector is either a mechanical connector or a chemical connector.

8. The electromagnetic shield structure of claim 7, wherein, The grounding connector is a conductive adhesive, with one side of the conductive adhesive connected to the conductive layer and the other side of the conductive adhesive used to connect to the support plate.

9. The electromagnetic shield structure of claim 8, wherein, The conductive adhesive includes multiple conductive adhesive blocks, which are distributed at intervals along the circumference of the shielding component.

10. The electromagnetic shield structure of claim 9, wherein, When the insulating layer is provided on the inner side of the conductive layer, the insulating layer provided on the inner side of the conductive layer has a plurality of through holes that penetrate into the conductive layer, and a conductive adhesive block is provided in one of the through holes so that the conductive layer is grounded to the support plate through the plurality of conductive adhesive blocks.

11. The electromagnetic shield structure of claim 9, wherein, Let k be the distance between the centers of two adjacent conductive adhesive blocks. Then, the following condition must be met: k > 30 mm. And / or, if the length of the conductive adhesive block is defined as a, then a > 5 mm; And / or, if the width of the conductive adhesive block is defined as b, then b > 5 mm.

12. The electromagnetic shielding structure of any one of claims 1 to 6, wherein, The shielding component has a shielding cavity.

13. The electromagnetic shield structure of claim 12, wherein, The shielding component includes: Cover plate; A surrounding panel is provided around the periphery of the cover plate and together with the cover plate to form the shielding cavity. The side edge of the surrounding panel away from the cover plate is provided with a flange, which extends in a direction away from the shielding cavity. The grounding connector is provided on the side of the flange away from the cover plate.

14. An electronic device, comprising: include: A support plate having an electromagnetic shielding area; Electronic components, wherein at least one of the electronic components is provided within the electromagnetic shielding area; The electromagnetic shielding structure as described in any one of claims 1 to 13, wherein the electromagnetic shielding structure is disposed over the electromagnetic shielding area so that the electromagnetic shielding structure provides electromagnetic shielding for electronic components within the electromagnetic shielding area.

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