Inductor module, circuit assembly, electric control heat dissipation structure, outdoor unit and heating and ventilation system

Abstract

The embodiment of the utility model provides an inductor module, a circuit assembly, an electric control heat dissipation structure, an outdoor unit and a heating and ventilation system. The inductor module comprises a support frame which is provided with a plurality of mounting positions arranged along a preset direction; the inductors are in one-to-one correspondence with the mounting positions, the inductors are arranged at the corresponding mounting positions, and the inductors located at the mounting positions are sequentially connected in series; and the plurality of pins are positioned on the same side of the support frame along a preset direction. According to the technical scheme, the inductors are arranged in a layered mode in the preset direction, the three-dimensional space is fully utilized, the occupied area of the inductor module on a circuit board can be reduced, and the area of a circuit assembly can be reduced; in the electric control heat dissipation structure, the circuit assembly is located in the second cavity, external airflow preferentially flows through the second cavity, and sufficient air cooling heat dissipation can be carried out on the inductor module in the circuit assembly.

Description

Technical Field

[0001] This disclosure relates to the field of heating, ventilation and air conditioning (HVAC) technology, and more particularly to an inductor module, circuit assembly, electrically controlled heat dissipation structure, outdoor unit, and HVAC system. Background Technology

[0002] Electrical equipment, such as air conditioners, often requires a filter circuit at the power input to pass electromagnetic interference (EMI) tests. This filter circuit consists of a circuit board and at least two common-mode inductors mounted on it. Since both common-mode inductors are located on the surface of the circuit board (also called a printed circuit board, PCB), they occupy a relatively large area, hindering miniaturization. Utility Model Content

[0003] This disclosure provides an inductor module, circuit assembly, electronically controlled heat dissipation structure, outdoor unit, and HVAC system to solve or alleviate one or more technical problems in the prior art.

[0004] As a first aspect of the present disclosure, the present disclosure provides an inductor module, including:

[0005] The support frame has multiple mounting positions arranged along a preset direction;

[0006] Multiple inductors correspond one-to-one with multiple mounting positions. The inductors are set in the corresponding mounting positions, and the multiple inductors located in the multiple mounting positions are connected in series in sequence.

[0007] Multiple pins are located on the same side of the support frame along the preset direction.

[0008] In some embodiments, the inductor includes a common-mode inductor.

[0009] In some embodiments, the support frame includes a first support column and a second support column disposed opposite to each other, both of which extend along a preset direction. A snap-fit ​​structure located at the mounting position is provided on the opposite surfaces of the first support column and the second support column. The inductor includes a magnetic ring and a coil wound on the magnetic ring, and the magnetic ring is snapped into the snap-fit ​​structure.

[0010] In some embodiments, the support frame includes a first support column and a second support column disposed opposite to each other, both of which extend along a preset direction. The support frame also includes a load-bearing structure connected between the first support column and the second support column and located at the mounting position, and an inductor is disposed on the load-bearing structure.

[0011] In some embodiments, the support frame includes a positioning surface perpendicular to a preset direction. The positioning surface is used to contact the circuit board for support and positioning, and a plurality of mounting positions are located on the side of the positioning surface opposite to the circuit board.

[0012] In some embodiments, the orthographic projection of a first inductor on the positioning surface lies within the orthographic projection of a second inductor on the positioning surface, wherein the first inductor is one of the plurality of inductors, and the second inductor is one of the plurality of inductors other than the first inductor.

[0013] As a second aspect of the present disclosure, the present disclosure provides a circuit assembly including a circuit board and an inductor module according to any of the present disclosures. The inductor module is disposed on the surface of the circuit board, and a preset direction in the inductor module is perpendicular to the surface of the circuit board.

[0014] As a third aspect of this disclosure, this disclosure provides an electrically controlled heat dissipation structure, including:

[0015] The box-shaped enclosure has an internal cavity for receiving contents.

[0016] A partition assembly is disposed in the receiving cavity and divides the receiving cavity into at least a first cavity and a second cavity;

[0017] The electronic control device includes a circuit assembly according to an embodiment of the present disclosure. The circuit assembly is mounted on the partition assembly and located in the second cavity.

[0018] The enclosure is equipped with an air-cooled air inlet, and the partition assembly is equipped with an air-cooled air outlet. The air-cooled air inlet connects the second cavity to the outside, and the air-cooled air outlet connects the first cavity and the second cavity.

[0019] In some embodiments, the electronic control device further includes an electronic control bracket, a circuit board is mounted on the electronic control bracket, the electronic control bracket is mounted on a partition assembly, and the circuit assembly further includes power devices disposed on the surface of the circuit board;

[0020] The electrical control bracket divides the second cavity into an air-cooled cavity and an air-out cavity. The circuit board and power devices are located in the air-cooled cavity. The electrical control bracket is provided with a transition air vent connecting the air-cooled cavity and the air-out cavity. The air-cooled inlet is connected to the air-cooled cavity, and the air-cooled outlet is connected to the air-cooled cavity through the air-out cavity and the transition air vent in sequence.

[0021] In some embodiments, the circuit assembly includes an air-cooled heat dissipation area and a refrigerant heat dissipation area spaced apart. The circuit assembly includes a power device disposed on the surface of a circuit board. The power device includes a second power device, which includes an inductor module. The second power device is disposed in the air-cooled heat dissipation area.

[0022] In some embodiments,

[0023] The air-cooled heat dissipation area and the refrigerant heat dissipation area are arranged at intervals along the second direction, and the direction from the air-cooled air inlet to the air-cooled air outlet is perpendicular to the second direction or forms an angle greater than 0 degrees.

[0024] As a fourth aspect of the present disclosure, the present disclosure provides an outdoor unit, including a heat exchanger, a fan, and an electronically controlled heat dissipation structure according to any of the present disclosures, wherein the heat exchanger and the fan are disposed in a first cavity of the electronically controlled heat dissipation structure.

[0025] As a fifth aspect of the present disclosure, the present disclosure provides a heating, ventilation, and air conditioning system, including an outdoor unit according to the present disclosure.

[0026] In the inductor module of this disclosure embodiment, when the inductor module is mounted on the surface of a circuit board, a preset direction can be made perpendicular to the surface of the circuit board. This allows multiple inductors to be arranged along a preset direction perpendicular to the surface of the circuit board, making full use of the three-dimensional space and arranging multiple inductors in layers. This reduces the area occupied by multiple inductors on the circuit board, which is beneficial to reducing the area of ​​the entire circuit board and achieving miniaturization.

[0027] The electronically controlled heat dissipation structure of this disclosure, employing the inductor module of this disclosure, helps to reduce the size of the electronically controlled device, and thus the size of the electronically controlled heat dissipation structure. Furthermore, the circuit components are mounted on the partition assembly and located in the second cavity. The air-cooling inlet connects the second cavity to the outside, and the air-cooling outlet connects the first and second cavities. Thus, cooler outside air enters the second cavity through the air-cooling inlet and flows out through the air-cooling outlet, providing sufficient air cooling for the circuit components within the second cavity, which helps to extend the lifespan of the circuit components.

[0028] The above overview is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of this disclosure will become readily apparent from the accompanying drawings and the following detailed description. Attached Figure Description

[0029] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the various drawings denote the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings depict only some embodiments according to this disclosure and should not be construed as limiting the scope of this disclosure.

[0030] Figure 1 This is a circuit diagram of a filter circuit in related technologies;

[0031] Figure 2 The inductance-frequency curves and impedance-frequency curves of three different common-mode inductors are shown.

[0032] Figure 3 This is a schematic diagram of the structure of an inductor module in one embodiment of the present disclosure;

[0033] Figure 4This is a schematic diagram of the structure of the inductor module in another embodiment of the present disclosure;

[0034] Figure 5 This is a schematic diagram of the structure of the inductor module in another embodiment of this disclosure;

[0035] Figure 6 A schematic diagram of two common-mode inductors connected in series;

[0036] Figure 7 This is a side view of the inductor at the mounting position in another embodiment of the present disclosure;

[0037] Figure 8 This is a plan view of a circuit component in one embodiment of the present disclosure;

[0038] Figure 9 This is a partial structural schematic diagram of an air conditioner outdoor unit from one perspective according to an embodiment of the present invention;

[0039] Figure 10 This is a partial structural schematic diagram of an air conditioner outdoor unit from another perspective of one embodiment of the present invention;

[0040] Figure 11 This is a schematic diagram of the partition and electronic control device from one perspective according to an embodiment of the present invention;

[0041] Figure 12 This is a schematic diagram of the partition and the electronic control device from another perspective of one embodiment of the present invention;

[0042] Figure 13 for Figure 4 A schematic diagram of the cross-sectional structure of section AA;

[0043] Figure 14 This is a schematic diagram of the structure of the electrically controlled bracket from one perspective according to an embodiment of the present invention;

[0044] Figure 15 This is a schematic diagram of the structure of the electronic control bracket and partition from one perspective according to an embodiment of the present invention;

[0045] Figure 16 This is a partial structural schematic diagram of an outdoor unit of an air conditioner from one perspective, according to an embodiment of the present invention.

[0046] Figure 17 This is a partial structural diagram of the outdoor unit of an air conditioner after removing the top cover and front panel, according to one perspective of an embodiment of the present invention.

[0047] Figure 18 This is a partial structural schematic diagram of an outdoor unit of an air conditioner according to one embodiment of the present invention.

[0048] Explanation of reference numerals in the attached figures:

[0049] 1. Outdoor unit; 10. Cabinet; 101. Receiving cavity; 1011. First cavity; 10111. Heat dissipation return air vent; 10112. Heat dissipation exhaust air vent; 1012. Second cavity; 10121. Air-cooled cavity; 10122. Air outlet cavity;

[0050] 12. Front panel; 111. Bottom plate; 14. Top cover; 131. Left side panel; 132. Right side panel; 13201. Right panel body; 13202. Rear panel body; 10101. Wind baffle; 10102. Valve plate; 1013. Protective plate; 10132. Air inlet; 10133. Air-cooled air inlet;

[0051] 160. Partition assembly; 16. Partition; 1611. Baffle; 1610. Air-cooled outlet; 16101. Air passage hole; 162. Insertion assembly hole; 1620. Water baffle structure;

[0052] 30. Electrical control device; 31. Electrical control bracket; 313. Enclosure panel; 315. Transition air vent; 32. Main board; 331. First power device; 332. Second power device; 3001. Air-cooled heat dissipation area; 3002. Refrigerant heat dissipation area;

[0053] 300. Refrigerant cooling module;

[0054] 61. Heat exchanger; 680. Fan; 690. High and low pressure valve assembly;

[0055] 80. Inductor module; 81. Support frame; 811. First support column; 812. Second support column; 813. Mounting position; 814. Bearing structure; 815. Positioning surface; 816. Snap-fit ​​structure. Detailed Implementation

[0056] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of this disclosure, and different embodiments can be combined arbitrarily without conflict. Therefore, the drawings and description are considered to be exemplary in nature and not restrictive.

[0057] Figure 1 This is a circuit diagram of a filter circuit in related technologies, such as... Figure 1 As shown, the AC power enters through connector CN1, passes through the fuse FUSE for startup safety protection, then surge suppressors ZR1 and ZR2, and the discharge diode DSA1, followed by capacitor C1 (X capacitor), common-mode inductors L1 and L2, capacitor C2 (X capacitor), and capacitors C3 and C4 (Y capacitors). Next comes the NTC and bridge rectifier BR1. Electrolytic capacitor E1 is part of the pre-charge rectifier circuit. Common-mode inductors L1 and L2 are key components in the filter circuit.

[0058] Figure 2 The graph shows the inductance-frequency and impedance-frequency curves for three different common-mode inductors. The solid line represents the impedance-frequency curve, and the dashed line represents the inductance-frequency curve. Curves 1 and 4 correspond to the same common-mode inductor, as do curves 2 and 5, and curves 3 and 6. From... Figure 2 As can be seen, inductance decreases with increasing frequency, and impedance is only relatively high within a certain frequency band. EMI testing covers a wide frequency range; for example, air conditioners exhibit conducted emissions of 150kΩ-30MHz (0.15M-30M) and radiated emissions of 30M-1G. For this wide frequency band, a resistor can be placed on circuit board 321, and a ferrite core can be added to the power line with a coil wound with the appropriate number of turns. The advantage of using a ferrite core is that it doesn't occupy area on circuit board 321. However, the disadvantages are poor test result consistency due to inconsistent winding and power line routing, additional fixing of the ferrite core, low production efficiency, and asymmetrical fixing of the ferrite core can cause stress on the winding, affecting performance. Furthermore, placing two common-mode inductors on circuit board 321 occupies a relatively large area, which is detrimental to product miniaturization.

[0059] To address some problems in the related technologies, this disclosure provides an embodiment of an inductor module.

[0060] Figure 3 This is a schematic diagram of the structure of an inductor module in one embodiment of the present disclosure. Figure 4 This is a schematic diagram of the structure of the inductor module in another embodiment of this disclosure. Figure 5 This is a schematic diagram of the structure of the inductor module in another embodiment of this disclosure. Figure 6 This is a schematic diagram of two common-mode inductors connected in series. Figures 3-6 As shown, the inductor module 80 includes a support frame 81 and multiple inductors L. The support frame 81 has multiple mounting positions 813 arranged along a preset direction, thereby the multiple mounting positions 813 are stacked along the preset direction. Each inductor L corresponds one-to-one with a mounting position 813, with one inductor L mounted at each mounting position 813. The multiple inductors L located at the multiple mounting positions 813 are connected in series. When an inductor L is placed at the corresponding mounting position 813, the multiple inductors L are stacked in the preset direction. The inductor module also includes multiple pins P, which are located on the same side of the support frame 81 along the preset direction. The multiple pins P are respectively connected to the coils in the inductors, and the multiple pins P are used for connection to a circuit board. In one embodiment, the inductor module includes two common-mode inductors L1 and L2, and the number of multiple pins is four. Figure 3 and Figure 4 The diagram shows two pins, P1 and P2. Figure 5 The four pins P1, P2, P3 and P4 are shown.

[0061] For example, in Figure 3 and Figure 4 In the support frame 81, there are two mounting positions 813, namely mounting position 813a and mounting position 813b. Mounting positions 813a and 813b are arranged sequentially along a preset direction (vertical direction in the figure). Mounting position 813a is provided with a first inductor L1, and mounting position 813b is provided with a second inductor L2.

[0062] Compared to multiple inductors being mounted in parallel on the surface of the circuit board 321, for the inductor module 80 of this embodiment, when the inductor module 80 is mounted on the surface of the circuit board 321, since multiple pins are located on the same side of the support frame along a preset direction, after the multiple pins are connected to the circuit board, the preset direction is perpendicular to the surface of the circuit board 321. Thus, multiple inductors are arranged along a preset direction perpendicular to the surface of the circuit board 321, making full use of the three-dimensional space and arranging multiple inductors in layers. This reduces the area occupied by multiple inductors on the circuit board 321 in the inductor module 80, which is beneficial to reducing the area of ​​the entire circuit board 321 and achieving miniaturization.

[0063] Inductors can include common-mode inductors. For example, inductor L in inductor module 80 is a common-mode inductor. Figures 3-5 The inductor module 80 includes a first common-mode inductor L1 and a second common-mode inductor L2, which are sequentially arranged on the support frame 81 along a preset direction. The first common-mode inductor L1 and the second common-mode inductor L2 are connected in series, as shown below. Figure 6 As shown. The first common-mode inductor L1 may include a first magnetic ring and a first coil and a second coil wound on the first magnetic ring. The second common-mode inductor L2 may include a second magnetic ring and a third coil and a fourth coil wound on the second magnetic ring. In actual implementation, during winding, the first wire winds the first coil on the first magnetic ring, and then the first wire winds the third coil on the second magnetic ring; the second wire winds the second coil on the first magnetic ring, and then the second wire winds the fourth coil on the second magnetic ring, thereby forming the first common-mode inductor L1 and the second common-mode inductor L2 connected in series. The two ends of the first wire and the two ends of the second wire serve as the four pins P1, P2, P3 and P4 of the inductor module 80, used to connect to external circuits.

[0064] In related technologies, the first common-mode inductor has four pins, and the second common-mode inductor has four pins. In production, when both the first and second common-mode inductors are mounted on circuit board 321, both common-mode inductors need to be plugged into circuit board 321, and eight pins need to be soldered.

[0065] In the inductor module 80 of this embodiment, the first common-mode inductor L1 and the second common-mode inductor L2 are connected in series. Therefore, in production, it is only necessary to insert the inductor module 80 into the circuit board 321 and connect the four pins of the inductor module 80 to the circuit board 321, which reduces the number of material insertions and the number of pins soldered, greatly improving productivity. Furthermore, the two inductor modules 80 are arranged sequentially along a direction perpendicular to the surface of the circuit board 321, reducing the area occupied by the inductor module 80 on the circuit board 321 to about half of the original area, greatly reducing the area occupied by the inductor module 80.

[0066] It is understandable that inductors are not limited to common-mode inductors; inductors can also be other types, such as differential-mode inductors and PFC inductors.

[0067] To enable the inductor to be mounted in mounting position 813, such as Figures 3-5 As shown, the support frame 81 may include a first support column 811 and a second support column 812 disposed opposite to each other, and the cross-sectional shape of the first support column 811 and the second support column 812 may be set as needed. For example, the cross-sectional shape of the first support column 811 and the second support column 812 may be a quadrilateral or other shapes.

[0068] The first support column 811 and the second support column 812 can be parallel to each other and both extend along a preset direction.

[0069] In one embodiment, the support frame 81 may further include a load-bearing structure 814, which may be plate-shaped, such as... Figure 3 and Figure 4 As shown. The load-bearing structure 814 is connected between the first support column 811 and the second support column 812, and the load-bearing structure 814 is located at the mounting position 813. An inductor can be provided on the load-bearing structure 814.

[0070] An inductor may include a magnetic ring and a coil wound on the magnetic ring. When the inductor is mounted on the support structure 814, the radial plane of the magnetic ring may be parallel to the surface of the support structure 814, or in other words, the radial plane of the magnetic ring may be perpendicular to a predetermined direction, such as... Figure 3 As shown. Thus, the area occupied by the inductor module 80 on the circuit board 321 can be the radial planar area of ​​an inductor.

[0071] It should be noted that the "radial plane of the magnetic ring" is the surface on which the radial dimension of the magnetic ring is located. When the shape of the magnetic ring is polygonal, the radial plane is the surface on which the length dimension of the magnetic ring is located.

[0072] In another embodiment, when the inductor is positioned at mounting location 813, the radial plane of the magnetic ring can form a first angle θ with a preset direction Z, where 0 < θ < 90°, as shown below. Figure 7As shown, Figure 7 This is a side view diagram of the inductor at the mounting position in another embodiment of the present disclosure. Figure 7 The radial plane 830 of the first support post 811 and the magnetic ring of one of the inductors is shown. Thus, it can be compared to... Figure 3 Further reduce the area occupied by the inductor module 80 on the circuit board 321, Figure 3 In this case, θ is 90°.

[0073] In another embodiment, such as Figure 4 As shown, when the inductor is mounted on the support structure 814, the radial plane of the magnetic ring can be parallel to a preset direction, i.e., θ is 0. This configuration, compared to... Figure 7 This can further reduce the area occupied by the inductor module 80 on the circuit board 321. In order to integrate the inductor as... Figure 4 The inductor is mounted on the support structure 814, which may include a support plate. A support groove may be provided on the support plate, and a portion of the magnetic ring of the inductor may be embedded in the support groove.

[0074] The inductor module 80 includes multiple inductors, and the mounting methods of each inductor at the mounting position 813 can be the same or different. For example, the first common-mode inductor can be mounted in the following manner: Figure 3 In that case, the second common-mode inductor can be set in the corresponding mounting position 813, as follows: Figure 4 or Figure 7 That setting is configured in the corresponding installation position 813.

[0075] In other embodiments, for Figure 3 and Figure 4 The inductor can be fixed on the load-bearing structure 814, and the specific fixing method can be set as needed.

[0076] In another embodiment, such as Figure 5 As shown, a snap-fit ​​structure 816 is provided on the opposite surfaces of the first support post 811 and the second support post 812, located at the mounting position 813. For example, the surface of the first support post 811 facing the second support post 812 is provided with a first snap-fit ​​structure, and the surface of the second support post 812 facing the first support post 811 is provided with a second snap-fit ​​structure. The magnetic ring of the inductor is snapped between the first snap-fit ​​structure and the second snap-fit ​​structure, fixing the inductor in the corresponding mounting position 813. This method facilitates the installation and removal of the inductor in the inductor module 80. The specific structure of the snap-fit ​​structure can be set as needed, as long as it can snap and fix the inductor in the mounting position 813.

[0077] To facilitate the mounting of the inductor module 80 on the circuit board 321, the support frame 81 may further include a positioning surface 815, which is perpendicular to a preset direction. For example, a support plate may be provided at the bottom end of the first support column 811 and the second support column 812, and the bottom surface of the support plate may serve as the positioning surface 815. Alternatively, in Figure 3 and Figure 4 In this configuration, the lower surface of the supporting structure 814 serves as a positioning surface 815. When the inductor module 80 is mounted on the circuit board 321, the positioning surface 815 can contact the surface of the circuit board 321 for support and positioning. Multiple mounting positions 813 are located on the side of the positioning surface 815 facing away from the circuit board 321. Multiple pins P can be perpendicular to the positioning surface 815, and the multiple pins P protrude from the positioning surface 815 along a predetermined direction toward the side facing away from the mounting positions. Therefore, when the multiple pins P are soldered onto the circuit board, multiple inductors are stacked sequentially on top of the circuit board.

[0078] To minimize the area occupied by multiple inductors in the inductor module 80, the orthographic projection of the first inductor on the positioning surface 815 lies within the orthographic projection of the second inductor on the positioning surface 815. The first inductor is one of the multiple inductors, and the second inductor is one of the multiple inductors excluding the first inductor. For example, the orthographic projection of the second common-mode inductor on the positioning surface 815 lies within the orthographic projection of the first common-mode inductor on the positioning surface 815. Therefore, the area occupied by the second common-mode inductor on the circuit board 321 is within the area occupied by the first common-mode inductor on the circuit board 321, and the second common-mode inductor does not occupy additional area, further reducing the area occupied by the common-mode inductor on the circuit board 321.

[0079] It should be noted that since inductors typically include a magnetic ring and a coil wound around the magnetic ring, there is a hollow area inside the inductor. However, the area occupied by the inductor is the area defined by its outer contour. Therefore, in this article, "the orthographic projection of the inductor on the positioning surface" should be understood as the orthographic projection of the inductor's outer contour on the positioning surface.

[0080] To improve the common-mode signal suppression of the inductor module 80, one of the multiple inductors can be configured to suppress low-frequency signals, while another can be configured to suppress high-frequency signals.

[0081] For example, the magnetic ring of the first common-mode inductor can correspond to high-frequency EMI, while the magnetic ring of the second common-mode inductor can correspond to low-frequency EMI. The specific frequency band can be set as needed. The two magnetic rings can be made of different core materials or the same core material. In practice, the core material can be flexibly selected according to the EMI interference to achieve bipolar filtering. The number of turns in each magnetic core can be the same or different, depending on actual needs.

[0082] This disclosure also provides a circuit component, such as Figure 8 As shown, Figure 8 This is a plan view of a circuit assembly according to one embodiment of the present disclosure. The circuit assembly includes a circuit board 321 and an inductor module 80 as described in any embodiment of the present disclosure. The inductor module 80 is disposed on the surface of the circuit board 321, and a predetermined direction in the inductor module 80 is perpendicular to the surface of the circuit board 321. Therefore, from... Figure 8 As can be seen, although the inductor module 80 contains multiple inductors connected in series, the area occupied by the inductor module 80 is only about the area occupied by one inductor, which greatly reduces the sum of the areas occupied by multiple inductors and is conducive to the compact structure of the circuit components.

[0083] Another embodiment of this disclosure provides an electronically controlled heat dissipation structure. Please refer to... Figure 9 , Figure 10 , Figure 13 , Figure 15 and Figure 16 As shown, the electronically controlled heat dissipation structure includes a housing 10, a partition assembly 160, and an electronic control device 30.

[0084] like Figure 9 , Figure 12 , Figure 17 and Figure 18 As shown, the housing 10 includes a bottom plate 111, a top cover 14, a front panel 12, a left side panel 131, and a right side panel 132. The bottom plate 111, top cover 14, front panel 12, left side panel 131, and right side panel 132 together enclose a receiving cavity 101. A partition assembly 160 is disposed within the receiving cavity 101. The partition assembly 160 is connected to the front panel 12 and the bottom plate 111 respectively. The partition assembly 160 is located between the left side panel 131 and the right side panel 132, dividing the receiving cavity 101 into a first cavity 1011 and a second cavity 1012. The first cavity 1011 is used to accommodate the heat exchanger 61 and the fan 680. The electrical control device 30 is installed in the partition assembly 160 and located within the second cavity 1012.

[0085] The electronic control device 30 includes a circuit assembly 32, which is mounted on the partition assembly 160 and located within the second cavity 1012.

[0086] The circuit assembly 32 is provided with an air-cooled heat dissipation area 3001 and a refrigerant heat dissipation area 3002 arranged at intervals. The circuit assembly 32 includes power devices disposed on the surface of the circuit board 321, including a first power device and a second power device. The first power device is disposed in the refrigerant heat dissipation area 3002 and is thermally connected to the refrigerant heat dissipation module 300 (see [link to relevant documentation]). Figure 12The second power device is located in the air-cooled heat dissipation area 3001, and the second power device includes the inductor module in this embodiment. The refrigerant heat dissipation module 300 removes heat from the power device through the circulation of refrigerant, achieving efficient heat dissipation.

[0087] Please combine Figure 9 , Figure 10 , Figure 13 and Figure 16 As shown, the housing 10 is provided with an air-cooled inlet 10133, and the partition assembly 160 is provided with an air-cooled outlet 1610. The air-cooled inlet 10133 connects the second cavity 1012 to the outside, and the air-cooled outlet 1610 connects the first cavity 1011 and the second cavity 1012. Figure 10 and Figure 13 The continuous indicator arrows in the middle indicate the direction of airflow.

[0088] When the fan 680 in the first cavity 1011 is running, it drives the air in the first cavity 1011 to flow to the outside, creating a negative pressure area in the first cavity 1011. Air in the second cavity 1012 is drawn into the first cavity 1011 through the air-cooled outlet 1610, providing power for the airflow in the second cavity 1012. This causes outside air to first enter the second cavity 1012 through the air-cooled inlet 10133, and then flow back to the first cavity 1011 through the air-cooled outlet 1610. During this flow, the air in the second cavity 1012 exchanges heat with the power devices in the electronic control device 30, carrying away the heat from the power devices, thus utilizing natural wind to dissipate heat from the power devices. Furthermore, at least one power device in the electronic control device 30 also dissipates heat through the refrigerant cooling module 300, giving the electronic control cooling structure both refrigerant cooling and air cooling modes. This allows for targeted selection of the cooling method based on the heat generation and cooling requirements of different power devices. For critical power devices that generate a lot of heat, the refrigerant heat dissipation module 300 is used for efficient heat dissipation; while for other power devices, air cooling is sufficient to meet the requirements, thereby better ensuring the stable operation of the entire electronic control device 30 and extending the service life of electronic components.

[0089] In this embodiment, the second cavity 1012 is also used to accommodate devices such as compressors, and the airflow formed in the second cavity 1012 for heat dissipation is also beneficial to the heat dissipation of devices such as compressors.

[0090] In some embodiments, such as Figure 9 , Figure 11 , Figure 12 and Figure 13As shown, the electronic control device 30 also includes an electronic control bracket 31. The circuit assembly 32 is the core component of the electronic control device 30. In the circuit assembly 32, multiple power devices are electrically connected and transmit signals through the circuitry inside the circuit board 321, ensuring the stable operation of the entire electronic control device 30. The electronic control bracket 31 is mounted on the partition 16 and is located inside the second cavity 1012, dividing the second cavity 1012 into a cooling cavity 10121 and an exhaust cavity 10122. The circuit assembly 32 is mounted on the electronic control bracket 31 and is located within the cooling cavity 10121. The electronic control bracket 31 has a transition air vent 315, which connects the cooling cavity 10121 and the exhaust cavity 10122. The transition air vent 315 is the necessary channel for air to flow from the cooling cavity 10121 to the exhaust cavity 10122 throughout the entire heat dissipation airflow cycle.

[0091] In this embodiment, when the fan 680 in the first cavity 1011 is running, a negative pressure area is formed within the first cavity 1011. Since the air-cooled outlet 1610 is connected to the air-cooled cavity 10121 sequentially through the outlet cavity 10122 and the transition outlet 315, and the air-cooled inlet 10133 is also connected to the air-cooled cavity 10121, outside air first enters the air-cooled cavity 10121 through the air-cooled inlet 10133. Inside the air-cooled cavity 10121, the air exchanges heat with the power devices located in the circuit assembly 32, carrying away the heat generated by the power devices. Subsequently, the heated air enters the outlet cavity 10122 through the transition outlet 315, and is then drawn into the first cavity 1011 through the air-cooled outlet 1610, finally being discharged to the outside.

[0092] By subdividing the second cavity 1012 into a cooling cavity 10121 and an exhaust cavity 10122, and utilizing the transition vent 315 on the electronic control bracket 31 to guide airflow, the air in the cooling cavity 10121 can more fully exchange heat with power devices such as inductor modules. This optimizes the airflow path, improves heat dissipation efficiency, and ensures that the power devices can operate in a more suitable temperature environment. The embodiments of this disclosure, through reasonable cavity division and airflow guidance, make the air cooling process more stable and reliable, ensuring a stable flow of cold air through the power devices, reducing performance fluctuations of the power devices caused by unstable heat dissipation, thereby improving the stability and reliability of the entire electronic control device 30.

[0093] Furthermore, please combine Figure 12 , Figure 13 and Figure 16As shown, the transition vent 315 and the air-cooling inlet 10133 are located on opposite sides of the circuit board 321. The air-cooling inlet 10133 introduces outside cold air. Because it is opposite to the transition vent 315 on the other side of the circuit board 321, the cold air can form a through-flow path within the air-cooling cavity 10121, making the airflow direction parallel to the surface of the circuit board 321 and perpendicular to the orientation of the power devices. After entering through the air-cooling inlet 10133, the cold air can flow comprehensively and deeply through all parts of the circuit board 321 and the power devices, maximizing contact with the heat source and carrying away heat. Subsequently, the heated air is smoothly discharged through the transition vent 315, forming an efficient convection circulation, which can more effectively reduce the temperature of the circuit board 321 and the power devices, significantly improving heat dissipation efficiency.

[0094] It should also be emphasized that the heat generation of different areas of the circuit board 321 and power devices may vary during operation. Placing the transition air vent 315 and the air-cooled air inlet 10133 on opposite sides ensures that cool air evenly covers the entire surface of the circuit components, avoiding localized overheating.

[0095] Furthermore, the transition air vent 315 and the air-cooled air inlet 10133 are spaced apart along the first direction, and along the first direction, the air-cooled air outlet 1610 is located between the transition air vent 315 and the air-cooled air inlet 10133. With this arrangement, the air-cooled air inlet 10133 introduces outside cold air. In the first direction, the cold air flows through the transition air vent 315 and then flows to the air-cooled air outlet 1610. During this process, the cold air first flows through the front of the electrical control bracket 31 (the side where the circuit assembly 32 is installed, i.e., the side of the electrical control bracket 31 facing away from the partition assembly 160), and exchanges heat with the circuit board 321 and the power devices on the circuit board 321 before flowing into the air outlet cavity 10122 through the transition air vent 315. Since the air-cooled air outlet 1610... The air inlet 0 is positioned between the transition air inlet 315 and the air-cooled inlet 10133. Therefore, as the airflow flows from the transition air inlet 315 through the air outlet cavity 10122 to the air-cooled outlet 1610, it comes into contact with the back of the electronic control bracket 31 (the side of the electronic control bracket 31 facing away from the partition assembly 160) again, continuing to dissipate heat from the electronic control bracket 31. This prolongs the contact time between the cold air and the entire electronic control device 30, resulting in more thorough heat exchange and more effective absorption of the heat generated by the power devices, thus improving heat dissipation efficiency.

[0096] Furthermore, the first direction is parallel to or at an angle to the vertical direction, and the air-cooled inlet 10133 is located below the transition air outlet 315 and the air-cooled outlet 1610. Understandably, in terms of spatial layout, from bottom to top, the air-cooled inlet 10133, the air-cooled outlet 1610, and the transition air outlet 315 are at the very top. After entering through the lower air-cooled inlet 10133, the cold air can flow upwards along a relatively smooth path, passing through the transition air outlet 315 and the air-cooled outlet 1610 in sequence. Utilizing a relatively vertical flow pattern from bottom to top, this reduces air detours and collisions during the flow, thus lowering energy loss. Furthermore, because the air-cooled inlet 10133 is located at the bottom, the cold air can diffuse upwards relatively evenly, covering all parts of the circuit board 321 and the power devices. During the rising of cold air, the cold air and the heating element continuously exchange heat, ensuring that the temperature gradient at each position in the first direction is relatively small. This makes the temperature distribution of the entire electronic control device 30 more uniform, which can prevent local overheating, improve the stability and reliability of electronic components, and effectively extend the service life of the electronic control device 30.

[0097] In some embodiments, please combine Figure 9 , Figure 12 , Figure 13 and Figure 16 As shown, the electronic control device 30 is provided with an air-cooled heat dissipation area 3001 and a refrigerant heat dissipation area 3002 arranged at intervals. The power devices include a first power device 331 and a second power device 332. The first power device 331 generates more heat than the second power device 332 during operation. It is located in the refrigerant heat dissipation area 3002 and is thermally connected to the refrigerant heat dissipation module 300. The refrigerant heat dissipation module 300 can efficiently remove the heat from the first power device 331 through the circulation of refrigerant, providing a stronger and more stable heat dissipation effect, ensuring that the first power device 331 is always in a suitable temperature range during operation, maintaining good performance and reliability. The second power device 332 is housed in the air-cooled heat dissipation area 3001. The air-cooled heat dissipation area 3001 utilizes an air-cooled inlet 10133, an air-cooled outlet 1610, and a transition vent 315 to form an effective air-cooled heat dissipation cycle. Cool air enters through the air-cooled inlet 10133, flows through the second power device 332, absorbs the heat generated by it, and is then discharged through the transition vent 315 and the air-cooled outlet 1610. For the second power device 332, which generates relatively little heat, the air-cooled heat dissipation method satisfies its heat dissipation requirements while being relatively simple and economical, eliminating the need for a complex refrigerant cooling system.

[0098] It should also be noted that dividing the electronic control device 30 into zones and separating the air-cooled heat dissipation zone 3001 and the refrigerant heat dissipation zone 3002 serves two purposes. First, it avoids heat dissipation interference. By separating them, mutual interference between the two zones can be effectively avoided, allowing each zone's heat dissipation process to take place in a relatively stable environment, thereby ensuring the reliability of the heat dissipation effect. Second, it optimizes the use of space. The air-cooled heat dissipation zone 3001 needs to consider the airflow path to form a smooth airflow channel, while the refrigerant heat dissipation zone 3002 needs to accommodate refrigerant pipes and other components. Separating the air-cooled heat dissipation zone 3001 and the refrigerant heat dissipation zone 3002 makes more rational use of the internal space of the electronic control device 30, preventing the refrigerant heat dissipation module 300 from blocking the airflow to the air-cooled heat dissipation zone 3001 and preventing low heat dissipation efficiency due to unreasonable spatial layout.

[0099] Furthermore, such as Figure 12 As shown, the air-cooled heat dissipation area 3001 and the refrigerant heat dissipation area 3002 are spaced apart along the second direction. The direction from the air-cooled inlet 10133 to the air-cooled outlet 1610 is perpendicular to the second direction Y or forms an angle greater than 0. This ensures that the airflow path from the air-cooled inlet 10133 to the air-cooled outlet 1610 is perpendicular to the second direction or forms a certain angle, further reducing heat transfer interference between the two heat dissipation areas. The heat generated in the refrigerant heat dissipation area 3002 will not easily diffuse to the air-cooled heat dissipation area 3001 with the air-cooled airflow, and the heat generated in the air-cooled heat dissipation area 3001 will not easily diffuse to the refrigerant heat dissipation area 3002 with the air-cooled airflow. This helps maintain temperature stability in each heat dissipation area, ensures efficient operation of each heat dissipation method, and improves the reliability of the entire heat dissipation system of the electronic control device 30.

[0100] In some embodiments, the electronic control bracket 31 is provided with a plurality of transition vents 315, which are sequentially arranged around the circumferential edge of the circuit board 321. The sequential arrangement of the transition vents 315 around the circumferential edge of the motherboard 32 allows hot air to be exhausted from all directions around the circuit components. During heat dissipation, heat generated by power devices at different locations on the circuit components can be uniformly guided to the transition vents 315. For example, heat from both the edge and center portions of the circuit components has suitable exhaust paths, avoiding localized overheating. Compared to having only one or a few transition vents 315, a uniformly distributed distribution of transition vents 315 allows hot air to leave the heat dissipation area more evenly, ensuring a more uniform temperature distribution across the entire surface of the circuit components, thereby improving the uniformity of heat dissipation.

[0101] The circuit board 321 has a rectangular plate-like structure. Multiple transition vents 315 may be located on only one side of the circuit board 321, or they may be distributed across different sides of the circuit board 321. For example, in some exemplary embodiments, all of the multiple transition vents 315 are located on the side of the circuit board 321 facing the top cover 14. In other exemplary embodiments, some of the multiple transition vents 315 are located on the side of the circuit board 321 facing the top cover 14, while another portion is located on the side of the circuit board 321 facing the front panel 12.

[0102] In some embodiments, please combine Figure 13 and Figure 14 As shown, the electrical control bracket 31 also includes a surrounding plate 313. The surrounding plate 313 protrudes from the side of the support plate 3101 facing the partition 16. The surrounding plate 313 extends circumferentially around the air-cooled air outlet 1610 and tightly surrounds the outside of the air-cooled air outlet 1610. The support plate 3101, the surrounding plate 313, and the partition 16 together define the air outlet cavity 10122. The way the surrounding plate 313 surrounds the air-cooled air outlet 1610 allows the surrounding plate 313 to effectively constrain the air flowing out of the air-cooled air outlet 1610, ensuring that hot air can only flow out through the area defined by the air-cooled air outlet 1610. This avoids disorderly leakage or turbulence of hot air around the air outlet, ensuring that the direction of airflow is stable and concentrated, and greatly optimizing the exhaust path of the airflow. Furthermore, the end of the enclosure 313 facing away from the support plate 3101 abuts against the partition 16, and the support plate 3101 provides a stable support foundation for the enclosure 313, ensuring that the enclosure 313 can be firmly fixed in the corresponding position.

[0103] In some embodiments, such as Figure 14 and Figure 17 As shown, the electronically controlled heat dissipation structure also includes a baffle plate 10101. The baffle plate 10101 is installed on the top of the electronically controlled bracket 31 and covers the top of the partition 16, the front panel 12, and the right side panel 132. The baffle plate 10101, the front panel 12, the right side panel 132, and the bottom plate 111 together define the second cavity 1012. Installing the baffle plate 10101 on the top of the partition 16 and the electronically controlled bracket 31 provides a stable and flat mounting base, making the installation of the baffle plate 10101 easier and better ensuring the stability and sealing after installation. This reduces the leakage of cold air from the second cavity 1012 into the first cavity 1011 through the connection gap between the baffle plate 10101 and the partition 16 and the electronically controlled bracket 31.

[0104] In this embodiment, by setting a baffle plate 10101, the sealing of the top of the second cavity 1012 is improved, reducing the flow of air from the gap between the top cover 14 and the partition 16 into the first cavity 1011. In addition, the baffle plate 10101 can also guide the upward flowing cold air to the transition air vent 315, so that the cold air in the second cavity 1012 can flow smoothly through the transition air vent 315 into the air outlet cavity 10122, and then enter the first cavity 1011 through the air-cooled air outlet 1610.

[0105] In some embodiments, such as Figure 16 As shown, the right side plate 13201 of the right side plate 132 has a mounting port. The housing 10 also includes a valve plate 10102, which is mounted on the side plate and covers the mounting port. The valve plate 10102 is used to install the high and low pressure valve assembly 690. The mounting port is a channel interface between the inside of the housing 10 and the external environment, allowing the high and low pressure valve assembly 690 to be mounted on the side plate through the valve plate 10102, thus connecting the inside of the equipment to the outside. In the refrigeration system, the high and low pressure valve assembly 690 is used to connect high and low pressure pipelines. The high and low pressure valve assembly 690 is a key component of the air conditioning system. The high and low pressure valve assembly 690 includes a high-pressure valve and a low-pressure valve. The function of the high-pressure valve and the low-pressure valve is to control the pressure and flow of refrigerant in the system. The high-pressure valve is mainly used to control the flow of high-temperature, high-pressure refrigerant discharged from the compressor to prevent excessive pressure from damaging the system; the low-pressure valve is used to regulate the entry and exit of refrigerant in low-pressure areas such as the evaporator to ensure the normal operation of the air conditioning system. The air-cooled air inlet 10133 is located on the valve plate 10102. Placing the air-cooled air inlet 10133 on the valve plate 10102 makes full use of the space within the valve plate 10102. Since the valve plate 10102 itself is a component used to install the high and low pressure valve assembly 690, setting the air inlet on it avoids the need for additional space required for separate air inlets in other locations on the housing 10. In the refrigeration system, the cold air entering through the air-cooled air inlet 10133 can directly cool the high and low pressure valve assembly 690 to a certain extent. Simultaneously, the heat around the high and low pressure valve assembly 690 can be better dissipated with the airflow, improving the overall system's heat dissipation efficiency and stability.

[0106] In some embodiments, such as Figure 16As shown, the electronically controlled heat dissipation structure also includes a protective plate 1013, which covers the valve plate 10102 and defines an installation space between the protective plate 1013 and the valve plate 10102 to accommodate the high and low pressure valve assembly 690, providing physical protection for the valve plate 10102 and the high and low pressure valve assembly 690. The protective plate 1013 effectively blocks external foreign objects, such as dust, debris, and moisture, from entering the installation space, preventing these foreign objects from interfering with the normal operation of the high and low pressure valve assembly 690. The protective plate 1013 is provided with an air inlet 10132, and the air-cooled air inlet 10133 connects the second cavity 1012 and the installation space, connecting the installation space with the outside. When outside air enters, the protective plate 1013 can guide the air to flow in the installation space along a specific path, which helps to dissipate heat from the high and low pressure valve assembly 690. After entering through the air inlet 10132, the cold air flows around the high and low pressure valve group 690 under the guidance of the protective plate 1013, carrying away the heat generated by the high and low pressure valve group 690 during operation, and then flows into the second cavity 1012 through the air-cooled air inlet 10133 to complete the heat dissipation cycle.

[0107] In this embodiment, please refer to Figure 9 and Figure 16 As shown, the housing 10 is also provided with a heat dissipation return air vent 10111 and a heat dissipation air outlet 10112 communicating with the first cavity 1011. When the fan 680 in the first cavity 1011 is running, the fan 680 drives the air in the first cavity 1011 to be discharged from the first cavity 1011 through the heat dissipation air outlet 10112, thereby creating a negative pressure area in the first cavity 1011. Under the suction force of the fan 680, outside air enters the first cavity 1011 through the heat dissipation return air vent 10111 and flows through the heat exchanger 61 toward the heat dissipation air outlet 10112. At the same time, under the negative pressure state of the first cavity 1011, outside cold air enters the installation space between the guard plate 1013 and the valve plate 10102 from the air inlet 10132, first cooling the high and low pressure valve group 690, and then flowing into the air-cooled cavity 10121 through the air-cooled air inlet 10133. In the second cavity 1012, cold air undergoes further heat exchange with the electronic control device 30 (such as the motherboard 32, power devices, etc.) to reduce the temperature of the electronic control device 30. After the cold air exchanges heat with the electronic control device 30, the temperature continues to rise and flows into the air outlet cavity 10122 through the transition air outlet 315, and then flows into the first cavity 1011 through the air-cooled air outlet 1610, where it merges with the air in the first cavity 1011 and is discharged outside the housing 10 through the heat dissipation air outlet 10112.

[0108] The orientation of the heat dissipation return air vent 10111 is the same as that of the air inlet 10132, allowing the cold air entering through the air inlet 10132 and the hot air returning through the heat dissipation return air vent 10111 to form a similar airflow trend to some extent. This reduces airflow collisions and turbulence within the housing 10, resulting in a more orderly airflow organization and improved airflow efficiency throughout the entire heat dissipation system, thereby enhancing the heat dissipation effect.

[0109] In some embodiments, such as Figure 12 As shown, the refrigerant heat dissipation module 300 includes a first heat sink (not shown) and a second heat sink (not shown). The first heat sink is thermally connected to the first power device 331, and the second heat sink is thermally connected to the first heat sink. The second heat sink is provided with a refrigerant flow channel (not shown). Through the two-stage thermal connection between the first and second heat sinks, and the circulation of refrigerant in the refrigerant flow channel of the second heat sink, efficient transfer and dissipation of the large amount of heat generated by the first power device 331 can be achieved.

[0110] According to embodiments of the present invention, such as Figure 9 and Figure 18 As shown, an outdoor air conditioning unit 1 is also proposed. The outdoor air conditioning unit 1 includes a heat exchanger 61, a fan 680, and an electrically controlled heat dissipation structure. The heat exchanger 61 and the fan 680 are disposed within the first cavity 1011 of the electrically controlled heat dissipation structure. The outdoor air conditioning unit 1 proposed in this invention, with its combination of air cooling and refrigerant heat dissipation, and the special structural design within the refrigerant flow channel, significantly enhances heat exchange efficiency, enabling the outdoor air conditioning unit 1 to efficiently dissipate the heat generated by the power devices in the electronic control device 30, ensuring the stable operation of the electronic control device 30.

[0111] According to an embodiment of the present invention, a heating, ventilation, and air conditioning (HVAC) system is also proposed. The HVAC system includes an outdoor air conditioning unit 1 and an indoor air conditioning unit, which are connected by refrigerant pipes and electrical wiring. The electrical wiring includes control signal lines and power lines. The control signal lines are used by the indoor unit's control unit to send commands to the outdoor unit, such as start, stop, adjusting cooling or heating modes, and adjusting the fan speed 680. The power lines provide power to the outdoor unit's compressor, fan 680, and other equipment to ensure their normal operation. The HVAC system proposed in this invention includes an outdoor air conditioning unit 1 and an electrically controlled heat dissipation structure; therefore, the same technical effects as the electrically controlled heat dissipation structure will not be described further here.

[0112] In the description of this specification, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this disclosure.

[0113] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this disclosure, "multiple" means two or more, unless otherwise explicitly specified.

[0114] In this disclosure, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this disclosure according to the specific circumstances.

[0115] In this disclosure, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0116] The foregoing disclosure provides many different implementations or examples for carrying out different structures of this disclosure. To simplify this disclosure, the components and arrangements of specific examples are described above. Of course, these are merely examples and are not intended to limit this disclosure. Furthermore, reference numerals and / or reference letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various implementations and / or arrangements discussed.

[0117] The above are merely specific embodiments of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any person skilled in the art can easily conceive of various variations or substitutions within the technical scope disclosed in this disclosure. Different parts of different embodiments can be combined with each other without conflict, and these should all be covered within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. An inductor module, characterized in that, include: The support frame has multiple mounting positions arranged along a preset direction; Multiple inductors are provided, each corresponding to one of the mounting positions. The inductors are disposed at the corresponding mounting positions, and the multiple inductors located at the multiple mounting positions are connected in series sequentially. Multiple pins are located on the same side of the support frame along the preset direction.

2. The inductor module according to claim 1, characterized in that, The inductor includes a common-mode inductor.

3. The inductor module according to claim 1, characterized in that, The support frame includes a first support column and a second support column arranged opposite to each other. Both the first support column and the second support column extend along the preset direction. A snap-fit ​​structure located at the mounting position is provided on the opposite surface of the first support column and the second support column. The inductor includes a magnetic ring and a coil wound on the magnetic ring. The magnetic ring is snapped into the snap-fit ​​structure.

4. The inductor module according to claim 1, characterized in that, The support frame includes a first support column and a second support column arranged opposite to each other, both of which extend along the preset direction. The support frame also includes a load-bearing structure connected between the first support column and the second support column and located at the mounting position. The inductor is disposed on the load-bearing structure.

5. The inductor module according to any one of claims 1-4, characterized in that, The support frame includes a positioning surface that is perpendicular to the preset direction. The positioning surface is used to contact the circuit board for support and positioning. The plurality of mounting positions are located on the side of the positioning surface opposite to the circuit board.

6. The inductor module according to claim 5, characterized in that, The orthographic projection of the first inductor on the positioning surface is located within the orthographic projection of the second inductor on the positioning surface. The first inductor is one of the plurality of inductors, and the second inductor is one of the plurality of inductors other than the first inductor.

7. A circuit component, characterized in that, The invention includes a circuit board and an inductor module as described in any one of claims 1-6, wherein the inductor module is disposed on the surface of the circuit board and a preset direction in the inductor module is perpendicular to the surface of the circuit board.

8. An electronically controlled heat dissipation structure, characterized in that, include: The box-shaped enclosure has an internal cavity for receiving contents. A partition assembly is disposed in the receiving cavity and divides the receiving cavity into at least a first cavity and a second cavity; The electronic control device includes the circuit assembly as described in claim 7, the circuit assembly being mounted on the partition assembly and located within the second cavity; The housing is provided with an air-cooled inlet, the partition assembly is provided with an air-cooled outlet, the air-cooled inlet connects the second cavity to the outside, and the air-cooled outlet connects the first cavity and the second cavity.

9. The electronically controlled heat dissipation structure according to claim 8, characterized in that, The electronic control device further includes an electronic control bracket, the circuit board is mounted on the electronic control bracket, the electronic control bracket is mounted on the partition assembly, and the circuit assembly further includes power devices disposed on the surface of the circuit board; The electrical control bracket divides the second cavity into a cooling cavity and an exhaust cavity. The circuit board and the power device are located in the cooling cavity. The electrical control bracket is provided with a transition air vent that connects the cooling cavity and the exhaust cavity. The cooling inlet is connected to the cooling cavity, and the cooling outlet is connected to the cooling cavity through the exhaust cavity and the transition air vent in sequence.

10. The electronically controlled heat dissipation structure according to claim 8, characterized in that, The circuit assembly has an air-cooled heat dissipation area and a refrigerant heat dissipation area arranged at intervals. The circuit assembly includes a power device disposed on the surface of the circuit board. The power device includes a second power device, which includes an inductor module. The second power device is disposed in the air-cooled heat dissipation area.

11. The electronically controlled heat dissipation structure according to claim 10, characterized in that, The air-cooled heat dissipation area and the refrigerant heat dissipation area are arranged at intervals along the second direction, and the direction from the air-cooled air inlet to the air-cooled air outlet forms an angle greater than 0 degrees with the second direction.

12. An outdoor unit, characterized in that, It includes a heat exchanger, a fan, and an electrically controlled heat dissipation structure as described in any one of claims 8-11, wherein the heat exchanger and the fan are disposed in the first cavity of the electrically controlled heat dissipation structure.

13. A heating, ventilation, and air conditioning system, characterized in that, Including the outdoor unit as described in claim 12.

Images