Liftable LHP hot plate for baking wafer plate
By combining a two-stage lifting mechanism with low-temperature radiation baking, the problems of wafer breakage and abnormal film thickness caused by ordinary cylinder lifting are solved, achieving stable wafer lifting and improved film thickness uniformity.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- WUXI XINLI ELECTRONIC TECHNOLOGY CO LTD
- Filing Date
- 2025-06-04
- Publication Date
- 2026-04-24
AI Technical Summary
The existing LHP hot plate for lifting and baking wafers uses a common cylinder for lifting, which causes the wafer temperature to rise too quickly, leading to wafer cracking or abnormal film thickness on the wafer surface, which in turn affects the pattern linewidth.
A two-stage lifting mechanism is adopted, and the gas inlet and outlet are controlled by the first and second control boards. The gas enters the inner cavity of the first and second cylinders, which pushes the push rod and the buffer piston to work together to achieve stable lifting of the lifting plate and the ejector pin. Combined with low temperature radiation baking, it reduces wafer cracking and improves the uniformity of surface film thickness.
It effectively reduces wafer breakage and improves the uniformity of wafer surface film thickness, meeting the wafer size variations required by different processes.
Smart Images
Figure CN224165080U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor manufacturing technology, and in particular to a height-adjustable baking wafer plate (LHP hot plate). Background Technology
[0002] Semiconductor manufacturing refers to various technologies for semiconductor processing, including wafer growth technology, thin film deposition, photolithography, etching, doping technology, and process integration. In semiconductor manufacturing and related fields, wafer baking is a crucial step. Traditional wafer baking equipment has some limitations in the design of the hot plate, such as a fixed height, which makes it difficult to adapt to different process requirements and wafer size variations. Therefore, a height-adjustable baking wafer plate (LHP) is particularly needed.
[0003] However, existing height-adjustable baking wafer LHP hot plates use ordinary cylinders for lifting. In actual processes, it has been found that lifting with ordinary cylinders causes the wafer temperature to rise too quickly, leading to wafer cracking or abnormal film thickness on the wafer surface, which in turn affects the pattern linewidth. Utility Model Content
[0004] The purpose of this invention is to provide a height-adjustable baking wafer LHP hot plate to solve the problem mentioned in the background art. Conventional LHP hot plates use ordinary cylinders for lifting. In actual process, it has been found that lifting with ordinary cylinders causes the temperature of the wafer to rise too quickly, leading to wafer cracking or abnormal film thickness on the wafer surface, which in turn affects the pattern linewidth.
[0005] To achieve the above objectives, this utility model provides the following technical solution: a liftable baking wafer LHP hot plate, comprising a housing, a lifting mechanism provided on the inner surface of the housing, a lifting plate provided on the upper surface of the lifting mechanism, a pin fixedly connected to the upper surface of the lifting plate, an LHP hot plate slidably connected to the outer surface of the pin, a fixing hole provided on the surface of the LHP hot plate, a support block fixedly connected to the lower surface of the LHP hot plate, and an alarm sensor fixedly connected to the surface of the housing;
[0006] The lifting mechanism includes a first cylinder, a stabilizing block, a first air inlet, a first air outlet, a first pipe, a first control board, a second pipe, a first inner cavity, a fixed sealing ring, a first lower buffer piston, a first push rod, a first sealing ring, a first guide ring, a first upper buffer piston, a second cylinder, a second air inlet, a second air outlet, a third pipe, a second control board, a fourth pipe, a second inner cavity, a second sealing ring, a second guide ring, a second upper buffer piston, a second lower buffer piston, and a second push rod. The first cylinder is fixedly connected to the inner surface of the housing. A stabilizing block is fixedly connected to one side surface of the first cylinder. The first air inlet and the first air outlet are both located on the inner surface of the first cylinder. A first pipe is fixedly connected to the outer surface of the first air inlet. A first control board is fixedly connected to one end surface of the first pipe. A second pipe is fixedly connected to one side surface of the first control board. A first inner cavity is formed on the inner surface of the first cylinder. A fixed sealing ring is fixedly connected to the inner surface of the first inner cavity. A first push rod is engaged with the inner surface of the fixed sealing ring. A first lower buffer piston is fixedly connected to the upper surface of the first lower buffer piston. A first push rod is fixedly connected to the outer surface of the first push rod. A first sealing ring is fixedly connected to the outer surface of the first sealing ring. A first guide ring is fixedly connected to the outer surface of the first push rod. A first upper buffer piston is fixedly connected to the outer surface of the first cylinder. A second cylinder is fixedly connected to the upper surface of the first cylinder. A second air inlet and a second air outlet are opened on the inner surface of the second cylinder. A third pipe is fixedly connected to the outer surface of the second air inlet. A second control plate is fixedly connected to one end of the third pipe. A fourth pipe is fixedly connected to one side surface of the second control plate. A second inner cavity is opened on the inner surface of the second cylinder. A second sealing ring is slidably connected to the inner surface of the second inner cavity. A second guide ring is fixedly connected to the outer surface of the second sealing ring. A second upper buffer piston is fixedly connected to the upper surface of the second sealing ring. A second lower buffer piston is fixedly connected to the lower surface of the second sealing ring. A second push rod is fixedly connected to the upper surface of the second lower buffer piston.
[0007] Preferably, two sets of stabilizing blocks are symmetrically arranged around the central axis of the first cylinder, and the stabilizing blocks are fixedly connected to the housing by bolts.
[0008] Preferably, the first air inlet corresponds to the first air outlet, and the second air inlet corresponds to the second air outlet.
[0009] Preferably, the outer wall dimension of the first sealing ring matches the inner wall dimension of the first inner cavity, and the inner wall dimension of the fixed sealing ring matches the outer wall dimension of the first lower buffer piston.
[0010] Preferably, the second pipe is fixedly connected to the first air outlet, the fourth pipe is fixedly connected to the second air outlet, and two sets of the second guide ring are provided.
[0011] Preferably, multiple sets of ejector pins are provided on the surface of the lifting plate, and multiple sets of fixing holes are provided on the surface of the LHP hot plate.
[0012] Preferably, the support blocks are arranged symmetrically with respect to the central axis of the LHP hot plate, and multiple sets of alarm sensors are provided on the surface of the enclosure.
[0013] Compared with the prior art, the beneficial effects of this utility model are as follows: This liftable baking wafer LHP hot plate, through the setting of the lifting mechanism, when lifting operation is required, the gas inlet and outlet are controlled by the first control plate and the second control plate. The gas enters the first air inlet of the first cylinder through the first pipe. After the gas enters the first inner cavity of the first cylinder, it acts on the first lower buffer piston. As the gas pressure increases, the first lower buffer piston pushes the first push rod to move upward. The first sealing ring and the first guide ring on the outside of the first push rod play a sealing and guiding role, ensuring that the first push rod can move stably in the first inner cavity. When the first push rod moves a certain distance, it will push the second lower buffer piston and the second push rod to move upward a certain distance. When further rise is required, the gas enters the second inner cavity from the third pipe and the second air inlet, which acts on the first lower buffer piston and the second push rod to move upward. The two sealing rings generate upward pressure, and the second sealing ring drives the second push rod to move upward. The first and second cylinders work together, and the upward movement of the first and second push rods pushes the lifting plate and ejector pin to rise. When it is necessary to descend, the first and second control plates control the gas to be discharged from the first and second air outlets. As the gas is discharged, the pressure in the first and second cylinders gradually decreases. Under the action of gravity and load, the first lower buffer piston, the first push rod, the second lower buffer piston, and the second push rod begin to move downward. The lifting plate and ejector pin also descend accordingly. The two-stage lifting and lowering, with an additional position close to the surface of the LHP hot plate for low-temperature radiation baking, and then baking at the lowered position after a certain period of time, can greatly reduce the occurrence of wafer cracking and greatly improve the uniformity of surface film thickness. Attached Figure Description
[0014] Figure 1 This is a side view of the appearance structure of this utility model;
[0015] Figure 2 This is a schematic diagram of the structure in which the support block and the LHP hot plate of this utility model cooperate with each other;
[0016] Figure 3 This is a schematic diagram of the structure of the lifting plate and the ejector pin of this utility model in cooperation with each other;
[0017] Figure 4This is a schematic diagram of the structure of the first cylinder and the second cylinder of this utility model in cooperation with each other.
[0018] In the diagram: 1. Housing; 2. Lifting mechanism; 201. First cylinder; 202. Stabilizing block; 203. First air inlet; 204. First air outlet; 205. First pipe; 206. First control board; 207. Second pipe; 208. First inner cavity; 209. Fixed sealing ring; 210. First lower buffer piston; 211. First push rod; 212. First sealing ring; 213. First guide ring; 214. First upper buffer piston; 215. 216. Second cylinder block; 217. Second air inlet; 218. Second air outlet; 219. Third pipe; 220. Second control board; 221. Fourth pipe; 222. Second inner cavity; 223. Second sealing ring; 224. Second guide ring; 225. Second upper buffer piston; 226. Second lower buffer piston; 227. Second push rod; 228. Lifting plate; 229. Ejector pin; 220. LHP hot plate; 221. Fixing hole; 222. Support block; 222. Alarm sensor. Detailed Implementation
[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the protection scope of the present utility model.
[0020] Please see Figure 1-4 This utility model provides a technical solution: a height-adjustable baking wafer LHP hot plate, including a box body 1, a lifting mechanism 2 is provided on the inner surface of the box body 1, a lifting plate 3 is provided on the upper surface of the lifting mechanism 2, a pin 4 is fixedly connected to the upper surface of the lifting plate 3, an LHP hot plate 5 is slidably connected to the outer surface of the pin 4, a fixing hole 6 is opened on the surface of the LHP hot plate 5, a support block 7 is fixedly connected to the lower surface of the LHP hot plate 5, and an alarm sensor 8 is fixedly connected to the surface of the box body 1.
[0021] The lifting mechanism 2 includes a first cylinder 201, a stabilizing block 202, a first air inlet 203, a first air outlet 204, a first pipe 205, a first control board 206, a second pipe 207, a first inner cavity 208, a fixed sealing ring 209, a first lower buffer piston 210, a first push rod 211, a first sealing ring 212, a first guide ring 213, a first upper buffer piston 214, a second cylinder 215, a second air inlet 216, a second air outlet 217, a third pipe 218, a second control board 219, a fourth pipe 220, a second inner cavity 221, a second sealing ring 222, a second guide ring 223, a second upper buffer piston 224, and a second lower buffer piston 225. 5. The second push rod 226, the inner surface of the housing 1 is fixedly connected to the first cylinder 201, the side surface of the first cylinder 201 is fixedly connected to the stabilizing block 202, the inner surface of the first cylinder 201 is provided with a first air inlet 203, the inner surface of the first cylinder 201 is provided with a first air outlet 204, the outer surface of the first air inlet 203 is fixedly connected to the first pipe 205, one end surface of the first pipe 205 is fixedly connected to the first control plate 206, the side surface of the first control plate 206 is fixedly connected to the second pipe 207, the inner surface of the first cylinder 201 is provided with a first inner cavity 208, the inner surface of the first inner cavity 208 is fixedly connected to the fixing sealing ring 2. 09. A first lower buffer piston 210 is engaged with the inner surface of the fixed sealing ring 209. A first push rod 211 is fixedly connected to the upper surface of the first lower buffer piston 210. A first sealing ring 212 is fixedly connected to the outer surface of the first push rod 211. A first guide ring 213 is fixedly connected to the outer surface of the first sealing ring 212. A first upper buffer piston 214 is fixedly connected to the outer surface of the first push rod 211. A second cylinder 215 is fixedly connected to the upper surface of the first cylinder 201. A second air inlet 216 and a second air outlet 217 are opened on the inner surface of the second cylinder 215. The outer surface of the second air inlet 216... A third pipe 218 is fixedly connected. A second control plate 219 is fixedly connected to one end surface of the third pipe 218. A fourth pipe 220 is fixedly connected to one side surface of the second control plate 219. A second inner cavity 221 is formed on the inner surface of the second cylinder 215. A second sealing ring 222 is slidably connected to the inner surface of the second inner cavity 221. A second guide ring 223 is fixedly connected to the outer surface of the second sealing ring 222. A second upper buffer piston 224 is fixedly connected to the upper surface of the second sealing ring 222. A second lower buffer piston 225 is fixedly connected to the lower surface of the second sealing ring 222. A second push rod 226 is fixedly connected to the upper surface of the second lower buffer piston 225.The system comprises the following components: first cylinder 201, stabilizing block 202, first air inlet 203, first air outlet 204, first pipe 205, first control board 206, second pipe 207, first inner cavity 208, fixed sealing ring 209, first lower buffer piston 210, first push rod 211, first sealing ring 212, first guide ring 213, first upper buffer piston 214, second cylinder 215, second air inlet 216, second air outlet 217, third pipe 218, second control board 219, fourth pipe 220, second inner cavity 221, second sealing ring 222, second guide ring 223, and second upper buffer piston 224. The second buffer piston 225 and the second push rod 226 are configured so that, during use, when lifting operations are required, the gas intake and exhaust are controlled by the first control plate 206 and the second control plate 219. The gas enters the first air inlet 203 of the first cylinder 201 through the first pipe 205. After entering the first inner cavity 208 of the first cylinder 201, the gas acts on the first buffer piston 210. As the gas pressure increases, the first buffer piston 210 pushes the first push rod 211 upward. The first sealing ring 212 and the first guide ring 213 on the outer side of the first push rod 211 play a sealing and guiding role, ensuring that the first push rod 211 can move steadily. The cylinder 201 moves stationary within the first inner cavity 208. When the first push rod 211 moves a certain distance, it pushes the second lower buffer piston 225 and the second push rod 226 upwards. When further upward movement is needed, gas enters the second inner cavity 221 from the third pipe 218 and the second air inlet 216, generating upward pressure on the second sealing ring 222. The second sealing ring 222 drives the second push rod 226 upwards. The first cylinder 201 and the second cylinder 215 work together, pushing the lifting plate 3 and the ejector pin 4 upwards through the upward movement of the first push rod 211 and the second push rod 226. When downward movement is needed, the first control plate 206 and the second control plate 226... The control gas for the wafer liner 219 is discharged from the first outlet 204 and the second outlet 217. As the gas is discharged, the pressure inside the first cylinder 201 and the second cylinder 215 gradually decreases. Under the action of gravity and load, the first lower buffer piston 210, the first push rod 211, the second lower buffer piston 225, and the second push rod 226 begin to move downwards. The lifting plate 3 and the ejector pin 4 also descend accordingly. This two-stage lifting process, with an additional position close to the surface of the LHP hot plate 5 for low-temperature radiation baking, followed by baking at the lowered position after a certain time, greatly reduces wafer breakage and significantly improves the uniformity of surface film thickness.
[0022] Furthermore, two sets of stabilizing blocks 202 are symmetrically arranged around the central axis of the first cylinder 201. The stabilizing blocks 202 are fixedly connected to the housing 1 by bolts. With the stabilizing blocks 202, during use, the two sets of stabilizing blocks 202 are symmetrically distributed on both sides of the first cylinder 201, providing a more balanced support force for the entire lifting mechanism 2. During the lifting process, it can effectively prevent the first cylinder 201 and the components connected to it from tilting or shaking, ensuring the smooth operation of the lifting action.
[0023] Furthermore, the first air inlet 203 corresponds to the first air outlet 204, and the second air inlet 216 corresponds to the second air outlet 217. With the first air inlet 203 and the first air outlet 204 in place, the corresponding positions of the first air inlet 203 and the first air outlet 204 make it easier to control the lifting mechanism 2 during use. The lifting speed and height can be precisely adjusted by controlling the air inlet and outlet flow rate and pressure to meet different working requirements.
[0024] Furthermore, the outer wall dimension of the first sealing ring 212 matches the inner wall dimension of the first inner cavity 208, and the inner wall dimension of the fixed sealing ring 209 matches the outer wall dimension of the first lower buffer piston 210. Through the arrangement of the first sealing ring 212 and the first inner cavity 208, the outer wall of the first sealing ring 212 and the inner wall of the first inner cavity 208 are tightly fitted during use, which can effectively prevent gas leakage. The matching size of the first sealing ring 212 can ensure the stability of the air pressure in the first inner cavity 208, thereby improving the working efficiency and reliability of the lifting mechanism 2.
[0025] Furthermore, the second pipe 207 is fixedly connected to the first air outlet 204, the fourth pipe 220 is fixedly connected to the second air outlet 217, and two sets of the second guide ring 223 are provided. By setting the second guide ring 223, two sets of the second guide ring 223 are provided during use, which further enhances the stability and reliability of the lifting mechanism 2 and improves the smoothness of the lifting process.
[0026] Furthermore, multiple sets of ejector pins 4 are provided on the surface of the lifting plate 3, and multiple sets of fixing holes 6 are provided on the surface of the LHP hot plate 5. With the arrangement of ejector pins 4 and fixing holes 6, during use, multiple sets of ejector pins 4 can hold the wafer, allowing the wafer to remain stably on the upper surface of the LHP hot plate 5, while fixing holes 6 can fix the wafer, making the wafer more stable on the surface of the LHP hot plate 5.
[0027] Furthermore, the support block 7 is symmetrically arranged with respect to the central axis of the LHP hot plate 5, and multiple sets of alarm sensors 8 are arranged on the surface of the housing 1. Through the arrangement of the alarm sensors 8, the alarm sensors 8 will monitor the wafer during use. If the wafer is removed from the surface of the LHP hot plate 5, an alarm will be issued to remind the staff.
[0028] Working principle: When lifting is required, the gas intake and exhaust are controlled by the first control board 206 and the second control board 219. Gas enters the first air inlet 203 of the first cylinder 201 through the first pipe 205. After entering the first inner cavity 208 of the first cylinder 201, the gas acts on the first lower buffer piston 210. As the gas pressure increases, the first lower buffer piston 210 pushes the first push rod 211 upward. The first sealing ring 212 and the first guide ring 213 on the outside of the first push rod 211 play a sealing and guiding role, ensuring that the first push rod 211 can move stably within the first inner cavity 208. After the first push rod 211 moves a certain distance, it will push the second lower buffer piston 225 and the second push rod 226 upward a certain distance. When further lifting is required, gas enters the second inner cavity 221 through the third pipe 218 and the second air inlet 216, generating upward pressure on the second sealing ring 222. The sealing ring 222 drives the second push rod 226 to move upward. The first cylinder 201 and the second cylinder 215 work together. By moving the first push rod 211 and the second push rod 226 upward, the lifting plate 3 and the ejector pin 4 are pushed up. When it is necessary to descend, the first control plate 206 and the second control plate 219 control the gas to be discharged from the first air outlet 204 and the second air outlet 217. As the gas is discharged, the pressure in the first cylinder 201 and the second cylinder 215 gradually decreases. Under the action of gravity and load, the first lower buffer piston 210, the first push rod 211, the second lower buffer piston 225 and the second push rod 226 begin to move downward. The lifting plate 3 and the ejector pin 4 also descend accordingly. The two-stage lifting and lowering adds a position close to the surface of the LHP hot plate 5 for low-temperature radiation baking. After a certain period of time, the baking is carried out at the lowered position. This can greatly reduce the occurrence of wafer cracking and greatly improve the uniformity of surface film thickness.
[0029] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A LHP (Liftable Hot Plate) for baking wafer, comprising a box (1), characterized in that: The inner surface of the box (1) is provided with a lifting mechanism (2), the upper surface of the lifting mechanism (2) is provided with a lifting plate (3), the upper surface of the lifting plate (3) is fixedly connected with a pin (4), the outer surface of the pin (4) is slidably connected with an LHP hot plate (5), the surface of the LHP hot plate (5) is provided with a fixing hole (6), the lower surface of the LHP hot plate (5) is fixedly connected with a support block (7), and the surface of the box (1) is fixedly connected with an alarm sensor (8). The lifting mechanism (2) includes a first cylinder (201), a stabilizing block (202), a first air inlet (203), a first air outlet (204), a first pipe (205), a first control board (206), a second pipe (207), a first inner cavity (208), a fixed sealing ring (209), a first lower buffer piston (210), a first push rod (211), a first sealing ring (212), a first guide ring (213), a first upper buffer piston (214), a second cylinder (215), a second air inlet (216), a second air outlet (217), a third pipe (218), a second control board (219), a fourth pipe (220), a second inner cavity (221), and a second sealing ring (222). The housing (1) consists of a second guide ring (223), a second upper buffer piston (224), a second lower buffer piston (225), and a second push rod (226). A first cylinder (201) is fixedly connected to the inner surface of the housing (1). A stabilizing block (202) is fixedly connected to one side surface of the first cylinder (201). A first air inlet (203) and a first air outlet (204) are provided on the inner surface of the first cylinder (201). A first pipe (205) is fixedly connected to the outer surface of the first air inlet (203). A first control plate (206) is fixedly connected to one end surface of the first pipe (205). A first control plate (206) is fixedly connected to one side surface of the first control plate (206). A second pipe (207) is fixedly connected. A first inner cavity (208) is formed on the inner surface of the first cylinder (201). A fixed sealing ring (209) is fixedly connected to the inner surface of the first inner cavity (208). A first lower buffer piston (210) is engaged with the inner surface of the fixed sealing ring (209). A first push rod (211) is fixedly connected to the upper surface of the first lower buffer piston (210). A first sealing ring (212) is fixedly connected to the outer surface of the first push rod (211). A first guide ring (213) is fixedly connected to the outer surface of the first sealing ring (212). A first upper buffer piston (214) is fixedly connected to the outer surface of the first push rod (211). A second cylinder (215) is fixedly connected to the upper surface of the first cylinder (201). A second air inlet (216) is provided on the inner surface of the second cylinder (215). A second air outlet (217) is provided on the inner surface of the second cylinder (215). A third pipe (218) is fixedly connected to the outer surface of the second air inlet (216). A second control plate (219) is fixedly connected to one end surface of the third pipe (218). A fourth pipe (220) is fixedly connected to one side surface of the second control plate (219). A second inner cavity (221) is provided on the inner surface of the second cylinder (215). A second sealing ring (222) is slidably connected to the inner surface of the second inner cavity (221).The outer side surface of the second sealing ring (222) is fixedly connected with a second guide ring (223), the upper surface of the second sealing ring (222) is fixedly connected with a second upper buffer piston (224), the lower surface of the second sealing ring (222) is fixedly connected with a second lower buffer piston (225), and the upper surface of the second lower buffer piston (225) is fixedly connected with a second push rod (226).
2. A liftable hot plate (LHP) baking wafer plate according to claim 1, characterized in that: The stabilizing blocks (202) are arranged in two sets symmetrically around the central axis of the first cylinder (201), and the stabilizing blocks (202) are fixedly connected to the housing (1) by bolts.
3. The liftable hot plate (LHP) baking wafer plate according to claim 1, characterized in that: The first air inlet (203) corresponds to the first air outlet (204), and the second air inlet (216) corresponds to the second air outlet (217).
4. The liftable hot plate (LHP) baking wafer plate according to claim 1, characterized in that: The outer wall dimension of the first sealing ring (212) matches the inner wall dimension of the first inner cavity (208), and the inner wall dimension of the fixed sealing ring (209) matches the outer wall dimension of the first lower buffer piston (210).
5. The liftable hot plate (LHP) baking wafer plate according to claim 1, characterized in that: The second pipe (207) is fixedly connected to the first air outlet (204), the fourth pipe (220) is fixedly connected to the second air outlet (217), and the second guide ring (223) is provided in two sets.
6. The liftable hot plate (LHP) baking wafer plate according to claim 1, characterized in that: The ejector pin (4) is provided in multiple sets on the surface of the lifting plate (3), and the fixing hole (6) is provided in multiple sets on the surface of the LHP hot plate (5).
7. The liftable hot plate (LHP) baking round wafer plate according to claim 1, characterized in that: The support block (7) is symmetrically arranged with respect to the central axis of the LHP hot plate (5), and multiple sets of alarm sensors (8) are arranged on the surface of the housing (1).