Wire rod low-pressure automatic forming device

Abstract

The utility model discloses a low-pressure automatic forming device for wire rods, which comprises a demoulding base and a main mould detachably mounted on the demoulding base, a plurality of sheet-shaped mould cavities are arranged in the main mould, a plurality of core wires penetrate through the inside of each mould cavity, the mould cavities are arranged in a linear or matrix manner, a glue injection port is arranged on the main mould, and the glue injection port is communicated with the demoulding base. The rubber injection port is communicated with the mold cavity through the rubber inlet channel, rubber sheets manufactured by the mold cavity are mutually spliced to form a rectangular blocky rubber block, the design can realize layered rapid injection molding of the rubber block and can be mutually spliced and formed, and the multi-layer rubber block forming device has the advantages that the production efficiency is improved, the rubber block is ensured to be uniformly distributed on a core wire, and the forming process of the multi-layer rubber block is simplified.

Description

Technical Field

[0001] This utility model relates to the field of wire production equipment, specifically to a low-pressure automatic wire forming device. Background Technology

[0002] During wire manufacturing, it is often necessary to install retaining blocks inside wire harness connectors to protect the solder joints between the wire cores and the PCB board inside the connector. Specifically, these retaining blocks are typically placed near the solder joints on the cores. When the wire is pulled, the retaining blocks, based on their positioning inside the housing, absorb the tension from the wire direction, limiting the relative tension between the wire ends and the PCB board. Current practices for these retaining blocks generally involve placing multiple cores in a mold with a cavity shaped like the retaining block, with the ends of the cores extending out of the mold. After the mold is closed, hot melt adhesive is injected into the mold, and after the hot melt adhesive cools, the block is demolded to form the retaining block. However, with the explosive growth in the data that wires need to carry, the number of cores inside the wires has also increased exponentially. This means an increase in wire diameter and a larger size for the wire harness connector. Directly injection molding large retaining blocks requires a long cooling time, limiting the production efficiency of wire harness connectors. Furthermore, directly injection molding a large number of cores as a whole can easily lead to uneven adhesive distribution, affecting product consistency. To address these issues, the industry has attempted a layered injection molding process. Specifically, a large number of core wires are first distributed and soldered to multiple PCB boards. Each layer of core wires is then secured with a thin sheet of adhesive, and these sheets are then combined to form a large adhesive block. However, traditional injection molding requires individual injection of adhesive for each core wire layer, which is inefficient. Furthermore, the relative position of the adhesive sheets on the core wires is difficult to control precisely, leading to insufficient structural stability in the final assembled block and affecting the quality of wire assembly. In addition, existing injection molding equipment has room for improvement in areas such as pressure relief buffering, cooling efficiency, and the standardized design of multi-layer molds. Therefore, it is necessary to improve the existing injection molding equipment for adhesive blocks in wire production. Utility Model Content

[0003] The purpose of this application is to provide a low-pressure automatic forming device for wires, which can simultaneously process multiple layers of core wires and ensure uniform glue positioning. This device offers advantages such as improved production efficiency, uniform glue distribution, and simplified multi-layer glue block forming process. This application proposes placing multiple layers of core wires in the same mold structure, utilizing interconnected mold cavities to achieve uniform glue distribution. This avoids the efficiency loss caused by layered glue injection. Furthermore, considering the influence of mold cavity arrangement on glue forming, a structure of sheet-like mold cavities spliced ​​together to form an integral glue block is adopted. This maintains the rapid cooling characteristics of single-layer glue injection while ensuring precise alignment of multiple layers of glue.

[0004] To solve the above problems, the specific technical solution is as follows:

[0005] A low-pressure automatic wire forming device includes a demolding base and a main mold detachably mounted on the demolding base. The main mold has multiple sheet-like mold cavities, through which multiple core wires pass. The mold cavities are arranged linearly or in a matrix. The main mold has a glue injection port, which is connected to the mold cavity through a glue inlet channel. The film sheets formed by the mold cavity are spliced ​​together to form rectangular block-shaped glue blocks.

[0006] Preferably, the inner surface of the mold cavity is provided with protrusions and concave parts that form characteristic structures on the surface of the injection molded part.

[0007] Preferably, each mold cavity is connected to a pressure relief buffer channel.

[0008] Preferably, the mold cavity is connected to a cooling water supply.

[0009] Preferably, the main mold includes an upper mold and a lower mold. The upper surface of the lower mold has a plurality of mold grooves that form a mold cavity. The mold grooves are arranged in a linear pattern. The core wire passes through each of the mold grooves, and the line connecting the core wire and the mold groove is perpendicular to it.

[0010] Preferably, the main mold is provided with multiple injection ports, which are evenly distributed along the edge of the main mold.

[0011] Preferably, the main mold includes multiple stacked mold assemblies, with mold cavities provided between adjacent mold assemblies. The mold cavities are arranged linearly from top to bottom, and the core wire is distributed through each mold cavity, with the line connecting the core wire and the mold cavity perpendicular to each other.

[0012] Preferably, in the mold assembly, the other mold components except for the top and bottom layers have the same structure.

[0013] Preferably, the injection port is located at the bottom.

[0014] Preferably, the main mold includes multiple stacked mold assemblies, with mold cavities provided between adjacent mold assemblies. The mold cavities are arranged linearly within the mold assemblies, all of which are in the same plane. The core wire is distributed through each mold cavity, and the core wire is perpendicular to the plane.

[0015] The low-pressure automatic forming device for wires proposed in this utility model achieves rapid layered injection molding of rubber blocks through modular mold components and multi-cavity collaborative design, and the blocks can be spliced ​​together to form a mold. It has the advantages of improving production efficiency, ensuring uniform distribution of rubber blocks on the core wire, and simplifying the multi-layer rubber block forming process. Attached Figure Description

[0016] Figure 1 This is a structural schematic diagram of Embodiment 1 of the present invention;

[0017] Figure 2 This is a schematic diagram of the structure of Embodiment 2 of this utility model;

[0018] Figure 3 This is a structural schematic diagram of Embodiment 3 of this utility model. Detailed Implementation

[0019] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments. Example

[0020] This embodiment discloses a low-pressure automatic forming device for wires, which includes a demolding base 1 and a main mold 2 detachably installed on the demolding base 1. The main mold 2 has multiple sheet-like mold cavities 3, and multiple core wires 4 pass through the inside of the mold cavities 3. The mold cavities 3 are arranged in a linear or matrix manner. The main mold 2 is provided with a glue injection port 5, which is connected to the mold cavity 3 through a glue inlet channel. The glue blocks 6 formed by the mold cavity 3 are spliced ​​together to form rectangular block glue blocks 6.

[0021] Specifically, the demolding base 1 refers to the basic structure supporting the main mold 2, which can be implemented using a metal base with positioning bosses to ensure mold assembly accuracy. The main mold 2 refers to a detachable module containing the molding structure, which can be quickly assembled with or disassembled from the demolding base 1 via bolt connection or a quick-release mechanism, facilitating maintenance and replacement of main molds 2 of different specifications. The mold cavity 3 refers to the space that accommodates the core wire 4 and molten colloidal material, i.e., the thin sheet space of the adhesive liquid. Multiple accommodating spaces can be formed within the main mold 2 using CNC machining to define the shape of the colloidal molding. The core wire 4 refers to the wire that needs to be coated with the adhesive, which can be evenly distributed and inserted into the mold cavity 3 at a preset interval to ensure uniform coating of the adhesive. The preset interval can be achieved through multiple core wire through holes 7 evenly arranged on the wall of the mold cavity 3. The injection port 5 refers to the adhesive injection channel, which can be set at the edge of the mold and balance the adhesive pressure through a flow diversion design. The inlet channel refers to the channel connecting the injection port 5 and the mold cavity 3, which can adopt a tapered cross-section design to reduce adhesive flow resistance. The term "plastic block splicing" refers to the assembly of multiple sheet-like plastic blocks (6) obtained through cooling and hardening into a rectangular block-shaped overall structure.

[0022] Furthermore, to ensure the mechanical strength of the overall cubic plastic block, it can be achieved through the interlocking mechanism 8 on the surface of the sheet-like plastic block. The interlocking mechanism 8 on the surface of the sheet-like plastic block can also be a feature structure that can identify and distinguish each other. In order to make the surface of the obtained sheet-like plastic block have an interlocking feature structure, the inner surface of the mold cavity is provided with concave and convex parts that form feature structures on the surface of the injection molded part.

[0023] Furthermore, to prevent excess glue from affecting the shape and quality of the glue block, this design incorporates pressure relief buffer channels connected to each mold cavity. These pressure relief buffer channels are channel structures located on the sidewalls or ends of the mold cavity to discharge excess glue or release injection pressure. Specifically, they can be implemented using independent branch channels connected to the mold cavity, with a cross-sectional dimension smaller than the main inlet channel. This structure can accommodate instantaneous pressure fluctuations during glue flow, preventing excessively high local pressure within the mold cavity due to sudden changes in glue flow rate.

[0024] Since the main mold 2 in this case processes the plastic block 6 by first injection molding it in sections and then assembling them together, the cooling of the plastic block 6 can avoid the situation where the outside of the plastic block 6 cools while the inside is not yet formed. Therefore, the main mold 2 can use cold water for rapid cooling, thereby improving production efficiency. The mold cavity 3 is connected to a cooling water supply. The specific structure of the cooling water supply is not the focus of this case and will not be described in detail here. The cooling water supply introduces the cooling medium into the area around the mold cavity 3 through external pipelines. Specifically, this can be achieved by setting an annular pipe on the side wall of the mold cavity 3 and connecting it to an external water pump. Its function is to accelerate the curing process of the colloid by circulating cooling water. After the injection of colloid is completed, the cooling water in the mold cavity 3 within the main mold 2 enters the circulation channel around the mold cavity 3 through the supply system. The heat is continuously carried away, allowing the colloid to cure rapidly within the mold cavity 3. Since the cooling water acts directly on the mold cavity 3, the curing time of the colloid is shortened. At the same time, the position of the core wire 4 within the mold cavity 3 remains fixed, preventing displacement caused by external forces when the colloid is not fully cured.

[0025] The mold cavities 3 can be arranged linearly or in a matrix, depending on the specific processing requirements of different products. In this embodiment, the mold cavities 3 are arranged linearly and horizontally. Specifically, the main mold 2 includes an upper mold 21 and a lower mold 22. The upper surface of the lower mold has multiple mold grooves 31 that make up the mold cavities 3. The mold grooves 31 are arranged linearly, and the core wires 4 are distributed through each mold groove 31. The lines connecting the core wires 4 and the mold grooves 31 are perpendicular. The upper mold 21 and the lower mold 22 refer to two separable mold components. This design is a conventional mold design and will not be elaborated here. The linear arrangement of the mold cavities 3 means that multiple grooves are arranged at intervals along a straight line. Specifically, the mold grooves 31 with equal spacing can be formed on the upper mold 21 and the lower mold 22 by mechanical processing. The linear layout achieves the uniformity of the position of the sheet-like plastic block 6 on the core wire 4. When the upper mold 21 and the lower mold 22 are closed, the upper and lower mold grooves 31 form a closed sheet-like mold cavity 3. After the core wire 4 is distributed, it passes through the core wire through hole 7 on the side of the mold groove 31 and passes through the center of the mold cavity 3, ensuring that the glue is evenly covered around the core wire 4. The extension direction of the core wire 4 forms a right angle with the arrangement direction of the mold groove 31.

[0026] During injection, molten adhesive, i.e., liquid adhesive, enters the mold cavity 3 through the injection channel and fills the cavity along the extension direction of the mold groove 31 to form a thin sheet-like adhesive block 6. The core wires 4 are arranged perpendicular to the mold groove 31, and the liquid adhesive forms a transversely covering sheet-like structure on the surface of the core wires 4. Multiple core wires 4 can simultaneously complete the molding of a single-layer sheet-like adhesive block 6. Through the linear layout of the split main mold 2 and the mold groove 31, multiple core wires 4 can form a thin sheet-like adhesive block 6 with consistent alignment during a single injection process, obtaining multiple stackable sheet-like adhesive blocks 6 without repeated mold disassembly and assembly. By fixing the adhesive blocks 6 of multiple sets of core wires 4 in one go, the misalignment problem of adhesive blocks caused by multiple injections is avoided. At the same time, the linear arrangement of the mold groove 31 improves the injection efficiency and ensures that the relative positions of each adhesive block 6 on the core wires 4 are uniform.

[0027] Furthermore, to improve injection efficiency and avoid the impact of the wide lateral distribution of linearly distributed mold cavities 3 on injection speed, multiple injection ports 5 can be designed on the main mold 2. These ports 5 are evenly distributed along the edge of the main mold 2, allowing simultaneous injection of adhesive into the main mold 2 from multiple ports 5. The surface of the core wire 4 within each mold cavity 3 will be quickly and evenly coated with molten adhesive from the nearest injection port 5. Traditional single-point injection methods use only a single injection port, requiring the adhesive to flow a long distance to fill the mold cavity. While this is suitable for a few cavities, it may lead to inconsistent cooling and solidification rates of the adhesive in the end areas, especially with the multiple mold cavities designed in this case. This solution uses multiple evenly distributed injection ports 5 along the edge to allow the colloid to reach all areas of the mold cavity 3 simultaneously with a shorter path. The temperature gradient distribution of the colloid within the mold cavity 3 is effectively controlled, and the colloid curing time difference is compressed to within the allowable range of the process. This solution improves the synchronicity of the colloid filling speed within the mold cavity 3, ensuring that the molding position of each layer of sheet-like colloid blocks 6 remains uniform, avoiding local colloid accumulation or incomplete filling caused by single-point injection. Example

[0028] This embodiment also discloses a low-pressure automatic wire forming device, which also includes a demolding base 1 and a main mold 2 detachably mounted on the demolding base 1. The main mold 2 has multiple sheet-like mold cavities 3, through which multiple core wires pass. The mold cavities 3 are arranged in a linear fashion, unlike Embodiment 1, where the arrangement of the mold cavities 3 is vertical. In this embodiment, the main mold 2 includes multiple stacked mold components 23, which refers to a combination formed by stacking at least three plate-like structures. The mold components 23 can be positioned together by positioning pins or positioning blocks. Mold cavities 3 are provided between adjacent mold components, arranged vertically from top to bottom. The mold cavities 3 are also flat sheet-like structures, and the inner wall of the mold cavity 3 is also provided with core wire through holes 7 for core wire positioning. The core wires are distributed through each mold cavity 3, and the line connecting the core wire and the mold cavity 3 is perpendicular.

[0029] Similarly, in this embodiment, the inner surface of the mold cavity 3 is provided with a concave-convex part forming an interlocking structure 8 on the surface of the sheet-like rubber block. The mold cavity 3 is connected to a pressure relief buffer rubber channel, and channels that allow cooling water to pass through are evenly distributed around the mold cavity 3.

[0030] The fixing of each mold component 23 within the main mold 2 can be done individually between each layer, or it can be directly fixed as a whole using a method similar to that of a multi-layer lunchbox after pin positioning. Furthermore, in the mold components 23, except for the top and bottom layers, the other mold components can have the same structure. This allows the number of mold cavities 3 inside the main mold 2 to be adjusted in real time according to production needs by adding or removing intermediate mold components. Once the mold components other than the top and bottom layers have the same structure, the intermediate mold components can be interchanged without distinguishing the order during stacking. After the glue is injected from the injection port 5, it can be evenly filled along the mold cavity 3 into the gaps between each layer of mold components 23, forming a sheet-like glue. Since the intermediate layer mold components 23 have the same structure, the relative position of the core wire in each layer of mold cavity 3 remains consistent, thereby avoiding misalignment when splicing the injection-molded glue blocks. Therefore, regardless of the number of mold cavities 3, the resulting sheet-like glue blocks can be completely spliced ​​together, reducing mold development, simplifying the mold preparation process, and ensuring the splicing accuracy of the glue blocks.

[0031] The mold cavities 3 are interconnected, unlike the traditional method of injecting glue into each individual sheet-like plastic block. This multi-layer injection molding not only improves production efficiency but also solves the problem of inconsistent positioning when assembling multiple plastic blocks. It ensures that the plastic blocks are strictly aligned after molding, preventing core wire pulling or exposed solder joints due to misalignment during wire assembly. However, to ensure stability during injection and the integrity of each plastic block layer, the injection port 5 can be located at the bottom. This bottom injection port 5 delivers the glue to the mold cavity 3. This design allows the glue to fill the mold cavity 3 evenly from bottom to top during injection, preventing some glue from quickly entering the lower mold cavity 3 under gravity due to the injection port 5 being too high, which could lead to uneven glue distribution or air bubbles. Example

[0032] Furthermore, to improve production efficiency, the main mold 2 can be designed with the mold cavities 3 arranged in a matrix. Specifically, the main mold 2 includes multiple stacked mold components 23, with mold cavities 3 between adjacent mold components 23. The mold cavities 3 are arranged linearly within the mold components 23, and all mold cavities 3 are in the same plane. The core wire 4 passes through each mold cavity 3, and the core wire 4 is perpendicular to the plane where the mold cavity is located. After the glue is injected through the injection port 5, the main mold 2 can quickly and in large quantities realize the injection molding production of sheet-like glue blocks 6.

[0033] The above description is merely a preferred embodiment of the present utility model and does not constitute any limitation on the technical scope of the present utility model. Therefore, any changes or modifications made in accordance with the claims and description of the present utility model shall fall within the scope of the patent of the present utility model.

Claims

1. A low-pressure automatic wire forming device, characterized in that: The device includes a demolding base and a main mold that is detachably mounted on the demolding base. The main mold has multiple sheet-like mold cavities, and multiple core wires pass through the inside of the mold cavities. The mold cavities are arranged in a linear or matrix pattern. The main mold has a glue injection port, which is connected to the mold cavity through a glue inlet channel. The film sheets produced by the mold cavity are spliced ​​together to form a rectangular block.

2. The low-pressure automatic wire forming device according to claim 1, characterized in that: The inner surface of the mold cavity is provided with protrusions and concave parts that form characteristic structures on the surface of the injection molded part.

3. The low-pressure automatic wire forming device according to claim 1, characterized in that: Each mold cavity is connected to a pressure relief buffer channel.

4. The low-pressure automatic wire forming device according to claim 1, characterized in that: The mold cavity is connected to a cooling water supply.

5. The low-pressure automatic wire forming device according to claim 1, characterized in that: The main mold includes an upper mold and a lower mold. The upper surface of the lower mold has a plurality of mold grooves that form a mold cavity. The mold grooves are arranged in a linear pattern. The core wire passes through each mold groove, and the line connecting the core wire and the mold groove is perpendicular to it.

6. The low-pressure automatic wire forming device according to claim 5, characterized in that: The main mold is provided with multiple injection ports, which are evenly distributed along the edge of the main mold.

7. The low-pressure automatic wire forming device according to claim 1, characterized in that: The main mold includes multiple stacked mold assemblies, with mold cavities provided between adjacent mold assemblies. The mold cavities are arranged linearly from top to bottom, and the core wire is distributed through each mold cavity. The line connecting the core wire and the mold cavity is perpendicular to the core wire.

8. The low-pressure automatic wire forming device according to claim 7, characterized in that: In the mold assembly, except for the top and bottom layers, the other mold components have the same structure.

9. The low-pressure automatic wire forming device according to claim 7, characterized in that: The injection port is located at the bottom.

10. The low-pressure automatic wire forming device according to claim 1, characterized in that: The main mold includes multiple stacked mold assemblies, with mold cavities provided between adjacent mold assemblies. The mold cavities are arranged linearly within the mold assemblies, and all the mold cavities are in the same plane. The core wire is distributed through each mold cavity, and the core wire is perpendicular to the plane.

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