Flexible circuit board air tightness testing device

Abstract

The utility model relates to the technical field of flexible circuit boards, and discloses a flexible circuit board air tightness testing device, which comprises a sky board assembly comprising a sky board and a horn device arranged on the sky board; the carrier plate assembly comprises a carrier plate, and the carrier plate is used for bearing and placing a flexible circuit board to be tested; and the upper jacking assembly comprises an upper jacking mechanism and a test module, and the test module is arranged on the upper jacking mechanism. According to the air tightness testing device for the flexible circuit board provided by the utility model, loading, unloading and testing of the flexible circuit board to be tested can be flexibly realized, each main part is respectively arranged so that each part can be quickly replaced and adjusted according to different tested products, and the layout is flexible; in addition, the testing device can meet the operation requirement of targeted flexible circuit board air tightness testing, and is simple in structure and low in cost.

Description

Technical Field

[0001] This utility model relates to the field of flexible circuit board technology, and in particular to a flexible circuit board airtightness testing device. Background Technology

[0002] The demand for testing flexible printed circuit boards (FPCs) is increasing rapidly, with numerous testing types and environments, particularly in 5G communications, computers, mobile phones, and wearable electronic devices. As these fields increasingly require high-precision, miniaturized testing technologies, traditional large-module designs are showing their limitations in terms of cost, space utilization, and flexibility. Especially in semiconductor manufacturing, new energy battery testing, and high-precision electronic component testing, achieving efficient and accurate testing at the microscale has become crucial for technological breakthroughs.

[0003] For the airtightness testing of flexible circuit boards, if the traditional integrated large module equipment is used, it will lead to low testing efficiency, inflexibility, and inconvenient equipment switching when testing a small number of individual items, such as the airtightness of flexible circuit boards. This will also occupy the use of the large module equipment and reduce its original working time and efficiency.

[0004] Therefore, there is a lack of equipment in the current technology that can be used to test the airtightness of flexible circuit boards in a targeted and flexible manner. Summary of the Invention

[0005] To address the aforementioned problems, the present invention aims to provide a flexible circuit board airtightness testing device, which can solve the problem of the lack of targeted and flexible equipment for testing the airtightness of flexible circuit boards in the prior art.

[0006] The above-mentioned technical objective of this utility model is achieved through the following technical solution:

[0007] A flexible circuit board airtightness testing device, comprising:

[0008] A ceiling assembly, the ceiling assembly including a ceiling and a speaker device, the speaker device being disposed on the ceiling;

[0009] A carrier assembly, the carrier assembly including a carrier plate, the carrier plate being used to support and place a flexible circuit board to be tested;

[0010] An upper lifting assembly, the upper lifting assembly including an upper lifting mechanism and a test module, the test module being disposed on the upper lifting mechanism;

[0011] The top plate assembly is fixedly installed, the upper lifting mechanism is movable and height-adjustable below the top plate assembly, and the carrier plate assembly is movable and height-adjustable between the top plate assembly and the upper lifting mechanism. The upper lifting mechanism can lift and contact the carrier plate assembly, and drive the carrier plate assembly to rise together to contact the top plate assembly, so that a sealed space for supporting the flexible circuit board to be tested is formed between the carrier plate and the top plate. The test module can rise with the upper lifting mechanism and be electrically connected to the flexible circuit board to be tested placed on the carrier plate. The speaker device can emit sound into the sealed space to complete the test.

[0012] In one feasible embodiment, the test module includes a mounting plate, a driving component, and a spring pin module. The mounting plate is fixedly mounted on the upper lifting mechanism. One end of the driving component is fixedly mounted on the mounting plate, and the other end is provided with the spring pin module. The driving component can drive the spring pin module to move up and down to make an electrical connection with the flexible circuit board to be tested placed on the carrier plate.

[0013] In one feasible embodiment, the carrier plate assembly is provided with at least one first guide hole, and the spring pin module is provided with at least one first guide shaft corresponding to the first guide hole. The first guide shaft is inserted into the first guide hole to form a positioning when the spring pin module rises.

[0014] In one feasible embodiment, the carrier plate assembly is further provided with at least one second guide hole, and the spring pin module is provided with at least one second guide shaft corresponding to the second guide hole. When the upper lifting mechanism pushes up, the second guide shaft is inserted into the second guide hole to form a positioning. The second guide hole and the first guide hole are different in position and diameter, and the second guide shaft and the first guide shaft are different in position and diameter.

[0015] In one feasible embodiment, the carrier assembly further includes a positioning block disposed on the carrier, the positioning block having a positioning structure for positioning and placing the flexible circuit board to be tested, the positioning block having a first guide hole and a second guide hole, and the positioning block having a through hole for the probe of the spring pin module to pass through.

[0016] In one feasible embodiment, a positioning clamping block is provided on the side of the top plate facing the carrier assembly, the positioning clamping block being used to align with the positioning block to clamp and fix the flexible circuit board to be tested.

[0017] In one possible embodiment, the top panel assembly further includes a first buffer member disposed on the top panel and oriented toward the carrier assembly.

[0018] In one feasible embodiment, the carrier plate is provided with at least one third guide hole, and the upper lifting mechanism is provided with at least one third guide shaft corresponding to the third guide hole. When the upper lifting mechanism pushes upward, the third guide shaft is inserted into the third guide hole to form a positioning.

[0019] In one feasible embodiment, the carrier plate is provided with at least one fourth guide hole, and the top plate is provided with at least one fourth guide shaft corresponding to the fourth guide hole. The fourth guide shaft is inserted into the fourth guide hole to form a positioning when the top mechanism connects to the carrier plate assembly for top positioning.

[0020] In one feasible embodiment, the upper lifting assembly further includes a sealing block disposed on the upper lifting mechanism, which can be pushed up with the upper lifting mechanism below the carrier plate to seal the lower end face of the carrier plate.

[0021] By adopting the above technical solution, this utility model has at least the following beneficial effects:

[0022] The flexible circuit board airtightness testing device provided by this utility model has a structure consisting of three parts: a top plate assembly, a carrier plate assembly, and an upper top assembly. These parts move relative to each other, allowing for flexible loading and unloading of the flexible circuit board to be tested and the testing process to be performed. The top plate assembly, carrier plate assembly, and upper top assembly are respectively equipped with a speaker device simulating the testing environment, a carrier plate for placing the flexible circuit board to be tested, and a testing module providing testing functions. Each major part is designed to allow for quick replacement and adjustment according to different testing products; for example, different carrier plate assemblies can be switched for different products, resulting in a flexible layout. Furthermore, this testing device can meet the specific operational needs of flexible circuit board airtightness testing, and its structure is simple and cost-effective. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the structure of the flexible circuit board airtightness testing device provided in this embodiment of the utility model;

[0024] Figure 2 This is a schematic diagram of the structure of the test module provided in this embodiment of the utility model;

[0025] Figure 3 This is a schematic diagram of the cooperation between the test module and the positioning block provided in this embodiment of the utility model;

[0026] Figure 4 This is a schematic diagram of the carrier plate assembly provided in an embodiment of the present invention;

[0027] Figure 5 This is a first-view structural schematic diagram of the roof assembly provided in this embodiment of the utility model;

[0028] Figure 6 This is a second-view structural schematic diagram of the ceiling assembly provided in this embodiment of the present invention;

[0029] Figure 7 This is a schematic diagram of the structure of the top component provided in this embodiment of the utility model.

[0030] In the attached diagram, 1. Top plate assembly; 11. Top plate; 12. Horn device; 13. Positioning and clamping block; 14. First buffer component; 15. Fourth guide shaft; 2. Carrier plate assembly; 21. Carrier plate; 22. First guide hole; 23. Second guide hole; 24. Positioning block; 214. Through hole; 25. Third guide hole; 26. Fourth guide hole; 3. Top assembly; 31. Top mechanism; 32. Test module; 321. Mounting and fixing plate; 322. Drive component; 323. Spring pin module; 3231. Probe; 3232. Base; 324. First guide shaft; 325. Second guide shaft; 33. Third guide shaft; 34. Sealing block. Detailed Implementation

[0031] The technical solution of this utility model patent will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0032] In the description of this utility model, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0033] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0034] See Figure 1 ,in Figure 1This is a schematic diagram of the flexible circuit board airtightness testing device provided in this embodiment. The flexible circuit board airtightness testing device provided in this embodiment includes:

[0035] The ceiling assembly 1 includes a ceiling 11 and a speaker device 12, wherein the speaker device 12 is disposed on the ceiling 11;

[0036] Carrier assembly 2, the carrier assembly 2 includes a carrier 21, the carrier 21 is used to support and place the flexible circuit board to be tested;

[0037] The upper lifting component 3 includes an upper lifting mechanism 31 and a test module 32, wherein the test module 32 is disposed on the upper lifting mechanism 31.

[0038] The top plate assembly 1 is fixedly installed, the upper lifting mechanism 31 is movably installed below the top plate assembly 1, and the carrier plate assembly 2 is movably installed between the top plate assembly 1 and the upper lifting mechanism 31. The upper lifting mechanism 31 can lift up and contact the carrier plate assembly 2, and drive the carrier plate assembly 2 to rise together and contact the top plate assembly 1, so that a sealed space for supporting the flexible circuit board to be tested is formed between the carrier plate 21 and the top plate 11. The test module 32 can rise with the upper lifting mechanism and be electrically connected to the flexible circuit board to be tested placed on the carrier plate 21. The speaker device 12 can emit sound into the sealed space to complete the test.

[0039] It is understandable that using traditional large-module equipment for airtightness testing of flexible circuit boards would result in low testing efficiency, inflexibility, and inconvenient equipment switching, further reducing the original working time and efficiency of the large-module equipment. The flexible circuit board airtightness testing device provided by this invention uses a three-part structure—a top plate assembly, a carrier plate assembly, and an upper assembly—that moves relative to each other. This allows for rapid replacement and adjustment of each part according to different test products, offering flexible layout and enabling targeted airtightness testing of flexible circuit boards. It also boasts a simple structure and low cost.

[0040] Furthermore, traditional testing equipment typically integrates the testing function and product positioning components, with each component used in a one-to-one manner. The flexible circuit board (PCB) is placed and fixed, and the probes of the testing component directly contact the PCB before power-on testing. However, this approach presents several problems. Because the testing function and product positioning components are fixed in a one-to-one configuration, different integrated testing equipment needs to be customized for different PCBs, leading to increased testing costs and inflexible equipment use. The flexible circuit board airtightness testing device provided by this invention separates the testing module responsible for the testing function from the carrier board assembly responsible for product positioning. This allows for rapid response in the overall testing process and facilitates switching of the carrier board assembly according to different test products, significantly improving the flexibility and adaptability of the testing.

[0041] It is understandable that the airtightness test of flexible circuit boards is mainly because the incoming flexible circuit boards may have defects such as broken components, poor soldering, or broken loops after mounting, but other performance is normal. A sound leakage test is needed to confirm whether the mounting and incoming components are normal. For example, for microphone products, a sound sealing test is required on the flexible circuit board to isolate external noise. High and low frequencies and specific sound pressure levels are output through a speaker in the internal cavity to detect whether the output of the flexible circuit board is affected. This diagnostic process confirms that the airtightness of the internal sealing loops and circuits is good, and no noise infiltration is allowed. Further details can be understood by those skilled in the art based on the description and conventional knowledge of the prior art; no further elaboration is provided here.

[0042] It is understood that in this embodiment, the flexible circuit board airtightness testing device can be used in conjunction with other equipment, such as setting up a frame structure for the overall equipment. The top plate assembly 1 can be fixedly connected to the frame structure at the top, the carrier plate assembly 2 can be raised and lowered on the frame structure via guide rods, and the top assembly 3 can be raised and lowered at the bottom of the frame structure via a lifting mechanism such as a telescopic rod or cylinder. In general, the main purpose is to achieve the fixed setting of the top plate assembly 1, the elliptical setting of the top assembly 3 below the top plate assembly 1, and the elliptical setting of the carrier plate assembly 2 between the top plate assembly 1 and the top assembly 3. The top assembly 3 can push upwards to contact and cooperate with the carrier plate assembly 2, and drive the carrier plate assembly 2 upwards together to contact and cooperate with the top plate assembly 1. In addition to the above examples, those skilled in the art can also implement more forms according to actual needs and in combination with existing technology and conventional knowledge, which will not be further described here.

[0043] It is understood that the speaker device 12 mainly refers to a device or component that can emit sound. Its main purpose is to emit sound to simulate the test environment so as to act on the flexible circuit board through sound waves and detect whether the signal or function of the flexible circuit board connected to the external output through the test module 32 is affected. The specific speaker device 12 can be selected according to actual needs, and will not be described in further detail here.

[0044] It is understandable that the main function of the test module 32 is to form an electrical connection with the flexible circuit board under test so as to connect the circuit of the flexible circuit board. The test module 32 can be a simple electrical connection component, which is only responsible for connecting the flexible circuit board to the external test circuit or external test equipment. It can also be a test device that integrates connection and test functions. In specific tests, it can receive the signal output of the flexible circuit board so as to detect whether the output of the flexible circuit board is affected by the sound emitted by the speaker device 12, thereby demonstrating the sensitivity of the flexible circuit board.

[0045] Understandably, the purpose of a sealed space is to isolate the flexible circuit board under test from the external environment and avoid interference from the external environment. Reasonable sealing is sufficient, with complete sealing being preferred. The specific situation can be adjusted according to actual needs.

[0046] In this embodiment, as Figure 2 As shown, Figure 2 This is a schematic diagram of the test module provided in this embodiment. The test module 32 includes a mounting plate 321, a driving component 322, and a spring pin module 323. The mounting plate 321 is fixedly mounted on the upper lifting mechanism 31. One end of the driving component 322 is fixedly mounted on the mounting plate 321, and the other end is provided with the spring pin module 323. The driving component 322 can drive the spring pin module 323 to rise and fall to make an electrical connection with the flexible circuit board to be tested placed on the carrier plate 21.

[0047] It is understandable that, such as Figure 2 As shown, the spring pin module 323 mainly includes a probe 3231 and a base 3232 for mounting the probe 3231. The probe 3231 is mainly used to make contact with the flexible circuit board under test to form an electrical connection. The specific structural design of the probe 3231 and the base 3232 will not be described in detail here. Generally speaking, the probe 3231 can form a circuit loop between the connection point of the circuit board under test and the external test equipment, so as to test the influence of the circuit board under test in the sound-emitting environment of the speaker device 12. The first driving component 322 mainly realizes the driving of the spring pin module 323. It can be a telescopic cylinder or a conventional telescopic mechanical mechanism, which will not be described in detail here.

[0048] In this embodiment, as Figures 3-4 As shown, Figure 3 This is a schematic diagram showing the cooperation between the test module and the positioning block provided in an embodiment of this utility model. Figure 4 This is a schematic diagram of the carrier plate assembly provided in this embodiment. The carrier plate assembly 2 is provided with at least one first guide hole 22, combined with... Figure 2 As shown, the spring needle module 323 is provided with at least one first guide shaft 324 corresponding to the first guide hole 22. The first guide shaft 324 is inserted into the first guide hole 22 to form a positioning when the spring needle module 323 rises.

[0049] In this embodiment, the carrier plate assembly 2 is further provided with at least one second guide hole 23, and the spring pin module 323 is provided with at least one second guide shaft 325 corresponding to the second guide hole 23. The second guide shaft 325 is inserted into the second guide hole 23 to form a positioning when the spring pin module 323 rises. The second guide hole 23 is different from the first guide hole 22 in terms of position and diameter, and the second guide shaft 325 is different from the first guide shaft 324 in terms of position and diameter.

[0050] It is understandable that, such as Figure 2 As shown, the first guide shaft 324 and the second guide shaft 325 can both be mounted on the base 3232 of the spring pin module 323. However, mounting them in other locations is not excluded; this is merely illustrative and not a strict limitation. Multiple first guide shafts 324 and second guide shafts 325 can be provided. In this embodiment, two are used as an example. The first guide shafts 324 and second guide shafts 325 are staggered around the probe 3231, thus forming a multi-level guiding constraint through the first guide shafts 324 and second guide shafts 325. This further improves the positioning accuracy between the test module 32 and the circuit board under test, ensures effective electrical connection, and avoids interference with test results caused by poor contact. It is understood that the first guide shaft 324 and the first guide hole 22, and the second guide shaft 325 and the second guide hole 23, are clearance fits or transition fits to facilitate repeated insertion and mating.

[0051] In this embodiment, as Figure 4 As shown, combined with Figure 3 The carrier board assembly 2 further includes a positioning block 24, which is disposed on the carrier board 21. The positioning block 24 is provided with a positioning structure for positioning and placing the flexible circuit board to be tested. The positioning block 24 is provided with a first guide hole 22 and a second guide hole 23, and the positioning block 24 is provided with a through hole 241 for the probe 3231 of the spring pin module 323 to pass through.

[0052] It is understandable that the positioning structure on the positioning block 24 can be a conventional structure such as a positioning groove or a positioning protrusion. Its main purpose is to achieve preliminary positioning and restriction of the flexible circuit board to be tested, so that the flexible circuit board to be tested will not shift during the operation of the testing device.

[0053] Furthermore, this embodiment uses the example of the first guide hole 22 and the second guide hole 23 being disposed on the positioning block 24. This arrangement allows the positioning block 24, which directly positions the flexible circuit board to be tested, and the test module 32 to directly cooperate through the first guide hole 22, the first guide shaft 324, the second guide hole 23, and the second guide shaft 325, reducing intermediate connecting parts and thus better ensuring accuracy. Of course, positioning can also be achieved by disposing of the first guide hole 22 and the second guide hole 23 on the carrier plate 21. Those skilled in the art can choose the appropriate setting based on actual needs, and this will not be described further here.

[0054] Furthermore, since the positioning block 24 is located above the test module 32, a through hole 241 is provided to facilitate the probe 3231 of the test module 32 to pass through the through hole 241 and make contact with the circuit board under test to form an electrical connection when the test module 32 rises. Additionally, the through hole 241 mainly provides space for the probe 3231 of the spring pin module 323 to pass through and contact the flexible circuit board under test; its structure is not strictly designed, such as... Figure 3 , Figure 4 The diagram may show a notch structure. As for the location and size of the perforation 241, those skilled in the art can adjust the design according to the actual situation, and it will not be described further here.

[0055] In this embodiment, as Figures 5-6 As shown, Figures 5-6 These are schematic diagrams of the first and second views of the top plate assembly provided in this embodiment. The top plate 11 is provided with a positioning and clamping block 13 on the side facing the carrier plate assembly 2. The positioning and clamping block 13 is used to align with the positioning block 24 to press and fix the flexible circuit board to be tested.

[0056] In this embodiment, as Figures 5-6As shown, the top plate assembly 1 also includes a first buffer member 14, which is disposed on the top plate 11 and faces the carrier plate assembly 2. It is understood that the main function of the first buffer member 14 is to prevent excessive collision and damage when the carrier plate assembly 2 rises with the upper lifting mechanism 31 and comes into contact with the top plate assembly 1. The first buffer member 14 can be a pin with a spring sleeved on it, one end of which is fixed to the top plate 11, and the other end facing the carrier plate 21. The carrier plate 21 has corresponding holes that engage with the pin. When the two work together, the compression of the spring achieves shock absorption and cushioning. Further details are not described here; those skilled in the art can choose from common cushioning methods in the prior art according to actual needs.

[0057] In addition to the first buffer 14 provided in the top plate assembly 1, a second buffer (not shown) can be provided between the spring pin module 323 and the driving component 322 in the test module 32. The second buffer can be designed with reference to the principle of the first buffer 14. Its main purpose is to buffer the spring pin module 323 when it is driven to rise by the driving component 322 and comes into contact with the flexible circuit board under test, so as to avoid damage to the flexible circuit board under test.

[0058] In this embodiment, as Figure 4 , Figure 7 As shown, Figure 7 The above is a schematic diagram of the top assembly structure provided in this embodiment. The carrier plate 21 is provided with at least one third guide hole 25, and the top mechanism 31 is provided with at least one third guide shaft 33 corresponding to the third guide hole 25. When the top mechanism 31 is pushed up, the third guide shaft 33 is inserted into the third guide hole 25 to form a positioning.

[0059] It is understandable that the fit between the third guide hole 25 and the third guide shaft 33 can be understood by referring to the fit between the first guide hole 22 and the first guide shaft 324 mentioned above. It mainly realizes the guiding and positioning function to ensure the accuracy of the fit between the carrier plate assembly 2 and the upper lifting mechanism 31. More details will not be described further here.

[0060] In this embodiment, as Figure 4 As shown, the carrier plate 21 is provided with at least one fourth guide hole 26, combined with Figure 6 As shown, the top plate 11 is provided with at least one fourth guide shaft 15 corresponding to the fourth guide hole 26. The fourth guide shaft 15 is inserted into the fourth guide hole 26 to form a positioning when the upper lifting mechanism 31 connects to the upper lifting of the carrier plate assembly 2.

[0061] Similarly, the fit between the fourth guide hole 26 and the fourth guide shaft 15 can be understood by referring to the fit between the first guide hole 22 and the first guide shaft 324 mentioned above. It mainly realizes the guiding and positioning function to ensure the accuracy of the fit between the carrier plate assembly 2 and the top plate assembly 1. More details will not be described further here.

[0062] In this embodiment, as Figure 7 As shown, the upper top assembly 3 also includes a sealing block 34, which is disposed on the upper top mechanism 31 and can be pushed up with the upper top mechanism 31 to seal the lower end face of the carrier plate 21.

[0063] It is understandable that the carrier plate 21 is usually designed with various holes. In order to ensure the airtightness of the sealed space, this embodiment uses a corresponding sealing block 34. When the upper lifting mechanism 31 is lifted, the sealing block 34 can press against the corresponding hole on the lower end face of the carrier plate 21, thereby providing a sealed space testing environment.

[0064] The working process and principle of the flexible circuit board airtightness testing device of this utility model:

[0065] When testing the airtightness of the flexible circuit board, the board is automatically fed onto the carrier assembly 2 and placed on the positioning block 24 for precise positioning. Then, the upper lifting assembly 3 (which can be a telescopic module, cylinder, motor, or other actuator) is driven to lift the carrier assembly 2. The third guide hole 25 on the carrier 21 and the third guide shaft 33 on the upper lifting assembly 3 are inserted and guided, supporting the carrier assembly 2 as it continues to move upward. This allows the fourth guide hole 26 of the carrier assembly 2 to engage with the fourth guide shaft 15 of the top plate assembly 1 for positioning and proper fit, thus meeting the requirements for testing. At this point, the product positioning clamping block 13, the top plate 11, the carrier 21, the sealing block 34, and the test module 32 form a sealed space, isolating external noise interference and transmission. As the test module 32 rises with the lifting mechanism 31, it comes into contact with the carrier plate assembly 2. Further, the spring pin module 323 of the test module 32, driven by the drive component 322 (module, motor, cylinder, etc.), performs the lifting operation. The first guide shaft 324, the second guide shaft 325 and the positioning block 24 respectively provide guidance, completing two-stage guidance and positioning. The spring pin module 323 contacts the flexible circuit board of the positioning block 24 and completes the pinning action, connecting the relevant signals of the flexible circuit board to the test system. Based on the sound emitted by the speaker device 12, the airtightness test of the flexible circuit board is performed to verify the sound shielding effect of the flexible circuit board.

[0066] Due to the adoption of the above technical solution, this utility model has the following beneficial effects:

[0067] The flexible circuit board airtightness testing device provided by this utility model has a structure consisting of three parts: a top plate assembly 1, a carrier plate assembly 2, and an upper top assembly 3, which move relative to each other in a lifting and lowering motion. This allows for flexible loading and unloading of the flexible circuit board to be tested and the testing process. The top plate assembly 1, the carrier plate assembly 2, and the upper top assembly 3 are respectively equipped with a speaker device 12 to simulate the test environment, a carrier plate 21 to place the flexible circuit board to be tested, and a test module 32 to provide testing functions. The separate arrangement of each main part allows for quick replacement and adjustment of each part according to different test products, resulting in a flexible layout. In addition, this testing device can meet the operational needs of targeted flexible circuit board airtightness testing, and has a simple structure and low cost.

[0068] Although the present invention has been described in detail above with general descriptions and specific embodiments, some modifications or improvements can be made to it, which will be obvious to those skilled in the art. Therefore, all such modifications or improvements made without departing from the spirit of the present invention fall within the scope of protection claimed by the present invention.

Claims

1. A flexible circuit board airtightness testing device, characterized in that, include: A ceiling assembly, the ceiling assembly including a ceiling and a speaker device, the speaker device being disposed on the ceiling; A carrier assembly, the carrier assembly including a carrier plate, the carrier plate being used to support and place a flexible circuit board to be tested; An upper lifting assembly, the upper lifting assembly including an upper lifting mechanism and a test module, the test module being disposed on the upper lifting mechanism; The top plate assembly is fixedly installed, the upper lifting mechanism is movable and height-adjustable below the top plate assembly, and the carrier plate assembly is movable and height-adjustable between the top plate assembly and the upper lifting mechanism. The upper lifting mechanism can lift and contact the carrier plate assembly, and drive the carrier plate assembly to rise together to contact the top plate assembly, so that a sealed space for supporting the flexible circuit board to be tested is formed between the carrier plate and the top plate. The test module can rise with the upper lifting mechanism and be electrically connected to the flexible circuit board to be tested placed on the carrier plate. The speaker device can emit sound into the sealed space to complete the test.

2. The flexible circuit board airtightness testing device according to claim 1, characterized in that, The test module includes a mounting plate, a driving component, and a spring pin module. The mounting plate is fixedly mounted on the upper lifting mechanism. One end of the driving component is fixedly mounted on the mounting plate, and the other end is provided with the spring pin module. The driving component can drive the spring pin module to move up and down to make an electrical connection with the flexible circuit board to be tested placed on the carrier plate.

3. The flexible circuit board airtightness testing device according to claim 2, characterized in that, The carrier plate assembly is provided with at least one first guide hole, and the spring pin module is provided with at least one first guide shaft corresponding to the first guide hole. When the spring pin module rises, the first guide shaft is inserted into the first guide hole to form a positioning.

4. The flexible circuit board airtightness testing device according to claim 3, characterized in that, The carrier plate assembly is also provided with at least one second guide hole, and the spring pin module is provided with at least one second guide shaft corresponding to the second guide hole. The second guide shaft is inserted into the second guide hole to form a positioning when the spring pin module rises. The second guide hole and the first guide hole are different in position and diameter, and the second guide shaft and the first shaft are different in position and diameter.

5. The flexible circuit board airtightness testing device according to claim 4, characterized in that, The carrier assembly further includes a positioning block disposed on the carrier. The positioning block is provided with a positioning structure for positioning and placing the flexible circuit board to be tested. The positioning block is provided with a first guide hole and a second guide hole, and the positioning block is provided with a through hole for the probe of the spring pin module to pass through.

6. The flexible circuit board airtightness testing device according to claim 5, characterized in that, The top plate is provided with a positioning and clamping block on the side facing the carrier assembly. The positioning and clamping block is used to align with the positioning block to press and fix the flexible circuit board to be tested.

7. The flexible circuit board airtightness testing device according to claim 1, characterized in that, The top panel assembly further includes a first buffer member, which is disposed on the top panel and oriented toward the carrier assembly.

8. The flexible circuit board airtightness testing device according to claim 1, characterized in that, The carrier plate is provided with at least one third guide hole, and the upper lifting mechanism is provided with at least one third guide shaft corresponding to the third guide hole. When the upper lifting mechanism pushes upward, the third guide shaft is inserted into the third guide hole to form a positioning.

9. The flexible circuit board airtightness testing device according to claim 1, characterized in that, The carrier plate is provided with at least one fourth guide hole, and the top plate is provided with at least one fourth guide shaft corresponding to the fourth guide hole. When the top mechanism connects to the carrier plate assembly for top positioning, the fourth guide shaft is inserted into the fourth guide hole to form a positioning.

10. The flexible circuit board airtightness testing device according to claim 1, characterized in that, The upper lifting assembly also includes a sealing block, which is disposed on the upper lifting mechanism and can be pushed up below the carrier plate along with the upper lifting mechanism to seal the lower end face of the carrier plate.

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