Cooling device used after SMT patch welding

Abstract

The utility model discloses a device for cooling after SMT (Surface Mount Technology) patch welding, a patch is conveyed into a cooling cover through a conveying belt on a conveying table, a semiconductor cooler rapidly cools air, and the air is uniformly blown to the patch through an air feeder to realize cooling; baffles are arranged at openings in the two ends of the cooling cover and form a refrigeration cavity with an isolation plate, cold air loss is slowed down, the cooling efficiency is improved, an air inlet is obliquely and upwards formed and matched with a buffer plate and an air outlet hole, the air flowing and pre-cooling effect is optimized, an outer dustproof net prevents dust from entering, and the service life of equipment is prolonged. The device is reasonable in structure and remarkable in cooling effect, can effectively improve the production efficiency and the product quality, and has high practicability and popularization value.

Description

Technical Field

[0001] This utility model relates to the field of SMT (Surface Mount Technology) technology, specifically a cooling device for SMT (Surface Mount Technology) soldering after soldering. Background Technology

[0002] SMT (Surface Mount Technology) refers to a series of processes performed on a PCB (Printed Circuit Board) substrate. This process includes solder paste printing, component placement, reflow soldering, AOI (Optical Inspection) inspection, and board separation. After the reflow soldering process, the PCB is at a high temperature and needs to be cooled before proceeding to the next step. Traditionally, this is done by using fans to cool the reflow-soldered PCB. However, this method is inefficient due to the long cooling time, inconsistent fan airflow, the need for numerous fans and long cooling circuits, and its inconvenience in production.

[0003] Utility model CN218868599U discloses a cooling device for SMT surface mount soldering, including a conveyor belt for transporting the PCB board after SMT surface mount soldering. A cooling mechanism is provided above the conveyor belt, which includes a high-pressure centrifugal fan and an air distribution box. The air distribution box is flat and horizontally arranged. The air supply end of the high-pressure centrifugal fan is connected to the middle of the air distribution box. The air distribution box has several air supply ports on both sides of the air supply end of the high-pressure centrifugal fan to supply air to the conveyor line. A fan cover is also installed at the lower end of the air distribution box close to the conveyor belt.

[0004] The device of this utility model delivers air to a flat air distribution box via a high-pressure centrifugal fan above the conveyor line. The air volume is then quickly distributed to the air outlets on both sides for air cooling. Since the lower end of the air distribution box is also equipped with a wind hood, when a large amount of air is delivered from the air outlet, the wind hood can also collect some of the disturbed air, thus improving the cooling efficiency.

[0005] However, the cooling effect of this equipment is limited by air cooling, and multiple air cooling devices need to be installed on the conveyor line to achieve a good cooling effect. In addition, a large space is needed to arrange multiple fans and heat sinks, especially on the conveyor line, which may increase the size and floor space of the equipment. Utility Model Content

[0006] In view of the technical problems in the prior art, the present invention provides a cooling device for SMT chip soldering, the purpose of which is to solve the above problems.

[0007] To achieve the above objectives, this utility model provides the following technical solution:

[0008] A cooling device for SMT (Surface Mount Technology) soldering after surface mount technology (SMT) assembly includes a conveyor platform with a conveyor belt for conveying SMT components. A cooling cover is fixedly installed on the upper side of the conveyor platform corresponding to the conveyor belt. The cooling cover is open at both ends along the conveying direction. A semiconductor cooler is installed on the top of the cooling cover. An isolation plate is horizontally installed inside the cooling cover opposite the semiconductor cooler. A blower is installed on the isolation plate corresponding to the conveyor belt.

[0009] Preferably, the blower has an expansion port on its lower side corresponding to the conveyor belt.

[0010] Preferably, the top of the cooling cover is a detachable cover plate, which is fixedly connected by bolts.

[0011] Preferably, baffles are provided at the openings at both ends of the cooling cover, and a cooling cavity is formed between the baffles, the isolation plate and the cooling cover. Air inlets are provided on the left and right sides of the cooling cover respectively.

[0012] Preferably, the air inlet is inclined upwards from the outside to the inside.

[0013] Preferably, a dustproof net is provided on the outer side of the cooling cover at the air inlet.

[0014] Preferably, a buffer plate is provided in the cooling cavity at the air inlet, and multiple air outlet holes are evenly opened on the buffer plate.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] This utility model provides a cooling device for SMT (Surface Mount Technology) surface mount soldering after soldering. It uses a semiconductor cooler and a blower to pre-cool the air entering the cooling hood, and then transports the pre-cooled air to the SMT components on a conveyor belt for further cooling. Simultaneously, a cooling chamber is formed between the baffle, isolation plate, and cooling hood to slow down the loss of cool air. A buffer plate further buffers the incoming air, ensuring the pre-cooling effect and preventing the blower from directly delivering uncooled air, thereby significantly improving the cooling efficiency. Attached Figure Description

[0017] Figure 1 This is a front sectional view of a cooling device for SMT chip soldering according to the present invention;

[0018] Figure 2 This is a side view of a cooling device for SMT surface mount soldering according to the present invention.

[0019] In the diagram: 1. Conveyor platform; 2. Conveyor belt; 3. Cooling cover; 4. Semiconductor cooler; 5. Isolation plate; 6. Blower; 7. Expansion port; 8. Cover plate; 9. Bolt; 10. Baffle; 11. Cooling chamber; 12. Air inlet; 13. Dustproof net; 14. Buffer plate; 15. Air outlet. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0021] Please see Figure 1-2 This application proposes a cooling device for SMT chip soldering provided in this embodiment. The device includes a conveyor table 1, on which a conveyor belt 2 for conveying SMT chips is provided. A cooling cover 3 is fixedly provided on the upper side of the conveyor table 1 corresponding to the conveyor belt 2. The cooling cover 3 is open at both ends along the conveying direction. A semiconductor cooler 4 is provided on the top of the cooling cover 3. The semiconductor cooler 4 can quickly cool the air and provide a low temperature environment for the cooling process. An isolation plate 5 is provided laterally inside the cooling cover 3 corresponding to the semiconductor cooler 4. A blower 6 is provided on the isolation plate 5 corresponding to the conveyor belt 2. This structural design allows the cooled air to be blown evenly onto the SMT chips on the conveyor belt 2 by the blower 6, achieving rapid cooling.

[0022] Furthermore, an expansion port 7 is provided on the lower side of the blower 6 corresponding to the conveyor belt 2. The design of the expansion port 7 allows the cold air blown out by the blower 6 to cover the SMT components on the conveyor belt 2 more evenly, ensuring that all parts of the components can be adequately cooled.

[0023] To facilitate maintenance and cleaning, the top of the cooling cover 3 is a detachable cover plate 8, which is fixedly connected by bolts 9. This design facilitates the maintenance and cleaning of the inside of the cooling cover 3, and also makes it easy to replace components such as the semiconductor cooler 4, thereby improving the maintainability and service life of the device.

[0024] Furthermore, baffles 10 are provided at the openings at both ends of the cooling cover 3. A cooling chamber 11 is formed between the baffles 10, the isolation plate 5 and the cooling cover 3. The design of the cooling chamber 11 can effectively slow down the loss of cold air and allow the cold air to stay in the cooling cover 3 for a longer time, thereby improving the cooling efficiency. Air inlets 12 are provided on the left and right sides of the cooling cover 3 to introduce outside air for pre-cooling.

[0025] Furthermore, the air inlet 12 is angled upwards from the outside in. This angled design allows the air entering the cooling hood 3 to form a certain upward airflow, which helps to increase the contact time between the air and the semiconductor cooler 4, thereby improving the pre-cooling effect and also facilitating the uniform distribution of cold air.

[0026] To prevent dust from entering the cooling shroud 3 and affecting the cooling effect, a dustproof net 13 is installed on the outside of the cooling shroud 3 corresponding to the air inlet 12. The dustproof net 13 can effectively intercept dust and impurities in the air, ensuring that the air entering the cooling shroud 3 is clean and extending the service life of the semiconductor cooler 4 and the blower 6.

[0027] Furthermore, a buffer plate 14 is provided at the air inlet 12 inside the refrigeration chamber 11. Multiple air outlets 15 are evenly opened on the buffer plate 14. The design of the buffer plate 14 can buffer the incoming air, so that the air is buffered before entering the refrigeration chamber 11, avoiding the air being directly sent out by the blower 6. At the same time, the setting of the air outlets 15 can make the air more evenly distributed in the entire refrigeration chamber 11, further improving the pre-cooling effect.

[0028] When using this SMT surface mount cooling device, the SMT components are first placed on the conveyor belt 2 and fed into the cooling shroud 3. The semiconductor cooler 4 starts working, cooling the air entering the cooling shroud 3. The cooled air is then blown evenly onto the SMT components on the conveyor belt 2 by the blower 6, achieving rapid cooling. At the same time, the design of the baffle 10 and the cooling chamber 11 can effectively reduce the loss of cold air and improve the cooling effect. The buffer plate 14 and the air outlet 15 ensure the pre-cooling effect of the air, further improving the cooling efficiency.

[0029] In summary, the cooling device for SMT surface mount soldering of this utility model can effectively meet the cooling requirements after SMT surface mount soldering. Through reasonable structural design, it achieves rapid and uniform cooling effect, improving production efficiency and product quality. At the same time, the design of dustproof net 13, buffer plate 14 and cooling cavity 11 further improves the performance and reliability of the device, and has high practical value and promotion prospects.

[0030] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0031] In the description of this utility model, unless otherwise stated, "a plurality of" means two or more; the terms "upper", "lower", "left", "right", "inner", "outer", "front end", "rear end", "head", "tail", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0032] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A cooling device for SMT (Surface Mount Technology) components after soldering, comprising a conveyor table (1), wherein a conveyor belt (2) for conveying SMT components is provided on the conveyor table (1), characterized in that, A cooling cover (3) is fixedly provided on the upper side of the conveyor platform (1) corresponding to the conveyor belt (2). The cooling cover (3) is set with openings at both ends along the conveying direction. A semiconductor cooler (4) is provided on the top of the cooling cover (3). An isolation plate (5) is provided horizontally inside the cooling cover (3) corresponding to the semiconductor cooler (4). A blower (6) is provided on the isolation plate (5) corresponding to the conveyor belt (2).

2. The cooling device for SMT surface mount soldering according to claim 1, characterized in that, An expansion port (7) is provided on the lower side of the blower (6) corresponding to the conveyor belt (2).

3. A cooling device for SMT surface mount soldering according to any one of claims 1-2, characterized in that, The top of the cooling cover (3) is a detachable cover plate (8), which is fixedly connected by bolts (9).

4. A cooling device for SMT surface mount soldering according to any one of claims 1-2, characterized in that, The cooling cover (3) has baffles (10) at both ends of the opening. A cooling cavity (11) is formed between the baffles (10), the isolation plate (5) and the cooling cover (3). Air inlets (12) are opened on the left and right sides of the cooling cover (3).

5. The cooling device for SMT surface mount soldering according to claim 4, characterized in that, The air inlet (12) is inclined upward from the outside to the inside.

6. The cooling device for SMT surface mount soldering according to claim 5, characterized in that, The cooling cover (3) is provided with a dustproof net (13) on the outside corresponding to the air inlet (12).

7. The cooling device for SMT surface mount soldering according to claim 4, characterized in that, The cooling chamber (11) is provided with a buffer plate (14) at the air inlet (12), and a plurality of air outlet holes (15) are evenly opened on the buffer plate (14).

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