Radio frequency power amplification device

Abstract

The radio frequency power amplification device is used for a wireless communication base station or a relay station and comprises a radio frequency circuit board, a shell A and a shell B, the surface A1 of the shell A covers one surface of the radio frequency circuit board; one surface B1 of the shell B covers the other surface of the radio frequency circuit board; the other surface A2 of the shell A comprises radiating fins which are used for radiating heat of the radio frequency power amplification device; the other surface B2 of the shell B is not provided with radiating fins; the face B1 of the shell B comprises a containing cavity, and the containing cavity is used for containing protruding electronic components on the radio frequency circuit board or used for achieving the radio frequency circuit function.

Description

Technical Field

[0001] This utility model relates to the field of digital intercom technology, specifically to a radio frequency power amplification device. Background Technology

[0002] In communication equipment, heat dissipation is a challenge when the transmission power is high. Good heat dissipation performance is an important condition for ensuring the normal and stable operation of the RF power amplifier.

[0003] When the entire communication device needs to be installed in a standard cabinet of a set size, the height limitation of the product makes the design of the heat dissipation structure more difficult. Summary of the Invention

[0004] The technical problem to be solved by this utility model is to avoid the shortcomings of the above-mentioned existing technical solutions, and proposes a radio frequency power amplifier device. The housing A and housing B enclose the radio frequency circuit board, which can perform all-round electromagnetic shielding to ensure signal integrity. At the same time, the overall structural design is very conducive to heat dissipation, and can achieve extremely high heat dissipation efficiency within a limited space.

[0005] The technical solution of this application to solve the above-mentioned technical problems is a radio frequency power amplifier device for use in wireless communication base stations or relay stations, including a radio frequency circuit board, a housing A, and a housing B; one side A1 of housing A covers one side of the radio frequency circuit board; one side B1 of housing B covers the other side of the radio frequency circuit board; the other side A2 of housing A includes heat dissipation fins for heat dissipation of the radio frequency power amplifier device; the other side B2 of housing B does not have heat dissipation fins; the side B1 of housing B includes a receiving cavity for accommodating protruding electronic components on the radio frequency circuit board or for realizing radio frequency circuit functions.

[0006] It is possible that the planar projected area of ​​the housing A is greater than the planar projected area of ​​the housing B.

[0007] It is possible that the heat dissipation fins of the housing A have different lengths, with shorter fins used to reduce heat dissipation resistance.

[0008] It is possible that the surface A1 of the housing A includes a receiving cavity A, which is used to receive electronic components protruding from the radio frequency circuit board.

[0009] It may also include an air guide module and a cooling fan; the port C1 of the air guide module is mechanically connected to the end A3 of the housing A; the port C2 of the air guide module is mechanically connected to the cooling fan; the fan is used to drive the cooling airflow through the air guide module to the cooling fins.

[0010] Yes, the cross-sectional area of ​​port C1 of the air guide module is smaller than the cross-sectional area of ​​port C2.

[0011] It is possible that the cross-sectional area of ​​port C1 of the air guide module corresponds to the heat dissipation fins on surface A2 of housing A.

[0012] It can be placed inside a housing for a wireless communication base station or relay station, where the heat dissipation fins and the housing form a heat dissipation duct, and the air guide module is used to guide the heat dissipation airflow to the heat dissipation duct.

[0013] It may also include a radio frequency signal interface K1, which is connected to the outer surface B4 of the housing B. The radio frequency signal interface K1 communicates with the electronic devices inside the housing B through the housing B.

[0014] It may also include a radio frequency signal interface K2, which is connected to the outer facade B5 of the housing B. The radio frequency signal interface K2 communicates with the electronic devices inside the housing B through the housing B. The outer facade B5 and the outer facade B4 are not the same surface.

[0015] Compared with the prior art, the beneficial effects of this application are: the housing A and housing B enclose the radio frequency circuit board, which can provide all-round electromagnetic shielding and ensure signal integrity. At the same time, the housing A is used for heat dissipation, achieving two goals at once.

[0016] Compared with the prior art, the beneficial effects of this application are: the planar projected area of ​​shell A is larger than the planar projected area of ​​shell B, and the area that can be installed with heat dissipation fins is relatively larger, which is more conducive to heat dissipation.

[0017] Compared with the prior art, the beneficial effects of this application are: the heat dissipation fins of the housing A have different lengths, and the shorter heat dissipation fins are used to reduce the heat dissipation resistance.

[0018] Compared with the prior art, the beneficial effects of this application are: the setting of the air guide module and the cooling fan further increases the flow rate of the cooling air and the precision of the airflow channel, so that the airflow channel can be more accurately connected with the airflow channel between the heat dissipation fins, thereby improving the heat dissipation efficiency.

[0019] Compared with the prior art, the beneficial effects of this application are: the cross-sectional area of ​​port C1 of the air guide module is smaller than that of port C2, which can increase the airflow and improve the heat dissipation efficiency.

[0020] Compared with the prior art, the beneficial effect of this application is that the cross-sectional area of ​​the port C1 of the air guide module corresponds to the heat dissipation fins of the surface A2 of the housing A, which can accurately guide the heat dissipation airflow.

[0021] Compared with the prior art, the beneficial effects of this application are: the housing A includes heat dissipation fins, which are parallel to the airflow direction of the cooling fan, resulting in higher heat dissipation efficiency.

[0022] Compared with the prior art, the beneficial effects of this application are: the housing A includes one or more accommodating cavities, which are used to accommodate radio frequency devices and can shield different devices separately.

[0023] Compared with the prior art, the beneficial effect of this application is that multiple fans dissipate heat, further improving heat dissipation efficiency.

[0024] Compared with the prior art, the beneficial effects of this application are: the applicable wireless communication base station or relay station, under the constraints of a length of 403mm, a height of 45mm, and a width of 430mm, can achieve excellent heat dissipation and ensure stable and reliable performance.

[0025] Compared with the prior art, the beneficial effects of this application are: the radio frequency signal interface K1 and the radio frequency signal interface K2 are connected through the outer surface of the housing B, which can enhance the shielding formed by the housing A and the housing B. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the disassembled state of the radio frequency power amplifier device;

[0027] Figure 2 This is a schematic diagram of the combined state of the radio frequency power amplifier device with some components removed;

[0028] Figure 3 This is a schematic diagram of the combined state of the radio frequency power amplifier device with some components removed;

[0029] Figure 4 This is a schematic diagram of the disassembled state of the radio frequency power amplifier device;

[0030] Figure 5 This is a three-dimensional schematic diagram of housing B in the walkie-talkie communication control device;

[0031] Figure 6 This is a schematic diagram of the orthographic projection of housing B in the walkie-talkie communication control device;

[0032] Figure 7 This is a three-dimensional schematic diagram of housing A in the walkie-talkie communication control device;

[0033] Figure 8 This is a three-dimensional schematic diagram of housing A in the walkie-talkie communication control device;

[0034] Figure 9 This is a schematic diagram of the combined state of the radio frequency power amplifier device;

[0035] Figure 10 This is a schematic diagram of the combined state of the radio frequency power amplifier device;

[0036] Figure 11This is a schematic diagram of the orthographic projection of an RF power amplifier device;

[0037] Figure 12 This is a schematic diagram of an integrated radio frequency power amplifier in a walkie-talkie communication control device;

[0038] Figure 13 This is a schematic diagram of an integrated radio frequency power amplifier in a walkie-talkie communication control device. Detailed Implementation

[0039] The contents of this application will be further described in detail below with reference to the accompanying drawings.

[0040] like Figures 1 to 4 As shown, an RF power amplifier device for use in a wireless communication base station or relay station includes an RF circuit board, a housing A, and a housing B; surface A1 of housing A covers one side of the RF circuit board; surface B1 of housing B covers the other side of the RF circuit board; the other side A2 of housing A includes heat dissipation fins for heat dissipation of the RF power amplifier device; the other side B2 of housing B does not have heat dissipation fins; surface B1 of housing B includes a receiving cavity for accommodating protruding electronic components on the RF circuit board or for implementing RF circuit functions.

[0041] like Figures 5 to 6 As shown, a radio frequency power amplifier device has a housing B with a surface B1 including multiple receiving cavities, including receiving cavity B1, receiving cavity B2, receiving cavity B3 and receiving cavity B4.

[0042] like Figures 1 to 4 As shown, in a radio frequency power amplifier device, the planar projected area of ​​housing A is larger than that of housing B. The larger planar projected area of ​​housing A increases the heat dissipation area.

[0043] like Figure 7 As shown, an RF power amplifier device has heat dissipation fins of different lengths on the housing A, with shorter fins used to reduce heat dissipation resistance.

[0044] like Figure 8 As shown, an RF power amplifier device includes a receiving cavity A on surface A1 of a housing A. The receiving cavity is used to accommodate protruding electronic components on an RF circuit board, and the depth of the receiving cavity A is less than the depth of the receiving cavity B. Figure 8 The receiving cavity A is used to attach to the device to be cooled; there are multiple receiving cavities A, namely receiving cavity A1, receiving cavity A2, receiving cavity A3, receiving cavity A4, and receiving cavity A5.

[0045] like Figure 7As shown, an RF power amplifier device is provided, wherein the heat sink fins are parallel to the airflow direction of the cooling fan; the housing A includes one or more receiving cavities for accommodating RF devices.

[0046] like Figure 7 On the other side of the casing A, multiple heat dissipation fins are arranged in parallel, and an airflow channel is formed between two heat dissipation fins; the direction of the airflow channel is parallel to the direction of the cooling fan.

[0047] like Figure 7 The heat dissipation fins of the housing A include group A, group B, group C, and group D heat dissipation fins arranged sequentially from the edge to the center.

[0048] like Figure 7 Group A heat dissipation fins include symmetrically arranged heat dissipation fins A1 and A2; Group A heat dissipation fins surround Group B, Group C and Group D heat dissipation fins, constraining the overall direction of heat dissipation airflow.

[0049] like Figure 7 Group B heat dissipation fins include symmetrically arranged heat dissipation fins B1 and B2; Group C heat dissipation fins include symmetrically arranged heat dissipation fins C1 and C2; Group D heat dissipation fins include symmetrically arranged heat dissipation fins D1 and D2. In all three groups (B, C, and D), one end of the fin is lower than the other, and the height difference between the two ends decreases sequentially. This height difference extends along the fin body direction, with the closer to the center, the longer the height difference extends along the fin body direction. The length of the height difference extending along the fin body direction is less than half the length of the fin body. Lowering one end of the fin in the central area reduces wind resistance and facilitates airflow. The symmetrical distribution and extension of the height difference design allows for a more efficient overall airflow for heat dissipation, improving overall cooling efficiency.

[0050] like Figure 9 As shown, an RF power amplifier device further includes an air guide module and a cooling fan; port C1 of the air guide module is mechanically connected to end A3 of the housing A; port C2 of the air guide module is mechanically connected to the cooling fan; the fan is used to drive the cooling airflow through the air guide module to the heat dissipation fins.

[0051] like Figure 9 As shown, an RF power amplifier device has two cooling fans, namely cooling fan A and cooling fan B. Cooling fan A is used for electrical signal connection with an external control module; cooling fan B is used for electrical signal connection with an external control module; cooling fans A and B are controlled by the control module, and when the temperature is lower than a set threshold, cooling fans A and B alternately start.

[0052] The control module monitors the equipment temperature and controls the on / off state and speed of cooling fans A and B in stages according to the temperature to reduce noise and extend fan life. It avoids having only one fan running continuously, as prolonged operation of a single fan can cause one fan to work for significantly longer than the other, thus affecting its lifespan. The control module controls the two fans to alternate operation based on the number of startups, thereby balancing the operating time of the two fans and improving their lifespan.

[0053] Specifically, when the temperature is below a set threshold, cooling fan A and cooling fan B may alternately start, with the fan speed selected based on the temperature. Alternatively, when the temperature is above the set threshold, cooling fan A and cooling fan B may start simultaneously. Furthermore, the speed of cooling fan A and / or cooling fan B can be controlled based on the temperature conditions.

[0054] like Figure 9 As shown, in an RF power amplifier device, the cross-sectional area of ​​port C1 of the air guide module is smaller than that of port C2. Port C2 of the air guide module is larger than port C1, facilitating the entry of external cold air.

[0055] like Figure 9 As shown, in a radio frequency power amplifier device, the air guide module draws external cold air into the heat dissipation channel where the heat dissipation fins of the housing A are located, resulting in a more concentrated airflow and higher heat dissipation efficiency.

[0056] like Figure 10 and Figure 11 As shown, in a radio frequency power amplifier device, the cross-sectional area of ​​port C1 of the air guide module corresponds to the heat dissipation fins on surface A2 of the housing A. Figure 11 In the image, the fan blades for cooling fans A and B have been removed, leaving only the mounting holes for cooling fans A and B. Figure 11 It is evident that the cross-sectional area of ​​the cooling fan location is larger than the cross-sectional area of ​​the heat dissipation channel formed by the heat dissipation fins of casing A. Therefore, an air guide module is needed to guide the airflow and improve the heat dissipation efficiency.

[0057] like Figure 12 and Figure 13 As shown, an RF power amplifier device is used to be placed inside the enclosure of a wireless communication base station or relay station. The heat dissipation fins and the enclosure form a heat dissipation duct, and the air guide module is used to guide the heat dissipation airflow to the heat dissipation duct.

[0058] like Figure 9 and Figure 10As shown, a radio frequency power amplifier device further includes a radio frequency signal interface K1, which is connected to the outer surface B4 of the housing B. The radio frequency signal interface K1 is electrically connected to the electronic devices inside the housing B through the housing B.

[0059] like Figure 9 and Figure 10 As shown, a radio frequency power amplifier device further includes a radio frequency signal interface K2, which is connected to the outer surface B5 of the housing B. The radio frequency signal interface K2 communicates with the electronic devices inside the housing B via the housing B. The outer surface B5 and the outer surface B4 are not the same surface.

[0060] The above are merely embodiments of this utility model and do not limit the patent scope of this utility model. Any equivalent structural or procedural transformations made based on the contents of the utility model specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. A radio frequency power amplifier device for use in wireless communication base stations or relay stations, characterized in that, Includes an RF circuit board, housing A, and housing B; Surface A1 of housing A covers one side of the radio frequency circuit board; One side B1 of the housing B covers the other side of the radio frequency circuit board; The other side A2 of housing A includes heat dissipation fins for heat dissipation of the radio frequency power amplifier. The other side of casing B, B2, has no heat dissipation fins; The housing B has a receiving cavity on its surface B1, which is used to receive protruding electronic components on the radio frequency circuit board or to implement radio frequency circuit functions.

2. The radio frequency power amplifier device according to claim 1, characterized in that, The planar projected area of ​​shell A is greater than the planar projected area of ​​shell B.

3. The radio frequency power amplifier device according to claim 1, characterized in that, The heat dissipation fins of the housing A have different lengths, with shorter fins used to reduce heat dissipation resistance.

4. The radio frequency power amplifier device according to claim 1, characterized in that, The housing A has a surface A1 including a receiving cavity A for accommodating protruding electronic components on an RF circuit board.

5. The radio frequency power amplifier device according to claim 1, characterized in that, It also includes an air guide module and a cooling fan; the port C1 of the air guide module is mechanically connected to end A3 of the housing A; the port C2 of the air guide module is mechanically connected to the cooling fan; the fan is used to drive the cooling airflow through the air guide module to the cooling fins.

6. The radio frequency power amplifier device according to claim 5, characterized in that, The cross-sectional area of ​​port C1 of the air guide module is smaller than that of port C2.

7. The radio frequency power amplifier device according to claim 6, characterized in that, The cross-sectional area of ​​port C1 of the air guide module corresponds to the heat dissipation fins on surface A2 of housing A.

8. The radio frequency power amplifier device according to claim 6, characterized in that, The heat dissipation fins and the housing form a heat dissipation duct, which is used to place the heat dissipation airflow inside a wireless communication base station or relay station. The air guide module is used to guide the heat dissipation airflow to the heat dissipation duct.

9. The radio frequency power amplifier device according to claim 1, characterized in that, It also includes a radio frequency signal interface K1, which is connected to the outer surface B4 of the housing B. The radio frequency signal interface K1 communicates with the electronic devices inside the housing B through the housing B.

10. The radio frequency power amplifier device according to claim 9, characterized in that, It also includes a radio frequency signal interface K2, which is connected to the outer facade B5 of the housing B. The radio frequency signal interface K2 communicates with the electronic devices inside the housing B through the housing B. The outer facade B5 and the outer facade B4 are not the same surface.

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