Wafer cleaning equipment facilitating stable supply of cleaning liquid

Abstract

The utility model relates to the technical field of wafer cleaning, in particular to wafer cleaning equipment convenient for stable supply of cleaning liquid, which comprises a bearing plate, a supply component and a guide component are respectively arranged at the top of the bearing plate, and the guide component is positioned on the side surface of the supply component. Through cooperative use of a liquid supply barrel, a stirring motor, a stirring frame, a filter screen, a heating plate and a temperature sensor, in order to ensure that a cleaning liquid is uniformly mixed in the liquid supply barrel and prevent a precipitation or layering phenomenon, a stirring measure is adopted, so that the stability and consistency of the cleaning liquid are ensured; the temperature of cleaning liquid can be accurately controlled through cooperation of a heating plate and a temperature sensor, the cleaning effect is further improved, a drying fan, an air blowing head, a liquid pumping pump, a liquid pumping pipe, a moving block and a threaded rod are arranged and used in cooperation, and in order to ensure that the cleaned wafer can be timely and evenly dried, the drying effect is improved. And secondary pollution or oxidation caused by residual water on the surface of the wafer is avoided.

Description

Technical Field

[0001] This utility model relates to the field of wafer cleaning technology, specifically to a wafer cleaning device that facilitates a stable supply of cleaning solution. Background Technology

[0002] In semiconductor manufacturing, wafer cleaning is a critical process because if contamination caused by processes such as cutting or etching is not cleaned properly, it will seriously affect subsequent processes, ultimately leading to product defects and a decrease in yield.

[0003] Existing technologies, such as CN216757409U, describe a wafer cleaning device that, after the wafer has undergone chemical cleaning, can effectively remove residual chemical solutions, dust particles, and contaminants from the wafer surface. This wafer cleaning device can also guide the acid gas and water vapor generated during the wafer cleaning process to the outside of the fan filter device.

[0004] However, this device still has some shortcomings in its use:

[0005] 1. This equipment is not convenient for supplying liquid to the cleaning equipment. The liquid supply process of the cleaning equipment cannot provide a stable and uniform cleaning liquid. The instability of the liquid supply will lead to uneven wafer cleaning, thereby affecting the cleaning effect and possibly damaging the wafer surface.

[0006] 2. This device cannot quickly dry the cleaned wafers, which reduces production efficiency and increases the risk of secondary contamination of the wafers. Utility Model Content

[0007] The purpose of this invention is to provide a wafer cleaning device that facilitates a stable supply of cleaning solution, in order to solve the problems mentioned in the background art, such as the inconvenience of supplying cleaning solution to the cleaning equipment, the inability to provide a stable and uniform cleaning solution during the supply process, the instability of the supply volume leading to uneven wafer cleaning, thus affecting the cleaning effect and potentially damaging the wafer surface. Furthermore, the device cannot quickly dry the cleaned wafers, reducing production efficiency and increasing the risk of secondary contamination of the wafers.

[0008] To achieve the above objectives, this utility model provides the following technical solution:

[0009] A wafer cleaning device that facilitates a stable supply of cleaning fluid includes a support plate, on the top of which a supply component and a guide component are respectively provided, and the guide component is located on the side of the supply component.

[0010] The supply assembly includes a mounting plate on top of a support plate, a supply tank fixedly connected to the top of the mounting plate, a sealing cover on top of the supply tank, a stirring motor mounted on top of the sealing cover, a stirring frame fixedly connected to the output end of the stirring motor, the stirring frame penetrating the sealing cover and extending into the supply tank, the stirring frame rotatably connected to the sealing cover, a groove formed on the inner surface wall of the supply tank, a heating plate fixedly connected to the groove, a temperature sensor fixedly connected to the inner surface wall of the supply tank, a sealing groove formed on the top of the supply tank, a filter screen fixedly connected to the supply tank, the stirring frame penetrating the filter screen and rotatably connected to it, a cleaning box fixedly connected to the top of the support plate, and a drain pipe fixedly connected to the side of the cleaning box.

[0011] As a preferred embodiment of this utility model, the guiding assembly includes a liquid pump installed on the side of the supply tank, a liquid pumping pipe fixedly connected to the top of the liquid pump, a drying fan installed on the top of the mounting plate, the drying fan being located on the side of the liquid pump, a guiding channel fixedly connected to the side of the drying fan, and a guiding pipe fixedly connected to the side of the guiding channel.

[0012] As a preferred embodiment of this utility model, a support plate is fixedly connected to the top of the bearing plate, a drive motor is installed on the side of the support plate, and a threaded rod is fixedly connected to the output end of the drive motor. The threaded rod passes through the support plate and is rotatably connected to the support plate.

[0013] As a preferred embodiment of this utility model, a movable plate is threadedly connected to the outer surface of the threaded rod, an injection pipe is fixedly connected to the bottom of the movable plate, the end of the extraction pipe is fixedly connected to the injection pipe, and the injection pipe and the extraction pipe are in communication.

[0014] As a preferred embodiment of this utility model, the guide tube passes through the movable plate and extends to the bottom of the movable plate, and a blower head is fixedly connected to the end of the guide tube. The guide channel, the guide tube and the blower head are interconnected.

[0015] As a preferred embodiment of this utility model, a sealing strip is fixedly connected to the bottom of the supply tank, the sealing strip extends into the sealing groove, and a feed hole is provided on the top of the sealing cover.

[0016] As a preferred embodiment of this utility model, the side of the supply tank is provided with a mounting hole, and a scale is fixedly connected in the mounting hole.

[0017] As a preferred embodiment of this utility model, a fixing rod is provided on the side of the supply tank, the fixing rod passes through the supply tank and extends into the sealing strip, and the fixing rod is inserted into the supply tank.

[0018] Compared with the prior art, the beneficial effects of this utility model are:

[0019] 1. In this utility model, by setting up a liquid supply tank, a stirring motor, a stirring frame, a filter screen, a heating plate, and a temperature sensor, stirring measures are taken to ensure that the cleaning solution is uniformly mixed in the liquid supply tank and to prevent sedimentation or stratification. This ensures the stability and consistency of the cleaning solution. By setting up a filter screen, we can effectively remove impurities in the cleaning solution and avoid these impurities causing scratches or contamination to the wafer surface. With the use of the heating plate and temperature sensor, the temperature of the cleaning solution can be precisely controlled, further improving the cleaning effect.

[0020] 2. In this invention, by using a drying fan, blower head, liquid pump, liquid extraction pipe, moving block, and threaded rod in combination, the cleaned wafers are dried promptly and evenly, avoiding secondary contamination or oxidation caused by residual moisture on the wafer surface. The blower head is designed to precisely target the wafer, ensuring optimal drying results. Simultaneously, the coordinated operation of the liquid pump and liquid extraction pipe efficiently extracts used cleaning fluid from the equipment, ensuring the continuity and efficiency of the cleaning process. The combination of the moving block and threaded rod facilitates the adjustment of the blower head and liquid injection pipe positions to adapt to the cleaning needs of wafers of different sizes, thereby improving the flexibility and applicability of the equipment. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0022] Figure 2 This is a schematic diagram of the supply component structure of this utility model;

[0023] Figure 3 This is a schematic diagram of the guide component structure of this utility model;

[0024] Figure 4 This is a schematic diagram of the side structure of the drying fan of this utility model.

[0025] In the diagram: 1. Support plate; 2. Supply assembly; 201. Supply tank; 202. Sealing cover; 203. Stirring motor; 204. Sealing groove; 205. Stirring frame; 206. Filter screen; 207. Fixing rod; 208. Temperature sensor; 209. Heating plate; 210. Feed hole; 211. Sealing strip; 3. Guide assembly; 301. Drying fan; 302. Liquid pump; 303. Liquid extraction pipe; 304. Threaded rod; 305. Moving plate; 306. Liquid injection pipe; 307. Drive motor; 308. Air blower head; 309. Guide channel; 310. Guide tube; 4. Cleaning box; 5. Drain pipe; 6. Support plate; 7. Mounting plate; 8. Scale; 9. Mounting hole. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the protection scope of the present utility model.

[0027] For examples, please refer to Figures 1-4 This utility model provides a technical solution:

[0028] A wafer cleaning device for facilitating stable supply of cleaning solution includes a support plate 1. A supply component 2 and a guide component 3 are respectively disposed on the top of the support plate 1. The guide component 3 is located on the side of the supply component 2. The supply component 2 includes a mounting plate 7 on the top of the support plate 1. A supply tank 201 is fixedly connected to the top of the mounting plate 7. A sealing cover 202 is disposed on the top of the supply tank 201. A stirring motor 203 is mounted on the top of the sealing cover 202. A stirring frame 205 is fixedly connected to the output end of the stirring motor 203. The stirring frame 205 penetrates the sealing cover 202 and extends into the supply tank 201. The stirring frame 205 is rotatably connected to the sealing cover 202. A groove is formed on the inner surface wall of the supply tank 201. A heating plate 209 is fixedly connected to the groove. A temperature sensor 208 is connected to the top of the supply tank 201, a sealing groove 204 is provided on the top of the supply tank 201, a filter screen 206 is fixedly connected inside the supply tank 201, a stirring rack 205 passes through the filter screen 206 and is rotatably connected to it, a cleaning box 4 is fixedly connected to the top of the support plate 1, a drain pipe 5 is fixedly connected to the side of the cleaning box 4, a sealing strip 211 is fixedly connected to the bottom of the supply tank 201, the sealing strip 211 extends into the sealing groove 204, a feed hole 210 is provided on the top of the sealing cover 202, an installation hole 9 is provided on the side of the supply tank 201, a scale 8 is fixedly connected inside the installation hole 9, a fixing rod 207 is provided on the side of the supply tank 201, the fixing rod 207 passes through the supply tank 201 and extends into the sealing strip 211, and the fixing rod 207 is inserted into the supply tank 201.

[0029] The system ensures the stability and uniformity of the cleaning solution. The filter screen 206 can effectively filter out impurities in the cleaning solution, preventing impurities from scratching or contaminating the wafer surface. The heating plate 209 and the temperature sensor 208 work together to heat the cleaning solution and monitor its temperature, thereby improving the cleaning effect.

[0030] In this embodiment, as Figure 1 , Figure 2 , Figure 3 and Figure 4As shown, the guide assembly 3 includes a liquid pump 302 mounted on the side of the supply tank 201, a liquid pump pipe 303 fixedly connected to the top of the liquid pump 302, a drying fan 301 mounted on the top of the mounting plate 7, the drying fan 301 being located on the side of the liquid pump 302, a guide channel 309 fixedly connected to the side of the drying fan 301, a guide pipe 310 fixedly connected to the side of the guide channel 309, a support plate 6 fixedly connected to the top of the support plate 1, a drive motor 307 mounted on the side of the support plate 6, and a threaded connection fixedly connected to the output end of the drive motor 307. Rod 304, threaded rod 304 passes through support plate 6 and is rotatably connected to support plate 6. The outer surface of threaded rod 304 is threadedly connected to moving plate 305. The bottom of moving plate 305 is fixedly connected to injection pipe 306. The end of suction pipe 303 is fixedly connected to injection pipe 306. Injection pipe 306 and suction pipe 303 are connected. Guide pipe 310 passes through moving plate 305 and extends to the bottom of moving plate 305. The end of guide pipe 310 is fixedly connected to blower head 308. Guide channel 309, guide pipe 310 and blower head 308 are connected.

[0031] Among them, the post-cleaning wafers of the drying fan 301 can be dried in a timely and uniform manner, avoiding secondary pollution or oxidation caused by residual moisture on the wafer surface. The design of the blower head 308 can blow air onto the wafer to ensure the best drying effect.

[0032] The working process of this utility model is as follows: When using the wafer cleaning equipment designed for stable cleaning fluid supply, first check if the device is functioning correctly. Place the wafer to be cleaned in the cleaning tank 4. Start the pump 302 to extract liquid from the supply tank 201 and clean the wafer through the injection pipe 306. Start the stirring motor 203 to ensure the cleaning fluid is evenly stirred within the supply tank 201, preventing sedimentation or stratification and ensuring the stability and uniformity of the cleaning fluid. The filter screen 206 effectively filters out impurities in the cleaning fluid, preventing scratches or contamination of the wafer surface. The combined use of the heating plate 209 and the temperature sensor 208 can further enhance the cleaning fluid's properties. The use of hot cleaning fluid and its temperature control improves the cleaning effect. After the drying fan 301 is activated, the cleaned wafers are dried promptly and evenly, preventing secondary contamination or oxidation caused by residual moisture on the wafer surface. The design of the blower head 308 allows for direct airflow onto the wafers, ensuring optimal drying. The combined use of the liquid pump 302 and the liquid extraction pipe 303 efficiently extracts used cleaning fluid from the equipment, ensuring the continuity and efficiency of the cleaning process. The combined use of the movable plate 305 and the threaded rod 304 allows for easy adjustment of the positions of the blower head 308 and the liquid injection pipe 306 to adapt to the cleaning needs of wafers of different sizes, improving the flexibility and applicability of the equipment.

[0033] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A round crystal cleaning device for facilitating stable supply of cleaning liquid, comprising a bearing plate (1), characterized in that: The top of the support plate (1) is provided with a supply component (2) and a guide component (3), and the guide component (3) is located on the side of the supply component (2); The supply assembly (2) includes a mounting plate (7) on top of a support plate (1). A supply tank (201) is fixedly connected to the top of the mounting plate (7). A sealing cover (202) is provided on the top of the supply tank (201). A stirring motor (203) is installed on the top of the sealing cover (202). A stirring frame (205) is fixedly connected to the output end of the stirring motor (203). The stirring frame (205) penetrates the sealing cover (202) and extends into the supply tank (201). The stirring frame (205) is rotatably connected to the sealing cover (202). The inner wall of the supply tank (201) is provided with a groove, and a heating plate (209) is fixedly connected in the groove. A temperature sensor (208) is fixedly connected in the inner wall of the supply tank (201). A sealing groove (204) is provided on the top of the supply tank (201). A filter screen (206) is fixedly connected in the supply tank (201). The stirring rack (205) passes through the filter screen (206) and is rotatably connected to it. A cleaning box (4) is fixedly connected to the top of the support plate (1). A drain pipe (5) is fixedly connected to the side of the cleaning box (4).

2. The round wafer cleaning apparatus for stable supply of cleaning liquid with ease of cleaning according to claim 1, wherein The guiding assembly (3) includes a liquid pump (302) installed on the side of the supply tank (201), a liquid pump (303) fixedly connected to the top of the liquid pump (302), a drying fan (301) installed on the top of the mounting plate (7), the drying fan (301) being located on the side of the liquid pump (302), a guide channel (309) fixedly connected to the side of the drying fan (301), and a guide pipe (310) fixedly connected to the side of the guide channel (309).

3. The wafer cleaning equipment according to claim 1, which facilitates a stable supply of cleaning solution, is characterized in that... A support plate (6) is fixedly connected to the top of the bearing plate (1). A drive motor (307) is installed on the side of the support plate (6). A threaded rod (304) is fixedly connected to the output end of the drive motor (307). The threaded rod (304) passes through the support plate (6) and is rotatably connected to the support plate (6).

4. The wafer cleaning apparatus for stable supply of cleaning liquid with ease of cleaning according to claim 3, wherein The outer surface of the threaded rod (304) is threadedly connected to a movable plate (305). The bottom of the movable plate (305) is fixedly connected to an injection pipe (306). The end of the extraction pipe (303) is fixedly connected to the injection pipe (306). The injection pipe (306) and the extraction pipe (303) are connected.

5. The wafer cleaning apparatus for stable supply of cleaning liquid with ease of cleaning according to claim 2, wherein The guide tube (310) passes through the movable plate (305) and extends to the bottom of the movable plate (305). A blower head (308) is fixedly connected to the end of the guide tube (310). The guide channel (309), the guide tube (310) and the blower head (308) are connected.

6. The wafer cleaning equipment according to claim 1, which facilitates a stable supply of cleaning solution, is characterized in that, A sealing strip (211) is fixedly connected to the bottom of the supply tank (201), the sealing strip (211) extends into the sealing groove (204), and a feed hole (210) is opened on the top of the sealing cover (202).

7. The wafer cleaning apparatus for stable supply of cleaning liquid with ease according to claim 1, wherein The side of the supply tank (201) is provided with a mounting hole (9), and a scale (8) is fixedly connected in the mounting hole (9).

8. The wafer cleaning apparatus for stable supply of cleaning liquid with ease according to claim 1, wherein A fixing rod (207) is provided on the side of the supply tank (201). The fixing rod (207) passes through the supply tank (201) and extends into the sealing strip (211). The fixing rod (207) is inserted into the supply tank (201).

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