Die with heat dissipation structure

Abstract

The utility model discloses a die with a heat dissipation structure, which belongs to the technical field of dies, and comprises a base, a lower die arranged at the top end of the base, a top plate arranged above the base, four symmetrically distributed upright posts arranged between the top end of the base and the top plate, a stamping cavity arranged at the top end of the lower die, an upper die arranged above the lower die, and an air cylinder fixedly mounted at the top end of the top plate, a piston shaft of the air cylinder penetrates through the top plate in a sliding mode and is fixedly connected with the top end of the upper die. A through groove is formed in the bottom of the base, a mounting groove is formed in the bottom of the lower die, a sealing plate is arranged on the inner wall of the lower section of the mounting groove, and a heat dissipation assembly is arranged in the mounting groove. Through the arrangement of the heat dissipation assembly, cold air is generated through the semiconductor refrigeration plate, then the speed reduction motor drives the fan blades to rotate to generate wind power, the wind power drives the cold air to act on the interior of the lower die, the heat dissipation effect can be achieved, the heat dissipation efficiency of the die and a product can be improved, and follow-up material taking is facilitated.

Description

A mold with a heat dissipation structure Technical Field

[0001] This utility model relates to the field of mold technology, and more specifically, to a mold with a heat dissipation structure. Background Technology

[0002] Stamping dies are special process equipment used in cold stamping to process materials into parts. Stamping is a pressure processing method that uses dies mounted on a press to apply pressure to materials at room temperature, causing them to separate or plastically deform, thereby obtaining the desired parts. Stamping dies generate heat during the stamping process, so heat dissipation is required. The dies generate temperature during stamping, especially when stamping non-metallic materials, the temperature may be even higher.

[0003] Some existing stamping dies lack heat dissipation structures and typically rely on natural heat dissipation, which is slow. Furthermore, the residual heat on the surface of parts, especially those manually unloaded, can affect workers' ability to handle them. Therefore, we propose a die with a heat dissipation structure. Summary of the Invention

[0004] To solve the above problems, this utility model provides a mold with a heat dissipation structure, adopting the following technical solution:

[0005] A mold with a heat dissipation structure includes a base, a lower mold at the top of the base, a top plate above the base, four symmetrically distributed columns between the top of the base and the top plate, a stamping cavity at the top of the lower mold, an upper mold above the lower mold, a cylinder fixedly installed at the top of the top plate, the piston shaft of the cylinder slidingly passing through the top plate and fixedly connected to the top of the upper mold, and an ejection assembly inside the stamping cavity.

[0006] The base has a through groove at the bottom, the lower mold has an installation groove at the bottom, the lower section of the installation groove has a sealing plate on the inner wall, and the installation groove has a heat dissipation component.

[0007] By adopting the above technical solution, when the equipment is in use, the operator places the raw material above the lower mold, and then drives the upper mold to descend through a cylinder. The top of the lower mold has a stamping cavity. The raw material enters the stamping cavity under the continuous stamping of the upper mold, which can play a shaping role. The stamping cavity is equipped with an ejector component. When the equipment stamps the raw material into the stamping cavity, the raw material pushes the ejector component down into the stamping cavity. After the product is stamped, the upper mold is driven to rise through a cylinder, and then the product is pushed out of the stamping cavity by the action of the ejector component, which can play a demolding role and facilitate subsequent material handling.

[0008] When the equipment stamps the raw materials, it may generate heat. The lower die is equipped with a heat dissipation component. The heat dissipation component generates cold air that fills the mounting groove and then covers the side wall of the stamping cavity, which can cool the mold and the product, making it easier to remove the material later.

[0009] Furthermore, the ejection assembly includes an ejection plate that is slidably installed in the stamping cavity. The inner wall of the bottom end of the stamping cavity has four symmetrically distributed movable slots. An ejection rod is slidably installed in each movable slot. A spring is fixedly connected between the bottom end of the ejection rod and the inner wall of the bottom end of the movable slot on the same side. The top end of each ejection rod is fixedly connected to the bottom end of the ejection plate.

[0010] By adopting the above technical solution, when the equipment presses the raw material into the stamping cavity, the raw material pushes the ejector plate to move into the stamping cavity, and the ejector plate pushes the ejector rod to slide into the movable groove on the same side. The ejector rod pushes the spring on the same side to retract, which facilitates the equipment to press the raw material. After the product is stamped, the upper die is driven to rise by the cylinder, so that the upper die and the stamping cavity are separated. Then, the ejector rod, with the elastic force of the spring on the same side, drives the ejector plate to rise. The ejector plate pushes the product to rise, which can play the role of demolding and facilitate subsequent material removal.

[0011] Furthermore, the heat dissipation component includes a mounting plate fixedly installed in the mounting groove. A geared motor is provided at the top of the mounting plate. A fan blade is fixedly sleeved on the side wall of the output shaft of the geared motor. Multiple semiconductor cooling plates are arranged in a linear array at the top of the sealing plate. The bottom ends of the semiconductor cooling plates all penetrate the sealing plate. Multiple air inlets are arranged in a linear array on both sides of the lower mold. All air inlets are connected to the mounting groove.

[0012] By adopting the above technical solution, a semiconductor cooling plate is installed in the mounting groove. The cooling end of the semiconductor cooling plate is located inside the mounting groove, and the cooling end is located outside the mounting groove. Therefore, cold air is generated by the semiconductor cooling plate, and then the fan blades are driven to rotate by the geared motor to generate wind. The wind drives the cold air to fill the mounting groove, so that the cold air covers the outside of the stamping cavity, which can play the role of cooling the mold and the product.

[0013] Furthermore, an air outlet pipe is fixedly installed on the inner wall of one side of the mounting groove. One end of the air outlet pipe passes through the lower mold, and a connecting pipe is fixedly connected to the end of the air outlet pipe that passes through the lower mold. An air outlet frame is fixedly installed on the end of the connecting pipe that is away from the air outlet pipe.

[0014] By adopting the above technical solution, external airflow enters the mounting groove through the air inlet, and some gas enters the connecting pipe through the air outlet pipe. Finally, it is sprayed onto the side walls of the upper and lower molds through the air outlet frame, which plays an auxiliary role in heat dissipation and helps to improve the utilization rate of cold air. The cooperation between the air inlet and the air outlet frame facilitates the flow of gas inside the lower mold.

[0015] Furthermore, a protective frame is fixedly installed at the bottom of the sealing plate, and multiple heat dissipation holes distributed in a rectangular array are opened at the bottom end of the protective frame. The semiconductor cooling plate passes through one end of the sealing plate and is located inside the protective frame. Dustproof cotton is provided on both sides of the lower mold.

[0016] By adopting the above technical solution, a protective frame is provided at the bottom of the sealing plate. The protective frame is fitted onto the bottom of the semiconductor refrigeration plate to protect the semiconductor refrigeration plate. The heat dissipation holes opened at the bottom of the protective frame can dissipate heat. Dustproof cotton is provided on both sides of the lower mold to filter dust in the air entering the mounting groove through the air inlet, thereby achieving the dustproof effect.

[0017] Furthermore, positioning blocks are fixedly installed at both the top and bottom of the column, and positioning grooves matching the positioning blocks on the same side are opened at the bottom of the top plate and the top of the base.

[0018] By adopting the above technical solution, positioning blocks are provided at the top and bottom of the column. When the column is installed, the positioning blocks engage with the positioning grooves opened on the opposite side of the top plate and the base, which can play a positioning role and facilitate subsequent fixing with fasteners of existing technology.

[0019] Furthermore, each column has a groove on one side, and a slider is slidably installed in the groove. An installation block is fixedly installed on the side of the slider away from the column on the same side, and the bottom of the installation block is fixedly connected to the top of the upper mold.

[0020] By adopting the above technical solution, when the upper mold is raised or lowered, the upper mold moves synchronously with the mounting block and the slider. The slider slides in the groove opened on one side of the same column. Through the cooperation of the mounting block, the slider and the groove, the upper mold is restricted and stabilized, which helps to maintain the stability of the upper mold raising and lowering.

[0021] In summary, this utility model has the following beneficial technical effects:

[0022] (1) In this utility model, by setting up a heat dissipation component, cold air is generated by a semiconductor cooling plate, and then the fan blades are driven to rotate by a geared motor to generate wind. The wind carries the cold air to the inside of the lower mold, which can play a role in heat dissipation, which is conducive to improving the heat dissipation efficiency of the mold and the product, and facilitates subsequent material handling.

[0023] (2) In this utility model, the external airflow enters the mounting groove through the air inlet, and some gas enters the connecting pipe through the air outlet pipe. Finally, it is sprayed onto the side walls of the upper and lower molds through the air outlet frame, which plays an auxiliary role in heat dissipation and is conducive to improving the utilization rate of cold air. Through the cooperation of the air inlet and the air outlet frame, it is convenient for the gas to flow inside the lower mold. Attached Figure Description

[0024] Figure 1 is a structural schematic diagram of the mold with heat dissipation structure of this utility model;

[0025] Figure 2 is an enlarged view of A in Figure 1 of the mold with heat dissipation structure of this utility model;

[0026] Figure 3 is a bottom view of the mold with heat dissipation structure of this utility model;

[0027] Figure 4 is a cross-sectional view of the mold with heat dissipation structure of this utility model;

[0028] Figure 5 is an enlarged view of B in Figure 4 of the mold with heat dissipation structure of this utility model;

[0029] Figure 6 is an unfolded view of the mold top plate, column and base with heat dissipation structure of this utility model.

[0030] Explanation of the labels in the diagram:

[0031] 1. Base; 2. Lower mold; 3. Column; 4. Ejector plate; 5. Air outlet frame; 6. Slide groove; 7. Upper mold; 8. Mounting block; 9. Cylinder; 10. Top plate; 11. Slider; 12. Protective frame; 13. Connecting pipe; 14. Semiconductor cooling plate; 15. Mounting groove; 16. Mounting plate; 17. Ejector rod; 18. Stamping chamber; 19. Movable groove; 20. Spring; 21. Gear motor; 22. Fan blade; 23. Positioning block. Detailed Implementation

[0032] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the protection scope of the present utility model.

[0033] In the description of this utility model, it should be noted that the terms "upper," "lower," "inner," "outer," "top / bottom," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0034] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," "sleeved / connected," "connected," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0035] The present invention will be further described in detail below with reference to Figures 1-6.

[0036] Please refer to Figures 1-6. A mold with a heat dissipation structure includes a base 1, a lower mold 2 at the top of the base 1, a top plate 10 above the base 1, four symmetrically distributed columns 3 between the top of the base 1 and the top plate 10, a stamping cavity 18 at the top of the lower mold 2, an upper mold 7 above the lower mold 2, a cylinder 9 fixedly installed at the top of the top plate 10, the piston shaft of the cylinder 9 slidingly passing through the top plate 10 and fixedly connected to the top of the upper mold 7, an ejection assembly inside the stamping cavity 18, the ejection assembly including an ejection plate 4 slidably installed inside the stamping cavity 18, four symmetrically distributed movable grooves 19 on the inner wall of the bottom end of the stamping cavity 18, an ejection rod 17 slidably installed in each movable groove 19, a spring 20 fixedly connected between the bottom end of the ejection rod 17 and the inner wall of the bottom end of the movable groove 19 on the same side, and the top end of each ejection rod 17 fixedly connected to the bottom end of the ejection plate 4.

[0037] When using this equipment, the operator places the raw material above the lower mold 2, and then drives the upper mold 7 to descend via the cylinder 9. The top of the lower mold 2 has a stamping cavity 18. The raw material enters the stamping cavity 18 under the continuous stamping of the upper mold 7, which can play a shaping role. When the equipment stamps the raw material into the stamping cavity 18, the raw material pushes the ejector plate 4 to move into the stamping cavity 18, and the ejector plate 4 pushes the ejector rod 17 to slide into the movable groove 19 on the same side. The ejector rod 17 pushes the spring 20 on the same side to retract, which facilitates the equipment to stamp the raw material. After the product is stamped, the cylinder 9 drives the upper mold 7 to rise, so that the upper mold 7 and the stamping cavity 18 are separated. Then, the ejector rod 17, with the elastic force of the spring 20 on the same side, drives the ejector plate 4 to rise. The ejector plate 4 pushes the product to rise, which can play a demolding role, which facilitates subsequent material removal.

[0038] The base 1 has a through groove at its bottom, and the lower mold 2 has an installation groove 15 at its bottom. The lower inner wall of the installation groove 15 is provided with a sealing plate. The installation groove 15 is provided with a heat dissipation component, which includes an installation plate 16 fixedly installed in the installation groove 15. The top of the installation plate 16 is provided with a geared motor 21. The output shaft side wall of the geared motor 21 is fixedly fitted with a fan blade 22. The top of the sealing plate is provided with multiple semiconductor cooling plates 14 arranged in a linear array. The bottom ends of the semiconductor cooling plates 14 all penetrate the sealing plate. Multiple air inlets arranged in a linear array are provided on both sides of the lower mold 2. The air inlets are all connected to the installation groove 15. An air outlet pipe is fixedly installed on the inner wall of one side of the installation groove 15. One end of the air outlet pipe penetrates the lower mold 2. A connecting pipe 13 is fixedly connected to the end of the air outlet pipe that penetrates the lower mold 2. An air outlet frame 5 is fixedly installed on the end of the connecting pipe 13 away from the air outlet pipe.

[0039] The raw materials may generate heat during the stamping process. A semiconductor cooling plate 14 is provided in the mounting groove 15. The cooling end of the semiconductor cooling plate 14 is located inside the mounting groove 15, and the cooling end is located outside the mounting groove 15. Therefore, cold air is generated by the semiconductor cooling plate 14. Then, the fan blade 22 is driven by the geared motor 21 to rotate and generate wind. The wind drives the cold air to fill the mounting groove 15, so that the cold air covers the outside of the stamping cavity 18, which can play a role in cooling the mold and the product. The external airflow enters the mounting groove 15 through the air inlet, and some of the gas enters the connecting pipe 13 through the air outlet pipe. Finally, it is sprayed onto the side walls of the upper mold 7 and the lower mold 2 through the air outlet frame 5, which plays a role in auxiliary heat dissipation and helps to improve the utilization rate of cold air. The cooperation of the air inlet and the air outlet frame 5 facilitates the flow of gas inside the lower mold 2.

[0040] A protective frame 12 is fixedly installed at the bottom of the sealing plate. The bottom of the protective frame 12 has multiple heat dissipation holes arranged in a rectangular array. The semiconductor cooling plate 14 passes through one end of the sealing plate and is located inside the protective frame 12. Dustproof cotton is provided on both sides of the lower mold 2. The protective frame 12 is provided at the bottom of the sealing plate and is fitted onto the bottom of the semiconductor cooling plate 14 to protect the semiconductor cooling plate 14. The heat dissipation holes at the bottom of the protective frame 12 can dissipate heat. The dustproof cotton on both sides of the lower mold 2 can filter dust in the air entering the mounting groove 15 through the air inlet to achieve the dustproof effect.

[0041] Positioning blocks 23 are fixedly installed at the top and bottom of the column 3. Positioning grooves matching the positioning blocks 23 on the same side are opened at the bottom of the top plate 10 and the top of the base 1. Positioning blocks 23 are provided at the top and bottom of the column 3. When the column 3 is installed, the positioning blocks 23 and the positioning grooves opened on the opposite side of the top plate 10 and the base 1 are engaged to achieve the positioning function, which facilitates subsequent fixation with fasteners of existing technology.

[0042] Each side of the column 3 has a sliding groove 6, and a slider 11 is slidably installed in each sliding groove 6. An installation block 8 is fixedly installed on the side of the slider 11 away from the column 3 on the same side. The bottom end of the installation block 8 is fixedly connected to the top end of the upper mold 7. When the upper mold 7 is raised or lowered, the upper mold 7 moves synchronously with the installation block 8 and the slider 11. The slider 11 slides in the sliding groove 6 opened on the side of the column 3 on the same side. Through the cooperation of the installation block 8, the slider 11 and the sliding groove 6, the upper mold 7 is restricted and stabilized, which helps to maintain the stability of the raising and lowering of the upper mold 7.

[0043] The implementation principle of this utility model embodiment is as follows: When the equipment is in use, the operator places the raw material above the lower mold 2, and then drives the upper mold 7 to descend through the cylinder 9. The top of the lower mold 2 is provided with a stamping cavity 18. The raw material enters the stamping cavity 18 under the continuous stamping of the upper mold 7, which can play a shaping role. The stamping cavity 18 is provided with an ejector component. When the equipment stamps the raw material into the stamping cavity 18, the raw material pushes the ejector component to descend into the stamping cavity 18. After the product is stamped, the cylinder 9 drives the upper mold 7 to rise. Then the product is pushed out of the stamping cavity 18 under the action of the ejector component, which can play a demolding role and facilitate subsequent material handling.

[0044] When the equipment presses the raw materials, it may generate heat. The lower mold 2 is equipped with a heat dissipation component. The heat dissipation component generates cold air that fills the mounting groove 15, which in turn covers the side wall of the stamping cavity 18, thus cooling the mold and the product and facilitating subsequent material handling.

[0045] The above are all preferred embodiments of this utility model, and are not intended to limit the scope of protection of this utility model. Therefore, all equivalent changes made to the structure, shape and principle of this utility model should be covered within the scope of protection of this utility model.

Claims

1. A mold with a heat dissipation structure, characterized in that: The system includes a base (1), a lower mold (2) at the top of the base (1), a top plate (10) above the base (1), four symmetrically distributed columns (3) between the top of the base (1) and the top plate (10), a stamping cavity (18) at the top of the lower mold (2), an upper mold (7) above the lower mold (2), a cylinder (9) fixedly installed at the top of the top plate (10), the piston shaft of the cylinder (9) slidingly passing through the top plate (10) and fixedly connected to the top of the upper mold (7), and an ejection assembly inside the stamping cavity (18); a through groove is opened at the bottom of the base (1), an installation groove (15) is opened at the bottom of the lower mold (2), a sealing plate is provided on the lower inner wall of the installation groove (15), and a heat dissipation assembly is provided inside the installation groove (15).

2. The mold with a heat dissipation structure according to claim 1, characterized in that: The ejection assembly includes an ejection plate (4) slidably installed in the stamping cavity (18). The inner wall of the bottom end of the stamping cavity (18) is provided with four symmetrically distributed movable grooves (19). An ejection rod (17) is slidably installed in each of the movable grooves (19). A spring (20) is fixedly connected between the bottom end of the ejection rod (17) and the inner wall of the bottom end of the movable groove (19) on the same side. The top end of the ejection rod (17) is fixedly connected to the bottom end of the ejection plate (4).

3. The mold with a heat dissipation structure according to claim 1, characterized in that: The heat dissipation assembly includes a mounting plate (16) fixedly installed in the mounting groove (15). The top of the mounting plate (16) is provided with a geared motor (21). The output shaft side wall of the geared motor (21) is fixedly sleeved with a fan blade (22). The top of the sealing plate is provided with a plurality of semiconductor cooling plates (14) arranged in a linear array. The bottom ends of the semiconductor cooling plates (14) all penetrate the sealing plate. The lower mold (2) has a plurality of air inlets arranged in a linear array on both sides. The air inlets are all connected to the mounting groove (15).

4. A mold with a heat dissipation structure according to claim 3, characterized in that: An air outlet pipe is fixedly installed on one side of the inner wall of the mounting groove (15). One end of the air outlet pipe passes through the lower mold (2), and a connecting pipe (13) is fixedly connected to the end of the air outlet pipe that passes through the lower mold (2). An air outlet frame (5) is fixedly installed on the end of the connecting pipe (13) away from the air outlet pipe.

5. A mold with a heat dissipation structure according to claim 3, characterized in that: A protective frame (12) is fixedly installed at the bottom of the sealing plate. The bottom end of the protective frame (12) has multiple heat dissipation holes arranged in a rectangular array. The semiconductor cooling plate (14) passes through one end of the sealing plate and is located inside the protective frame (12). Dustproof cotton is provided on both sides of the lower mold (2).

6. A mold with a heat dissipation structure according to claim 1, characterized in that: The top and bottom of the column (3) are fixedly installed with positioning blocks (23), and the bottom of the top plate (10) and the top of the base (1) are provided with positioning grooves that match the positioning blocks (23) on the same side.

7. A mold with a heat dissipation structure according to claim 1, characterized in that: Each of the columns (3) has a sliding groove (6) on one side, and a slider (11) is slidably installed in each of the sliding grooves (6). Each slider (11) is fixedly installed on the side away from the column (3) on the same side, and the bottom end of each mounting block (8) is fixedly connected to the top end of the upper mold (7).

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