Wafer storage device

Abstract

The utility model discloses a wafer storage device in the technical field of wafer storage, which comprises a bottom plate and a side plate, the top of the bottom plate is provided with the side plate, the side plate is fixedly connected with the bottom plate, the inner side of the side plate is provided with a plurality of layer plates, the top of the side plate is provided with a top plate, one end of the top plate is provided with a placing plate, and the placing plate is fixedly connected with the top plate. A fixing frame is arranged at one end of the side plate, a baffle is arranged on the inner side of the fixing frame, the baffle is fixedly connected with the fixing frame, an insertion block is arranged at one end of the fixing frame, and a socket is arranged on one side of the side plate. Through the arrangement of the side plate, the layer plate, the top plate, the placing plate, the fixing frame, the baffle, the insertion block and the socket, the wafer limiting function is achieved, the fixing frame is opened, and the wafer is inserted into the layer plate; and the fixing frame is closed until the inner side of the wafer is inserted into the placing plate, the inserting block is inserted into the socket, and the outer side of the wafer is inserted into the inner side of the baffle plate, so that the wafer can be limited in all directions, and the wafer is more stable during transportation.

Description

Technical Field

[0001] This utility model belongs to the field of wafer storage technology, and specifically relates to a wafer storage device. Background Technology

[0002] A wafer is a silicon wafer used to fabricate silicon semiconductor circuits; its raw material is silicon. High-purity polycrystalline silicon is dissolved, doped with silicon crystal seeds, and then slowly pulled out to form a cylindrical single-crystal silicon wafer. After grinding, polishing, and slicing, the silicon ingot is formed into a silicon wafer. Domestic wafer production lines mainly use 8-inch and 12-inch wafers, and storage devices are required for storing wafers.

[0003] Existing wafer storage devices still have some defects. Most of them do not have a limiting structure, resulting in insufficient stability. During transportation, the wafer may fall or even be damaged, making them inconvenient to use. To address this, we propose a wafer storage device. Utility Model Content

[0004] The purpose of this invention is to provide a wafer memory device to solve the problem that most of the devices mentioned in the background art do not have a limiting structure.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a wafer memory device, comprising a base plate and a side plate, wherein the top of the base plate is provided with a side plate, the side plate and the base plate are fixedly connected, the inner side of the side plate is provided with a layer plate, there are multiple layers plate, the side plate and the layers plate are provided in two sets, the top of the side plate is provided with a top plate, one end of the top plate is provided with a placement plate, the placement plate and the top plate are fixedly connected, one end of the side plate is provided with a fixing frame, the fixing frame and the side plate are rotatably connected by a hinge, the inner side of the fixing frame is provided with a baffle, the baffle and the fixing frame are fixedly connected, one end of the fixing frame is provided with an insertion block, one side of the side plate is provided with a socket, the insertion block and the socket are fixed by interlocking.

[0006] Preferably, a storage groove is embedded on one side of the insert block, and a first spring is provided inside the storage groove, with the first spring and the storage groove being fixedly connected.

[0007] Preferably, the storage slot has a buckle inside, the buckle and the storage slot are slidably connected, and the socket has a slot on one side, the buckle and the slot are fixed by snapping together.

[0008] Preferably, the socket has a push plate inside, and the push plate is slidably connected to the socket.

[0009] Preferably, a second spring is provided on one side of the push plate, and the second spring is fixedly connected to the push plate.

[0010] Preferably, the bottom of the base plate is provided with three casters, and a brake is provided on one side of each caster.

[0011] Compared with the prior art, the beneficial effects of this utility model are:

[0012] 1. The wafer is positioned using side plates, shelves, top plates, placement plates, fixing brackets, baffles, inserts, and sockets. The fixing bracket is opened, and the wafer is inserted into the shelf until the inside of the wafer is inserted into the placement plate. Then the fixing bracket is closed, and the inserts are inserted into the socket. The outside of the wafer is inserted into the inside of the baffle, thus providing omnidirectional positioning for the wafer and making it more stable during transportation.

[0013] 2. With the push plate and the second spring, when the plug is inserted into the socket, it will squeeze the push plate, thereby compressing the second spring. When disassembling, press the buckle, and the push plate will push the plug out of the socket under the reaction force of the second spring, thus completing the disassembly. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0015] Figure 2 This is a side view of the present invention.

[0016] Figure 3 This is a schematic diagram of the exploded structure of this utility model;

[0017] Figure 4 For the present utility model Figure 3 Enlarged structural diagram of section A.

[0018] In the diagram: 1. Base plate; 2. Side plate; 3. Shelf; 4. Top plate; 5. Placement plate; 6. Fixing frame; 7. Baffle; 8. Insert block; 9. Socket; 10. Storage slot; 11. First spring; 12. Buckle; 13. Slot; 14. Push plate; 15. Second spring; 16. Casters. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] Please see Figure 1-4This utility model provides a technical solution: a wafer memory device, including a base plate 1 and a side plate 2. The top of the base plate 1 is provided with the side plate 2, which is fixedly connected to the base plate 1. The inner side of the side plate 2 is provided with multiple layers 3, and there are two sets of side plates 2 and layers 3. The top of the side plate 2 is provided with a top plate 4, and one end of the top plate 4 is provided with a placement plate 5, which is fixedly connected to the top plate 4. One end of the side plate 2 is provided with a fixing frame 6, which is rotatably connected to the side plate 2 via a hinge. The inner side of the fixing frame 6 is provided with a baffle 7, which is fixedly connected to the fixing frame 6. The end is provided with an insertion block 8, and one side of the side plate 2 is provided with a socket 9. The insertion block 8 and the socket 9 are fixed by interlocking. The side plate 2, the shelf 3, the top plate 4, the placement plate 5, the fixing frame 6, the baffle 7, the insertion block 8 and the socket 9 are provided to realize the limiting function of the wafer. Open the fixing frame 6 and insert the wafer into the inside of the shelf 3 until the inner side of the wafer is inserted into the inside of the placement plate 5. Then close the fixing frame 6 so that the insertion block 8 is inserted into the inside of the socket 9. The outer side of the wafer will be inserted into the inner side of the baffle 7, which can limit the wafer in all directions, making it more stable during transportation and less likely to fall.

[0021] Specifically, a storage groove 10 is embedded on one side of the insert block 8, and a first spring 11 is provided inside the storage groove 10. The first spring 11 and the storage groove 10 are fixedly connected. The storage groove 10 and the first spring 11 are provided to realize the control function of the buckle 12.

[0022] Specifically, the storage slot 10 has a buckle 12 inside, which is slidably connected to the storage slot 10. The socket 9 has a slot 13 on one side, and the buckle 12 and the slot 13 are fixed by snapping together. The buckle 12 and the slot 13 are provided to fix the socket 9 and the plug block 8.

[0023] Specifically, the socket 9 has a push plate 14 inside, which is slidably connected to the socket 9. The push plate 14 facilitates the disassembly of the structure.

[0024] Specifically, a second spring 15 is provided on one side of the push plate 14. The second spring 15 is fixedly connected to the push plate 14. The second spring 15, in conjunction with the push plate 14, enables the disassembly of the insert block 8.

[0025] Specifically, the bottom of the base plate 1 is provided with three casters 16. A brake is provided on one side of each caster 16. The casters 16 facilitate the movement of the device.

[0026] In this embodiment, the fixing frame 6 is opened, and the wafer is inserted into the interior of the shelf 3 until the inner side of the wafer is inserted into the interior of the placement plate 5. Then the fixing frame 6 is closed, and the insert 8 is inserted into the interior of the socket 9. The buckle 12 will retract into the interior of the storage groove 10 under the pressure of the inner wall of the socket 9, and at the same time, the first spring 11 is compressed. When the buckle 12 moves to the position of the slot 13, the buckle 12 will be locked into the interior of the slot 13 under the reaction force of the first spring 11, thus completing the fixing of the fixing frame 6. At this time, the outer side of the wafer will be inserted into the inner side of the baffle 7, which can limit the wafer in all directions, making it more stable during transportation and less likely to fall. When the insert 8 is inserted into the interior of the socket 9, it will squeeze the push plate 14, thereby compressing the second spring 15. When disassembling, press the buckle 12, and the push plate 14 will push the insert 8 out of the interior of the socket 9 under the reaction force of the second spring 15, thus completing the disassembly.

[0027] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A wafer memory device, comprising a base plate (1) and a side plate (2), characterized in that: The bottom plate (1) has a side plate (2) on its top, which is fixedly connected to the bottom plate (1). The side plate (2) has a shelf (3) on its inner side, which has multiple shelves (3). The side plate (2) and the shelf (3) have two sets. The side plate (2) has a top plate (4) on its top, which has a placement plate (5) at one end. The placement plate (5) and the top plate (4) are fixedly connected. The side plate (2) has a fixing frame (6) at one end. The fixing frame (6) and the side plate (2) are rotatably connected by a hinge. The fixing frame (6) has a baffle (7) on its inner side, which is fixedly connected to the fixing frame (6). The fixing frame (6) has an insertion block (8) at one end. The side plate (2) has a socket (9) on one side, which is fixed by interlocking.

2. The wafer memory device according to claim 1, characterized in that: The insert (8) has a storage groove (10) embedded on one side, and a first spring (11) is provided inside the storage groove (10). The first spring (11) and the storage groove (10) are fixedly connected.

3. The wafer storage apparatus of claim 2, wherein: The storage slot (10) is provided with a buckle (12) inside, and the buckle (12) and the storage slot (10) are slidably connected. The socket (9) is provided with a slot (13) on one side, and the buckle (12) and the slot (13) are fixed by snapping together.

4. A wafer memory device according to claim 1, characterized in that: The socket (9) has a push plate (14) inside, and the push plate (14) and the socket (9) are slidably connected.

5. The wafer storage apparatus of claim 4, wherein: A second spring (15) is provided on one side of the push plate (14), and the second spring (15) and the push plate (14) are fixedly connected.

6. The wafer storage apparatus of claim 1, wherein: The bottom of the base plate (1) is provided with casters (16), and there are three casters (16). A brake is provided on one side of each caster (16).

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