Turnover type implanting mechanism of chip capacitor

Abstract

The utility model discloses a turnover implanting mechanism for chip capacitors, which comprises an implanting device and a feeding device, the feeding device is positioned behind the implanting device, and the feeding device is used for feeding the chip capacitors to the implanting device; the implanting device comprises an implanting seat, a positioning seat, a feeding seat and an electromagnet; the positioning seat is mounted at the top of the front side of the implanting seat and is used for mounting the material loading disc; the rear end of the implanting seat is connected with the rear end of the feeding seat through a bearing seat, and the feeding seat swings relative to the implanting seat; the feeding seat comprises an implanting mesh basket and a receiving box, the rear end of the implanting mesh basket is mounted on the bearing seat in a swinging manner, and the receiving box is mounted at the top of the rear end of the implanting mesh basket; and the receiving box is used for receiving the chip capacitors discharged from the feeding device. According to the scheme, the chip capacitor is directly laid on the top of the implanting mesh basket through overturning type blanking, so that the implanting time of the chip capacitor is shortened, and the energy consumption of the electromagnet for realizing the shape change of the chip capacitor is reduced.

Description

A flip-type implantation mechanism for surface mount capacitors Technical Field

[0001] This utility model relates to the technical field of chip capacitor production equipment, and in particular to a flip-type implantation mechanism for chip capacitors. Background Technology

[0002] With the rapid development of electronic technology, the types of electronic components are becoming increasingly diverse. As people's requirements for the quality of electronic products continue to improve, capacitors, as a basic and important electronic component, are also widely used in the production of electronic products, and the production and processing technology of capacitors is also constantly improving.

[0003] As one of the key processes in capacitor manufacturing, the sealing process plays a decisive role in the production efficiency, product performance, and quality of capacitors. The sealing process usually requires a sealing machine to complete.

[0004] To facilitate the mass production and sealing of surface mount capacitors, adhesive application and implantation are typically required before sealing. Specifically, workers prepare a carrier tray, a fixing sticker, and unsealed surface mount capacitors. The fixing sticker is then affixed to one side of the carrier tray. Next, the unsealed capacitors are manually spread on the other side of the tray, embedding them into the feed holes. Simultaneously, one end of each capacitor is adhered to the fixing sticker. After this process, a sealing machine performs silver printing for sealing. As can be seen, existing sealing machines generally only handle the silver printing step in the sealing process, while the implantation step before silver printing must be done manually, significantly increasing labor costs. Furthermore, excessive manual intervention is detrimental to improving the sealing efficiency of surface mount capacitors.

[0005] To further improve the sealing efficiency of surface mount capacitors, existing technologies have developed implantation mechanisms specifically designed to automatically implant surface mount capacitors into a carrier tray. In these existing implantation mechanisms, the capacitors to be implanted are typically poured into the top of the implantation basket from the feeding mechanism's inlet and piled up to a certain height. This requires the capacitors to be dispersed from their piled state into a single, flat layer before falling into the tray's holes. This process takes considerable time, reducing implantation efficiency and increasing the energy consumption of the vibrator and / or oscillator used to change the capacitor's shape. Summary of the Invention

[0006] The purpose of this invention is to propose a flip-type implantation mechanism for surface mount capacitors. By flipping the material, the surface mount capacitor is directly laid flat on the top of the implantation basket, thereby shortening the implantation time of the surface mount capacitor and reducing the energy consumption of the electromagnet that changes the shape of the surface mount capacitor, thus overcoming the shortcomings of the prior art.

[0007] To achieve this objective, the present invention adopts the following technical solution:

[0008] A flip-type implantation mechanism for a surface mount capacitor includes an implantation device and a feeding device. The feeding device is located behind the implantation device and is used to feed the surface mount capacitor into the implantation device.

[0009] The implantation device includes an implantation seat, a positioning seat, a feeding seat, and an electromagnet; the positioning seat is installed on the top front side of the implantation seat and is used to install a material tray; the rear end of the implantation seat is connected to the rear end of the feeding seat through a bearing seat, and the feeding seat swings relative to the implantation seat.

[0010] The feeding seat includes an implantation basket and a receiving box. The rear end of the implantation basket is sway-mounted on the bearing seat, and the receiving box is installed on the top of the rear end of the implantation basket. The receiving box is used to receive the surface mount capacitors fed from the feeding device.

[0011] The implantation basket has multiple implantation mesh holes, and the implantation mesh holes match the material holes of the material tray; the electromagnet is installed inside the implantation base, and the electromagnet is used to cause the chip capacitor to vibrate through the implantation mesh holes and fall into the material holes of the material tray.

[0012] Preferably, the implantation device further includes a buffer limiting rod, which is installed on the top front side of the implantation seat and disposed on both sides of the positioning seat;

[0013] The buffer limiting rod includes a buffer pad and an elastic telescopic rod connected from top to bottom, and the buffer pad is used to abut against the bottom of the implanted basket.

[0014] Preferably, the implantation device further includes a clamping cylinder, which is installed on the top front side of the implantation seat and is located on the front side of the positioning seat;

[0015] The clamping cylinder is used to press the implanted basket against the positioning seat.

[0016] Preferably, the positioning seat moves vertically relative to the implantation seat;

[0017] The bottom edge of the implanted basket is provided with a positioning post, and the top edge of the positioning seat is recessed inward to provide a positioning groove, which is used to accommodate the positioning post.

[0018] Preferably, the feeding seat further includes a pressing pin, and the pressing pin can extend and retract on the bottom surface of the implantation basket. The top of the positioning seat is provided with a pressing groove, and the pressing pin can be accommodated inside the pressing groove.

[0019] The edge of the material tray is provided with fixing holes. When the implantation basket is flipped over to the top of the positioning seat, the positions of the pressure pin, the fixing holes and the pressure groove are matched with each other.

[0020] When the pressure pin passes through the fixing hole and is received inside the pressure groove, the material tray is positioned between the positioning seat and the implantation basket.

[0021] Preferably, the implantation device further includes multiple pins, which are protrudingly mounted on the top of the positioning seat and located at the edge of the positioning seat.

[0022] The bottom surface of the implanted basket has multiple insertion holes that match the pins, and the insertion holes are used to accommodate the pins.

[0023] Preferably, the implantation device further includes a mounting base located below the implantation site;

[0024] The bottom center of the implant is connected to the top center of the mounting base via a bearing seat, and the implant swings relative to the mounting base.

[0025] The oscillation axis of the implant relative to the mounting base is parallel to the oscillation axis of the feed seat relative to the implant.

[0026] Preferably, the implant includes an upper mounting plate, a support rod, and a lower mounting plate connected sequentially from top to bottom, the electromagnet is mounted on the lower mounting plate, and the electromagnet is located between the upper mounting plate and the lower mounting plate;

[0027] The implant also includes a shock-absorbing plate, which rests between the electromagnet and the lower mounting plate.

[0028] The technical solution provided by this utility model can include the following beneficial effects:

[0029] Compared to existing chip capacitor implantation mechanisms that use vibrators to disperse the chip capacitors from a stacked state into a single, flat layer during implantation, this solution utilizes a mechanical tilting action to quickly lay the chip capacitors flat on the surface of the implantation basket. This effectively shortens the implantation time and reduces the energy consumption of the electromagnet used to change the shape of the chip capacitors. Furthermore, it also effectively reduces the size of the implantation mechanism, making its structure more compact. Attached Figure Description

[0030] Figure 1 is a schematic diagram of the structure of a flip-type implantation mechanism for a chip capacitor according to the present invention.

[0031] Figure 2 is a structural schematic diagram of the implantation device in the flip-type implantation mechanism of the patch capacitor of this utility model from one perspective.

[0032] Figure 3 is a structural schematic diagram of the implantation device in the flip-type implantation mechanism of the patch capacitor of this utility model from one perspective.

[0033] Figure 4 is a structural schematic diagram of the implantation device in the implantation state of the flip-type implantation mechanism of the chip capacitor of this utility model.

[0034] The components include: implantation device 1, implantation seat 11, upper mounting plate 111, support rod 112, lower mounting plate 113, shock absorber 114, positioning seat 12, positioning groove 121, feeding seat 13, implantation basket 131, positioning post 1311, insertion hole 1312, receiving box 132, pressing pin 133, electromagnet 14, buffer limit rod 15, buffer pad 151, elastic telescopic rod 152, pressing cylinder 16, pin 17, and mounting base 18.

[0035] Feeding device 2;

[0036] Material tray 3, fixing hole 31. Detailed Implementation

[0037] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0038] This technical solution provides a flip-type implantation mechanism for surface mount capacitors, including an implantation device 1 and a feeding device 2. The feeding device 2 is located behind the implantation device 1 and is used to feed the surface mount capacitors into the implantation device 1.

[0039] The implantation device 1 includes an implantation seat 11, a positioning seat 12, a feeding seat 13, and an electromagnet 14; the positioning seat 12 is installed on the top front side of the implantation seat 11, and the positioning seat 12 is used to install the material tray 3; the rear end of the implantation seat 11 is connected to the rear end of the feeding seat 13 through a bearing seat, and the feeding seat 13 swings relative to the implantation seat 11.

[0040] The feeding seat 13 includes an implantation basket 131 and a receiving box 132. The rear end of the implantation basket 131 is sway-mounted on the bearing seat, and the receiving box 132 is mounted on the top of the rear end of the implantation basket 131. The receiving box 132 is used to receive the chip capacitors fed from the feeding device 2.

[0041] The implantation basket 131 has multiple implantation mesh holes, and the implantation mesh holes match the material holes of the material tray 3; the electromagnet 14 is installed inside the implantation base 211, and the electromagnet 14 is used to cause the chip capacitor to vibrate through the implantation mesh holes and fall into the material holes of the material tray 3.

[0042] In existing chip capacitor implantation mechanisms, the chip capacitors to be implanted are generally poured into the top of the implantation basket from the feeding port of the feeding mechanism and piled up to a certain height on the top of the implantation basket. As a result, the chip capacitors need to be dispersed from the piled state into a single layer flat state before falling into the material hole of the loading tray. This makes the implantation process take a lot of time, which not only reduces the implantation efficiency, but also increases the energy consumption of the vibrator and / or oscillator that realizes the change of the shape of the chip capacitor.

[0043] To solve the above-mentioned technical problems, this technical solution proposes a flip-type implantation mechanism for surface mount capacitors, as shown in Figures 1-4, which includes an implantation device 1 and a feeding device 2 for feeding surface mount capacitors (not shown in the figure) into the implantation device 1.

[0044] Specifically, compared to existing chip capacitor implantation mechanisms, the implantation device 1 of this solution mainly sets the feeding seat 13, including the implantation basket 131, as a flip-type feeding structure. That is, when the feeding device 2 delivers chip capacitors to the implantation device 1, the receiving box 132 first receives the preset implantation quantity (i.e., the number of chip capacitors) for one implantation process; then the feeding seat 13 is swung relative to the implantation seat 11, causing the implantation basket 131 to rotate above the positioning seat 12 on which the material tray 3 is installed. During the swaying process, the chip capacitors can be relatively evenly laid on the surface of the implantation basket 131 under the combined action of swaying and their own gravity. Then, by changing the magnetic field inside the implantation basket 131 through the switching on and off of the electromagnet 14, the chip capacitors change their placement orientation and shape under the action of the magnetic field, thereby achieving rapid implantation. Compared to existing chip capacitor implantation mechanisms that use a vibrator to disperse the chip capacitors from a stacked state into a single, flat layer during implantation, this solution utilizes a mechanical tilting action to quickly lay the chip capacitors flat on the surface of the implantation basket 131. This effectively shortens the implantation time and reduces the energy consumption of the electromagnet used to change the shape of the chip capacitors. Furthermore, it also effectively reduces the size of the implantation mechanism, making its structure more compact.

[0045] It should be noted that the feeding mechanism 2 in this solution is a conventional feeding mechanism in this technical field, and its specific structure will not be described in detail here.

[0046] Furthermore, the implantation device 1 also includes a buffer limiting rod 15, which is installed on the top front side of the implantation seat 11 and is disposed on both sides of the positioning seat 12.

[0047] The buffer limiting rod 15 includes a buffer pad 151 and an elastic telescopic rod 152 connected from top to bottom. The buffer pad 151 is used to abut against the bottom of the implanted basket 131.

[0048] Furthermore, in order to achieve the flipping of the feeding seat 13 into position, this solution also adds buffer limiting rods 15 on both sides of the positioning seat 12, so that the buffer pad 151 on its top abuts against the bottom of the implantation basket 131, thereby achieving the flipping into position without damaging other devices in the implantation mechanism.

[0049] Furthermore, the buffer limiting rod 15 of this solution includes a buffer pad 151 and an elastic telescopic rod 152 connected from top to bottom. The material of the buffer pad 151 includes, but is not limited to, silicone, to form a soft contact with the implantation basket 131, so as to avoid damage to the structure of the implantation basket 131 when it is flipped into place; the elastic telescopic rod 152 can be essentially a spring, which plays an elastic buffering role.

[0050] Furthermore, the implantation device 1 also includes a clamping cylinder 16, which is installed on the top front side of the implantation seat 11 and is located on the front side of the positioning seat 12.

[0051] The clamping cylinder 16 is used to press the implantation basket 131 against the positioning seat 12.

[0052] Furthermore, the implantation device 1 of this solution also includes a clamping cylinder 16, which is used to press the implantation basket 131 against the positioning seat 12, thereby ensuring the stable installation of the material tray 3 on the positioning seat 12 without affecting the implantation, and also effectively ensuring the effective alignment of the implantation mesh in the implantation basket 131 with the material hole of the material tray 3 during the implantation process.

[0053] It should be noted that the clamping cylinder 16 in this solution is a standard structural component for achieving the clamping effect, and its specific structure will not be described in detail here.

[0054] To further explain, the positioning seat 12 can move up and down relative to the implantation seat 11;

[0055] The bottom edge of the implanted basket 131 is provided with a positioning post 1311, and the top edge of the positioning seat 12 is provided with a positioning groove 121, which is used to accommodate the positioning post 1311.

[0056] To improve the implantation accuracy during the implantation process, this solution also adds a positioning post 111 and a positioning groove 121 that are matched and installed together in the implantation device 1. At the same time, during the subsequent tilting of the implantation seat 11 relative to the mounting base 18, the addition of the above structure also helps to prevent the material tray 3 from detaching from the positioning seat 12.

[0057] In one specific embodiment, the flipping process of this solution is as follows: (1) the feed seat 13 swings relative to the implant seat 11 and the buffer pad 151 abuts against the bottom of the implant basket 131; (2) the positioning seat 12 moves upward relative to the implant seat 11 and the positioning column 1311 is accommodated in the positioning groove 121; (3) the pressing cylinder 16 is driven so that its conveying end presses the implant basket 131 against the positioning seat 12.

[0058] Furthermore, the feeding seat 13 also includes a pressing pin 133, and the pressing pin 133 can extend and retract on the bottom surface of the implantation basket 131. The top of the positioning seat 12 is provided with a pressing groove, and the pressing pin 133 can be accommodated inside the pressing groove.

[0059] The edge of the material tray 3 is provided with a fixing hole 31. When the implantation basket 131 is flipped to the top of the positioning seat 12, the positions of the pressing pin 133, the fixing hole 31 and the pressing groove are matched with each other.

[0060] When the pressure pin 133 passes through the fixing hole 31 and is received inside the pressure groove, the material tray 3 is positioned between the positioning seat 12 and the implantation basket 131.

[0061] In a preferred embodiment of this technical solution, to further improve the implantation accuracy during the implantation process, the implantation device 1 is further equipped with a matching pressure pin 133, a fixing hole 31, and a pressure groove (not shown in the figure). When the material tray 3 is placed on the positioning seat 12, the pressure pin 133 can pass through the fixing hole 31 (as shown in Figure 2) and be accommodated inside the pressure groove. This not only limits the material tray 3 but also ensures a one-to-one match between the implantation mesh and the material hole, thereby improving the implantation accuracy of the material tray 3. Furthermore, during the subsequent tilting of the implantation seat 11 relative to the mounting base 18, the addition of the above structure also helps prevent the material tray 3 from detaching from the positioning seat 12.

[0062] Furthermore, the implantation device 1 also includes multiple pins 17, which are provided in a manner that protrudes from the top of the positioning seat 12 and is located at the edge of the positioning seat 12.

[0063] The bottom surface of the implanted basket 131 is provided with a plurality of insertion holes 1312 that match the pin 17, and the insertion holes 1312 are used to accommodate the pin 17.

[0064] In another preferred embodiment of this technical solution, to further improve the implantation accuracy during the implantation process, this solution also adds a matching pin 17 and a socket 1312 to the implantation device 1. During the flipping process of the feed seat 13, the pin 17 can be accommodated in the socket 1312, which not only limits the material tray 3, but also ensures the one-to-one matching between the implantation mesh and the material hole, thereby improving the implantation accuracy of the material tray 3. At the same time, during the subsequent tilting of the implantation seat 11 relative to the mounting base 18, the addition of the above structure also helps to prevent the material tray 3 from detaching from the positioning seat 12.

[0065] Furthermore, the implantation device 1 also includes a mounting base 18, which is located below the implantation seat 11;

[0066] The bottom center of the implant 11 is connected to the top center of the mounting base 18 via a bearing seat, and the implant 11 swings relative to the mounting base 18.

[0067] The swing axis of the implant 11 relative to the mounting base 18 is parallel to the swing axis of the feed seat 13 relative to the implant 11.

[0068] In addition, to further shorten the implantation time and improve implantation efficiency, this solution also sets the implantation seat 11 as a swing mechanism. Specifically, the implantation process of the implantation device 1 in this solution includes the following steps: First, the empty material tray 3 is installed on the positioning seat 12, and at the same time, the chip capacitor is poured into the receiving box 132 by the feeding mechanism 2 to wait for implantation; the material tray 13 is swung relative to the implantation seat 11, and the bottom of the implantation basket 131 abuts against the top of the positioning seat 12; so as to achieve a tight match between the implantation mesh of the implantation basket 131 and the material hole of the material tray 3, so that the chip capacitor can fall directly into the corresponding material hole after passing through the implantation mesh; then the implantation seat 11 is swung slightly relative to the mounting base 18, and at the same time the electromagnet 14 is turned on, so that the chip capacitor located in the implantation basket 131 passes through the implantation mesh and falls into the corresponding material hole under the dual action of the swing of the implantation seat 11 and the electromagnet 14, thus completing the implantation process.

[0069] To further explain, the implant 11 includes an upper mounting plate 111, a support rod 112 and a lower mounting plate 113 connected sequentially from top to bottom. The electromagnet 14 is mounted on the lower mounting plate 113 and is located between the upper mounting plate 111 and the lower mounting plate 113.

[0070] The implant 11 also includes a shock-absorbing plate 114, which rests between the electromagnet 14 and the lower mounting plate 113.

[0071] Since the electromagnet 14 generates a magnetic field by the current flowing in the wire, this magnetic field can attract or repel other magnetic materials. In order to avoid the electromagnet 14 causing resonance to the structure of other magnetic materials in the implantation mechanism, this solution also adds a damping plate 114 between the electromagnet 14 and the lower mounting plate 113 on which the electromagnet 14 is installed, so as to effectively alleviate the resonance phenomenon and prevent unnecessary vibration to other magnetic material structures.

[0072] It should be noted that the shock-absorbing pads 114 in this solution include, but are not limited to, silicone pads, and the number of shock-absorbing pads 114 can be set as needed and is not limited here. In addition, the number of electromagnets 14 used in this solution is not limited here and can be set as needed according to the implantation effect.

[0073] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0074] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps described in these embodiments do not limit the scope of this invention. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.

[0075] In the description of this utility model, it should be understood that the directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this utility model. The directional terms "inner" and "outer" refer to the inner and outer contours of each component itself.

[0076] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0077] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be construed as limiting the scope of protection of this utility model.

[0078] It should be noted that the terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in sequences other than those illustrated or described herein.

[0079] The technical principles of this utility model have been described above with reference to specific embodiments. These descriptions are merely for explaining the principles of this utility model and should not be construed as limiting the scope of protection of this utility model in any way. Based on this explanation, those skilled in the art can readily conceive of other specific embodiments of this utility model without any inventive effort, and these embodiments will all fall within the scope of protection of this utility model.

Claims

1. A flip-type implantation mechanism for a patch capacitor, characterized in that: The device includes an implantation unit and a feeding unit. The feeding unit is located behind the implantation unit and is used to feed surface-mount capacitors into the implantation unit. The implantation unit includes an implantation seat, a positioning seat, a feeding seat, and an electromagnet. The positioning seat is installed on the top front side of the implantation seat and is used to mount a material tray. The rear end of the implantation seat is connected to the rear end of the feeding seat via a bearing seat, and the feeding seat swings relative to the implantation seat. The feeding seat includes an implantation basket and a receiving box. The rear end of the implantation basket is swung and mounted on the bearing seat, and the receiving box is installed on the top rear end of the implantation basket. The receiving box is used to catch the surface-mount capacitors fed from the feeding unit. The implantation basket has multiple implantation mesh holes, and the implantation mesh holes match the material holes of the material tray. The electromagnet is installed inside the implantation seat and is used to cause the surface-mount capacitors to vibrate through the implantation mesh holes and fall into the material holes of the material tray.

2. The flip-type implantation mechanism for a patch capacitor according to claim 1, characterized in that: The implantation device further includes a buffer limiting rod, which is installed on the top front side of the implantation seat and is located on both sides of the positioning seat; the buffer limiting rod includes a buffer pad and an elastic telescopic rod connected from top to bottom, and the buffer pad is used to abut against the bottom of the implantation basket.

3. The flip-type implantation mechanism for a patch capacitor according to claim 1, characterized in that: The implantation device further includes a clamping cylinder, which is installed on the top front side of the implantation seat and located on the front side of the positioning seat; the clamping cylinder is used to press the implantation basket against the positioning seat.

4. The flip-type implantation mechanism for a patch capacitor according to claim 1, characterized in that: The positioning seat moves up and down relative to the implantation seat; the bottom edge of the implantation basket is provided with a positioning post protruding from it, and the top edge of the positioning seat is provided with a positioning groove recessed inward, the positioning groove being used to accommodate the positioning post.

5. The flip-type implantation mechanism for a patch capacitor according to claim 1, characterized in that: The feeding seat also includes a pressing pin, which can extend and retract on the bottom surface of the implantation basket. The top of the positioning seat has a pressing groove, and the pressing pin can be accommodated inside the pressing groove. The edge of the loading tray has a fixing hole. When the implantation basket is flipped above the positioning seat, the positions of the pressing pin, the fixing hole, and the pressing groove are matched. When the pressing pin passes through the fixing hole and is accommodated inside the pressing groove, the loading tray is positioned between the positioning seat and the implantation basket.

6. The flip-type implantation mechanism for a patch capacitor according to claim 1, characterized in that: The implantation device also includes multiple pins, which are protrudingly mounted on the top of the positioning seat and located at the edge of the positioning seat; the bottom surface of the implantation basket has multiple insertion holes that match the pins, and the insertion holes are used to accommodate the pins.

7. The flip-type implantation mechanism for a patch capacitor according to claim 1, characterized in that: The implantation device further includes a mounting base located below the implant; the bottom center of the implant is connected to the top center of the mounting base via a bearing seat, and the implant swings relative to the mounting base; the swing axis of the implant relative to the mounting base is parallel to the swing axis of the feed seat relative to the implant.

8. The flip-type implantation mechanism for a patch capacitor according to claim 1, characterized in that: The implantation base includes an upper mounting plate, a support rod, and a lower mounting plate connected sequentially from top to bottom. The electromagnet is mounted on the lower mounting plate and is located between the upper mounting plate and the lower mounting plate. The implantation base also includes a shock-absorbing plate that rests between the electromagnet and the lower mounting plate.

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