Electroplating circuit board wastewater treatment equipment

Abstract

The utility model discloses electroplating circuit board wastewater treatment equipment which comprises a treatment box, an electric-hydraulic push rod is arranged at the top of an inner cavity of the treatment box, a mounting ring is arranged at the bottom of the electric-hydraulic push rod, a cleaning mechanism is arranged in the mounting ring, and a supply and transportation mechanism is connected to the left side of the cleaning mechanism. A hollow ring is arranged at the bottom of the mounting ring, a discharging mechanism is arranged in the hollow ring, and the cleaning mechanism, the supply and conveying mechanism, the discharging mechanism, the supply mechanism, the mixing mechanism and other structures are arranged to assist in cooperation, so that maintenance is facilitated, sludge deposition is reduced, sediments in the box are conveniently and regularly cleaned, sludge hardening is prevented, and the manual cleaning frequency is reduced; the maintenance cost is reduced, the reduction of the treatment capacity caused by sludge accumulation is avoided, the dispersion nozzles are adopted, so that the wastewater is fully mixed with chemicals (such as a coagulant and a neutralizer), the reaction effect (such as flocculent precipitation and heavy metal removal) is improved, excessive or insufficient local chemicals are avoided, and the chemical consumption is reduced.

Description

A wastewater treatment device for electroplating circuit boards Technical Field

[0001] This utility model relates to the technical field of electroplating circuit board processing equipment, and more specifically, to an electroplating circuit board wastewater treatment equipment. Background Technology

[0002] The amount of wastewater generated from circuit boards is very large, with numerous sources and complex composition. It often contains harmful substances such as heavy metals and cannot be discharged directly. It needs to undergo scientific filtration, degradation, and sedimentation to ensure that the heavy metals and other harmful substances in the wastewater meet the discharge standards before being discharged.

[0003] For example, an existing Chinese authorized patent (publication number: CN220467616U) discloses a wastewater treatment device in flexible circuit board production, including a base plate. A treatment box is fixedly connected to the top left of the base plate, and a motor is fixedly connected to the top right of the treatment box. A third bevel gear is fixedly connected to the output end of the motor. A mounting plate is fixedly connected to the top center of the treatment box, and a second bevel gear is fixedly connected to the bottom end of the mounting plate. A rotating rod is fixedly connected inside the second bevel gear, and multiple first stirring blades are fixedly connected to the lower outer side of the rotating rod. In this invention, wastewater and chemical agents can be stirred bidirectionally, ensuring that the agents and target pollutants in the wastewater fully contact and react, which helps to improve treatment efficiency and pollutant removal effect. At the same time, it is convenient to disassemble, clean, or replace the filter plate, ensuring the normal operation and filtration effect of the wastewater treatment device.

[0004] The wastewater treatment device designed for flexible circuit board production has the following drawbacks in actual use: the inside of the treatment tank does not have a cleaning structure, which makes it impossible to effectively clean the sludge inside the tank, resulting in accumulation and hardening, reducing the effective volume and affecting the treatment efficiency. In addition, the feeding point is concentrated, and the reagents and wastewater are not mixed sufficiently, which reduces the neutralization, precipitation and other reaction effects, and may require the addition of additional reagents.

[0005] In view of this, an electroplating circuit board wastewater treatment device is provided to overcome the above-mentioned defects. Summary of the Invention

[0006] In view of the problems in the related technologies, this utility model proposes an electroplating circuit board wastewater treatment device to overcome the above-mentioned technical problems existing in the existing related technologies.

[0007] Therefore, the specific technical solution adopted by this utility model is as follows:

[0008] An electroplating circuit board wastewater treatment device includes a treatment tank. An electro-hydraulic push rod is provided at the top of the inner cavity of the treatment tank. An installation ring is provided at the bottom of the electro-hydraulic push rod. A cleaning mechanism is provided inside the installation ring. A feeding mechanism is connected to the left side of the cleaning mechanism. A hollow ring is provided at the bottom of the installation ring. A feeding mechanism is provided inside the hollow ring. A feeding mechanism is connected to the right side of the feeding mechanism. A mixing mechanism is provided at the bottom of the inner cavity of the treatment tank.

[0009] Preferably, the cleaning mechanism includes a ring pipe and spray heads, the ring pipe is disposed in the inner cavity of the mounting ring, and the outer wall of the ring pipe is circumferentially connected with multiple spray heads.

[0010] Preferably, the supply mechanism includes a supply box, a supply trough, a storage tank, a water pump, a water pipe, and a first flexible hose. The supply box is located on the left side of the processing box. The supply box has a supply trough and a storage tank dug out from top to bottom. A water pump is installed in the supply trough. Water pipes are connected to both sides of the water pump. The first flexible hose is connected between the water pipe located at the top and the ring pipe.

[0011] Preferably, the feeding mechanism includes an annular feeding pipe and a feeding head, wherein the annular feeding pipe is disposed inside a hollow ring, and the feeding head is annularly connected to the bottom of the annular feeding pipe.

[0012] Preferably, the feeding mechanism includes a feeding box, a storage tank, a feeding trough, a material pump, a feeding pipe, and a second flexible hose. The feeding box is located on the right side of the processing box. The feeding box has a storage tank and a feeding trough dug out from top to bottom. The storage tank is equipped with a material pump. The two sides of the material pump are respectively connected to the feeding pipe. The second flexible hose is connected between the upper feeding pipe and the annular conveying pipe.

[0013] Preferably, the mixing mechanism includes a speed-regulating motor and a mixing rod, with the speed-regulating motor located at the bottom of the processing chamber and the mixing rod located at the top of the speed-regulating motor.

[0014] This utility model has the following beneficial effects:

[0015] Compared with existing technologies, this electroplating circuit board wastewater treatment equipment:

[0016] The system utilizes multiple mechanisms, including a cleaning mechanism, a conveying mechanism, a discharging mechanism, a feeding mechanism, and a mixing mechanism, to work together in coordination.

[0017] 1. Easy to maintain and reduces sludge accumulation: It facilitates regular cleaning of sediment inside the tank, prevents sludge hardening, reduces the frequency of manual cleaning, lowers maintenance costs, and avoids a decrease in processing capacity due to sludge accumulation.

[0018] 2. Use dispersing nozzles to ensure that wastewater and chemicals (such as coagulants and neutralizers) are fully mixed, thereby improving the reaction effect (such as flocculation and sedimentation, and heavy metal removal), avoiding local over- or under-dosage of chemicals, and reducing chemical consumption. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 is a front view of an electroplating circuit board wastewater treatment device according to an embodiment of the present utility model;

[0021] Figure 2 is an internal view of an electroplating circuit board wastewater treatment device according to an embodiment of the present utility model.

[0022] Figure 3 is an internal view of the cleaning mechanism and the unloading mechanism of an electroplating circuit board wastewater treatment device according to an embodiment of the present utility model.

[0023] In the picture:

[0024] 1. Processing box; 2. Electro-hydraulic actuator; 3. Mounting ring; 4. Cleaning mechanism; 5. Feeding mechanism; 6. Hollow ring; 7. Discharge mechanism; 8. Feeding mechanism; 9. Mixing mechanism; 10. Ring pipe; 11. Spray head; 12. Feeding box; 13. Feeding trough; 14. Storage tank; 15. Water pump; 16. Water pipe; 17. First hose; 18. Annular conveying pipe; 19. Discharge head; 20. Feeding box; 21. Storage tank; 22. Feeding trough; 23. Pump; 24. Feeding pipe; 25. Second hose. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions in the embodiments will be clearly and completely described below with reference to the accompanying drawings. The following embodiments are used to illustrate this utility model, but are not intended to limit its scope.

[0026] In the description of this utility model, it should be noted that the terms "upper", "lower", "front", "back", "left", "right", "vertical", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0027] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0028] Example 1

[0029] As shown in Figures 1-3, an electroplating circuit board wastewater treatment device according to an embodiment of the present invention includes a treatment tank 1. An electro-hydraulic push rod 2 is provided at the top of the inner cavity of the treatment tank 1. An installation ring 3 is provided at the bottom of the electro-hydraulic push rod 2. A cleaning mechanism 4 is provided inside the installation ring 3. A feeding mechanism 5 is connected to the left side of the cleaning mechanism 4. A hollow ring 6 is provided at the bottom of the installation ring 3. A feeding mechanism 7 is provided inside the hollow ring 6. A feeding mechanism 8 is connected to the right side of the feeding mechanism 7. A mixing mechanism 9 is provided at the bottom of the inner cavity of the treatment tank 1.

[0030] In this embodiment, when feeding, the feeding mechanism 8 is activated by an external switch. The feeding mechanism 8 transmits the material to the treatment tank 1. The mixing mechanism 9 treats the material and the wastewater to be treated. After the wastewater is treated, the conveying mechanism 5 is activated by an external switch. The conveying mechanism 5 transmits the liquid to the cleaning mechanism 4. The cleaning mechanism 4 sprays the liquid onto the inner wall of the treatment tank 1. During spraying, the electro-hydraulic push rod 2 moves the mounting ring 3 and its components to adjust. The cleaning mechanism 4 cleans the sediment in the tank to prevent the sludge from hardening.

[0031] Example 2

[0032] The cleaning mechanism 4 includes a ring pipe 10 and a spray head 11. The ring pipe 10 is disposed in the inner cavity of the mounting ring 3, and a plurality of spray heads 11 are circumferentially connected to the outer wall of the ring pipe 10.

[0033] The supply mechanism 5 includes a supply box 12, a supply trough 13, a liquid storage tank 14, a water pump 15, a water pipe 16, and a first flexible hose 17. The supply box 12 is located on the left side of the treatment tank 1. The supply box 12 has a supply trough 13 and a liquid storage tank 14 dug out from top to bottom. The water pump 15 is installed in the supply trough 13. The water pump 15 is connected to both sides of the water pipe 16. The first flexible hose 17 is connected between the upper water pipe 16 and the ring pipe 10. The water pump 15 is started by an external switch. The water pump 15 draws liquid from the liquid storage tank 14 through the lower water pipe 16 and transmits the liquid to the inner wall of the treatment tank 1 through the upper water pipe 16, the first flexible hose 17, the ring pipe 10, and the spray head 11. During spraying, the electro-hydraulic push rod 2 moves the mounting ring 3 and its components to adjust. The spraying method cleans the sediment in the treatment tank 1 and prevents the sludge from hardening.

[0034] The feeding mechanism 7 includes an annular conveying pipe 18 and a feeding head 19. The annular conveying pipe 18 is disposed inside the hollow ring 6, and the bottom of the annular conveying pipe 18 is connected to the feeding head 19 in an annular manner.

[0035] The feeding mechanism 8 includes a feeding box 20, a storage tank 21, a feeding trough 22, a material pump 23, a feeding pipe 24, and a second flexible hose 25. The feeding box 20 is located on the right side of the processing tank 1. The feeding box 20 has a storage tank 21 and a feeding trough 22 dug out from top to bottom. The material pump 23 is installed in the storage tank 21. The material pump 23 is connected to the two sides of the material pump 23. The second flexible hose 25 is connected between the upper feeding pipe 24 and the annular conveying pipe 18. When feeding, the material pump 23 is started by an external switch. The material pump 23 draws the material from the feeding trough 22 through the lower feeding pipe 24 and transmits the raw material to the processing tank 1 through the upper feeding pipe 24, the second flexible hose 25, the annular conveying pipe 18, and the discharge head 19. The material and the wastewater to be treated are then treated by the mixing mechanism 9.

[0036] The mixing mechanism 9 includes a speed-regulating motor and a mixing rod. The speed-regulating motor is located at the bottom of the inner cavity of the processing box 1, and the mixing rod is located at the top of the speed-regulating motor.

[0037] Based on Example 1, the structure and function of the device are further optimized. The intelligent control system includes a control panel and a PLC controller. The control panel is fixed to the side of the device by bolts and adopts a touch screen design, which can display parameters such as the operating status of the device in real time. The PLC controller is electrically connected to the device in this case through a cable and can automatically adjust the operating mode of the device according to a preset program. Remote monitoring function is added to the intelligent control system, and users can view the operating status of the device in real time and perform remote control through a mobile phone or computer.

[0038] In summary, with the help of the above-mentioned technical solution of this utility model, when this device is in use, firstly, during material feeding, the material pump 23 is started by an external switch. The material pump 23 draws the material from the material feeding tank 22 through the lower material feeding pipe 24, and transmits the raw material to the processing tank 1 through the upper material feeding pipe 24, the second hose 25, the annular conveying pipe 18 and the discharge head 19. The material and the wastewater to be treated are then treated by the mixing mechanism 9. After the wastewater is treated, the water pump 15 is started by an external switch. The water pump 15 draws the liquid from the liquid storage tank 14 through the lower water pipe 16, and transmits the liquid to the inner wall of the processing tank 1 through the upper water pipe 16, the first hose 17, the annular pipe 10 and the spray head 11. During spraying, the electro-hydraulic push rod 2 moves the mounting ring 3 and its components to adjust. The spraying method cleans the sediment in the processing tank 1 and prevents the sludge from hardening.

[0039] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A wastewater treatment device for electroplating circuit boards, characterized in that, The device includes a processing box (1), an electro-hydraulic push rod (2) is provided at the top of the inner cavity of the processing box (1), an installation ring (3) is provided at the bottom of the electro-hydraulic push rod (2), a cleaning mechanism (4) is provided inside the installation ring (3), a feeding mechanism (5) is connected to the left side of the cleaning mechanism (4), a hollow ring (6) is provided at the bottom of the installation ring (3), a feeding mechanism (7) is provided inside the hollow ring (6), a feeding mechanism (8) is connected to the right side of the feeding mechanism (7), and a mixing mechanism (9) is provided at the bottom of the inner cavity of the processing box (1).

2. The wastewater treatment equipment for electroplating circuit boards according to claim 1, characterized in that, The cleaning mechanism (4) includes a ring pipe (10) and a spray head (11). The ring pipe (10) is disposed in the inner cavity of the mounting ring (3), and the outer wall of the ring pipe (10) is connected to a plurality of spray heads (11) in a ring.

3. The wastewater treatment equipment for electroplating circuit boards according to claim 1, characterized in that, The supply mechanism (5) includes a supply box (12), a supply trough (13), a liquid storage tank (14), a water pump (15), a water pipe (16), and a first flexible hose (17). The supply box (12) is located on the left side of the processing box (1). The supply box (12) has a supply trough (13) and a liquid storage tank (14) dug out from top to bottom. The supply trough (13) is equipped with a water pump (15). The water pump (15) is connected to the water pipe (16) on both sides. The water pipe (16) located above is connected to the ring pipe (10) by the first flexible hose (17).

4. The wastewater treatment equipment for electroplating circuit boards according to claim 3, characterized in that, The feeding mechanism (7) includes an annular feeding pipe (18) and a feeding head (19). The annular feeding pipe (18) is disposed inside a hollow ring (6), and the feeding head (19) is connected to the bottom of the annular feeding pipe (18).

5. The wastewater treatment equipment for electroplating circuit boards according to claim 1, characterized in that, The feeding mechanism (8) includes a feeding box (20), a storage tank (21), a feeding trough (22), a material pump (23), a feeding pipe (24), and a second hose (25). The feeding box (20) is located on the right side of the processing box (1). The feeding box (20) has a storage tank (21) and a feeding trough (22) dug out from top to bottom. The storage tank (21) is equipped with a material pump (23). The material pump (23) is connected to the feeding pipe (24) on both sides. The upper feeding pipe (24) is connected to the annular conveying pipe (18) with a second hose (25).

6. The wastewater treatment equipment for electroplating circuit boards according to claim 1, characterized in that, The mixing mechanism (9) includes a speed-regulating motor and a mixing rod. The speed-regulating motor is located at the bottom of the inner cavity of the processing box (1), and the mixing rod is located at the top of the speed-regulating motor.

Images