Flexible semiconductor refrigeration sheet and semiconductor refrigeration system

Abstract

The utility model relates to the technical field of refrigeration, in particular to a flexible semiconductor refrigeration sheet and a semiconductor refrigeration system, the flexible semiconductor refrigeration sheet comprises a refrigeration surface flexible substrate, a heat dissipation surface flexible substrate and a core particle matrix clamped between the refrigeration surface flexible substrate and the heat dissipation surface flexible substrate; the core particle matrix comprises a plurality of P-type semiconductor core particles, a plurality of N-type semiconductor core particles and conductive electrodes, the P-type semiconductor core particles and the N-type semiconductor core particles are arranged adjacently, and the conductive electrodes are connected with the adjacent P-type semiconductor core particles and N-type semiconductor core particles; and a heat dissipation area is arranged between the P-type semiconductor core particle and the N-type semiconductor core particle. By utilizing the excellent mechanical property of the flexible substrate, the flexible semiconductor chilling plate can be applied to irregular surfaces such as various curved surfaces; and the heat dissipation area can improve the heat dissipation effect of the heat dissipation surface flexible substrate, so that the temperature of the refrigeration surface flexible substrate can be rapidly reduced, the refrigeration efficiency is improved, and the purpose of rapid refrigeration is achieved.

Description

A flexible semiconductor refrigeration chip and a semiconductor refrigeration system Technical Field

[0001] This utility model relates to the field of refrigeration technology, and in particular to a flexible semiconductor refrigeration chip and a semiconductor refrigeration system. Background Technology

[0002] A thermoelectric cooler is a cooling device based on the thermoelectric effect. Its working principle is as follows: when a direct current passes through a circuit composed of two different semiconductors, one node will absorb heat (cold end) and the other node will release heat (hot end). The essence of this phenomenon is the energy level transition of charge carriers at the material interface.

[0003] Currently, the substrate material of existing thermoelectric coolers on the market is rigid ceramic, which limits their application to flat surfaces and restricts their use to curved surfaces. Although some thermoelectric coolers are designed as flexible thermoelectric coolers, the need to inject a filler liquid between the substrates to form a filler layer results in lower cooling efficiency and poor heat dissipation.

[0004] Therefore, existing technologies still need to be improved and developed. Summary of the Invention

[0005] In view of the shortcomings of the prior art, the purpose of this utility model is to provide a flexible semiconductor refrigeration chip and a semiconductor refrigeration system, which aims to solve the problems that most existing semiconductor refrigeration chips are rigid structures, and flexible semiconductor refrigeration chips have low cooling efficiency and poor heat dissipation.

[0006] The technical solution of this utility model is as follows:

[0007] A flexible semiconductor cooling chip includes: a cooling surface flexible substrate, a heat dissipation surface flexible substrate, and a core matrix sandwiched between the cooling surface flexible substrate and the heat dissipation surface flexible substrate.

[0008] The chip matrix includes a plurality of P-type semiconductor chips, a plurality of N-type semiconductor chips, and conductive electrodes. The P-type semiconductor chips are arranged adjacent to the N-type semiconductor chips, and the conductive electrodes connect the adjacent P-type semiconductor chips and the N-type semiconductor chips. A heat dissipation area is provided between the P-type semiconductor chips and the N-type semiconductor chips.

[0009] The flexible semiconductor cooling chip, wherein both the heat dissipation flexible substrate and the cooling flexible substrate are made of polyimide film.

[0010] The flexible semiconductor cooling chip, wherein the flexible substrate of the heat dissipation surface is provided with a microchannel structure; the microchannel structure includes a plurality of branch microchannel structures and a main microchannel structure formed by the convergence of the two ends of the branch microchannel structures.

[0011] In the flexible semiconductor cooling chip, a conductive adhesive layer is provided between the conductive electrode and the P-type semiconductor chip, and between the conductive electrode and the N-type semiconductor chip.

[0012] In the flexible semiconductor cooling chip, the thickness of the conductive adhesive layer is 0.01 mm to 0.2 mm.

[0013] In the flexible semiconductor cooling chip, an adhesive layer is provided between the flexible substrate on the cooling surface and the conductive electrode, and between the flexible substrate on the heat dissipation surface and the conductive electrode.

[0014] The flexible semiconductor cooling chip, wherein the thickness of the adhesive layer is 0.01 mm to 0.2 mm.

[0015] The flexible semiconductor cooling chip further includes a positive electrode line connected to one of the N-type semiconductor chips and a negative electrode line connected to one of the P-type semiconductor chips; the thickness of the flexible substrate of the cooling surface is 0.05mm to 1mm; the thickness of the flexible substrate of the heat dissipation surface is 0.05mm to 1mm; and the thickness of the P-type semiconductor chip and the N-type semiconductor chip is 0.5mm to 8mm.

[0016] A semiconductor cooling system includes a flexible semiconductor cooling chip and heat dissipation fins disposed on the side of the flexible substrate of the heat dissipation surface away from the flexible substrate of the cooling surface.

[0017] The semiconductor cooling system further includes a cooling circulation pump; the cooling circulation pump is connected to the main microchannel structure on the flexible substrate of the heat dissipation surface.

[0018] Beneficial effects: This utility model provides a flexible semiconductor cooling chip and a semiconductor cooling system. The flexible semiconductor cooling chip includes: a flexible substrate with a cooling surface, a flexible substrate with a heat dissipation surface, and a core matrix sandwiched between the flexible substrate with the cooling surface and the flexible substrate with the heat dissipation surface. The core matrix includes a plurality of P-type semiconductor cores, a plurality of N-type semiconductor cores, and conductive electrodes. The P-type semiconductor cores and the N-type semiconductor cores are arranged adjacent to each other, and the conductive electrodes connect the adjacent P-type semiconductor cores and the N-type semiconductor cores. A heat dissipation area is provided between the P-type semiconductor cores and the N-type semiconductor cores. This invention utilizes the superior mechanical properties of flexible substrates—one for cooling and the other for heat dissipation—to extend the application range of flexible semiconductor refrigeration chips beyond flat surfaces to include various curved and irregular surfaces. Furthermore, by forming a heat dissipation zone between the P-type and N-type semiconductor cores, the deformation capability of the flexible semiconductor refrigeration chip is improved, meeting the requirements for installation on complex curved surfaces. This heat dissipation zone also enhances the heat dissipation effect of the flexible substrate, allowing the temperature of the cooling substrate to drop rapidly, thus increasing cooling efficiency and achieving rapid cooling. Attached Figure Description

[0019] Figure 1 is a schematic diagram of the overall structure of a flexible semiconductor cooling chip according to this utility model;

[0020] Figure 2 is a partial cross-sectional view of a flexible semiconductor cooling chip according to the present invention.

[0021] Figure 3 is an enlarged view of point A in Figure 2;

[0022] Figure 4 is a schematic diagram of the microchannel structure in the flexible substrate of the heat dissipation surface.

[0023] Figure 5 is a partial structural schematic diagram of a semiconductor refrigeration system according to this utility model;

[0024] Explanation of reference numerals in the attached figures: 10 for cooling flexible substrate, 20 for heat dissipation flexible substrate, 30 for core matrix, 31 for P-type semiconductor core, 32 for N-type semiconductor core, 33 for conductive electrode, 40 for heat dissipation area, 50 for microchannel structure, 51 for branch microchannel structure, 52 for main microchannel structure, 60 for conductive adhesive layer, 70 for adhesive layer, 80 for sealing layer, 91 for positive electrode line, 92 for negative electrode line, and 100 for heat dissipation fins. Detailed Implementation

[0025] This utility model provides a flexible semiconductor refrigeration chip and a semiconductor refrigeration system. To make the objectives, technical solutions, and effects of this utility model clearer and more explicit, the following provides a more detailed description. It should be understood that the specific embodiments described herein are merely illustrative of this utility model and are not intended to limit its scope.

[0026] In the description of this application, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," and "rear," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include one or more of the stated features.

[0027] It will be understood by those skilled in the art that, unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. It should also be understood that terms such as those defined in general dictionaries should be understood to have the same meaning as in the context of the prior art, and should not be interpreted in an idealized or overly formal sense unless specifically defined as herein.

[0028] As shown in Figures 1, 2 and 3, the present invention provides a flexible semiconductor cooling chip, comprising: a flexible substrate 10 with a cooling surface, a flexible substrate 20 with a heat dissipation surface, and a core matrix 30 sandwiched between the flexible substrate 10 with the cooling surface and the flexible substrate 20 with the heat dissipation surface.

[0029] The chip matrix 30 includes a plurality of P-type semiconductor chips 31, a plurality of N-type semiconductor chips 32, and conductive electrodes 33. The P-type semiconductor chips 31 and the N-type semiconductor chips 32 are arranged adjacent to each other, and the conductive electrodes 33 connect the adjacent P-type semiconductor chips 31 and the N-type semiconductor chips 32. A heat dissipation area 40 is provided between the P-type semiconductor chips 31 and the N-type semiconductor chips 32.

[0030] In this embodiment, by providing the cooling surface flexible substrate 10 and the heat dissipation surface flexible substrate 20, the excellent mechanical properties of the flexible substrate enable the flexible semiconductor cooling chip to be used not only on flat surfaces but also on various curved surfaces and other irregular surfaces, thus expanding the application range of the semiconductor cooling chip. Furthermore, by utilizing the gap between the P-type semiconductor core and the N-type semiconductor core to form a heat dissipation zone, the deformation capability of the flexible semiconductor cooling chip is improved, meeting the installation requirements of complex curved surfaces. Moreover, this heat dissipation zone can improve the heat dissipation effect of the heat dissipation surface flexible substrate, allowing the temperature of the cooling surface flexible substrate to drop rapidly, improving cooling efficiency, and achieving the purpose of rapid cooling.

[0031] Specifically, a heat dissipation zone 40 is formed between the P-type semiconductor core 31 and the N-type semiconductor core 32. This allows the P-type semiconductor core 31 and the N-type semiconductor core 32 to have a certain deformation space when the flexible semiconductor refrigeration chip undergoes bending deformation to adapt to irregular surfaces. This prevents the P-type semiconductor core 31 and the N-type semiconductor core 32 from squeezing each other due to deformation of the flexible semiconductor refrigeration chip, which could lead to chip failure. In addition, by using the heat dissipation zone to reduce the density of the core matrix 30, it is beneficial for the flexible substrate 10 on the cooling surface to transfer heat to the flexible substrate 20 on the heat dissipation surface after absorbing heat, thereby improving the heat dissipation effect of the flexible substrate on the heat dissipation surface and improving the cooling efficiency of the flexible semiconductor refrigeration chip.

[0032] In some embodiments, both the heat dissipation flexible substrate 20 and the cooling flexible substrate 10 are made of polyimide film. Polyimide film has excellent heat resistance, superior mechanical properties, good chemical stability, and excellent dielectric properties. Using it as the cooling flexible substrate 10 and the heat dissipation flexible substrate 20 can improve the service life of the flexible semiconductor cooling chip.

[0033] In some embodiments, as shown in FIG4, the flexible substrate 20 for heat dissipation is provided with a microchannel structure 50; the microchannel structure 50 includes a plurality of branch microchannel structures 51 and a main microchannel structure 52 formed by the convergence of the two ends of the branch microchannel structures 51. The microchannel structure is constituted by the plurality of branch microchannel structures 51 and the main microchannel structure 52 formed by the convergence of the plurality of branch microchannel structures 51, and heat dissipation is achieved in conjunction with heat dissipation fins disposed on the flexible substrate for heat dissipation.

[0034] In some embodiments, as shown in FIG3, conductive adhesive layers 60 are provided between the conductive electrode 33 and the P-type semiconductor chip 31, and between the conductive electrode 33 and the N-type semiconductor chip 32. The conductive adhesive layers 60 are used to connect several P-type semiconductor chips 31 and several N-type semiconductor chips 32 in series, thereby forming a chip matrix.

[0035] In some embodiments, the conductive adhesive layer is made of solder paste or silver paste, which has good conductivity and is not prone to cracking during long-term heat exchange, thereby improving the service life of the flexible semiconductor refrigeration chip.

[0036] In some embodiments, the conductive electrode 33 is made of copper foil, which has good ductility and conductivity. When the flexible semiconductor cooling chip is applied to an irregular surface, the conductive electrode can adapt to changes in the irregular plane and is not prone to cracking.

[0037] In some embodiments, the thickness of the conductive adhesive layer is 0.01 mm to 0.2 mm. This thickness range not only provides high conductivity but also allows for a reduction in the thickness of the flexible semiconductor cooling chip and a decrease in thermal resistance while ensuring the conductive electrodes do not detach.

[0038] In some embodiments, as shown in FIG3, adhesive layers 70 are provided between the cooling flexible substrate 10 and the conductive electrode 33, and between the heat dissipation flexible substrate 20 and the conductive electrode 33. The adhesive layers 70 allow the cooling flexible substrate 10 and the heat dissipation flexible substrate 20 to be fixed to the conductive electrode 33, thereby encapsulating the core matrix.

[0039] In some embodiments, the adhesive layer is made of insulating adhesive or conductive adhesive.

[0040] In some embodiments, the thickness of the adhesive layer is 0.01 mm to 0.2 mm. Using a thinner adhesive layer to cover the core matrix with the substrate reduces the thickness of the flexible semiconductor cooling chip and improves its deformation capability.

[0041] In some embodiments, the flexible semiconductor cooling chip can save the need for an adhesive layer by fabricating conductive electrodes on the flexible substrate 10 of the cooling surface and the flexible substrate 20 of the heat dissipation surface, or by coating copper foil on the substrate through etching, laser or other processes.

[0042] In some embodiments, as shown in FIG2, an encapsulating layer 80 is provided between the cooling surface flexible substrate 10 and the heat dissipation surface flexible substrate 20 and around the outermost edge of the core matrix 30; by providing an encapsulating layer at the outermost edge, the airtightness inside the flexible semiconductor cooling chip can be improved, preventing moisture from entering the core matrix and causing a short circuit.

[0043] In some embodiments, the flexible semiconductor cooling chip further includes a positive electrode line 91 connected to one of the N-type semiconductor chips and a negative electrode line 92 connected to one of the P-type semiconductor chips; the thickness of the flexible substrate of the cooling surface is 0.05 mm to 1 mm; the thickness of the flexible substrate of the heat dissipation surface is 0.05 mm to 1 mm; and the thickness of the P-type semiconductor chip and the N-type semiconductor chip is 0.5 mm to 8 mm.

[0044] In some embodiments, the fabrication process of the flexible semiconductor refrigeration chip is as follows: an adhesive layer material is coated on a flexible substrate with a cooling surface, and conductive electrodes are attached; then a conductive adhesive layer material is coated on the conductive electrodes, and a core particle is attached; on the other side of the core particle, conductive electrodes and a flexible substrate with a heat dissipation surface are also attached sequentially using an adhesive method; finally, the sides are sealed with glue to obtain the flexible semiconductor refrigeration chip. In use, the cold end of this semiconductor refrigeration chip can be brought into contact with the curved surface that needs cooling to achieve a cooling effect.

[0045] In some implementations, electrodes can be fabricated on one side of the substrate by etching or laser processing according to the required core matrix layout, which can save the need for adhesive layers. Then, a conductive adhesive layer is applied to the flexible substrate electrode forming the electrode, and the core is bonded to the conductive electrode. On the other side, a conductive adhesive layer, a conductive electrode, and a flexible substrate are also bonded. Finally, the sides are sealed with adhesive to complete the manufacturing process.

[0046] In addition, as shown in Figure 5, this utility model also provides a semiconductor cooling system, including a flexible semiconductor cooling chip and a heat dissipation fin 100 disposed on the side of the flexible substrate 20 of the heat dissipation surface away from the flexible substrate 10 of the cooling surface.

[0047] In this embodiment, by providing heat dissipation fins 100 on the side of the heat dissipation flexible substrate 20 away from the cooling flexible substrate 10, the heat dissipation effect of the heat dissipation flexible substrate 20 is improved, so that the temperature of the cooling flexible substrate can drop rapidly, thereby improving the cooling efficiency and achieving the purpose of rapid cooling.

[0048] As an example, the flexible substrate of the cooling surface of the flexible semiconductor cooling chip is attached to the pipe to wrap the surface of the pipe and achieve a cooling effect; and heat dissipation fins are provided on the flexible substrate of the heat dissipation surface, and a circulation pump or fan is installed outside the heat dissipation fins for cooling (not shown in the figure), thereby improving the heat dissipation effect of the flexible substrate of the heat dissipation surface, so that the temperature of the flexible substrate of the cooling surface can drop rapidly, improve the cooling efficiency, and achieve the purpose of rapid cooling.

[0049] In summary, this utility model provides a flexible semiconductor cooling chip and a semiconductor cooling system. The flexible semiconductor cooling chip includes: a flexible substrate with a cooling surface, a flexible substrate with a heat dissipation surface, and a core matrix sandwiched between the flexible substrate with the cooling surface and the flexible substrate with the heat dissipation surface. The core matrix includes a plurality of P-type semiconductor cores, a plurality of N-type semiconductor cores, and conductive electrodes. The P-type semiconductor cores and the N-type semiconductor cores are arranged adjacent to each other, and the conductive electrodes connect the adjacent P-type semiconductor cores and the N-type semiconductor cores. A heat dissipation area is provided between the P-type semiconductor cores and the N-type semiconductor cores. This invention utilizes the superior mechanical properties of flexible substrates—one for cooling and the other for heat dissipation—to extend the application range of flexible semiconductor refrigeration chips beyond flat surfaces to include various curved and irregular surfaces. Furthermore, by forming a heat dissipation zone between the P-type and N-type semiconductor cores, the deformation capability of the flexible semiconductor refrigeration chip is improved, meeting the requirements for installation on complex curved surfaces. This heat dissipation zone also enhances the heat dissipation effect of the flexible substrate, allowing the temperature of the cooling substrate to drop rapidly, thus increasing cooling efficiency and achieving rapid cooling.

[0050] It should be understood that the application of this utility model is not limited to the examples above. Those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. A flexible semiconductor cooling chip, characterized in that, include: A flexible substrate with a cooling surface, a flexible substrate with a heat dissipation surface, and a core matrix sandwiched between the flexible substrate with the cooling surface and the flexible substrate with the heat dissipation surface; the core matrix includes a plurality of P-type semiconductor cores, a plurality of N-type semiconductor cores, and conductive electrodes, wherein the P-type semiconductor cores and the N-type semiconductor cores are disposed adjacent to each other, and the conductive electrodes connect the adjacent P-type semiconductor cores and the N-type semiconductor cores; a heat dissipation area is provided between the P-type semiconductor cores and the N-type semiconductor cores.

2. The flexible semiconductor cooling chip according to claim 1, characterized in that, Both the heat dissipation flexible substrate and the cooling flexible substrate are made of polyimide film.

3. The flexible semiconductor cooling chip according to claim 1, characterized in that, The flexible substrate of the heat dissipation surface is provided with a microchannel structure; the microchannel structure includes a plurality of branch microchannel structures and a main microchannel structure formed by the convergence of the two ends of the branch microchannel structures.

4. The flexible semiconductor cooling chip according to claim 1, characterized in that, A conductive adhesive layer is provided between the conductive electrode and the P-type semiconductor chip, and between the conductive electrode and the N-type semiconductor chip.

5. The flexible semiconductor cooling chip according to claim 4, characterized in that, The thickness of the conductive adhesive layer is 0.01 mm to 0.2 mm.

6. The flexible semiconductor cooling chip according to claim 1, characterized in that, An adhesive layer is provided between the flexible substrate on the cooling surface and the conductive electrode, and between the flexible substrate on the heat dissipation surface and the conductive electrode.

7. The flexible semiconductor cooling chip according to claim 6, characterized in that, The thickness of the adhesive layer is 0.01mm to 0.2mm.

8. The flexible semiconductor cooling chip according to claim 1, characterized in that, The flexible semiconductor cooling chip further includes a positive electrode line connected to one of the N-type semiconductor chips and a negative electrode line connected to one of the P-type semiconductor chips; the thickness of the flexible substrate of the cooling surface is 0.05mm to 1mm; the thickness of the flexible substrate of the heat dissipation surface is 0.05mm to 1mm; and the thickness of the P-type semiconductor chip and the N-type semiconductor chip is 0.5mm to 8mm.

9. A semiconductor cooling system, characterized in that, It includes the flexible semiconductor cooling chip as described in any one of claims 1-8, and the heat dissipation fins disposed on the side of the flexible substrate of the heat dissipation surface away from the flexible substrate of the cooling surface.

10. The semiconductor cooling system according to claim 9, characterized in that, The semiconductor cooling system also includes a cooling circulation pump; the cooling circulation pump is connected to the main microchannel structure on the flexible substrate of the heat dissipation surface.

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