Adjustable hyperspectral chip

Abstract

The utility model provides an adjustable hyperspectral chip, the adjustable hyperspectral chip comprises a plurality of spectrum modulation layers and an adjusting assembly, the plurality of spectrum modulation layers are stacked and arranged at intervals, each spectrum modulation layer comprises at least one light modulation unit, and at least part of the spectrum modulation layer comprises a plurality of light modulation units; the adjusting assembly is connected with at least part of the spectrum modulation layers and used for switching the corresponding light modulation units in the different spectrum modulation layers and / or adjusting the distance between the different spectrum modulation layers, so that superposition and switching of different light modulation effects are achieved, and optimal modulation presentation or multi-effect presentation is achieved. The adjustable hyperspectral chip provided by the utility model not only can be used for single-point spectral modulation and is more suitable for hyperspectral imaging, but also can realize rapid switching of imaging wavebands through matching of different levels of spectral modulation layers, and is more beneficial to realizing multi-spectral image alignment and fusion.

Description

Technical Field

[0001] This application relates to the field of spectral imaging technology, and in particular to an adjustable hyperspectral chip. Background Technology

[0002] Hyperspectral imaging technology combines imaging and spectral techniques. By detecting the two-dimensional geometric space and one-dimensional spectral information of a target, it acquires continuous, narrow-band image data with high spectral resolution. Unlike traditional grayscale (single-channel) or RGB (three-channel) imaging, hyperspectral images meticulously segment the absorption and reflection spectra of substances, resulting in N channels in the spectral dimension. Therefore, what is acquired through hyperspectral equipment is a data cube, containing not only image information but also expanded spectrally. The result not only provides spectral data for each point in the image but also image information for any spectral band.

[0003] Currently, most hyperspectral imaging devices are based on dispersive, interferometric, filter-based, and computational reconstruction methods. Existing hyperspectral imaging devices often suffer from limitations such as single imaging bands, limited modulation effects, and conflicts between imaging and spatial resolution. Furthermore, it is difficult to modify or improve the modulation effects after the device is completed. This is primarily due to the inflexible structure of existing hyperspectral imaging devices. While tunable modulators based on traditional MEMS technology can perform spectral tunability within a small range, they are still limited by material properties and cannot overcome the limitations between bands, nor can they achieve real-time imaging and data acquisition across a wide spectrum.

[0004] Therefore, a new hyperspectral chip solution is urgently needed. Utility Model Content

[0005] In view of this, the purpose of this application is to propose a tunable hyperspectral chip that can realize the superposition and switching of different light modulation effects.

[0006] To achieve the above objectives, one embodiment of this application discloses a tunable hyperspectral chip, which includes:

[0007] Multiple spectral modulation layers are stacked and spaced apart. Each spectral modulation layer includes at least one optical modulation unit, and at least some of the spectral modulation layers include multiple different optical modulation units; wherein the different optical modulation units have different micro / nano structures.

[0008] An adjustment component is connected to at least a portion of the spectral modulation layers, and the adjustment component is used to switch the corresponding optical modulation units in different spectral modulation layers and / or adjust the distance between different spectral modulation layers.

[0009] In one embodiment, the adjustment component includes a central axis connected to at least a portion of the spectral modulation layer; the central axis is used to drive the corresponding spectral modulation layer to rotate to switch the corresponding optical modulation unit; and / or to drive the corresponding spectral modulation layer to move axially to adjust the distance between different spectral modulation layers.

[0010] In one embodiment, the adjustment assembly further includes a drive member connected to the central shaft to drive the central shaft to rotate and / or move axially.

[0011] In one embodiment, at least a portion of the spectral modulation layer includes a plurality of different optical modulation units distributed circumferentially along the central axis.

[0012] In one embodiment, the spectral modulation layer further includes a rotating plate with openings, and the optical modulation unit includes a substrate and a micro / nano structure disposed on the substrate;

[0013] The optical modulation unit is disposed on the rotating plate, and the micro-nano structure is disposed corresponding to the opening. At least part of the rotating plate is connected to the central axis and rotates with the central axis and / or moves along the axial direction.

[0014] In one embodiment, the optical modulation unit is connected to the rotating plate by means of a slot or adhesive bonding.

[0015] In one embodiment, the optical modulation unit is formed by one or more of the following processes: thin film deposition, etching, direct writing, or 3D printing.

[0016] In one embodiment, the optical modulation unit includes one or more of the following: an absorption filter layer, an interference filter layer, an induced transmission filter layer, a linear gradient filter layer, and a metasurface structure filter layer.

[0017] In one embodiment, the optical modulation unit includes a micro / nano structure, which includes one or more of the following: metal / dielectric nanowire array, metal nanoparticle / nanopore array, FP interferometer cavity, waveguide layer, quantum dot, dye, metasurface.

[0018] Based on the same inventive concept, another embodiment of this application discloses a tunable hyperspectral chip, which includes:

[0019] A first spectral modulation layer and a second spectral modulation layer are stacked and spaced apart. The first spectral modulation layer includes at least a first optical modulation unit and a second optical modulation unit, and the second spectral modulation layer includes at least a third optical modulation unit and a fourth optical modulation unit. The first optical modulation unit and the second optical modulation unit have different micro / nano structures, and the third optical modulation unit and the fourth optical modulation unit have different micro / nano structures.

[0020] The tunable hyperspectral chip includes a first state and a second state. In the first state, the first optical modulation unit corresponds to the third optical modulation unit, and the second optical modulation unit corresponds to the fourth optical modulation unit. In the second state, the first optical modulation unit corresponds to the fourth optical modulation unit, and the second optical modulation unit corresponds to the third optical modulation unit.

[0021] An adjustment component, connected to the first spectral modulation layer and / or the second spectral modulation layer, is used to switch the tunable hyperspectral chip between the first state and the second state; or to adjust the distance between the first spectral modulation layer and the second spectral modulation layer.

[0022] The tunable hyperspectral chip provided in this application includes multiple spectral modulation layers and an adjustment component. The multiple spectral modulation layers are stacked and spaced apart. Each spectral modulation layer includes at least one optical modulation unit, and at least some spectral modulation layers include multiple optical modulation units. The adjustment component is connected to at least some spectral modulation layers and is used to switch the corresponding optical modulation units in different spectral modulation layers and / or adjust the distance between different spectral modulation layers, thereby realizing the superposition and switching of different optical modulation effects to achieve optimal modulation presentation or multiple effect presentation.

[0023] The tunable hyperspectral chip provided in this application can not only be used for single-point spectral modulation, but is also more suitable for hyperspectral imaging. Furthermore, by matching different levels of spectral modulation layers, it can achieve rapid switching of imaging bands, which is more conducive to achieving multi-spectral image alignment and fusion. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the structure of an tunable hyperspectral chip provided in an embodiment of this application;

[0025] Figure 2 This is a schematic diagram of the structure of a spectral modulation layer provided in an embodiment of this application;

[0026] Figure 3 This is a schematic diagram of the structure of a rotating plate provided in an embodiment of this application;

[0027] Figure 4This is a schematic diagram of the structure of an optical modulation unit provided in an embodiment of this application;

[0028] Figure 5 This is a schematic diagram of the structure of an optical modulation unit provided in another embodiment of this application;

[0029] Figure 6 A modulation effect diagram of a first modulator formed from an tunable hyperspectral chip according to an embodiment of this application;

[0030] Figure 7 A modulation effect diagram of a third modulator formed by an tunable hyperspectral chip according to an embodiment of this application;

[0031] Figure 8 A modulation effect diagram of a fourth modulator formed by an tunable hyperspectral chip according to an embodiment of this application.

[0032] Marker explanation:

[0033] M1, First spectral modulation layer; M2, Second spectral modulation layer; N1, First optical modulation unit; N2, Second optical modulation unit; N3, Third optical modulation unit; N4, Fourth optical modulation unit;

[0034] 10. Spectral modulation layer; 11. Optical modulation unit; 111. Substrate; 112. Micro / nano structure; 12. Rotary plate; 121. Opening;

[0035] 20. Adjustment component; 21. Central axis. Detailed Implementation

[0036] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with specific embodiments and the accompanying drawings.

[0037] It should be noted that, unless otherwise defined, the technical or scientific terms used in the embodiments of this application should have the ordinary meaning understood by one of ordinary skill in the art to which this application pertains. The terms "first," "second," and similar terms used in the embodiments of this application do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as "comprising" or "including" mean that the element or object preceding the word encompasses the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are only used to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0038] like Figure 1 and 2 As shown, this application embodiment provides an adjustable hyperspectral chip, which includes multiple spectral modulation layers 10 and an adjustment component 20. The multiple spectral modulation layers 10 are stacked and spaced apart. Each spectral modulation layer 10 includes at least one optical modulation unit 11, and at least some spectral modulation layers 10 include multiple different optical modulation units 11. The different optical modulation units 11 have different micro-nano structures. The adjustment component 20 is connected to at least some of the spectral modulation layers 10, and the adjustment component 20 is used to switch the corresponding optical modulation units 11 in different spectral modulation layers 10 and / or adjust the distance between different spectral modulation layers 10.

[0039] The tunable hyperspectral chip provided in this embodiment includes multiple spectral modulation layers 10 and an adjustment component 20. The multiple spectral modulation layers 10 are stacked and spaced apart. Each spectral modulation layer 10 includes at least one optical modulation unit 11, and at least some spectral modulation layers 10 include multiple optical modulation units 11. The adjustment component 20 is connected to at least some of the spectral modulation layers 10 and is used to switch the corresponding optical modulation units 11 in different spectral modulation layers 10 and / or adjust the distance between different spectral modulation layers 10, thereby realizing the superposition and switching of different optical modulation effects to achieve optimal modulation presentation or multiple effect presentation.

[0040] The tunable hyperspectral chip provided in this application can not only be used for single-point spectral modulation, but is also more suitable for hyperspectral imaging. Furthermore, by matching different levels of spectral modulation layers 10, it can achieve rapid switching of imaging bands, which is more conducive to achieving multi-spectral image alignment and fusion.

[0041] Optionally, the optical modulation unit 11 is formed by one or more of the following processes: thin film deposition, etching, direct writing, or 3D printing.

[0042] Optionally, the optical modulation unit 11 includes one or more of the following: an absorption filter layer, an interference filter layer, an induced transmission filter layer, a linear gradient filter layer, and a metasurface structure filter layer.

[0043] Optionally, the optical modulation unit 11 includes a micro / nano structure 112, which includes one or more of the following: metal / dielectric nanowire array, metal nanoparticle / nanopore array, FP interferometer cavity, waveguide layer, quantum dot, dye, metasurface, etc.

[0044] Reference Figure 1As shown, in a specific embodiment, the tunable hyperspectral chip includes a first spectral modulation layer M1, a second spectral modulation layer M2, and an adjustment component 20. The first spectral modulation layer M1 and the second spectral modulation layer M2 are stacked and spaced apart. The first spectral modulation layer M1 includes at least a first optical modulation unit N1 and a second optical modulation unit N2, and the second spectral modulation layer M2 includes at least a third optical modulation unit N3 and a fourth optical modulation unit N4. The first optical modulation unit N1 and the second optical modulation unit N2 have different micro / nano structures 112, and the third optical modulation unit N3 and the fourth optical modulation unit N4 have different micro / nano structures 112.

[0045] The tunable hyperspectral chip includes a first state and a second state. In the first state, the first optical modulation unit N1 corresponds to the third optical modulation unit N3, and the second optical modulation unit N2 corresponds to the fourth optical modulation unit N4. In the second state, the first optical modulation unit N1 corresponds to the fourth optical modulation unit N4, and the second optical modulation unit N2 corresponds to the third optical modulation unit N3.

[0046] Optionally, the adjustment component 20 is connected to one of the first spectral modulation layer M1 or the second spectral modulation layer M2, while the other of the first spectral modulation layer M1 or the second spectral modulation layer M2 remains stationary. The adjustment component 20 drives the first spectral modulation layer M1 to move, thereby switching the adjustable hyperspectral chip between a first state and a second state; or, the distance between the first spectral modulation layer M1 and the second spectral modulation layer M2 is adjusted.

[0047] Optionally, the adjustment component 20 is simultaneously connected to the first spectral modulation layer M1 and the second spectral modulation layer M2. The adjustment component 20 drives the first spectral modulation layer M1 and the second spectral modulation layer M2 to move simultaneously. The first spectral modulation layer M1 and the second spectral modulation layer M2 move at different speeds to switch the adjustable hyperspectral chip between the first state and the second state; or, the distance between the first spectral modulation layer M1 and the second spectral modulation layer M2 is adjusted.

[0048] In other embodiments, the tunable hyperspectral chip includes three, four or more spectral modulation layers 10, each spectral modulation layer 10 including two, three or more optical modulation units, so that the tunable hyperspectral chip has more states, each state achieving a different modulation effect, thereby improving the modulation performance of the tunable hyperspectral chip.

[0049] Reference Figure 1As shown, in one embodiment, the adjustment component 20 includes a central shaft 21 connected to at least a portion of the spectral modulation layer 10. The central shaft 21 is used to drive the corresponding spectral modulation layer 10 to rotate to switch the corresponding optical modulation unit 11; and / or, to drive the corresponding spectral modulation layer 10 to move axially to adjust the distance between different spectral modulation layers 10. Optionally, the central shaft 21 is a stainless steel central shaft with a diameter of 1-2 mm; for example, 1 mm, 1.5 mm, 1.8 mm, or 2 mm, etc., and there is no specific limitation.

[0050] Taking an optical modulation unit 11 comprising a first spectral modulation layer M1 or a second spectral modulation layer M2, where the first spectral modulation layer M1 includes a first optical modulation unit N1 and a second optical modulation unit N2, and the second spectral modulation layer M2 includes a third optical modulation unit N3 and a fourth optical modulation unit N4 as an example, a central axis 21 can be connected to either the first spectral modulation layer M1 or the second spectral modulation layer M2. Rotation of the central axis 21 causes either the first spectral modulation layer M1 or the second spectral modulation layer M2 to rotate, switching the adjustable hyperspectral chip between a first state and a second state. Alternatively, it can cause either the first spectral modulation layer M1 or the second spectral modulation layer M2 to move axially, thereby adjusting the distance between them.

[0051] In one embodiment, the adjustment assembly 20 further includes a drive member connected to the central shaft 21 to drive the central shaft 21 to rotate and / or move axially. Optionally, the drive member includes a motor, the rotation of which drives the central shaft 21 to rotate, or the motor can drive the central shaft 21 to move axially via a transmission structure. The transmission structure can be a gear and rack, or a lead screw and nut, etc. In other embodiments, the transmission structure can be a cylinder, or an electric cylinder, etc.

[0052] In one embodiment, the spectral modulation layer 10, which includes multiple different optical modulation units 11, is uniformly distributed circumferentially along the central axis 21. This ensures that after the central axis 21 rotates by a predetermined angle, the corresponding optical modulation unit 11 in the different spectral modulation layers 10 can be switched. For example, the spectral modulation layer 10 includes three optical modulation units 11, which are uniformly distributed circumferentially along the central axis 21. The two adjacent optical modulation units 11 are 120 degrees apart, and the corresponding optical modulation unit 11 in the different spectral modulation layers 10 can be switched every 120 degrees of rotation of the central axis 21.

[0053] Reference Figure 2-5As shown, in one embodiment, the spectral modulation layer 10 further includes a rotating plate 12 with an opening 121. The optical modulation unit 11 includes a substrate 111 and a micro / nano structure 112 disposed on the substrate 111. The optical modulation unit 11 is disposed on the rotating plate 12, and the micro / nano structure 112 is correspondingly disposed with the opening 121. At least a portion of the rotating plate 12 is connected to the central axis 21 and rotates and / or moves axially with the central axis 21. By disposing the optical modulation unit 11 on the rotating plate 12, connecting the central axis 21 to the rotating plate 12 and driving the rotating plate 12 to rotate or move axially, the stability of the optical modulation unit 11 during its movement is ensured, thus guaranteeing the stability and accuracy of the adjustable high-spectral chip structure.

[0054] Optionally, the optical modulation unit 11 is connected to the rotating plate 12 by means of a slot or adhesive bonding to ensure the stability between the optical modulation unit 11 and the rotating plate 12.

[0055] Optionally, the rotating piece 12 is a circular acrylic rotating piece with a thickness of 0.3-0.5 mm and a diameter of 1-2 cm. The circular acrylic rotating piece has a 1-2 mm diameter opening at its center for connection with the central shaft 21; and rectangular openings 121, each 9-81 mm in size, are distributed on the circular acrylic rotating piece facing the center. 2 For example, the thickness of the circular acrylic sheet is 0.3mm, 0.35mm, 0.4mm, 0.45mm, 0.5mm, etc.; the diameter is 1cm, 1.2cm, 1.5cm, 1.8cm, 2cm, etc.; the diameter of the center opening is 1cm, 1.2cm, 1.5cm, 1.8cm, 2cm, etc., and there is no specific limitation.

[0056] The optical modulation unit 11 is composed of materials corresponding to the application spectrum. For example, in the visible and near-infrared bands (380nm-1100nm), materials such as silicon dioxide, silicon nitride, aluminum oxide, and various metals are used; in the short-wave infrared to long-wave infrared bands (1100nm-12000um), materials such as silicon, germanium, zinc sulfide, zinc selenide, and various metals are used. The structure of the optical modulation unit 11 is fabricated on different material substrates 111 according to the application band. For example, in the visible and near-infrared bands, substrates such as silicon dioxide and aluminum oxide are used; in the short-wave infrared to long-wave infrared bands, substrates such as silicon, germanium, and chalcogenide glass are used.

[0057] Different micro / nano structures refer to those that differ in at least one of the following: material, size, or arrangement, to achieve different light modulation effects. For example, in the first spectral modulation layer M1, the first light modulation unit N1 is a metal thin film with a glass substrate; the second light modulation unit N2 is a stacked material of a metal thin film with a glass substrate and an oxide.

[0058] Another embodiment of this application provides a method for fabricating a tunable hyperspectral chip, used to prepare such a chip. Figure 1-5 The tunable hyperspectral chip shown includes the following steps:

[0059] Step S10: Prepare the first optical modulation unit N1;

[0060] Specifically, a silver film area of ​​6*6mm is grown in the center of a glass substrate 111 with a thickness of 0.3mm and a size of 7*7mm by means of evaporation or magnetron sputtering, as shown in the figure. Figure 4 As shown in the figure. Among them, the silver film region forms a micro / nano structure 112.

[0061] Step S20: Prepare the third optical modulation unit N3;

[0062] Specifically, a silver film area of ​​6*6mm is grown in the center of a glass substrate 111 with a thickness of 0.3mm and a size of 7*7mm by means of evaporation or magnetron sputtering, as shown in the figure. Figure 4 As shown in the figure. Among them, the silver film region forms a micro / nano structure 112.

[0063] Step S30: Prepare the second optical modulation unit N2;

[0064] Specifically, a 6*6mm silver film region is grown in the center of a 0.3mm thick, 7*7mm large glass substrate using methods such as evaporation or magnetron sputtering. This silver film region is then divided into four 3*3mm regions, and silicon dioxide thin films with thicknesses of 40nm, 80nm, 120nm, and 160nm are sequentially grown on the silver film using methods such as evaporation or magnetron sputtering. Figure 5 As shown, the silver film and the silicon dioxide film form a micro / nano structure 112.

[0065] Step S40: Prepare the fourth optical modulation unit N4;

[0066] Specifically, a 6*6mm silver film region is grown in the center of a 0.3mm thick, 7*7mm large glass substrate using methods such as evaporation or magnetron sputtering. This silver film region is then divided into four 3*3mm regions, and silicon dioxide thin films with thicknesses of 40nm, 80nm, 120nm, and 160nm are sequentially grown on the silver film using methods such as evaporation or magnetron sputtering. Figure 5 As shown, the silver film and the silicon dioxide film form a micro / nano structure 112.

[0067] Step S50: A 2mm diameter opening is obtained at the center of a first acrylic disc with a thickness of 0.3mm and a diameter of 2cm by laser etching. Two rectangular openings 121 with a size of 6mm*6mm are obtained by laser etching with the center of the disc as point O and coordinates (±0.5mm, 0mm) as the center of the rectangle. The micro-nano structures 112 of the third optical modulation unit N3 and the fourth optical modulation unit N4 are aligned with the two rectangular openings 121 respectively, and fixed to the acrylic disc by means of adhesive bonding or fiber slots to form the first spectral modulation layer M1.

[0068] Step S60: A 2mm diameter opening is obtained at the center of a second acrylic disc with a thickness of 0.3mm and a diameter of 2cm by laser etching. Two rectangular openings 121 with a size of 6mm*6mm are obtained by laser etching with the center of the disc as point O and coordinates (±0.5mm, 0mm) as the center of the rectangle. The micro-nano structures 112 of the third optical modulation unit N3 and the fourth optical modulation unit N4 are aligned with the two rectangular openings 121 respectively, and fixed to the acrylic disc by means of adhesive bonding or slot limiting, etc., to form the second spectral modulation layer M2.

[0069] Step S70: Connect the first spectral modulation layer M1 and the second spectral modulation layer M2 via a stainless steel central shaft 21. The first spectral modulation layer M1 is completely fixed to the stainless steel central shaft 21 by adhesive bonding, and the second spectral modulation layer M2 does not move with the stainless steel central shaft. Figure 1 As shown. The end of the stainless steel central shaft 21 is connected to a micromotor, which controls the rotation and axial movement of the stainless steel central shaft 21. Simultaneously, the first spectral modulation layer M1 also rotates and moves axially along with the stainless steel central shaft. The initial positional distance between the first spectral modulation layer M1 and the second spectral modulation layer M2 is 1µm. The first optical modulation unit N1 and the fourth optical modulation unit N4 are perfectly aligned to form the first modulator, which is a spectral modulator containing four channels. The second optical modulation unit N2 and the third optical modulation unit N3 are perfectly aligned to form the second modulator, which is also a spectral modulator containing four channels.

[0070] Specifically, the first optical modulation unit N1 and the fourth optical modulation unit N4 form a Fabry-Perot (FP) array interference cavity with a spacing of 1 μm, serving as the first modulator. Incident light enters the first optical modulation unit N1, and after interacting with the fourth optical modulation unit N4, the incident light oscillates within the interference cavity before exiting from the fourth optical modulation unit N4, completing the modulation. The second optical modulation unit N2 and the third optical modulation unit N3 form a Fabry-Perot (FP) array interference cavity with a spacing of 1 μm, serving as the second modulator. Incident light enters the second optical modulation unit N2, and after interacting with the third optical modulation unit N3, the incident light oscillates within the interference cavity before exiting from the third optical modulation unit N3, completing the modulation. Initially, the modulation effects of the first modulator and the second modulator are exactly the same, such as... Figure 6 As shown.

[0071] When the micromotor rotates 180° and moves 0.5µm axially, the first optical modulation unit N1 and the third optical modulation unit N3 are completely aligned, forming a Fabry-Perot (FP) array interference cavity with a spacing of 1.5µm, which is the third modulator. The second optical modulation unit N2 and the fourth optical modulation unit N4 are also completely aligned, forming a Fabry-Perot (FP) array interference cavity with a spacing of 1.5µm, which is the fourth modulator. At this time, the third and fourth modulators have completely different modulation effects, such as... Figure 7 and Figure 8 As shown.

[0072] It should be noted that "a certain body" or "a certain part" can be a portion of the corresponding "component," meaning that "a certain body" or "a certain part" is integrally formed and manufactured with the "other parts of the component"; or it can be an independent component that can be separated from the "other parts of the component," meaning that "a certain body" or "a certain part" can be manufactured independently and then combined with the "other parts of the component" to form a whole. The expression of "a certain body" or "a certain part" in this application is only one embodiment for ease of reading, and is not intended to limit the scope of protection of this application. Any technical solution that includes the above features and has the same function should be understood as an equivalent technical solution of this application.

[0073] It should be noted that some embodiments of this application have been described above. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps described in the claims can be performed in a different order than that in the above embodiments and still achieve the desired result. In addition, the processes depicted in the drawings do not necessarily require the specific order or sequential order shown to achieve the desired result.

[0074] Those skilled in the art should understand that the discussion of any of the above embodiments is merely exemplary and is not intended to imply that the scope of this application (including the claims) is limited to these examples; under the concept of this application, the above embodiments or technical features of different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations of different aspects of the embodiments of this application as described above, which are not provided in detail for the sake of brevity.

[0075] The embodiments described herein are intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the embodiments described herein should be included within the protection scope of this application.

Claims

1. An adjustable hyperspectral chip, characterized in that, include: Multiple spectral modulation layers are stacked and spaced apart. Each spectral modulation layer includes at least one optical modulation unit, and at least some of the spectral modulation layers include multiple different optical modulation units; wherein the different optical modulation units have different micro / nano structures. An adjustment component is connected to at least a portion of the spectral modulation layers, and the adjustment component is used to switch the corresponding optical modulation units in different spectral modulation layers and / or adjust the distance between different spectral modulation layers.

2. The tunable hyper spectral chip of claim 1, wherein, The adjustment component includes a central axis connected to at least a portion of the spectral modulation layers; the central axis is used to drive the corresponding spectral modulation layer to rotate to switch the corresponding optical modulation unit; and / or to drive the corresponding spectral modulation layer to move along the axial direction to adjust the distance between different spectral modulation layers.

3. The tunable hyper spectral chip of claim 2, wherein, The adjustment assembly further includes a drive element connected to the central shaft to drive the central shaft to rotate and / or move axially.

4. The tunable hyperspectral chip according to claim 2, characterized in that, In the spectral modulation layer comprising multiple different optical modulation units, the multiple different optical modulation units are uniformly distributed circumferentially along the central axis.

5. The tunable hyper spectral chip of claim 2, wherein, The spectral modulation layer further includes a rotating plate with openings, and the optical modulation unit includes a substrate and micro / nano structures disposed on the substrate; The optical modulation unit is disposed on the rotating plate, and the micro-nano structure is disposed corresponding to the opening. At least part of the rotating plate is connected to the central axis and rotates with the central axis and / or moves along the axial direction.

6. The tunable hyperspectral chip according to claim 5, characterized in that, The optical modulation unit is connected to the rotating plate by means of a slot or adhesive bonding.

7. The tunable hyper spectral chip of claim 1, wherein, The optical modulation unit is formed by one or more of the following processes: thin film deposition, etching, direct writing, or 3D printing.

8. The tunable hyperspectral chip according to claim 1, characterized in that, The optical modulation unit includes one or more of the following: absorption filter layer, interference filter layer, induced transmission filter layer, linear gradient filter layer, and metasurface structure filter layer.

9. The tunable hyper spectral chip of claim 1, wherein, The optical modulation unit includes micro / nano structures, which include one or more of the following: metal / dielectric nanowire arrays, metal nanoparticle / nanopore arrays, FP interferometer cavities, waveguide layers, quantum dots, dyes, and metasurfaces.

10. A tunable hyperspectral chip, characterized in that, include: A first spectral modulation layer and a second spectral modulation layer are stacked and spaced apart. The first spectral modulation layer includes at least a first optical modulation unit and a second optical modulation unit, and the second spectral modulation layer includes at least a third optical modulation unit and a fourth optical modulation unit. The first optical modulation unit and the second optical modulation unit have different micro / nano structures, and the third optical modulation unit and the fourth optical modulation unit have different micro / nano structures. The tunable hyperspectral chip includes a first state and a second state. In the first state, the first optical modulation unit corresponds to the third optical modulation unit, and the second optical modulation unit corresponds to the fourth optical modulation unit. In the second state, the first optical modulation unit corresponds to the fourth optical modulation unit, and the second optical modulation unit corresponds to the third optical modulation unit. An adjustment component, connected to the first spectral modulation layer and / or the second spectral modulation layer, is used to switch the tunable hyperspectral chip between the first state and the second state; or to adjust the distance between the first spectral modulation layer and the second spectral modulation layer.

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