Chip testing device and equipment
By employing water-based heat conduction and gas-based channel design in the chip testing device, the problem of insufficient chip testing accuracy at high temperatures in existing technologies has been solved, achieving high-precision constant temperature control and temperature equalization, thus improving testing accuracy.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN HANSUN COOL TECH CO LTD
- Filing Date
- 2025-02-10
- Publication Date
- 2026-05-01
AI Technical Summary
Existing chip testing devices struggle to provide a high-precision constant temperature environment at high temperatures, and electrothermal solutions have low temperature control accuracy, failing to meet the requirements for chip performance testing at high temperatures.
A water-based heat conduction method is adopted, in which heat-conducting liquid is introduced and exported in the chip testing device through the first and second water channels. The specific heat capacity of the liquid is used to maintain a constant test temperature, and a constant pressure environment is created by combining the gas channel to ensure temperature uniformity.
It achieves high-precision constant temperature control, reduces the temperature difference between the upper and lower mold components after mold closing, ensures uniform temperature throughout the cavity, and improves testing accuracy.
Smart Images
Figure CN224190171U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of semiconductor testing, and in particular to a chip testing apparatus and equipment. Background Technology
[0002] Chips are a crucial component of modern electronic products. With the rapid pace of product updates and iterations, the market demands increasingly stringent requirements on chips. During operation, electronic products generate significant heat from their chips, thus requiring higher performance at high temperatures. Due to the small size and large demand for chips, a device is needed to test their performance under relatively high temperatures. Related technologies generally use electrothermal heating to provide a set ambient temperature. However, electrothermal solutions have relatively low temperature control accuracy and cannot provide a highly precise constant temperature environment. Utility Model Content
[0003] This application proposes a chip testing device and equipment that uses water-based heat conduction to provide a precise constant temperature environment for the chip.
[0004] This application proposes a chip testing device, comprising:
[0005] The lower mold assembly has a first water channel inside and a first mounting base on the upper part, and the first mounting base has a mounting position for mounting chips;
[0006] The upper mold assembly has a second water channel inside and a second mounting base at the bottom. The second mounting base has a probe for docking with the chip.
[0007] The upper mold assembly and the lower mold assembly, when combined, can form a cavity for accommodating the chip.
[0008] In some embodiments, the lower mold assembly includes:
[0009] The lower mold base has a first liquid inlet and a first liquid outlet inside, and a first manifold cavity on the lower side.
[0010] A first heat-conducting component is disposed on the upper side of the lower mold base. A first flow guide groove is provided between the lower surface of the first heat-conducting component and the lower mold base. The upper ends of the first liquid inlet and the first liquid outlet are respectively connected to the first flow guide groove. The lower end of the first liquid outlet is connected to the first confluence cavity.
[0011] The first liquid inlet, the first guide channel, the first liquid outlet, and the first confluence cavity are connected in sequence to form the first water channel.
[0012] In some embodiments, the first mounting base includes a first receiving plate disposed on the upper side of the first heat-conducting member, and a first mounting plate disposed on the upper side of the first receiving plate. The first mounting plate is provided with mounting holes for mounting chips, and the mounting holes constitute the mounting positions.
[0013] In some embodiments, the chip testing apparatus further includes:
[0014] The upper mold base has a second liquid inlet and a second liquid outlet inside, and a second manifold on the upper side;
[0015] A second heat-conducting component is disposed on the lower side of the upper mold base. A second flow guide groove is provided between the upper surface of the second heat-conducting component and the upper mold base. The lower ends of the second liquid inlet and the second liquid outlet are respectively connected to the second flow guide groove. The upper end of the second liquid outlet is connected to the second manifold.
[0016] The second inlet hole, the second guide groove, the second outlet hole, and the second confluence cavity are connected in sequence to form the second water channel.
[0017] In some embodiments, the second mounting base includes a PCB board disposed on the lower side of the second thermal conductive member, a probe holder disposed on the upper side of the first receiving plate, and a limiting member disposed around the probe holder; the probe is disposed in the probe holder and its upper end is electrically connected to the PCB board.
[0018] In some embodiments, the accommodating cavity is a sealed cavity, and the upper mold assembly or the lower mold assembly is further provided with an air passage communicating with the sealed cavity, the air passage being used to communicate with an external pressure supply device.
[0019] In some embodiments, in the mold-closed state, the lower surface of the limiting member and the upper surface of the lower mold base constitute the mold-closing surface, and the accommodating cavity is constructed in the central region between the lower mold base and the limiting member; the mold-closing surface is provided with two nested and spaced first sealing rings, and the central region is located in the inner first sealing ring.
[0020] In some embodiments, a second sealing ring is further provided between the first heat-conducting component and the lower mold base, and the first flow guide groove is located within the second sealing ring; a second sealing ring is further provided between the first heat-conducting component and the lower mold base, and the first flow guide groove is located within the second sealing ring.
[0021] In some embodiments, the lower mold assembly has multiple first guide channels arranged side by side, with adjacent first guide channels having opposite liquid flow directions; the upper mold assembly has multiple second guide channels arranged side by side, with adjacent second guide channels having opposite liquid flow directions.
[0022] This application also proposes a chip testing device, including the chip testing apparatus described above, and a machine for mounting the chip testing apparatus.
[0023] The chip testing apparatus and equipment in this embodiment include a lower mold assembly and an upper mold assembly. The lower mold assembly has a first water channel inside and a first mounting base at the top, with a mounting position for mounting the chip in the first mounting base. The upper mold assembly has a second water channel inside and a second mounting base at the bottom, with a probe in the second mounting base. The probe can be electrically connected to the chip to perform performance testing on the chip. The upper and lower mold assemblies, when closed, form a cavity that accommodates the first and second mounting bases. This cavity is a sealed cavity. The upper or lower mold assembly also has a gas channel communicating with the sealed cavity. This gas channel is used to communicate with an external pressure supply device to create a constant pressure environment, preventing pressure changes in the cavity due to excessive temperature, which could affect the test results. Because liquids have a high specific heat capacity, the first and second water channels can maintain a constant test temperature through liquid heat conduction, providing higher control precision than electrothermal methods. Attached Figure Description
[0024] Figure 1 This is a schematic diagram of the structure of a chip testing device in one embodiment of this application;
[0025] Figure 2 for Figure 1 A cross-sectional view of the lower mold assembly in the embodiment;
[0026] Figure 3 for Figure 2 A schematic diagram of the lower mold base in the embodiment;
[0027] Figure 4 for Figure 1 A partial sectional view of the lower mold base in the embodiment;
[0028] Figure 5 This is a cross-sectional view of the upper mold assembly in one embodiment of this application.
[0029] Label Explanation:
[0030] 10. Lower mold assembly; 11. Lower mold base; 111. First cavity; 112. Second cavity; 12. First mounting base; 121. First receiving plate; 122. First mounting plate; 123. Mounting position; 13. First water channel; 130. First inlet; 131. First liquid inlet hole; 132. First guide channel; 133. First liquid outlet hole; 134. First manifold; 135. First outlet; 14. Base plate; 15. First heat-conducting component; 161. First sealing... 162. Second sealing ring; 17. Air passage; 20. Lower mold assembly; 21. Upper mold base; 22. Second water passage; 220. Second inlet; 221. Second liquid inlet hole; 222. Second guide groove; 223. Second liquid outlet hole; 224. Second manifold; 225. Second outlet; 23. Second mounting base; 231. PCB board; 232. Probe holder; 233. Limiting component; 234. Second heat-conducting component; 24. Cover plate; 25. Probe.
[0031] The purpose, features, and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation
[0032] The solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments in this application, and not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.
[0033] It should be noted that all directional indications in the embodiments of this application, such as up, down, left, right, front, back, etc., are only used to explain the relative positional relationship and movement of the components in a specific posture as shown in the attached figure. If the specific posture changes, the directional indication will also change accordingly.
[0034] It should also be noted that when a component is described as "fixed to" or "set on" another component, it can be directly on the other component or there may be an intervening component present. When a component is described as "connected to" another component, it can be directly connected to the other component or there may be an intervening component present.
[0035] Furthermore, the descriptions involving "first," "second," etc., in the embodiments of this application are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. Additionally, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. If the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed in this application.
[0036] This application proposes a chip testing device, referring to... Figures 1 to 5 The chip testing device includes: a lower mold assembly 10, which has a first water channel 13 inside and a first mounting seat 12 at the top, wherein the first mounting seat 12 has a mounting position 123 for mounting the chip; an upper mold assembly 20, which has a second water channel 22 inside and a second mounting seat 23 at the bottom, wherein the second mounting seat 23 has a probe 25 for docking with the chip; the upper mold assembly 20 and the lower mold assembly 10 can be closed to form a chip accommodating cavity.
[0037] In this embodiment, the lower end of probe 25 can connect electrically to the contacts of the chip, while the upper end of probe 25 can connect electrically to an external test module for chip performance testing. Due to the high specific heat capacity of liquids, a constant test temperature can be maintained through liquid heat conduction using the first water path 13 and the second water path 22. Compared to electric heating methods such as resistance wires or PTC heaters, this method offers higher control precision. Furthermore, water paths are provided in both the upper mold assembly 20 and the lower mold assembly 10, which also reduces the temperature difference between the two after mold closing, ensuring a uniform temperature throughout the cavity.
[0038] In some embodiments, the lower mold assembly 10 includes: a lower mold base 11, which has a first liquid inlet hole 131 and a first liquid outlet hole 133 inside, and a first confluence cavity 134 on its lower side; a first heat-conducting element 15, which is disposed on the upper side of the lower mold base 11, and a first guide groove 132 is provided between the lower surface of the first heat-conducting element 15 and the lower mold base 11; the upper ends of the first liquid inlet hole 131 and the first liquid outlet hole 133 are respectively connected to the first guide groove 132; the lower end of the first liquid outlet hole 133 is connected to the first confluence cavity 134; the first liquid inlet hole 131, the first guide groove 132, the first liquid outlet hole 133 and the first confluence cavity 134 are sequentially connected and form a first water channel 13.
[0039] In this embodiment, a first cavity 111 can be provided on the upper surface of the lower mold base 11, and a second cavity 112 can be provided on the lower surface. A first heat-conducting element 15 is disposed in the first cavity 111. A first liquid inlet hole 131 is provided on the side wall of the lower mold base 11 and extends upward to the first cavity 111. A first liquid outlet hole 133 is provided through the lower mold base 11 and connects the first cavity 111 and the second cavity 112. A bottom plate 14 is provided at the lower opening of the second cavity 112. The bottom plate 14 is used to seal the second cavity 112 and construct the aforementioned first confluence cavity 134. A first guide groove 132 can be provided on the inner bottom surface of the first cavity 111 and / or the lower surface of the first heat-conducting element 15.
[0040] The upper end of the first liquid inlet 131 is connected to one end of the first guide channel 132, and the first liquid outlet 133 is located at the other end of the first guide channel 132. The heat-conducting liquid can enter from the first inlet 131 formed on the side wall of the lower mold base 11 through the first inlet 131, then flow upwards into one end of the first guide channel 132, then flow to the other end of the first guide channel 132, and then flow downwards along the first liquid outlet 133 into the first confluence cavity 134. Multiple first guide channels 132 can be provided within the lower mold base 11, and the liquid will ultimately converge in the first confluence cavity 134 before flowing out. Correspondingly, a first outlet 135 connected to the first confluence cavity 134 can be provided on the side wall of the lower mold base 11 for the heat-conducting liquid to flow out. The aforementioned first outlet 135 can also be considered a partial section of the first water channel 13.
[0041] In some embodiments, the first mounting base 12 includes a first receiving plate 121 disposed on the upper side of the first heat-conducting member 15, and a first mounting plate 122 disposed on the upper side of the first receiving plate 121. The first mounting plate 122 is provided with mounting holes for mounting chips, and the mounting holes constitute mounting positions 123. In this embodiment, the mounting holes can be configured as rectangular holes, specifically adapted to the chip under test. The chip under test can be placed upside down in the mounting holes, and due to the restriction of the mounting holes, it will not shift laterally. At the same time, its bottom is arranged upwards, and the bottom contacts can abut against the ejector pins in the upper mold assembly 20. Multiple mounting holes can be arranged in an array on the first mounting plate 122 to allow for simultaneous testing of multiple chips.
[0042] In some embodiments, the chip testing apparatus further includes: an upper mold base 21, which has a second liquid inlet hole 221 and a second liquid outlet hole 223 inside, and a second confluence cavity 224 on its upper side; a second heat-conducting element 234, which is disposed on the lower side of the upper mold base 21, and a second flow guide groove 222 is provided between the upper surface of the second heat-conducting element 234 and the upper mold base 21; the lower ends of the second liquid inlet hole 221 and the second liquid outlet hole 223 are respectively connected to the second flow guide groove 222; the upper end of the second liquid outlet hole 223 is connected to the second confluence cavity 224; the second liquid inlet hole 221, the second flow guide groove 222, the second liquid outlet hole 223 and the second confluence cavity 224 are connected in sequence and form a second water channel 22.
[0043] In this embodiment, a third cavity can be provided on the lower surface of the upper mold base 21, and a fourth cavity can be provided on the upper surface. A second heat-conducting plate is disposed in the third cavity, and a second liquid inlet 221 is provided on the side wall of the upper mold base 21 and extends downward to the third cavity. A second liquid outlet 223 is provided through the upper mold base 21 and connects the third cavity and the fourth cavity. A second flow guide trough 222 can be provided on the inner top surface of the third cavity and / or the upper surface of the second heat-conducting element 234. A cover plate 24 is provided at the upper opening of the fourth cavity. The cover plate 24 is used to seal the fourth cavity and construct the aforementioned second confluence cavity 224.
[0044] The lower end of the second inlet hole 221 is connected to one end of the second guide channel 222, and the second outlet hole 223 is located at the other end of the second guide channel 222. The heat-conducting liquid can enter from the second inlet 220 formed on the side wall of the upper mold base 21 through the second inlet hole 221, then flow downwards into one end of the second guide channel 222, then to the other end of the second guide channel 222, and then upwards along the second outlet into the second confluence cavity 224. Multiple second guide channels 222 can be provided within the upper mold base 21, ultimately converging in the second confluence cavity 224 before flowing out. Correspondingly, a second outlet 225 connected to the second confluence cavity 224 can be provided on the side wall of the upper mold base 21 for the heat-conducting liquid to flow out. The aforementioned second outlet 225 can also be considered a section of the second water channel 22.
[0045] In some embodiments, the second mounting base 23 includes a PCB board 231 disposed below the second heat-conducting element 234, a probe holder 232 disposed above the first receiving plate 121, and a limiting element 233 disposed around the probe holder 232; the probe 25 is disposed in the probe holder 232, and its upper end is electrically connected to the PCB board 231. In this embodiment, the PCB board 231 is used to seal the third cavity. A sealing ring is provided on the outer periphery of the lower end face of the third cavity, and is sealed by the PCB board 231 to ensure the airtightness of the cavity. The probe holder 232 is disposed in the center of the lower surface of the PCB board 231. The probe holder 232 has a mounting hole for mounting the probe 25. The upper end of the probe 25 is electrically connected to the PCB board 231, and the lower end extends out of the mounting hole to contact the chip in the lower mold assembly 10. The second heat-conducting element 234 can conduct heat to the PCB board 231, the probe holder 232 and the probe inside, ensuring that the temperature of each part of the upper mold assembly 20 is relatively constant. The limiting member 233 is used to fix the probe holder 232, which can be screwed onto the upper mold base 21 along with the PCB board 231.
[0046] In some embodiments, the mold-closing surfaces of the upper mold assembly 20 and the lower mold assembly 10 are provided with a first sealing ring 161 for sealing the accommodating cavity. In the mold-closing state, the lower surface of the limiting member 233 and the upper surface of the lower mold base 11 form the mold-closing surface, and the accommodating cavity is constructed in the central region between the lower mold base 11 and the limiting member 233. Providing the first sealing ring 161 can improve the sealing performance of the accommodating cavity. In addition, two nested and spaced first sealing rings 161 can be provided on the mold-closing surface, with the central region located in the inner first sealing ring 161. Two layers of first sealing rings 161 can further improve the sealing performance. The accommodating cavity is a sealed cavity, and the upper mold assembly 20 or the lower mold assembly 10 is also provided with an air passage 17 communicating with the sealed cavity. The air passage 17 is used to communicate with an external pressure supply device to create a constant pressure environment and avoid pressure changes in the accommodating cavity caused by excessive temperature, which would affect the test results.
[0047] Furthermore, a second sealing ring 162 is provided between the first heat-conducting component 15 and the lower mold base 11, and the first flow channel 132 is located within the second sealing ring 162. The second sealing ring 162 is used to ensure the sealing between the first heat-conducting component 15 and the first cavity 111, preventing the heat-conducting liquid from overflowing from the first flow channel 132. Alternatively, a third sealing ring can be provided on the mating surface between the second heat-conducting component 234 and the upper mold base 21 to prevent the heat-conducting liquid in the third flow channel located within the third sealing ring from overflowing.
[0048] In addition, the lower mold assembly 10 has multiple parallel first guide channels 132, with adjacent first guide channels 132 having opposite liquid flow directions; the upper mold assembly 20 has multiple parallel second guide channels 222, with adjacent second guide channels 222 having opposite liquid flow directions. The opposite liquid flow directions of adjacent second guide channels 222 prevent temperature differences in the lower mold assembly 10 along the length of the first guide channels 132. Structurally, the parallel first guide channels 132 are divided into two groups, specifically named the first channel group and the second channel group. The two groups of first guide channels 132 are arranged alternately. Thus, a first liquid inlet hole 131 corresponding to each of the first guide channels 132 can be provided at one end of the first channel group, and a corresponding first liquid outlet hole 133 can be provided at the other end. The positions of the first liquid inlet hole 131 and the first liquid outlet hole 133 of the second channel group are exactly opposite to those in the first channel group, thereby achieving bidirectional transmission of the heat transfer fluid in the first guide channels 132 and ensuring uniform heat conduction. Correspondingly, the arrangement of the second guide channel 222, the second inlet hole 221, and the second outlet hole 223 can also refer to the grouping and dual-flow arrangement in the first guide channel 132. Details will not be elaborated here, but this ensures balanced heat conduction in the upper mold assembly 20. The aforementioned confluence cavity also provides a certain degree of flow stabilization and temperature control.
[0049] This application also proposes a chip testing device, including the aforementioned chip testing apparatus and a machine for mounting the chip testing apparatus.
[0050] In this embodiment, the chip testing device operates as follows: The lower end of probe 25 can connect electrically to the chip's contacts, while the upper end of probe 25 can connect electrically to an external testing module for chip performance testing. The accommodating cavity is a sealed cavity. The upper mold assembly 20 or lower mold assembly 10 is also provided with an air passage 17 communicating with the sealed cavity. The air passage 17 is used to communicate with an external pressure supply device to create a constant pressure environment, preventing pressure changes in the accommodating cavity due to excessive temperature, which could affect the test results. Because liquids have a high specific heat capacity, the first water passage 13 and the second water passage 22 can maintain a constant test temperature through liquid heat conduction. Compared with electric heating methods such as resistance wires or PTC heaters, this method offers higher control precision. Furthermore, water passages are provided in both the upper mold assembly 20 and the lower mold assembly 10, which can also reduce the temperature difference between the two after mold closing, ensuring a uniform temperature throughout the accommodating cavity.
[0051] The above are only some or preferred embodiments of this application. Neither the text nor the drawings should limit the scope of protection of this application. All equivalent structural transformations made using the content of this application's specification and drawings under the overall concept of this application, or direct / indirect applications in other related technical fields, are included within the scope of protection of this application.
Claims
1. A chip testing device, characterized in that, include: The lower mold assembly has a first water channel inside and a first mounting base on the upper part, and the first mounting base has a mounting position for mounting chips; The upper mold assembly has a second water channel inside and a second mounting base at the bottom. The second mounting base has a probe for docking with the chip. The upper mold assembly and the lower mold assembly, when combined, can form a cavity for accommodating the chip.
2. The chip testing apparatus according to claim 1, wherein The lower mold assembly includes: The lower mold base has a first liquid inlet and a first liquid outlet inside, and a first manifold cavity on the lower side. A first heat-conducting component is disposed on the upper side of the lower mold base. A first flow guide groove is provided between the lower surface of the first heat-conducting component and the lower mold base. The upper ends of the first liquid inlet and the first liquid outlet are respectively connected to the first flow guide groove. The lower end of the first liquid outlet is connected to the first confluence cavity. The first liquid inlet, the first guide channel, the first liquid outlet, and the first confluence cavity are connected in sequence to form the first water channel.
3. The chip testing apparatus according to claim 2, characterized in that, The first mounting base includes a first receiving plate disposed on the upper side of the first heat-conducting component, and a first mounting plate disposed on the upper side of the first receiving plate. The first mounting plate is provided with mounting holes for mounting chips, and the mounting holes constitute the mounting position.
4. The chip testing apparatus according to claim 3, characterized in that, The chip testing device also includes: The upper mold base has a second liquid inlet and a second liquid outlet inside, and a second manifold on the upper side; A second heat-conducting component is disposed on the lower side of the upper mold base. A second flow guide groove is provided between the upper surface of the second heat-conducting component and the upper mold base. The lower ends of the second liquid inlet and the second liquid outlet are respectively connected to the second flow guide groove. The upper end of the second liquid outlet is connected to the second manifold. The second inlet hole, the second guide groove, the second outlet hole, and the second confluence cavity are connected in sequence to form the second water channel.
5. The chip testing apparatus according to claim 4, characterized in that, The second mounting base includes a PCB board disposed on the lower side of the second heat-conducting component, a probe holder disposed on the upper side of the first receiving plate, and a limiting member disposed around the probe holder; the probe is disposed in the probe holder and its upper end is electrically connected to the PCB board.
6. The chip testing apparatus according to claim 5, characterized in that, The accommodating cavity is a sealed cavity, and the upper mold assembly or the lower mold assembly is further provided with an air passage communicating with the sealed cavity. The air passage is used to communicate with an external pressure supply device.
7. The chip testing apparatus according to claim 6, characterized in that, In the mold-closed state, the lower surface of the limiting member and the upper surface of the lower mold base form a mold-closing surface, and the accommodating cavity is constructed in the central region between the lower mold base and the limiting member; the mold-closing surface is provided with two nested and spaced first sealing rings, and the central region is located in the inner first sealing ring.
8. The chip testing apparatus according to claim 7, characterized in that, A second sealing ring is also provided between the first heat-conducting component and the lower mold base, and the first flow guide groove is located inside the second sealing ring; a second sealing ring is also provided between the first heat-conducting component and the lower mold base, and the first flow guide groove is located inside the second sealing ring.
9. The chip testing apparatus according to claim 4, characterized in that, The lower mold assembly has multiple first flow channels arranged side by side, with adjacent first flow channels having opposite liquid flow directions; the upper mold assembly has multiple second flow channels arranged side by side, with adjacent second flow channels having opposite liquid flow directions.
10. A chip testing device, characterized in that, The device includes the chip testing apparatus according to any one of claims 1 to 9, and a machine for mounting the chip testing apparatus.