Electrical device

Abstract

The utility model discloses electrical equipment, and belongs to the technical field of electrics. The electrical equipment comprises a cabinet which is provided with a plurality of plate surfaces, and the plurality of plate surfaces are enclosed to form a closed first cavity; the heat dissipation piece is installed on the side, facing the outside of the first cavity, of the plate face, and at least part of the heat dissipation piece is located outside the first cavity; the heat conduction piece is arranged on one side, facing the first cavity, of the plate surface; the energy storage component is arranged at the end, away from the board, of the heat conduction piece and makes heat exchange contact with the heat conduction piece. According to the technical scheme, through the heat conduction part arranged between the plate face and the energy storage component and the heat dissipation part installed on the plate face and at least partially located outside the first cavity, the heat dissipation efficiency of the electrical equipment can be improved, control over the working temperature range of the energy storage component is achieved, and therefore the over-temperature risk of the energy storage component is reduced.

Description

Technical Field

[0001] This application belongs to the field of electrical technology, and in particular relates to an electrical device. Background Technology

[0002] In related technologies, the heat dissipation method for bus capacitors in electrical equipment within a sealed electronic cavity is air cooling. The heat generated by the capacitor is mainly carried away by thermal convection between the capacitor and the air inside the sealed cavity, thereby reducing the capacitor's temperature. However, the heat dissipation method of thermal convection is greatly affected by the air temperature inside the sealed cavity. When the air temperature inside the sealed cavity is high, the heat dissipation efficiency of thermal convection decreases, leading to a risk of the capacitor overheating. Long-term operation will reduce the capacitor's lifespan, indicating room for improvement. Utility Model Content

[0003] This application aims to at least solve one of the technical problems existing in the related art. To this end, this application proposes an electrical device that can improve the heat dissipation efficiency of the electrical device.

[0004] In a first aspect, this application provides an electrical device, comprising:

[0005] The cabinet has multiple panels that enclose a first cavity.

[0006] A heat sink is installed on the side of the plate facing out of the first cavity, and at least a portion of the heat sink is located outside the first cavity;

[0007] A heat-conducting component is disposed on the side of the plate facing the first cavity;

[0008] An energy storage component is disposed at the end of the heat-conducting component away from the plate surface and is in heat exchange contact with the heat-conducting component.

[0009] In the above technical solution, by using the heat-conducting component disposed between the plate and the energy storage component, and the heat dissipation component installed on the plate that is at least partially located outside the first cavity, the heat dissipation efficiency of the electrical equipment can be improved, the operating temperature range of the energy storage component can be controlled, and the risk of overheating of the energy storage component can be reduced.

[0010] According to one embodiment of this application, the heat-conducting component is provided with a plurality of grooves, and the energy storage component is disposed in the grooves and in contact with the wall surface of the grooves.

[0011] In the above technical solution, setting the heat-conducting component as a contoured structure can improve heat conduction efficiency and reduce the risk of failure of the energy storage device due to overheating.

[0012] According to one embodiment of this application, the thermally conductive component includes: a thermally conductive colloid layer and a thermally conductive pad, wherein the thermally conductive colloid layer is located between the plate surface and the energy storage device, and the thermally conductive pad is sandwiched between the thermally conductive colloid layer and the energy storage device.

[0013] In the above technical solution, the combined effect of the thermally conductive colloid layer and the thermally conductive pad can optimize the heat conduction path, thereby reducing contact thermal resistance and improving heat conduction efficiency.

[0014] According to one embodiment of this application, the energy storage device is a cylindrical capacitor, and the thermally conductive pad includes multiple arc-shaped segments and is in contact with a portion of the surface of the cylindrical capacitor.

[0015] In the above technical solution, the thermally conductive pad includes multiple arc-shaped segments and is in contact with a portion of the surface of the cylindrical capacitor, which can reduce the contact thermal resistance between the thermally conductive colloid layer and the cylindrical capacitor and improve the heat conduction efficiency.

[0016] According to one embodiment of this application, the heat sink includes a first heat sink and a second heat sink, the first heat sink and the groove are respectively disposed, and the height of the first heat sink along the first direction is greater than the height of the second heat sink along the first direction.

[0017] In the above technical solution, by reasonably adjusting the thickness relationship between the heat dissipation component and the heat conduction component, the excessive temperature difference caused by heat accumulation or excessive thermal resistance can be reduced, thereby reducing the risk of damage caused by overheating or uneven heating.

[0018] According to one embodiment of this application, the heat sink penetrates the plate surface and extends partially into the heat conductor.

[0019] In the above technical solution, the heat transfer path between the heat sink and the heat conductor can be optimized through direct contact, thereby improving the heat conduction efficiency between the heat sink and the heat conductor.

[0020] According to one embodiment of this application, the heat dissipation component is hollow inside to form a condensation cavity; the heat conduction component is hollow inside to form an evaporation cavity; the condensation cavity and the evaporation cavity are connected, and the condensation cavity and the evaporation cavity are provided with a cooling medium.

[0021] In the above technical solution, the heat transfer path between the heat sink and the heat conductor can be optimized by the cooperation of the heat sink and the heat conductor, thereby improving the heat conduction efficiency between the heat sink and the heat conductor.

[0022] According to one embodiment of this application, the cabinet is provided with a second cavity communicating with the outside, the side of the panel facing away from the first cavity is located in the second cavity, and at least a portion of the heat sink is located in the second cavity.

[0023] In the above technical solution, placing at least a portion of the heat sink inside the second cavity allows for more efficient heat exchange with the external environment through natural or forced convection, thereby reducing heat accumulation inside the cabinet.

[0024] According to one embodiment of this application, the electrical device further includes a fan disposed in the second cavity and configured to drive gas flow in the second cavity.

[0025] In the above technical solution, the gas flow in the second chamber driven by the fan can improve the heat exchange efficiency and help the electrical equipment to operate stably within a safe temperature range.

[0026] According to one embodiment of this application, the wall of the cabinet is provided with a first air vent, the fan is installed on the wall opposite to the first air vent, and the heat dissipation component is located between the first air vent and the fan.

[0027] In the above technical solution, the airflow circulation in the second cavity can be optimized and the heat dissipation efficiency can be improved by the reasonable layout of the first air outlet, the fan and the heat dissipation component.

[0028] According to one embodiment of this application, the cabinet has a first air vent and a second air vent on opposite walls, and the fan is installed on the wall adjacent to both the first air vent and the second air vent, with the fan facing the heat sink.

[0029] In the above technical solution, by reasonably configuring the air outlet and the fan, the airflow can form a good circulation flow in the second cavity, which helps to control the temperature range in the cabinet.

[0030] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0031] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0032] Figure 1 This is one of the structural schematic diagrams of the electrical equipment provided in the embodiments of this application;

[0033] Figure 2 This is a second schematic diagram of the structure of the electrical equipment provided in the embodiments of this application;

[0034] Figure 3 This is an exploded schematic diagram of the electrical equipment provided in the embodiments of this application;

[0035] Figure 4 This is the third schematic diagram of the electrical equipment provided in the embodiments of this application;

[0036] Figure 5 This is the fourth schematic diagram of the electrical equipment provided in the embodiments of this application;

[0037] Figure 6 This is the fifth schematic diagram of the electrical equipment provided in the embodiments of this application.

[0038] Figure label:

[0039] Electrical equipment 1;

[0040] Cabinet 10, first cavity 110, second cavity 120, panel 130;

[0041] Heat sink 20, first heat sink 210, second heat sink 220, condensation chamber 230;

[0042] 30 energy storage components;

[0043] Thermal conductive component 40, groove 410, thermal conductive colloid layer 420, thermal conductive pad 430, evaporation chamber 440;

[0044] Fan 50, first fan 510, second fan 520;

[0045] First gust of wind: 610; Second gust of wind: 620.

[0046] First direction X. Detailed Implementation

[0047] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0048] This application aims to at least solve one of the technical problems existing in the related art. To this end, this application proposes an electrical device that can improve the heat dissipation efficiency of the electrical device.

[0049] The following is for reference. Figures 1-6 The electrical device 1 according to an embodiment of this application is described.

[0050] like Figure 1As shown, the electrical equipment 1 includes a cabinet 10, a heat sink 20, an energy storage device 30, and a heat conductor 40. The cabinet 10 has multiple panels 130, which enclose a closed first cavity 110. The heat sink 20 is installed on the side of the panel 130 facing the outside of the first cavity 110, and at least a portion of the heat sink 20 is located outside the first cavity 110. The heat conductor 40 is disposed on the side of the panel 130 facing the first cavity 110. The energy storage device 30 is disposed at the end of the heat conductor 40 away from the panel 130 and has heat exchange contact with the heat conductor 40.

[0051] The cabinet 10 is the outer shell structure of the electrical equipment 1 used to house the energy storage components 30. It has multiple panels 130, which enclose a first cavity 110 for housing the energy storage components 30, thus protecting the internal components of the electrical equipment 1. The cabinet 10 can provide physical isolation and protection for the internal energy storage components 30. The electrical equipment 1 can be a power conversion device such as an inverter, energy storage converter, or charging pile, or an electrical device such as a distribution cabinet.

[0052] For example, the energy storage component 30 includes, but is not limited to, capacitors or inductors. The capacitors may include aluminum electrolytic capacitors and electrolytic capacitors, etc., and the capacitors may be cylindrical, cuboid, or flat box-shaped, etc., as commonly seen in the prior art.

[0053] The heat sink 20 is installed on at least one of the multiple plates 130. The plate 130 on which the heat sink 20 is installed can be the back plate of the enclosure, the top plate of the enclosure, or both the back plate and the top plate. At least a portion of the heat sink 20 is located outside the first cavity 110, forming an internal and external heat exchange interface on the plate 130, which can improve the heat conduction efficiency. The portion of the heat sink 20 located outside the first cavity 110 can utilize natural convection or air cooling to further improve the heat exchange effect.

[0054] Specifically, such as Figure 4 As shown, the heat sink 20 can be fitted to the plate surface 130, and the entire assembly is located outside the first cavity 110, as... Figure 5 As shown, the heat sink 20 can also penetrate through the plate surface 130 and partially extend into the first cavity 110.

[0055] The heat sink 20 and the energy storage component 30 are respectively arranged along the first direction X, which is the height direction of the plate 130 and perpendicular to the mounting surface of the plate 130. The heat conduction paths of the energy storage component 30 and the heat sink 20 along the first direction X are the same.

[0056] For example, the heat sink 20 may include heat sink fins or heat spreaders, and the heat sink 20 may be made of materials including but not limited to aluminum, copper, stainless steel or ceramic composite materials. The heat sink 20 may be a solid heat sink fin or heat sink column, or it may be a heat spreader with a hollow interior to achieve phase change heat dissipation. Multiple heat sink fins are spaced apart along the length of the energy storage device 30 to improve the heat dissipation uniformity of the energy storage device 30.

[0057] In addition, the heat-conducting element 40 is disposed on the side of the plate 130 facing the first cavity 110, and the energy storage element 30 is disposed at the end of the heat-conducting element 40 away from the plate 130, and makes heat exchange contact with the heat-conducting element 40.

[0058] Specifically, the heat-conducting component 40 is sandwiched between the plate surface 130 and the energy storage component 30. That is, the two ends of the heat-conducting component 40 are tightly attached to the side of the plate surface 130 facing the first cavity 110 and the energy storage component 30, respectively, forming a heat transfer channel. It is mainly used to transfer the heat generated by the energy storage component 30 during operation to the heat dissipation component 20 on the plate surface 130 and dissipate it to the external environment.

[0059] For example, the materials used to make the heat-conducting component 40 include, but are not limited to, silicone, epoxy resin, acrylic or polyurethane. The heat-conducting component 40 has good thermal conductivity and insulation properties, is easy to process into various shapes, and is attached to the outer surface of the energy storage device 30 to fill the gap between the plate surface 130 and the energy storage device 30.

[0060] It is understandable that by clamping the heat-conducting component 40 between the plate surface 130 and the energy storage component 30, the energy storage component 30 can be kept within a suitable operating temperature range, while reducing the space occupied inside the first cavity 110 and improving the space utilization of the equipment.

[0061] In related technologies, energy storage components of electrical equipment, such as bus capacitors, are cooled by air in a sealed electronic cavity. The heat generated by the capacitor is mainly carried away by thermal convection between the capacitor and the air inside the sealed cavity, thereby reducing the capacitor's temperature. However, the heat dissipation method of thermal convection is greatly affected by the air temperature inside the sealed cavity. When the air temperature inside the sealed cavity is high, the heat dissipation efficiency of thermal convection decreases, leading to the risk of the capacitor overheating. Long-term operation will reduce the capacitor's lifespan, indicating room for improvement.

[0062] In this application, the heat-conducting component 40 is disposed between the side of the plate surface 130 facing the first cavity 110 and the energy storage component 30, and the plate surface 130 is equipped with a heat sink 20 located at least partially outside the first cavity 110, which can form a high-efficiency heat dissipation system. In the heat dissipation system, the energy storage component 30 mainly dissipates heat through the heat sink 20, and secondly, it can also dissipate heat through air convection, thereby reducing the impact of the air temperature inside the first cavity 110 on the heat dissipation effect and reducing the risk of overheating of the energy storage component 30.

[0063] According to the embodiments of this application, the electrical equipment 1 can improve the heat dissipation efficiency of the electrical equipment 1 by using the heat-conducting component 40 disposed between the plate surface 130 and the energy storage component 30, and the heat dissipation component 20 installed on the plate surface 130 that is at least partially located outside the first cavity 110, thereby achieving control over the operating temperature range of the energy storage component 30 and reducing the risk of overheating of the energy storage component 30.

[0064] In some embodiments, such as Figure 2 and Figure 3 As shown, the heat-conducting component 40 is provided with multiple grooves 410, and the energy storage component 30 is installed in the grooves 410 and in contact with the wall of the grooves 410.

[0065] Specifically, the energy storage component 30 and the heat-conducting component 40 are both installed in the first cavity 110. The heat-conducting component 40 is disposed on the plate surface 130 and located in the first cavity 110. The side of the heat-conducting component 40 away from the plate surface 130 is provided with multiple grooves 410. The energy storage component 30 is installed in the grooves 410 and the energy storage component 30 and the heat-conducting component 40 are in heat exchange contact to form a heat transfer channel. The heat generated by the energy storage component 30 during operation is transferred to the heat dissipation component 20 on the plate surface 130 through the heat-conducting component 40 and dissipated into the external environment.

[0066] In addition, the groove 410 is mainly used to install the energy storage component 30. The side of the heat-conducting component 40 facing the energy storage component 30 is designed according to the shape of the energy storage component 30 to form a groove 410 for installing the energy storage component 30. The groove 410 can increase the contact area between the heat-conducting component 40 and the energy storage component 30, thereby improving the heat conduction efficiency.

[0067] For example, the energy storage device 30 can be a capacitor, further, the capacitor is square and the groove 410 is a rectangular structure, with at least a portion of the capacitor being accommodated in the groove 410; further, the capacitor is cylindrical and the groove 410 is an arc-shaped structure, with at least a portion of the capacitor being accommodated in the groove 410.

[0068] Meanwhile, the heat-conducting component 40 with groove 410 can protect the energy storage component 30 and reduce the displacement of the energy storage component 30 caused by vibration or external force. By clamping the heat-conducting component 40 between the plate surface 130 and the energy storage component 30, the energy storage component 30 can be kept within a suitable operating temperature range. At the same time, it can reduce the space occupied inside the first cavity 110 and improve the space utilization of the equipment.

[0069] It is understandable that setting grooves 410 on the heat-conducting component 40 can improve heat transfer efficiency and reduce the risk of failure of the energy storage component 30 due to overheating.

[0070] In some embodiments, the heat-conducting element 40 is provided with a plurality of grooves 410, and the energy storage element 30 is mounted in the grooves 410.

[0071] Specifically, the energy storage component 30 and the heat conduction component 40 are both installed in the first cavity 110, and the heat conduction component 40 is sandwiched between the plate surface 130 and the energy storage component 30, respectively, and is closely attached to the side of the plate surface 130 facing the first cavity 110 and the energy storage component 30 to form a heat transfer channel. The heat conduction component 40 can transfer the heat generated by the energy storage component 30 during operation to the heat dissipation component 20 on the plate surface 130 and dissipate it to the external environment.

[0072] like Figure 2 and Figure 3 As shown, the heat-conducting component 40 has various structural forms, including but not limited to:

[0073] Example 1: The thermally conductive component 40 may include a thermally conductive colloid layer 420.

[0074] like Figure 2 As shown, in this embodiment, the thermally conductive component 40 may include a thermally conductive colloid layer 420, which is located between the plate surface 130 and the energy storage component 30.

[0075] The thermally conductive colloid layer 420 has a contoured semi-enclosed structure. One end of the thermally conductive colloid layer 420 is fixedly installed on the side of the plate surface 130 facing the first cavity 110. Multiple grooves 410 are provided on the side of the thermally conductive colloid layer 420 away from the plate surface 130. The grooves 410 are mainly used to install the energy storage components 30.

[0076] For example, the thermally conductive colloid layer 420 is typically a gel-like substance composed of thermally conductive particles and an adhesive. For example, the thermally conductive particles include, but are not limited to, highly thermally conductive materials such as metal powder, alumina, or carbon materials, and the adhesive includes, but is not limited to, organic polymer materials such as silicone, epoxy resin, acrylic, or polyurethane. The main function of the adhesive is to fix the thermally conductive particles together and maintain the fluidity and stability of the thermally conductive colloid. At the same time, the thermally conductive colloid layer 420 has good thermal conductivity and insulation properties, is easy to process into various shapes, and is attached to the outer surface of the energy storage device 30 to fill the gap between the board surface 130 and the energy storage device 30.

[0077] Example 2: The thermally conductive component 40 may include a thermally conductive colloid layer 420 and a thermally conductive pad 430.

[0078] like Figure 3 As shown, in this embodiment, the thermally conductive component 40 may include a thermally conductive colloid layer 420 and a thermally conductive pad 430. The thermally conductive colloid layer 420 is located between the plate surface 130 and the energy storage device 30, and the thermally conductive pad 430 is sandwiched between the thermally conductive colloid layer 420 and the energy storage device 30.

[0079] Both the thermally conductive colloid layer 420 and the thermally conductive pad 430 are contoured semi-enclosed structures. One end of the thermally conductive colloid layer 420 is fixedly installed on the side of the plate surface 130 facing the first cavity 110. Multiple grooves 410 are provided on the side of the thermally conductive colloid layer 420 away from the plate surface 130. The grooves 410 are mainly used to install the energy storage component 30. The thermally conductive pad 430 is set in the grooves 410 and is located between the thermally conductive colloid layer 420 and the energy storage component 30. The thermally conductive pad 430 can reduce the contact thermal resistance between the thermally conductive component 40 and the energy storage component 30, thereby improving the heat conduction efficiency.

[0080] It should be noted that the thermally conductive pad 430 can be an arc-shaped structure or other structures. For example, the thermally conductive pad 430 can be multiple thermally conductive barriers attached to the thermally conductive colloid layer 420, or it can be a sealing pad layer filled inside the thermally conductive colloid layer 420.

[0081] For example, the thermally conductive colloid layer 420 is typically a gel-like substance composed of thermally conductive particles and an adhesive. For example, the thermally conductive particles include, but are not limited to, highly thermally conductive materials such as metal powder, alumina, or carbon materials, and the adhesive includes, but is not limited to, organic polymer materials such as silicone, epoxy resin, acrylic, or polyurethane. The main function of the adhesive is to fix the thermally conductive particles together and maintain the fluidity and stability of the thermally conductive colloid. At the same time, the thermally conductive colloid layer 420 has good thermal conductivity and insulation properties, is easy to process into various shapes, and is attached to the outer surface of the energy storage device 30 to fill the gap between the board surface 130 and the energy storage device 30.

[0082] For example, the thermal pad 430 is typically a flexible material with high thermal conductivity. The material used to make the thermal pad 430 includes, but is not limited to, metal foil, synthetic materials or other thermally conductive materials. The thermal conductivity of the thermal pad 430 is higher than that of the thermally conductive colloid layer 420. The thermal pad 430 is sandwiched between the thermally conductive colloid layer 420 and the energy storage device 30 to reduce the contact thermal resistance between the thermally conductive element 40 and the energy storage device 30.

[0083] In addition, the combination of thermally conductive colloid layer 420 and thermally conductive pad 430 can reduce the risk of equipment failure due to thermal expansion and thermal stress. Specifically, the flexible contact between thermally conductive pad 430 and energy storage component 30 and the good filling effect of thermally conductive colloid layer 420 help to slow down thermal stress changes caused by temperature difference, thereby reducing equipment damage or performance degradation caused by overheating.

[0084] Understandably, the combined effect of the thermally conductive colloid layer 420 and the thermally conductive pad 430 can optimize the heat conduction path, thereby reducing contact thermal resistance and improving heat conduction efficiency.

[0085] In some embodiments, such as Figure 3 As shown, when the thermal conductive component 40 includes a thermally conductive colloid layer 420 and a thermally conductive pad 430, the energy storage component 30 can be a cylindrical capacitor. The thermally conductive pad 430 includes multiple arc-shaped segments and is attached to a portion of the surface of the cylindrical capacitor.

[0086] Both the thermally conductive colloid layer 420 and the thermally conductive pad 430 are contoured semi-enclosed structures. One end of the thermally conductive colloid layer 420 is fixedly installed on the side of the plate surface 130 facing the first cavity 110. Multiple grooves 410 are provided on the side of the thermally conductive colloid layer 420 away from the plate surface 130. The grooves 410 are mainly used to install the energy storage components 30.

[0087] The energy storage component 30 can be a cylindrical capacitor. Multiple cylindrical capacitors are arranged in a one-to-one correspondence with multiple grooves 410. The thermally conductive pad 430 can include multiple arc segments. Multiple arc segments are sandwiched between the cylindrical capacitor and the groove 410 in a one-to-one correspondence. The arc segments are in contact with part of the surface of the cylindrical capacitor, thereby reducing the contact thermal resistance between the thermally conductive colloid layer 420 and the cylindrical capacitor and improving the thermal conduction efficiency.

[0088] In some embodiments, such as Figure 4 and Figure 5 As shown, the thickness of the heat sink 20 at various locations outside the first cavity 110 is negatively correlated with the thickness of the heat conductor 40 at those locations.

[0089] Specifically, the heat sink 20 is located on the side of the plate 130 facing the second cavity 120, the heat conductor 40 is located on the side of the plate 130 facing the first cavity 110, and the orthographic projection of the heat sink 20 along the direction perpendicular to the plate 130 is located within the orthographic projection of the heat conductor 40 along the direction perpendicular to the plate 130.

[0090] In addition, the thickness of the heat sink 20 outside the first cavity 110 is the distance from one end of the heat sink 20 away from the first cavity 110 along a direction perpendicular to the plate surface 130 to the other end of the heat sink 20, and the thickness of the heat conductor 40 is the distance from the side of the heat conductor 40 in contact with the energy storage device 30 along a direction perpendicular to the plate surface 130 to the side of the heat conductor 40 in contact with the plate surface 130.

[0091] The thickness of the heat sink 20 at various locations outside the first cavity 110 is negatively correlated with the thickness of the heat conductor 40 at that location. That is, the greater the thickness of the heat conductor 40 at a certain location, the smaller the thickness of the heat sink 20 at that location, and vice versa.

[0092] In some embodiments, such as Figure 4 and Figure 5 As shown, the heat sink 20 may include a first heat sink 210 and a second heat sink 220, wherein the first heat sink 210 and the groove 410 are respectively provided, and the height of the first heat sink 210 along the first direction X is greater than the height of the second heat sink 220 along the first direction X.

[0093] Specifically, the first heat dissipation part 210 and the second heat dissipation part 220 are alternately distributed along the length of the heat dissipation member 20.

[0094] Furthermore, the heat dissipation fins of the first heat dissipation part 210 and the second heat dissipation part 220 can both be arc-shaped, and the adjacent first heat dissipation parts 210 are smoothly transitioned through the second heat dissipation part 220.

[0095] For example, the sum of the heights of the heat-conducting component 40 and the heat-dissipating component 20 at the same location along the first direction X can be the same. That is, the distance from the end of the heat-dissipating component 20 furthest from the energy storage device 30 along the first direction X to the energy storage device 30 can be a certain value. For example, the shape of the end of the heat-dissipating component 20 away from the first cavity 110 can be, but is not limited to, wavy, so that the heat transfer path at different locations of the energy storage device 30 is the same, thereby improving the temperature uniformity at different locations of the energy storage device 30.

[0096] It is understandable that by reasonably adjusting the thickness relationship between the heat sink 20 and the heat conductor 40, the excessive temperature difference caused by heat accumulation or excessive thermal resistance can be reduced, thereby reducing the risk of damage caused by overheating or uneven heating.

[0097] In some embodiments, such as Figure 4and Figure 5 As shown, the heat sink 20 can be at least one of the following structural forms:

[0098] Example 1: The heat sink 20 is mounted on the plate surface 130, and all of the heat sink 20 is located outside the first cavity 110.

[0099] like Figure 4 As shown, in this embodiment, the heat sink 20 is mounted on the plate surface 130, and all of the heat sink 20 is located outside the first cavity 110. The heat conductor 40 is mounted on the plate surface 130, and all of the heat conductor 40 is located inside the first cavity 110. The heat sink 20 and the heat conductor 40 do not directly contact each other, but transfer heat through the plate surface 130. The heat sink 20 may include heat dissipation structures such as fins. The material of the heat sink 20 includes, but is not limited to, aluminum, copper, stainless steel or ceramic composite materials. Multiple fins are spaced apart along the width direction of the energy storage device 30 to improve the heat dissipation uniformity of the energy storage device 30.

[0100] For example, the heat sink 20 can be a solid fin. The heat exchange efficiency is mainly improved by increasing the contact area between the heat sink 20 and the air. At this time, the heat exchange method between the heat sink 20 and the air is thermal convection. The energy storage device 30 transfers heat to the heat conductor 40 through thermal conduction. The heat conductor 40 transfers heat to the plate surface 130 through thermal conduction. The plate surface 130 transfers heat to the heat sink 20 through thermal conduction. The heat sink 20 exchanges heat with the outside air.

[0101] For example, the heat sink 20 can be a hollow fin, and a cavity for containing a cooling medium is formed inside the heat sink 20. The cooling medium may include a phase change medium. At this time, the heat sink 20 can simultaneously perform phase change heat dissipation and convective heat exchange with the air. The energy storage device 30 transfers heat to the heat conductor 40 through thermal conduction. The heat conductor 40 transfers heat to the plate surface 130 through thermal conduction. Then, the heat is transferred to the heat sink 20 through the cooling medium. The heat sink 20 exchanges heat with the outside air.

[0102] Example 2: The heat sink 20 penetrates the plate surface 130, and part of the heat sink 20 extends into the heat conduction component 40.

[0103] like Figure 5 As shown, in this embodiment, the heat-conducting component 40 is installed on the side of the plate 130 facing the first cavity 110, the heat sink 20 penetrates the plate 130, a part of the heat sink 20 extends into the heat-conducting component 40, and the other part of the heat sink 20 is located outside the first cavity 110.

[0104] For example, the heat sink 20 can be a solid fin. The heat exchange efficiency is mainly improved by increasing the contact area between the heat sink 20 and the air. At this time, the heat exchange method between the heat sink 20 and the air is thermal convection. The energy storage device 30 transfers heat to the heat conductor 40 through thermal conduction. The heat conductor 40 transfers heat to the heat sink 20 through thermal conduction. The heat sink 20 exchanges heat with the outside air.

[0105] It is understandable that by having direct contact between the heat sink 20 and the heat conductor 40, the heat transfer path between the heat sink 20 and the heat conductor 40 can be optimized, thereby improving the heat conduction efficiency between the heat sink 20 and the heat conductor 40.

[0106] In some embodiments, such as Figure 4 and Figure 5 As shown, the heat sink 20 is hollow inside, forming a condensation chamber 230, and the heat conduction component 40 is hollow inside, forming an evaporation chamber 440. The condensation chamber 230 and the evaporation chamber 440 are connected, and the condensation chamber 230 and the evaporation chamber 440 are provided with a cooling medium.

[0107] When the heat sink 20 is mounted on the plate surface 130 and all of the heat sink 20 is located outside the first cavity 110, such as Figure 4 As shown, the heat-conducting component 40 is installed on the side of the plate 130 facing the first cavity 110, and the heat dissipation component 20 is installed on the side of the plate 130 away from the first cavity 110, separated from the heat-conducting component 40 by the plate 130. All parts of the heat dissipation component 20 are located outside the first cavity 110.

[0108] For example, an opening can be provided on the plate surface 130, through which the evaporation chamber 440 and the condensation chamber 230 are connected.

[0109] When the heat sink 20 penetrates the plate surface 130 and a portion of the heat sink 20 extends into the heat conductor 40, such as Figure 5 As shown, the heat-conducting component 40 is installed on the side of the plate 130 facing the first cavity 110, a part of the heat sink 20 extends into the heat-conducting component 40 and is in direct contact with the heat-conducting component 40, and the other part of the heat sink 20 is located outside the first cavity 110.

[0110] For example, the heat sink 20 can be a hollow fin or a hollow heat spreader. A condensation cavity 230 is formed inside the heat sink 20, and the heat conduction component 40 is hollow inside, forming an evaporation cavity 440. The condensation cavity 230 and the evaporation cavity 440 are connected.

[0111] For example, an opening can be provided on the heat-conducting component 40, through which the evaporation chamber 440 and the condensation chamber 230 are connected. Alternatively, an intermediate substrate can be provided, with an opening on the substrate to connect the condensation chamber 230 and the evaporation chamber 440.

[0112] When the condensing chamber 230 and the evaporating chamber 440 are connected, the heat sink 20 can simultaneously perform phase change heat dissipation and convective heat exchange with the air. The energy storage device 30 transfers heat to the heat conduction device 40 through heat conduction. The liquid refrigerant in the evaporating chamber 440 absorbs heat and is converted into gaseous refrigerant. The gaseous refrigerant enters the condensing chamber 230 and transfers heat to the heat sink 20. The heat sink 20 exchanges heat with the outside air. At the same time, the gaseous refrigerant is converted into liquid refrigerant and falls back into the evaporating chamber 440, forming a complete heat exchange cycle.

[0113] It is understandable that by cooperating with the heat sink 20 and the heat conductor 40, the heat transfer path between the heat sink 20 and the heat conductor 40 can be optimized, thereby improving the heat conduction efficiency between the heat sink 20 and the heat conductor 40.

[0114] In some embodiments, such as Figure 1 and Figure 6 As shown, the cabinet 10 is provided with a second cavity 120 that communicates with the outside. The side of the panel 130 facing away from the first cavity 110 is located in the second cavity 120, and at least a portion of the heat sink 20 is located in the second cavity 120.

[0115] For example, the cabinet 10 may include an outer shell and a partition. The bottom plate of the outer shell and the partition together form a first cavity 110, and the other parts of the outer shell and the partition together form a second cavity 120. The first cavity 110 is a sealed cavity used to accommodate energy storage components 30, and can also be used to accommodate power devices with high protection requirements. The second cavity 120 is connected to the outside and surrounds the first cavity 110, which helps to maximize heat exchange efficiency and reduce heat accumulation in the first cavity 110.

[0116] One side of the plate 130 faces the first cavity 110 and the other side faces the second cavity 120. The side of the plate 130 facing the first cavity 110 is provided with a heat-conducting component 40 that is in close contact with the energy storage component 30. The side of the plate 130 facing the second cavity 120 is provided with a heat dissipation component 20, and at least a portion of the heat dissipation component 20 is located in the second cavity 120.

[0117] The portion of the heat sink 20 located in the second cavity 120 exchanges heat with the air inside the second cavity 120. The second cavity 120 achieves air circulation by communicating with the external environment, thereby enhancing the heat dissipation effect.

[0118] It is understandable that placing at least a portion of the heat sink 20 within the second cavity 120 allows for more efficient heat exchange with the external environment through natural or forced convection, thereby reducing heat buildup inside the cabinet 10.

[0119] In some embodiments, such as Figure 1 and Figure 6As shown, the electrical equipment 1 also includes a fan 50, which is disposed in the second chamber 120 and configured to drive the gas flow in the second chamber 120.

[0120] The fan 50 is installed on the wall of the cabinet 10 and is connected to the second cavity 120. It is used to drive the air flow in the second cavity 120, quickly exhaust the hot air in the second cavity 120, and help the cold air from the outside environment flow into the second cavity 120 to form a convection heat dissipation system.

[0121] For example, the fan 50 can be installed on the side of the cabinet 10 facing the first cavity 110, or on the side of the cabinet 10 facing the outside.

[0122] For example, the fan 50 can be used for both air intake and air exhaust.

[0123] It is understandable that driving the gas flow in the second chamber 120 by the fan 50 can improve heat exchange efficiency and help the electrical equipment 1 operate stably within a safe temperature range.

[0124] In some embodiments, such as Figure 1 and Figure 6 As shown, the wall of the cabinet 10 is equipped with air vents, and the fan 50 and the air vents can be arranged in various ways, including but not limited to:

[0125] Example 1: The wall of the cabinet 10 is provided with a first air vent 610, the fan 50 is installed on the wall opposite to the first air vent 610, and the heat sink 20 is located between the first air vent 610 and the fan 50.

[0126] like Figure 1 As shown, in this embodiment, the second cavity 120 is connected to the outside through the first air vent 610 and the fan 50. The air inlet and outlet of the second cavity 120 are not restricted. Air can enter through the first air vent 610 and exit through the fan 50, or air can enter through the fan 50 and exit through the first air vent 610.

[0127] The fan 50 is installed on the wall opposite to the first air outlet 610, and the heat sink 20 is located between the first air outlet 610 and the fan 50, so that the air flow path in the second cavity 120 can cover the heat sink 20, thereby maximizing the heat exchange efficiency.

[0128] Furthermore, the heat sink 20 has multiple heat dissipation channels. Gas passes through the heat dissipation channels, thereby increasing the heat exchange area between the gas and the heat sink 20 and improving the heat exchange efficiency.

[0129] It is understandable that by rationally arranging the first air vent 610, the fan 50, and the heat sink 20, the airflow circulation within the second cavity 120 can be optimized, thereby improving heat dissipation efficiency.

[0130] Example 2: The walls opposite the cabinet 10 are respectively provided with a first air vent 610 and a second air vent 620. The fan 50 is installed on the wall adjacent to both the first air vent 610 and the second air vent 620, and the fan 50 faces the heat sink 20.

[0131] like Figure 6 As shown, in this embodiment, the second cavity 120 is connected to the outside through the first air vent 610, the second air vent 620, and the fan 50. The fan 50 includes a first fan 510 and a second fan 520. The first air vent 610 and the second air vent 620 can simultaneously draw in air or simultaneously discharge air. When the first air vent 610 and the second air vent 620 draw in air simultaneously, the second cavity 120 discharges air through the first fan 510 and the second fan 520. When the first air vent 610 and the second air vent 620 discharge air simultaneously, the second cavity 120 draws in air through the first fan 510 and the second fan 520.

[0132] The first fan 510 and the second fan 520 are installed on the wall adjacent to both the first air outlet 610 and the second air outlet 620. The wall where the first fan 510 and the second fan 520 are located is opposite to the plate surface 130. The first fan 510 and the second fan 520 are both facing the heat sink 20. That is, the first fan 510 and the second fan 520 are directly opposite the heat sink 20 in a direction perpendicular to the plate surface 130. The gas flow path formed by the first fan 510 and the first air outlet 610 covers part of the heat sink 20, and the gas flow path formed by the second fan 520 and the second air outlet 620 covers the other part of the heat sink 20.

[0133] Understandably, by properly configuring the air vents and fans 50, the airflow can form a good circulation within the second cavity 120, which helps to control the temperature range within the cabinet 10.

[0134] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0135] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0136] In the description of this application, "first feature" and "second feature" may include one or more of the features.

[0137] In the description of this application, "multiple" means two or more.

[0138] In the description of this application, the first feature being "above" or "below" the second feature may include the first and second features being in direct contact, or the first and second features being in contact through another feature between them.

[0139] In the description of this application, the terms "above," "over," and "on top" for the first feature and the second feature include the first feature being directly above or diagonally above the second feature, or simply indicate that the first feature is at a higher horizontal level than the second feature.

[0140] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0141] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. An electrical device (1), characterized in that, include: The cabinet (10) has multiple panels (130) that enclose a first cavity (110). A heat sink (20) is installed on the side of the plate (130) facing the outside of the first cavity (110), and at least a portion of the heat sink (20) is located outside the first cavity (110); A heat-conducting component (40) is disposed on the side of the plate (130) facing the first cavity (110); An energy storage component (30) is disposed at the end of the heat-conducting component (40) away from the plate surface (130) and is in heat exchange contact with the heat-conducting component (40).

2. The electrical equipment according to claim 1, characterized in that, The heat-conducting component (40) is provided with a plurality of grooves (410), and the energy storage component (30) is disposed in the grooves (410) and in contact with the wall surface of the grooves (410).

3. The electrical equipment according to claim 2, characterized in that, The thermally conductive component (40) includes a thermally conductive colloid layer (420) and a thermally conductive pad (430). The thermally conductive colloid layer (420) is located between the plate surface (130) and the energy storage device (30), and the thermally conductive pad (430) is sandwiched between the thermally conductive colloid layer (420) and the energy storage device (30).

4. The electrical device of claim 3, wherein, The energy storage component (30) is a cylindrical capacitor, and the thermal pad (430) includes multiple arc segments and is in contact with part of the surface of the cylindrical capacitor.

5. The electrical equipment according to claim 2, characterized in that, The heat sink (20) includes a first heat sink (210) and a second heat sink (220). The first heat sink (210) and the groove (410) are respectively provided, and the height of the first heat sink (210) along the first direction (X) is greater than the height of the second heat sink (220) along the first direction (X).

6. The electrical device of claim 1, wherein, The heat sink (20) penetrates the plate surface (130) and extends partially into the heat conductor (40).

7. The electrical device of claim 1, wherein, The heat dissipation component (20) is hollow inside, forming a condensation cavity (230); the heat conduction component (40) is hollow inside, forming an evaporation cavity (440); the condensation cavity (230) and the evaporation cavity (440) are connected, and the condensation cavity (230) and the evaporation cavity (440) are provided with a cooling medium.

8. The electrical equipment according to any one of claims 1-7, characterized in that, The cabinet (10) is provided with a second cavity (120) that communicates with the outside. The side of the panel (130) facing away from the first cavity (110) is located in the second cavity (120). At least a portion of the heat sink (20) is located in the second cavity (120).

9. The electrical equipment according to claim 8, characterized in that, include: A fan (50) is disposed in the second chamber (120) and configured to drive the gas flow in the second chamber (120).

10. The electrical equipment according to claim 9, characterized in that, The cabinet (10) has a first air vent (610) on its wall, the fan (50) is installed on the wall opposite to the first air vent (610), and the heat sink (20) is located between the first air vent (610) and the fan (50).

11. The electrical equipment according to claim 9, characterized in that, The cabinet (10) has a first air vent (610) and a second air vent (620) on opposite walls. The fan (50) is installed on the wall adjacent to both the first air vent (610) and the second air vent (620), and the fan (50) faces the heat sink (20).

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