Link communication device

Abstract

The utility model discloses a link communication device, and the device comprises a lower housing which is integrally provided with side plates at two opposite sides; the fixed plate is fixedly connected to the side plate; the first fan is fixedly connected to the fixing plate and located on the side, away from the side plate, of the fixing plate. The switching power supply is fixedly connected to the lower shell, and a second fan is arranged on the surface of the switching power supply; wherein heat dissipation holes are formed in the side plates in a penetrating mode, and heat in the device sequentially passes through the first fan, the second fan and the heat dissipation holes to be discharged.

Description

A link communication device Technical Field

[0001] This utility model relates to the field of communication hardware, and in particular to a link communication device. Background Technology

[0002] In the current field of communication network technology, link communication gateways play a crucial role as key devices for network connection and data transmission. However, with the surge in network traffic and the increasing complexity of data processing demands, existing gateways have revealed a series of technical deficiencies in their heat dissipation design. These problems severely restrict the performance stability and lifespan of the gateways.

[0003] First, inefficient heat dissipation is a common problem in current gateways. During high-intensity data transmission and processing, a large amount of heat is generated inside the gateway, and traditional heat dissipation designs often cannot dissipate this heat effectively and in a timely manner, causing the internal temperature of the device to rise sharply. This not only affects the gateway's processing speed and response time but may also cause a series of performance bottlenecks, such as increased network latency and higher packet loss rates, thus severely reducing the quality of network communication. Second, because heat cannot be dissipated in time, the electronic components inside the device (especially the switching power supply, which typically operates at very high temperatures) are highly susceptible to thermal damage, leading to aging, failure, or even burnout. This not only results in frequent equipment failures and increased maintenance costs but may also cause data loss or communication interruptions, causing incalculable losses to users.

[0004] Therefore, it is necessary to provide a link communication device that can effectively dissipate heat and protect internal electronic components. Summary of the Invention

[0005] The purpose of this invention is to provide a link communication device that can effectively dissipate heat and protect internal electronic components.

[0006] According to one aspect of this application, a link communication device is provided, the device comprising:

[0007] The lower housing has side plates integrally formed on opposite sides;

[0008] A fixing plate is fixedly connected to the side plate;

[0009] The first fan is fixedly connected to the fixing plate and is located on the side of the fixing plate opposite to the side plate;

[0010] A switching power supply is fixedly connected to the lower housing, and a second fan is provided on the surface of the switching power supply.

[0011] The side plate has heat dissipation holes, and the heat inside the device is discharged sequentially through the first fan, the second fan, and the heat dissipation holes.

[0012] More preferably, the device further includes:

[0013] The upper housing is fixedly spliced ​​with the lower housing;

[0014] The front cover, viewed along a first direction parallel to the surface of the upper housing, is fixedly connected between the upper housing and the lower housing.

[0015] More preferably, the device further includes:

[0016] The motherboard is fixedly connected to the lower housing and located between the upper housing and the lower housing, and is located on the side of the switching power supply away from the front cover plate;

[0017] The rear cover, viewed along a first direction parallel to the surface of the upper housing, is fixedly connected between the upper housing and the lower housing, and is located on the side of the motherboard away from the switching power supply.

[0018] Even better,

[0019] The motherboard is fixedly connected to a main switch, a USB interface, and a serial port on the side opposite to the lower housing, and the main switch, the USB interface, and the serial port are electrically connected to the motherboard.

[0020] More preferably, the main switch, the USB interface, and the serial port are also fixedly connected to the front cover, and when viewed along the first direction, the main switch, the USB interface, and the serial port are arranged sequentially on the surface of the front cover.

[0021] More preferably, the motherboard further includes:

[0022] A heat dissipation unit is fixedly connected to the motherboard and electrically connected to the motherboard.

[0023] The heat dissipation unit is equipped with a third fan to dissipate heat from the motherboard.

[0024] Even better,

[0025] The motherboard is also fixedly connected to a network port and a VGA interface on the side opposite to the lower housing, and the network port and the VGA interface are electrically connected to the motherboard respectively.

[0026] More preferably, the network port and the VGA interface are also fixedly connected to the rear cover plate, and when viewed from a second direction opposite to the first direction, the network port and the VGA interface are arranged sequentially on the surface of the rear cover plate.

[0027] More preferably, the device further includes:

[0028] The filter is fixedly connected to the lower housing and electrically connected to the motherboard. When viewed along the second direction, the filter is located on the side of the network port away from the VGA interface.

[0029] The power socket is fixedly connected to the rear cover and electrically connected to the motherboard. When viewed along the second direction, the power socket is located on the side of the filter away from the lower housing.

[0030] More preferably, the second fan is electrically connected to the motherboard, and the switching power supply is also electrically connected to the motherboard.

[0031] This utility model has the following beneficial effects:

[0032] The heat inside the device is discharged sequentially through the first fan, the second fan, and the heat dissipation hole, enabling the device to effectively dissipate heat. Furthermore, the design of the switching power supply also having a second fan effectively dissipates the heat inside the switching power supply, protecting the electronic components inside the device. Attached Figure Description

[0033] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0034] Figure 1 is a three-dimensional structural schematic diagram of the link communication device described in one embodiment of this application;

[0035] Figure 2 is a schematic diagram of the forward-looking structure of the link communication device described in one embodiment of this application;

[0036] Figure 3 is a schematic diagram of the rear view of the link communication device described in one embodiment of this application;

[0037] Figure 4 is a schematic diagram of the planar structure of the link communication device after the upper housing is removed in one embodiment of this application;

[0038] Figure 5 is a schematic diagram of the planar structure of the motherboard in the link communication device according to an embodiment of this application;

[0039] Figure 6 is an enlarged three-dimensional structural diagram of the first fan and the fixed plate in the link communication device according to an embodiment of this application;

[0040] Figure 7 is a three-dimensional enlarged schematic diagram of the switching power supply in the link communication device according to an embodiment of this application;

[0041] Reference numerals: 200, Link communication device; 10, Lower housing; 11, Side panel; 11A, Heat dissipation hole; 20, Fixing plate; 30, First fan; 40, Switching power supply; 41, Second fan; 50, Upper housing; 60, Front cover; 70, Main board; 71, Main switch; 72, USB interface; 73, Serial port; 74, Heat dissipation unit; 74A, Third fan; 75, Network port; 76, VGA interface; 80, Rear cover; 90, Filter; 100, Power socket; F1, First direction; F2, Second direction. Detailed Implementation

[0042] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings. Preferred embodiments of this application are shown in the drawings. However, this application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of this application.

[0043] It should be noted that when a component is said to be "fixed to" another component, it can be directly attached to the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0044] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the specification of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0045] Please refer to Figures 1-7. One embodiment of this application provides a link communication device, which includes: a lower housing 10, a fixing plate 20, a first fan 30, and a switching power supply 40.

[0046] Side plates 11 are integrally formed on opposite sides of the lower housing 10. A fixing plate 20 is fixedly connected to the side plates 11. The first fan 30 is fixedly connected to the fixing plate 20 and located on the side of the fixing plate 20 opposite to the side plates 11. The switching power supply 40 is fixedly connected to the lower housing 10, and a second fan 41 is provided on the surface of the switching power supply 40. A heat dissipation hole 11A is formed through the side plates 11, and heat from the device is sequentially discharged through the first fan 30, the second fan 41, and the heat dissipation hole 11A.

[0047] Side plates 11 are integrally formed on opposite sides of the lower housing 10. The side plates 11, as extensions of the lower housing 10, provide structural support and a base for the mounting plate 20 and other components. The mounting plate 20, connected to the side plates 11, ensures the stable installation of the first fan 30 and provides a heat dissipation channel for the first fan 30. The first fan 30 is responsible for initial heat dissipation, helping to reduce the overall temperature of the device by drawing heat from inside and expelling it. The switching power supply 40, as the main power supply component of the device, easily generates heat. The second fan 41 helps to quickly dissipate the heat generated by the switching power supply 40, preventing overheating. The heat dissipation hole 11A serves as the final channel for heat dissipation, allowing the heat cooled by the first fan 30 and the second fan 41 to be smoothly expelled from the outside of the device, ensuring that the internal temperature of the device remains suitable.

[0048] More preferably, the device further includes an upper housing 50 and a front cover 60.

[0049] The upper housing 50 and the lower housing 10 are fixedly joined together. When viewed along a first direction F1 parallel to the surface of the upper housing 50, the front cover plate 60 is fixedly connected between the upper housing 50 and the lower housing 10.

[0050] The upper housing 50 and lower housing 10 are fixedly joined, together forming the main structure of the link communication device. This design not only enhances the device's stability but also provides comprehensive protection for its internal components. The addition of the upper housing 50 creates a relatively enclosed space, helping to reduce the impact of external environmental factors such as dust and moisture on the internal components, thereby improving the device's durability and reliability. Although the upper housing 50 itself does not directly participate in the heat dissipation process, its tight fit with the lower housing 10 helps reduce air leakage around the heat dissipation holes 11A, thereby improving heat dissipation efficiency. In addition, the surface design of the upper housing 50 may also take into account heat dissipation requirements, such as using heat dissipation fins or ventilation holes to assist in heat dissipation. The front cover 60 is fixedly connected between the upper housing 50 and the lower housing 10, providing additional protection for the front interface of the device. This helps prevent the interface from being damaged by accidental impacts or scratches.

[0051] More preferably, the device further includes a motherboard 70 and a rear cover plate 80.

[0052] The motherboard 70 is fixedly connected to the lower housing 10 and is located between the upper housing 50 and the lower housing 10, and is located on the side of the switching power supply 40 opposite to the front cover plate 60. The rear cover plate 80, viewed along a first direction F1 parallel to the surface of the upper housing 50, is fixedly connected between the upper housing 50 and the lower housing 10, and is located on the side of the motherboard 70 opposite to the switching power supply 40.

[0053] The motherboard 70, as the core component of the link communication device, integrates key components such as the processor, memory, and interface controller. It is responsible for processing data, controlling communication between devices, and providing connection interfaces with external devices. The motherboard 70 is fixedly connected to the lower housing 10 and located between the upper housing 50 and the lower housing 10. This layout ensures the stability and safety of the motherboard 70. Simultaneously, the motherboard 70 is located on the side of the switching power supply 40 away from the front cover 60, avoiding the impact of heat and electromagnetic interference generated by the power supply on the motherboard 70, ensuring its normal operation. The layout of the motherboard 70 also considers heat dissipation requirements. Since the motherboard 70 integrates a large number of heat-generating components, its position design helps to effectively dissipate heat using the internal heat dissipation channels (such as fans and heat dissipation holes 11A), ensuring the stability of the motherboard 70 under high load operation. The rear cover 80 is fixedly connected between the upper housing 50 and the lower housing 10, and together with the motherboard 70, front cover 60, and other components, constitutes the complete structure of the link communication device. The addition of the rear cover 80 enhances the stability and sealing of the device. The rear cover 80 typically has pre-drilled locations for various interfaces, which connect to external devices via corresponding circuitry on the motherboard 70. The rear cover 80 helps protect these interfaces from environmental damage, improving the device's durability. The design of the rear cover 80 may also consider heat dissipation requirements. For example, ventilation holes or heat sinks may be incorporated into the rear cover 80 to aid in heat dissipation and ensure the internal temperature of the device remains within a suitable range. The rear cover 80 allows easy access to the internal components, facilitating maintenance and upgrades. For instance, users can easily replace components such as memory modules or hard drives, or clean internal dust.

[0054] More preferably, a main switch 71, a USB interface 72, and a serial port 73 are fixedly connected to the side of the motherboard 70 away from the lower housing 10, and the main switch 71, the USB interface 72, and the serial port 73 are electrically connected to the motherboard 70 respectively.

[0055] The master switch 71, a key component controlling the power supply of the entire communication device, is fixedly connected to the motherboard 70, ensuring direct and reliable power control. Users can easily turn the device on or off by operating the master switch 71, achieving rapid power response and energy-saving management. The motherboard 70 also has a fixedly connected USB interface 72 and a serial port 73, both electrically connected to the motherboard 70. As one of the most commonly used interfaces in modern electronic devices, the USB interface 72 provides high-speed, convenient data transmission and power supply. Fixedly connected to the motherboard 70, the USB interface 72 supports the connection of various external devices, such as storage devices, cameras, and keyboards, expanding the device's functionality and application range. The serial port 73, fixedly connected to the motherboard 70, supports low-speed, reliable serial communication, meeting the needs of specific applications.

[0056] More preferably, the main switch 71, the USB interface 72 and the serial port 73 are also fixedly connected to the front cover plate 60, and when viewed along the first direction F1, the main switch 71, the USB interface 72 and the serial port 73 are arranged sequentially on the surface of the front cover plate 60.

[0057] This design brings the interfaces and switches closer to the user's operating area, improving ease of use. Meanwhile, the front cover 60, as an external protective structure, provides additional protection for these interfaces and switches, preventing damage from accidental impacts or scratches. This arrangement makes the layout of the interfaces and switches more rational and orderly, improving not only aesthetics but also allowing users to quickly locate the required interface or switch at a glance. Furthermore, the sequential arrangement helps reduce the possibility of misoperation, improving the overall usability of the device.

[0058] More preferably, the motherboard 70 further includes a heat sink 74. The heat sink 74 is fixedly connected to the motherboard 70 and electrically connected to the motherboard 70. The heat sink 74 is provided with a third fan 74A to dissipate heat from the motherboard 70.

[0059] The heat sink 74, as a crucial component of the motherboard 70, primarily functions to dissipate heat. With the increase in the number of integrated components and the improvement in performance on the motherboard 70, the heat generated by the motherboard 70 also increases. The heat sink 74 effectively removes heat from the motherboard 70, preventing overheating and ensuring stable operation. The third fan 74A, as the core component of the heat sink 74, generates airflow through rotation, carrying away heat from the heat sink 74 and expelling it outside the device. This active cooling method has higher heat dissipation efficiency than natural cooling, reducing the temperature of the motherboard 70 more quickly and improving its heat dissipation performance. Simultaneously, the operation of the third fan 74A also enhances airflow within the device, contributing to a reduction in the overall device temperature.

[0060] More preferably, the motherboard 70 is also fixedly connected to a network port 75 and a VGA interface 76 on the side opposite to the lower housing 10, and the network port 75 and the VGA interface 76 are electrically connected to the motherboard 70 respectively.

[0061] Among them, Ethernet port 75 and VGA interface 76 are common external interfaces in electronic devices, used for network connection and video output, respectively. Fixing these two interfaces to the motherboard 70 and ensuring their electrical connection allows the link communication device to easily access the network environment and display devices. Ethernet port 75 (usually referring to the Ethernet interface) allows the link communication device to connect to a local area network (LAN) or wide area network (WAN) via a wired connection, enabling fast and stable data transmission. This is particularly important for applications requiring large amounts of data transmission or stable network connections. VGA interface 76 is an analog video transmission interface that can connect to display devices such as monitors or projectors for outputting video signals. Due to its wide compatibility and low cost, VGA interface 76 is practical in certain application scenarios.

[0062] More preferably, the network port 75 and the VGA interface 76 are also fixedly connected to the rear cover plate 80, and when viewed along the second direction F2 opposite to the first direction F1, the network port 75 and the VGA interface 76 are arranged sequentially on the surface of the rear cover plate 80.

[0063] The network port 75 and VGA interface 76 are not only fixedly connected to the motherboard 70, but also further fixedly connected to the rear cover 80. This design makes the network port 75 and VGA interface 76 more secure, reducing the risk of loosening or damage to the interfaces due to external factors (such as impacts, pulling, etc.). At the same time, the rear cover 80, as an external protective structure of the device, provides additional protection for these interfaces, enhancing the device's durability and reliability. This arrangement makes the interface layout more reasonable and orderly, improving aesthetics and allowing users to easily locate the required interface when connecting external devices. Furthermore, the sequential arrangement helps reduce the possibility of incorrect connections, improving the overall usability of the device.

[0064] More preferably, the device further includes a filter 90 and a power socket 100.

[0065] The filter 90 is fixedly connected to the lower housing 10 and electrically connected to the motherboard 70. Viewed along the second direction F2, the filter 90 is located on the side of the network port 75 opposite to the VGA interface 76. The power socket 100 is fixedly connected to the rear cover 80 and electrically connected to the motherboard 70. Viewed along the second direction F2, the power socket 100 is located on the side of the filter 90 opposite to the lower housing 10.

[0066] The filter 90 is used in electronic devices to filter out noise and interference in power supply or signals, ensuring stable operation of the electronic equipment. In this device, the filter 90 helps reduce noise on power lines and signal lines, improving the efficiency and stability of components on the motherboard 70. Simultaneously, fixing the filter 90 to the lower housing 10 not only enhances its stability but also helps maintain the neatness and orderliness of the device's interior. The power socket 100 is a key component for connecting the device to an external power source; its location and stability are crucial to the device's operation. In this device, fixing the power socket 100 to the rear cover 80 makes it more convenient for users to connect or disconnect the power cord, while also helping to protect the power cord from external damage. Furthermore, placing the power socket 100 on the side of the filter 90 away from the lower housing 10 avoids mutual interference between the power cord and other components such as the filter 90, ensuring stable power transmission.

[0067] More preferably, the second fan 41 is electrically connected to the motherboard 70, and the switching power supply 40 is also electrically connected to the motherboard 70.

[0068] The second fan 41, as a crucial component of the cooling system, generates airflow through rotation to help reduce the temperature of the motherboard 70 and other heat-generating components. Electrically connecting the second fan 41 to the motherboard 70 ensures that the fan automatically starts during device operation and intelligently adjusts its speed based on the motherboard 70's temperature monitoring and control system to achieve optimal cooling. This design not only improves cooling efficiency but also helps extend the lifespan of the motherboard 70 and other components. The switching power supply 40 is responsible for converting external power into stable DC power required by the device to ensure the normal operation of the motherboard 70 and other components. Electrically connecting the switching power supply 40 to the motherboard 70 ensures a stable power supply while allowing the motherboard 70 to intelligently control the power supply through its power management system, such as switching between standby, hibernation, and shutdown modes. This design not only improves power utilization efficiency but also helps reduce energy consumption and extend the device's lifespan. The second fan 41 and the electrical connection between the switching power supply 40 and the motherboard 70 together constitute a highly efficient and stable power supply and cooling system for the link communication device. This design not only improves the device's cooling and power utilization efficiency but also helps extend the lifespan of the motherboard 70 and other components, enhancing the device's reliability and durability.

[0069] In this way, the heat inside the device is discharged sequentially through the first fan 30, the second fan 41 and the heat dissipation hole 11A, so that the device can effectively dissipate heat. Furthermore, the design of the switching power supply 40 also having the second fan 41 effectively dissipates the heat inside the switching power supply 40, thus protecting the electronic components inside the device.

[0070] The embodiments described above are merely examples of several implementation methods of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these modifications and improvements all fall within the protection scope of this application.

Claims

1. A link communication device, characterized in that, The device includes: a lower housing, on which side plates are integrally formed on opposite sides; a fixing plate fixedly connected to the side plates; a first fan fixedly connected to the fixing plate and located on the side of the fixing plate opposite to the side plates; a switching power supply fixedly connected to the lower housing, on which a second fan is provided; wherein, heat dissipation holes are formed through the side plates, and heat inside the device is discharged sequentially through the first fan, the second fan and the heat dissipation holes.

2. The link communication device according to claim 1, characterized in that, The device further includes: an upper housing, which is fixedly spliced ​​with the lower housing; and a front cover plate, which is fixedly connected between the upper housing and the lower housing when viewed along a first direction parallel to the surface of the upper housing.

3. The link communication device according to claim 2, characterized in that, The device further includes: a motherboard, fixedly connected to the lower housing and located between the upper housing and the lower housing, and located on the side of the switching power supply away from the front cover; and a rear cover, viewed along a first direction parallel to the surface of the upper housing, fixedly connected between the upper housing and the lower housing, and located on the side of the motherboard away from the switching power supply.

4. The link communication device according to claim 3, characterized in that, The motherboard is fixedly connected to a main switch, a USB interface, and a serial port on the side opposite to the lower housing, and the main switch, the USB interface, and the serial port are electrically connected to the motherboard.

5. A link communication device according to claim 4, characterized in that, The main switch, the USB interface, and the serial port are also fixedly connected to the front cover plate, and when viewed along the first direction, the main switch, the USB interface, and the serial port are arranged sequentially on the surface of the front cover plate.

6. A link communication device according to claim 5, characterized in that, The motherboard further includes a heat sink, which is fixedly connected to the motherboard and electrically connected to it; wherein the heat sink is provided with a third fan to dissipate heat from the motherboard.

7. A link communication device according to claim 6, characterized in that, The motherboard is also fixedly connected to a network port and a VGA interface on the side opposite to the lower housing, and the network port and the VGA interface are electrically connected to the motherboard respectively.

8. A link communication device according to claim 7, characterized in that, The network port and the VGA interface are also fixedly connected to the rear cover plate, and when viewed from a second direction opposite to the first direction, the network port and the VGA interface are arranged sequentially on the surface of the rear cover plate.

9. A link communication device according to claim 8, characterized in that, The device further includes: a filter, fixedly connected to the lower housing and electrically connected to the motherboard, and viewed along the second direction, the filter is located on the side of the network port away from the VGA interface; and a power socket, fixedly connected to the rear cover and electrically connected to the motherboard, and viewed along the second direction, the power socket is located on the side of the filter away from the lower housing.

10. A link communication device according to claim 9, characterized in that, The second fan is electrically connected to the motherboard, and the switching power supply is also electrically connected to the motherboard.

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