Electric energy conversion device

Abstract

The utility model discloses an electric energy conversion device which comprises a case, a partition plate, an electronic device related to electric energy conversion and a liquid cooling plate, the case is divided into an electronic cavity and a cold plate cavity through the partition plate, the electronic device related to the electric energy conversion is installed in the electronic cavity, and the liquid cooling plate is installed in the cold plate cavity. As the partition plate and the liquid cooling plate are arranged in an attached manner or are of an integrated structure, and the partition plate is provided with the mounting notch penetrating to the liquid cooling plate, the heat dissipation end of at least part of the electronic device is matched with the mounting notch and is attached to the liquid cooling plate for heat exchange; therefore, at least part of electronic devices related to electric energy conversion in the electronic cavity can fully exchange heat with the liquid cooling plate, and the heat dissipation performance is ensured. Therefore, the problem that a large area of the cooling liquid enters the electronic cavity or is sprayed into the electronic cavity to cause the fault of an electrical device due to the failure of the liquid cooling plate is avoided, namely the safety and reliability of the liquid cooling heat dissipation system of the electric energy conversion device are greatly improved.

Description

Technical Field

[0001] This application relates to the field of electrical equipment technology, and more specifically, to an electrical energy conversion device. Background Technology

[0002] With the rapid development of renewable energy sources such as photovoltaics and wind power, power conversion devices play a crucial role, being essential for the efficient utilization and grid connection of new energy sources. Among these, optimizing the heat dissipation of power conversion devices has always been a focus of industry attention. Liquid cooling, as a currently highly efficient heat dissipation method, is widely used in power conversion devices (such as energy storage converters). However, current liquid cooling systems for power conversion devices generally suffer from poor safety and reliability. For example, if the liquid cooling system fails, coolant can easily leak into the electronic cavity, causing short circuits and other malfunctions in related electronic components inside the cavity.

[0003] In summary, how to solve the problem of poor safety and reliability of liquid cooling heat dissipation systems in power conversion devices has become a technical problem that urgently needs to be solved by those skilled in the art. Utility Model Content

[0004] In view of this, this application provides an energy conversion device to solve the problem of poor safety and reliability of the liquid cooling heat dissipation system of the energy conversion device.

[0005] To achieve the above objectives, this application provides the following technical solution:

[0006] An electrical energy conversion device, comprising:

[0007] Chassis;

[0008] A partition plate is disposed inside the chassis and divides the chassis into an electronic cavity and a cold plate cavity;

[0009] Electronic devices related to power conversion are housed within the electronic cavity;

[0010] A liquid cooling plate is disposed within the cavity of the cooling plate and includes a heat exchange mechanism for contacting and bonding with the electronic device.

[0011] The partition plate is attached to or integrated with the liquid cooling plate, and the partition plate is provided with a mounting slot that extends to the liquid cooling plate. At least some of the heat dissipation ends of the electronic devices are matched with the mounting slot and are attached to the liquid cooling plate for heat exchange.

[0012] In some embodiments of this application, the power conversion device further includes a heat dissipation cavity disposed within the chassis, the heat dissipation cavity having an air outlet window and an air return window communicating with the electronic cavity, and a heat dissipation fan for providing airflow circulation power is disposed within the heat dissipation cavity.

[0013] In some embodiments of this application, the cooling fan includes a first fan and / or a second fan;

[0014] The first fan is located at the air outlet window and is used to blow the airflow in the heat dissipation cavity into the electronic cavity; the second fan is located at the air return window and is used to draw the airflow in the electronic cavity into the heat dissipation cavity.

[0015] In some embodiments of this application, the heat dissipation cavity is in communication with the cold plate cavity, and at least a portion of the liquid cooling plate is located within the heat dissipation cavity.

[0016] In some embodiments of this application, a heat exchanger is further provided in the heat dissipation cavity, and the heat exchanger is located on the airflow path of the heat dissipation cavity.

[0017] In some embodiments of this application, the heat exchanger includes a first heat exchanger and / or a second heat exchanger;

[0018] The first heat exchanger is arranged at the air outlet window, and the second heat exchanger is arranged at the air return window.

[0019] In some embodiments of this application, the heat exchanger is connected to the liquid cooling plate via a pipeline;

[0020] Alternatively, the heat exchanger can be connected to the liquid cooling circulation pipeline where the liquid cooling plate is located via a pipeline.

[0021] In some embodiments of this application, at least one side wall of the heat dissipation cavity is formed by the side wall of the chassis.

[0022] In some embodiments of this application, the side wall of the side cavity wall constituting the heat dissipation cavity is provided with an installation opening and a sealing plate that can be detachably covered by the installation opening.

[0023] In some embodiments of this application, the electronic cavity is located above the cold plate cavity.

[0024] In some embodiments of this application, the bottom of the chassis is provided with at least one drain port communicating with the cold plate cavity.

[0025] In some embodiments of this application, the electronic device includes a reactor and a PCB board assembly. The heat dissipation end of the reactor is in contact with the liquid cooling plate for heat exchange. The PCB board assembly includes at least two PCBAs. Each PCBA is arranged in a flat layout, and at least some of the heat-generating devices on the PCBA are in contact with the liquid cooling plate for heat exchange.

[0026] In some embodiments of this application, the front panel of the chassis is provided with AC wiring ports, communication wiring ports and DC wiring ports arranged along a first direction, and the PCB board assembly includes a power conversion PCBA, a control PCBA, an AC output PCBA and an electrolytic capacitor PCBA;

[0027] The AC output PCBA and the reactor are arranged sequentially along the second direction, with the AC output PCBA positioned close to the AC connection port; the control PCBA and the power conversion PCBA are arranged sequentially along the second direction, with the control PCBA positioned close to the communication connection port, and the electrolytic capacitor PCBA positioned close to the DC connection port.

[0028] Compared to the background technology description, the aforementioned power conversion device, in practical applications, uses a partition plate to divide the chassis into an electronic cavity and a cold plate cavity. Power conversion-related electronic components are installed in the electronic cavity, while the liquid cooling plate is installed in the cold plate cavity. Because the partition plate and liquid cooling plate are fitted together or are an integral structure, and the partition plate has mounting slots extending to the liquid cooling plate, at least some of the heat dissipation ends of the electronic components match the mounting slots and are in contact with the liquid cooling plate for heat exchange. This ensures that at least some of the power conversion-related electronic components in the electronic cavity can fully exchange heat with the liquid cooling plate, guaranteeing heat dissipation performance. Simultaneously, the partition design between the liquid cooling plate and the electronic components effectively prevents the liquid cooling plate from failing, causing a large area of ​​coolant to enter or spray into the electronic cavity, leading to electrical component failure. This significantly improves the safety and reliability of the power conversion device's liquid cooling system. Attached Figure Description

[0029] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0030] Figure 1 A first-view isolating structural diagram of the chassis of the power conversion device provided in the embodiment of this application after the top cover is removed.

[0031] Figure 2A top view of the chassis of the power conversion device provided in this embodiment of the application after removing the top cover;

[0032] Figure 3 A schematic diagram showing the bottom design of a drain port for the chassis of the power conversion device provided in this application embodiment;

[0033] Figure 4 A second-view isolating structural diagram of the chassis of the power conversion device provided in the embodiment of this application after the top cover is removed.

[0034] Figure 5 for Figure 2 A schematic diagram of the AA cross-sectional structure.

[0035] in, Figures 1-5 middle:

[0036] 1-Box;

[0037] 2-DC connection port;

[0038] 3-Reactor;

[0039] 4-AC output PCBA;

[0040] 5-Power conversion PCBA;

[0041] 6-Control PCBA;

[0042] 7-Electrolytic capacitor PCBA;

[0043] 8-Partition plate;

[0044] 81-Mounting slot;

[0045] 9-Heat dissipation baffle;

[0046] 10 - Heat dissipation cavity;

[0047] 11-First wind turbine;

[0048] 12-Second fan;

[0049] 13-Heat exchanger;

[0050] 14- AC wiring port;

[0051] 15 - Communication connection port;

[0052] 16-Drainage port;

[0053] 17-Sealing plate;

[0054] 18-Electronic cavity;

[0055] 19-Cold plate cavity;

[0056] 20 - Air outlet window;

[0057] 21 - Return air window;

[0058] 22-Liquid cooling plate. Detailed Implementation

[0059] The core of this application is to provide an electrical energy conversion device to solve the problem of poor safety and reliability of the liquid cooling heat dissipation system of the electrical energy conversion device.

[0060] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0061] Reference Figure 1 and Figure 5 As shown in the figure, this application provides a power conversion device, which can be an inverter, a rectifier, or other power conversion equipment, without further specific limitations. The specific structure of the power conversion device includes a chassis 1, a partition plate 8, power conversion-related electronic components, and a liquid cooling system.

[0062] Specifically, the chassis 1 can be constructed from welded sheet metal. To facilitate the installation and arrangement of electronic components related to power conversion, the top wall of the chassis 1 is typically designed as a removable top wall. This removable top wall can be fixed with fasteners, or it can be a snap-fit, sliding push-pull locking structure, or a hinged single-door or double-door structure. The configuration can be selected according to actual needs during practical application. Similarly, to facilitate the installation and arrangement of components related to the liquid cooling system, the bottom wall of the chassis 1 can also be designed as a removable bottom wall structure, which can be fixed with fasteners, but is not limited to.

[0063] Reference Figure 5 The partition plate 8 is disposed inside the chassis 1 and divides the chassis 1 into an electronic cavity 18 and a cold plate cavity 19. Specifically, the partition plate 18 can be designed as an integral structure with the chassis wall of the chassis 1, such as being integrally stamped or welded into an integral structure, or it can be a separate fixed connection structure, such as being fixedly connected by fasteners, as long as it can divide the chassis 1 into two compartments.

[0064] Reference Figure 1 and Figure 2As shown, the electronic devices related to power conversion are housed in the electronic cavity 18. The electronic devices may include the reactor 3 and some circuit board assembly structures. These electronic devices may be fixed to the wall of the chassis 1 or to the partition plate 18. The fixing method may be, but is not limited to, fastener fixing.

[0065] Reference Figure 5 As shown, the liquid cooling plate 22 of the above-mentioned liquid cooling system is disposed in the cold plate cavity 19 for heat exchange with electronic devices. It should be noted that the heat exchange here can be direct contact heat exchange or indirect heat exchange. For example, heat transfer between the liquid cooling plate 22 and the heat dissipation end of the electronic device is achieved through thermal conductive grease, or indirect heat exchange is achieved through the partition plate 8. No specific limitation is made here. Furthermore, those skilled in the art should understand that, in addition to the liquid cooling plate 22, the liquid cooling system typically includes a liquid cooling circulation pipeline connected to the inlet and outlet of the liquid cooling plate 22. This liquid cooling circulation pipeline primarily supplies coolant to the liquid cooling plate 22 through a supply pipeline and recovers the coolant that has completed heat exchange through a return pipeline. The recovered coolant is then cooled to achieve circulating cooling. The specific structure of the liquid cooling circulation pipeline can employ compressor refrigeration or other cooling methods. For the related pipelines and components of the liquid cooling system other than the liquid cooling plate 22, some or all can be designed within the cold plate cavity 19, or they can be designed on the outside of the cold plate cavity 19, for example... Figure 5 In the structure shown, the liquid cooling plate 22 is mainly installed inside the cold plate cavity 19. Other components of the liquid cooling system are not shown. These other components are designed on the outside of the cold plate cavity 19. In actual application, the configuration can be selected according to actual needs, and no more specific limitations are made here.

[0066] Additionally, refer to Figure 1 , Figure 2 and Figure 5 As shown, the aforementioned partition plate 8 and liquid cooling plate 22 can be designed to be fitted together. This fitting arrangement can be direct or indirect, and the two can also be a separate fixed connection structure, such as welding, fastener, or other connection methods, or a separate sealed abutment structure. The two are fixed to the wall of the chassis 1, and a seal or sealing material is designed between them. In addition, the partition plate 8 and liquid cooling plate 22 can also be designed as an integral structure, such as integral stamping or machining. In actual application, the design can be selected according to actual needs. Furthermore, the partition plate 8 can be provided with a mounting slot that extends to the liquid cooling plate 22. The heat dissipation end of the electronic device is embedded in the mounting slot and fits against the liquid cooling plate 22 for heat exchange.

[0067] In practical applications, this power conversion device divides the chassis 1 into an electronic cavity 18 and a cold plate cavity 19 via a partition plate 8. Power conversion-related electronic components are installed in the electronic cavity 18, and the liquid-cooled plate 22 is installed in the cold plate cavity 19. Because the partition plate 8 and the liquid-cooled plate 22 are either fitted together or integrated, and the partition plate 8 has mounting slots 81 extending to the liquid-cooled plate 22, at least some of the electronic components' heat dissipation ends match the mounting slots 81 and are in contact with the liquid-cooled plate 22 for heat exchange. If, but not limited to, the heat dissipation end of the electronic device is embedded in the mounting slot 81, at least some of the power conversion-related electronic devices in the electronic cavity 18 can exchange heat fully with the liquid cooling plate 22, ensuring heat dissipation performance. At the same time, through the compartment design between the liquid cooling plate and the electronic device, the problem of large-scale entry of coolant into the electronic cavity 18 or spraying into the electronic cavity 18 due to the failure of the liquid cooling plate is effectively avoided, which would lead to electrical device failure. In other words, the safety and reliability of the liquid cooling heat dissipation system of the power conversion device are greatly improved.

[0068] In some specific implementation plans, refer to Figure 1 , Figure 2 and Figure 4 As shown, the aforementioned power conversion device may further include a heat dissipation cavity 10 disposed within the chassis 1. The heat dissipation cavity 10 has an air outlet window 20 and an air return window 21 communicating with the electronic cavity 18. A cooling fan for providing airflow circulation power is disposed within the heat dissipation cavity 10. Through this heat dissipation cavity 10, air-cooled circulation heat dissipation can be achieved for the electronic components within the electronic cavity 18, improving the heat dissipation effect of the electrical components.

[0069] In a further implementation plan, refer to Figure 2 As shown, the aforementioned cooling fan may specifically include a first fan 11 and / or a second fan 12; wherein, the first fan 11 is disposed at the air outlet 20 and is used to blow airflow from the cooling cavity 10 into the electronic cavity 18; the second fan 12 is disposed at the return air 21 and is used to draw airflow from the electronic cavity 18 into the cooling cavity 10. By designing the cooling fans to be arranged at the air outlet 20 and / or the return air 21, the airflow circulation dynamic performance of the cooling fans is improved. It should be noted that in actual applications, it is possible to choose to arrange only the first fan 11, only the second fan 12, or both the first fan 11 and the second fan 12 simultaneously, depending on the actual needs.

[0070] In some specific implementation plans, refer to Figure 5The aforementioned heat dissipation cavity 10 can be designed to communicate with the cold plate cavity 19, and at least part of the liquid cooling plate 22 is located within the heat dissipation cavity 10. For example, one end of the liquid cooling plate 22 extends into the heat dissipation cavity 10. Since the heat dissipation cavity 10 is connected to the cold plate cavity 19 and at least part of the liquid cooling plate 22 is located within the heat dissipation cavity 10, the relatively low airflow within the cold plate cavity 19 can be introduced into the electronic cavity 18, thereby helping to improve the air cooling effect. It is worth mentioning that although the electronic cavity 18 is indirectly connected to the cold plate cavity 19 through the heat dissipation cavity 10, since the connection is only indirectly established through the exhaust window 20 and the return window 21, even if the liquid cooling system fails, the coolant cannot enter the electronic cavity 18 in a large area through the exhaust window 20 and the return window 21.

[0071] In some other specific implementation schemes, refer to Figure 1 , Figure 2 ,and Figure 4 As shown, a heat exchanger 13 can also be provided in the heat dissipation cavity 10. The heat exchanger 13 is located on the airflow path of the heat dissipation cavity 10. The heat exchanger 13 can circulate heat exchange on the airflow in the heat dissipation cavity 10 by connecting to the heat exchange medium circulation loop, thereby further improving the heat dissipation effect.

[0072] Specifically, refer to Figure 2 As shown, the heat exchanger 13 may specifically include a first heat exchanger 13a and / or a second heat exchanger 13b; wherein, the first heat exchanger 13a is arranged in the air outlet window 20, and the second heat exchanger 13b is arranged in the air return window 21. In actual applications, only one of the first heat exchanger 13a and the second heat exchanger 13b may be arranged, or they may be arranged simultaneously. The configuration can be selected according to the actual heat dissipation requirements, and no further specific limitations are made here.

[0073] In a further embodiment, the heat exchanger 13 can be connected to the liquid cooling system where the liquid cooling plate 22 is located via a pipeline. Thus, the heat exchanger 13 can continuously acquire cooling energy from the liquid cooling system where the liquid cooling plate 22 is located, thereby allowing the airflow circulating through the heat dissipation cavity 10 to be continuously cooled by the heat exchanger 13. The circulating airflow not only creates turbulence in the airflow within the electronic cavity 18, but also exchanges heat within the heat dissipation cavity 10 through the heat exchanger 13, thereby reducing the internal ambient temperature of the electronic devices related to power conversion within the electronic cavity 18, ultimately improving the heat dissipation effect on the electronic devices within the electronic cavity 18.

[0074] Specifically, refer to Figure 5As shown, heat exchanger 13 can be connected to liquid cooling plate 22 via pipes. In this case, heat exchanger 13 and liquid cooling plate 22 are arranged in series on the circulation pipeline of the liquid cooling system. Specifically, the end side of liquid cooling plate 22 can be arranged close to heat dissipation cavity 10, and heat exchanger 13 can be connected to the end side of liquid cooling plate 22 via pipes. The advantage of this arrangement is that it is more convenient to arrange and saves on the layout of liquid cooling pipelines. Of course, heat exchanger 13 can also be connected to the liquid cooling circulation pipeline where liquid cooling plate 22 is located. In this case, liquid cooling plate 22 and heat exchanger 13 can be designed to be arranged in series or in parallel on the liquid cooling circulation pipeline. For example, heat exchanger 13 can be independently connected to the supply pipe and return pipe of liquid cooling circulation pipeline via pipes. In this case, liquid cooling plate 22 and heat exchanger 13 are arranged in parallel on the liquid cooling circulation pipeline. The advantage of this arrangement is that the cooling capacity of heat exchanger 13 comes directly from the cooling source of liquid cooling circulation pipeline, and the temperature of the coolant will be lower and not limited by liquid cooling plate 22. It is understandable that the above-mentioned method of heat exchanger 13 and liquid cooling plate 22 sharing a liquid cooling system is merely an example of the embodiments of this application. In actual application, heat exchanger 13 can also be designed to be equipped with an additional cooling system, without further specific limitations.

[0075] In some other specific implementation schemes, refer to Figure 1 , Figure 2 and Figure 4 As shown, the aforementioned heat dissipation cavity 10 can be specifically designed such that at least one side wall is formed by the side wall of the chassis 1. This structural design saves material required for arranging the heat dissipation cavity 10. Furthermore, because the heat dissipation cavity 10 is positioned close to the side wall of the chassis 1, it minimizes its impact on the arrangement space of the electronic cavity 10, making it easier to arrange electronic components within the electronic cavity 10. For example, refer to... Figure 2 The heat dissipation cavity 10 is located in the right rear corner of the chassis 1. At that time, the two side walls of the heat dissipation cavity 10 are formed by the side walls of the chassis 1. The other two side walls can be designed with heat dissipation baffles 9 to form a baffle structure with the electronic cavity 18. The heat dissipation baffles 9 can be L-shaped plate structure. The aforementioned air inlet window 20 and return air window 22 can be designed on two different plates of L-shaped plate.

[0076] It is understood that the above-described design of the heat dissipation cavity 10, in which at least one side wall is formed by the side wall of the chassis 1, is merely an example of the embodiments of this application. In actual application, the heat dissipation cavity 10 can also be designed with a side wall independent of the side wall of the chassis 1, such as the heat dissipation cavity 10 being arranged in the middle of the chassis 1. In actual application, the arrangement can be selected according to actual needs, and no more specific limitations are made here.

[0077] In a further embodiment, when the heat dissipation cavity 10 is designed such that at least one side wall is formed by the side wall of the chassis 1, the side wall constituting the heat dissipation cavity 10 can be provided with an installation opening and a sealing plate 17 that can be detachably covered by the installation opening. By designing the sealing plate 17, it is easier to maintain the heat dissipation modules (such as the aforementioned heat exchanger 13 and cooling fan) inside the heat dissipation cavity 10. In addition, the sealing plate can be made of metal or transparent material, such as glass. Designing it as transparent makes it easier to observe the operating status inside the heat dissipation cavity 10, thereby facilitating timely maintenance in case of failure.

[0078] In some other specific implementation schemes, refer to Figure 5 As shown, the electronic cavity 18 can be designed to be located above the cold plate cavity 19. This design can more effectively prevent the coolant in the cold plate cavity 19 from entering the electronic cavity 18, further improving safety.

[0079] In a further embodiment, the bottom of the aforementioned chassis 1 may also be provided with at least one drain port 16 communicating with the cold plate cavity 19, so that when the liquid cooling system in the cold plate cavity 19 malfunctions and leaks, the coolant can be drained in time, effectively preventing coolant from accumulating in the cold plate cavity 19. Furthermore, a drain valve may also be provided at the aforementioned drain port 16, allowing for selective opening and closing of the drain port 16 as needed.

[0080] In some specific implementation plans, refer to Figure 1 , Figure 2 and Figure 4 The aforementioned electronic components may specifically include a reactor 3 and a PCB assembly. The heat dissipation end of the reactor 3 is in contact with the liquid cooling plate 22 for heat exchange. The PCB assembly includes at least two PCBAs, each arranged in a flat layout, and at least some of the heat-generating components on the PCBAs are in contact with the liquid cooling plate 22 for heat exchange. This arrangement can minimize the thickness of the energy conversion device, which saves space in the energy storage system for arranging battery cells, increasing the overall capacity of the energy storage system, or reducing the footprint.

[0081] In a further implementation plan, refer to Figure 1 , Figure 2 and Figure 4The front panel of the aforementioned chassis 1 can specifically be provided with an AC connection port 14, a communication connection port 15, and a DC connection port 2 arranged along a first direction. The PCB assembly can specifically include a power conversion PCBA 5, a control PCBA 6, an AC output PCBA 4, and an electrolytic capacitor PCBA (i.e., a PCBA with electrolytic capacitors installed) 7. Among them, the AC output PCBA 4 and the reactor 3 are arranged sequentially along a second direction, with the AC output PCBA 4 located close to the AC connection port 14; the control PCBA 6 and the power conversion PCBA 5 are arranged sequentially along the second direction, with the control PCBA 6 located close to the communication connection port 15; and the electrolytic capacitor PCBA 7 is located close to the DC connection port 2. By designing the above-mentioned structural form, the arrangement within the electronic cavity 18 of the chassis 1 is more compact, reducing space waste, and its thickness can even be kept within 185mm.

[0082] It should also be noted that the various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0083] As indicated in this application and claims, unless the context clearly indicates otherwise, the words "a," "an," "a," and / or "the" are not specifically singular and may include the plural. Generally, the terms "comprising" and "including" only indicate the inclusion of expressly identified steps and elements, which do not constitute an exclusive list, and the method or apparatus may also include other steps or elements. An element defined by the phrase "comprising an..." does not exclude the presence of other identical elements in the process, method, product, or apparatus that includes the element.

[0084] In the description of the embodiments of this application, unless otherwise stated, " / " means "or", for example, A / B can mean A or B; "and / or" in this document is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Furthermore, in the description of the embodiments of this application, "multiple" refers to two or more.

[0085] This document uses specific examples to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are only for the purpose of helping to understand the core ideas of this application. It should be noted that those skilled in the art can make several improvements and modifications to this application without departing from the principles of this application, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. An electrical energy conversion device, characterized in that, include: Chassis (1); A partition plate (8) is disposed inside the chassis (1) and divides the chassis (1) into an electronic cavity (18) and a cold plate cavity (19). Electronic devices related to power conversion are disposed within the electronic cavity (18); A liquid cooling plate (22) is disposed in the cold plate cavity (19) and is used to contact and exchange heat with the electronic device; The partition plate (8) is attached to the liquid cooling plate (22) or is an integral structure, and the partition plate (8) is provided with an installation slot (81) that extends to the liquid cooling plate (22). At least some of the heat dissipation ends of the electronic devices are matched with the installation slot (81) and are attached to the liquid cooling plate (22) for heat exchange.

2. The power conversion device as described in claim 1, characterized in that, It also includes a heat dissipation cavity (10) disposed in the chassis (1), the heat dissipation cavity (10) having an air outlet window (20) and an air return window (21) communicating with the electronic cavity (18), and a heat dissipation fan for providing airflow circulation power is disposed in the heat dissipation cavity (10).

3. The power conversion device as described in claim 2, characterized in that, The cooling fan includes a first fan (11) and / or a second fan (12). The first fan (11) is located at the air outlet window (20) and is used to blow the airflow in the heat dissipation cavity (10) into the electronic cavity (18); the second fan (12) is located at the return air window (21) and is used to draw the airflow in the electronic cavity (18) into the heat dissipation cavity (10).

4. The power conversion device as described in claim 2, characterized in that, The heat dissipation cavity (10) is connected to the cold plate cavity (19), and at least part of the liquid cooling plate (22) is located inside the heat dissipation cavity (10).

5. The electrical energy conversion device of claim 2, wherein, A heat exchanger (13) is also provided inside the heat dissipation cavity (10), and the heat exchanger (13) is located on the airflow path of the heat dissipation cavity (10).

6. The power conversion device as described in claim 5, characterized in that, The heat exchanger (13) includes a first heat exchanger (13a) and / or a second heat exchanger (13b). The first heat exchanger (13a) is arranged at the air outlet window (20), and the second heat exchanger (13b) is arranged at the air return window (21).

7. The electrical energy conversion device of claim 5, wherein, The heat exchanger (13) is connected to the liquid cooling plate (22) via a pipeline. Alternatively, the heat exchanger (13) is connected to the liquid cooling circulation pipeline where the liquid cooling plate (22) is located via a pipeline.

8. The power conversion device as described in claim 2, characterized in that, At least one side wall of the heat dissipation cavity (10) is formed by the side wall of the chassis (1).

9. The power conversion device as described in claim 8, characterized in that, The side wall of the side cavity that constitutes the heat dissipation cavity (10) is provided with an installation opening and a sealing plate (17) that is detachably covered by the installation opening.

10. The power conversion device as described in claim 1, characterized in that, The electronic cavity (18) is located above the cold plate cavity (19).

11. The power conversion device as described in claim 10, characterized in that, The bottom of the chassis (1) is provided with at least one drain port (16) that communicates with the cold plate cavity (19).

12. The power conversion device as described in claim 1, characterized in that, The electronic device includes a reactor (3) and a PCB board assembly. The heat dissipation end of the reactor (3) is in contact with the liquid cooling plate (22) for heat exchange. The PCB board assembly includes at least two PCBAs. Each PCBA is laid out in a flat manner, and at least some of the heat-generating devices on the PCBA are in contact with the liquid cooling plate (22) for heat exchange.

13. The power conversion device as described in claim 12, characterized in that, The front panel of the chassis (1) is provided with an AC wiring port (14), a communication wiring port (15) and a DC wiring port (2) arranged along the first direction. The PCB board assembly includes a power conversion PCBA (5), a control PCBA (6), an AC output PCBA (4) and an electrolytic capacitor PCBA (7). The AC output PCBA (4) and the reactor (3) are arranged sequentially along the second direction, and the AC output PCBA (4) is arranged close to the AC connection port (14); the control PCBA (6) and the power conversion PCBA (5) are arranged sequentially along the second direction, and the control PCBA (6) is arranged close to the communication connection port (15); the electrolytic capacitor PCBA (7) is arranged close to the DC connection port (2).

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