Metal cooling fin structure with rapid heat conduction function

Abstract

The utility model relates to the technical field of radiating fins, in particular to a metal radiating fin structure with a quick heat conduction function, which comprises a radiating substrate and radiating fins. Vent holes are formed in the heat dissipation base plate at equal intervals, a combined groove is formed in the top face of the heat dissipation base plate, a positioning protruding block is installed in the combined groove, heat dissipation fins are arranged on the top face of the heat dissipation base plate, and a combined square frame is installed on the outer sides of the heat dissipation fins in a sleeving mode. The bottom of the combined square frame is located in the combined groove, and a positioning hole groove is formed in a frame of the combined square frame and connected with the positioning protruding block. According to the combined groove and the positioning protruding block arranged on the heat dissipation substrate, the combined square frame and the heat dissipation substrate can be combined and installed conveniently, the stability after combination is improved due to the fact that the positioning protruding block is in butt joint with the positioning hole groove, the overall combination operation steps are simple and rapid, and a fastening assembly does not need to be used.

Description

A metal heat sink structure with rapid heat conduction function Technical Field

[0001] This utility model relates to the field of heat sink technology, and in particular to a metal heat sink structure with rapid heat conduction function. Background Technology

[0002] Metal heat sink structures achieve efficient thermal management by optimizing metal materials, geometric design, and heat dissipation mechanisms. Their core structure typically includes a substrate and heat sink fins, combined with a thermally conductive medium and an active cooling fan, to balance thermal conductivity within a limited space. They are widely used in electronic devices.

[0003] Existing metal heat sink structures used in electronic devices mainly consist of a substrate and heat sink fins. The overall heat dissipation efficiency is not high due to the arrangement of heat sink fins. In addition, when assisted by a fan, the airflow of the metal heat sink structure cannot pass through the substrate.

[0004] Therefore, in response to the problem that airflow in the existing metal heat sink structure cannot pass through the substrate when assisted by a fan, this utility model can improve the overall structural stability of the heat sink by setting vent holes on the heat sink substrate, and by installing a heat-conducting frame and heat-conducting bracket between the heat sink fins, and increase the heat dissipation area. At the same time, when the heat sink fan is working in conjunction with the heat sink, the space between the heat sink fins can be connected through the vent holes to achieve the function of rapid heat conduction and heat dissipation. Summary of the Invention

[0005] To overcome the problem that airflow through the substrate is not possible with common metal heat sink structures when assisted by a fan.

[0006] The technical solution of this utility model is as follows: a metal heat sink structure with rapid heat conduction function, including a heat sink substrate and heat sink fins; the heat sink substrate has ventilation holes at equal intervals, and the top surface of the heat sink substrate has a combined groove, the interior of the combined groove is equipped with a positioning protrusion, the top surface of the heat sink substrate is provided with heat sink fins, the outer side of the heat sink fins is sleeved with a combined square frame, and the bottom of the combined square frame is located inside the combined groove, the frame of the combined square frame has a positioning hole groove, and the positioning hole groove is connected to the positioning protrusion.

[0007] Preferably, the positioning bump and the heat dissipation substrate are integrated into one structure, and the height of the positioning bump is equal to the height of the combined groove, and the positioning bump is symmetrically distributed at equal intervals within the combined groove.

[0008] Preferably, the positioning protrusion and the positioning hole are connected by a snap-fit ​​positioning method, and the top of the positioning protrusion is chamfered, and the height of the positioning protrusion is less than the height of the positioning hole.

[0009] Preferably, the height of the combined square frame is greater than the height of the combined groove, and the combined square frame and the combined groove are connected by a snap-fit ​​positioning method, and the inner wall of the combined square frame is connected to the outer surface of the heat dissipation fin frame by a sliding fit method.

[0010] Preferably, the top surface of the combined square frame is provided with a heat-conducting frame, and the bottom surface of the heat-conducting frame is provided with a heat-conducting bracket. The heat-conducting frame and the heat-conducting bracket are located between the heat dissipation fins, and ventilation slots are provided on the heat-conducting frame and the heat-conducting bracket.

[0011] Preferably, the heat-conducting frame, the heat-conducting bracket, and the combined square frame are integrated into a single structure, and the connection between the frame surface of the heat-conducting frame and the heat-conducting bracket and the surface of the heat dissipation fins is a sliding fit.

[0012] The beneficial effects of this utility model are:

[0013] The combination grooves and positioning protrusions on the heat dissipation substrate facilitate the assembly and installation of the combination square frame and the heat dissipation substrate. The docking of the positioning protrusions with the positioning holes and slots improves the stability after assembly. The overall assembly operation is simple and quick, without the need for fastening components.

[0014] The distribution of heat dissipation fins can be supported by a combination of square frames, thermally conductive frames, and thermally conductive supports, thereby maintaining the structural strength of the overall distribution of heat dissipation fins. At the same time, the close fit between the thermally conductive frames and thermally conductive supports and the heat dissipation fins increases the overall area for heat conduction and heat dissipation, which is conducive to rapid heat conduction.

[0015] Ventilation holes are distributed on the heat dissipation substrate, and the ventilation holes are located between the heat dissipation fins, so that the space between the heat dissipation fins and the ventilation holes are interconnected. At the same time, ventilation slots are provided on the heat conduction frame and heat conduction bracket, which facilitates the use of the whole system with the cooling fan, thereby facilitating the flow of air and enabling the heat on the heat dissipation fins, heat conduction frame and heat conduction bracket to be quickly discharged. Attached Figure Description

[0016] Figure 1 shows a schematic diagram of the combined three-dimensional structure of this utility model;

[0017] Figure 2 shows a three-dimensional structural diagram of the heat dissipation substrate and heat dissipation fins of this utility model.

[0018] Figure 3 shows an enlarged structural schematic diagram of point A in Figure 2 of this utility model;

[0019] Figure 4 shows a three-dimensional structural diagram of the heat dissipation substrate of this utility model from an upward perspective.

[0020] Figure 5 shows a three-dimensional structural diagram of the combined square frame and heat-conducting frame of this utility model.

[0021] Figure 6 shows a three-dimensional structural diagram of the heat-conducting frame of this utility model.

[0022] Explanation of reference numerals in the attached drawings: 1. Heat dissipation base plate; 2. Ventilation hole; 3. Combined groove; 4. Positioning protrusion; 5. Heat dissipation fins; 6. Combined square frame; 7. Positioning hole groove; 8. Heat-conducting frame; 9. Heat-conducting bracket; 10. Ventilation square groove. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] Please refer to Figures 1-6. This utility model provides a technical solution: a metal heat sink structure with rapid heat conduction function, including a heat sink substrate 1 and heat sink fins 5; the heat sink substrate 1 has vent holes 2 at equal intervals, and the top surface of the heat sink substrate 1 has a combined groove 3, the interior of the combined groove 3 is equipped with a positioning protrusion 4, the top surface of the heat sink substrate 1 is provided with heat sink fins 5, the outer side of the heat sink fins 5 is sleeved with a combined square frame 6, and the bottom of the combined square frame 6 is located inside the combined groove 3. The frame of the combined square frame 6 has a positioning hole groove 7, and the positioning hole groove 7 is connected to the positioning protrusion 4.

[0025] The positioning bump 4 and the heat dissipation substrate 1 are integrated into one structure, and the height of the positioning bump 4 is equal to the height of the combined groove 3. The positioning bump 4 is symmetrically distributed at equal intervals within the combined groove 3. Based on the height of the positioning bump 4, the positioning bump 4 is prevented from protruding from the combined groove 3. At the same time, the distribution of the positioning bump 4 improves the stability of subsequent assembly.

[0026] The positioning protrusion 4 is connected to the positioning hole groove 7 by a snap-fit ​​positioning method. The top of the positioning protrusion 4 is chamfered, and the height of the positioning protrusion 4 is less than the height of the positioning hole groove 7. By docking with the positioning hole groove 7, the positioning protrusion 4 can improve the stability of the combined square frame 6 after installation. At the same time, the top structure of the positioning protrusion 4 improves the installation efficiency and facilitates alignment. The height of the positioning protrusion 4 effectively avoids unevenness caused by passing through the positioning hole groove 7.

[0027] The height of the combined square frame 6 is greater than the height of the combined groove 3, and the combined square frame 6 and the combined groove 3 are connected by a snap-fit ​​positioning method. The inner wall of the combined square frame 6 is connected to the outer surface of the frame of the heat dissipation fin 5 by a sliding fit method. The combined square frame 6 can be combined with the combined groove 3 for installation. At the same time, the height of the combined square frame 6 makes it easy to protrude from the top surface of the heat dissipation base plate 1, thereby supporting the bottom area of ​​the heat dissipation fin 5.

[0028] The top surface of the combined square frame 6 is provided with a heat-conducting frame 8, and the bottom surface of the heat-conducting frame 8 is provided with a heat-conducting support 9. The heat-conducting frame 8 and the heat-conducting support 9 are located between the heat dissipation fins 5, and ventilation slots 10 are provided on the heat-conducting frame 8 and the heat-conducting support 9. The heat-conducting frame 8, the heat-conducting support 9 and the combined square frame 6 are integrated into one structure. The edge surface of the heat-conducting frame 8 and the heat-conducting support 9 is connected to the surface of the heat dissipation fins 5 by sliding fit. The combined square frame 6 drives the heat-conducting frame 8 and the heat-conducting support 9 to slide into the heat dissipation fins 5 for fit assembly, thereby increasing the overall heat conduction area. The heat-conducting frame 8 and the heat-conducting support 9 also improve the structural strength of the overall distribution of the heat dissipation fins 5.

[0029] Working principle: According to Figures 1-3 and 5-6, the combined square frame 6 can first drive the heat-conducting frame 8 and heat-conducting bracket 9 to assemble. The combined square frame 6 slides down to fit the outside of the heat dissipation fins 5. At the same time, the combined square frame 6 drives the heat-conducting frame 8 and heat-conducting bracket 9 to slide into the space between the heat dissipation fins 5 for fitting. When the combined square frame 6 slides into the combined groove 3 for assembly, the positioning hole groove 7 on the combined square frame 6 slides into and engages with the positioning protrusion 4 to improve the stability after assembly. At the same time, the bottom surface of the heat-conducting bracket 9 fits against the top surface of the heat dissipation substrate 1 to maintain the stability and support after assembly.

[0030] According to Figures 1 and 5-6, during subsequent use, the entire unit can be placed in the area of ​​the electronic device that requires heat conduction and heat dissipation. The heat conduction medium and heat dissipation substrate 1 are attached to the area to facilitate heat conduction. Subsequently, the heat energy is transferred to the heat dissipation fins 5, heat conduction frame 8 and heat conduction bracket 9 through the heat conduction medium and heat dissipation substrate 1. The overall heat conduction area is increased, the heat conduction efficiency is improved, and heat conduction can be carried out quickly.

[0031] According to Figures 1 and 4-6, it can be used in combination with a cooling fan as needed. The airflow can pass through the space between the vent 2 and the heat dissipation fins 5, as well as the venting grooves 10 on the heat-conducting frame 8 and the heat-conducting bracket 9, thereby increasing the overall airflow effect. This facilitates the airflow of the air medium and can quickly remove the heat energy from the heat dissipation base plate 1, heat dissipation fins 5, heat-conducting frame 8 and heat-conducting bracket 9, achieving rapid heat dissipation.

[0032] The above is the entire working process of the device, and all contents not described in detail in this specification are existing technologies known to those skilled in the art.

[0033] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A metal heat sink structure with rapid heat conduction function, comprising a heat sink substrate (1) and heat sink fins (5); characterized in that: Ventilation holes (2) are provided at equal intervals on the heat dissipation substrate (1), and a combined groove (3) is provided on the top surface of the heat dissipation substrate (1). A positioning protrusion (4) is installed inside the combined groove (3). Heat dissipation fins (5) are provided on the top surface of the heat dissipation substrate (1). A combined square frame (6) is sleeved on the outside of the heat dissipation fins (5), and the bottom of the combined square frame (6) is located inside the combined groove (3). A positioning hole groove (7) is provided on the frame of the combined square frame (6), and the positioning hole groove (7) is connected to the positioning protrusion (4).

2. The metal fin structure with fast heat conduction function according to claim 1, characterized in that: The positioning bump (4) and the heat dissipation substrate (1) are integrated into one structure, and the height of the positioning bump (4) is equal to the height of the combined groove (3), and the positioning bump (4) is symmetrically distributed at equal intervals in the combined groove (3).

3. The metal fin structure with fast heat conduction function according to claim 1, characterized in that: The positioning protrusion (4) and the positioning hole (7) are connected by a snap-fit ​​positioning method, and the top of the positioning protrusion (4) is chamfered, and the height of the positioning protrusion (4) is less than the height of the positioning hole (7).

4. The metal fin structure with fast heat conduction function according to claim 1, characterized in that: The height of the combined square frame (6) is greater than the height of the combined groove (3), and the combined square frame (6) and the combined groove (3) are connected by snap-fit ​​positioning, and the inner wall of the combined square frame (6) is connected to the outer surface of the heat dissipation fins (5) by sliding contact.

5. A metal heat sink structure with rapid heat conduction function according to claim 1, characterized in that: The top surface of the combined square frame (6) is provided with a heat-conducting frame (8), and the bottom surface of the heat-conducting frame (8) is provided with a heat-conducting bracket (9). The heat-conducting frame (8) and the heat-conducting bracket (9) are located between the heat dissipation fins (5), and ventilation slots (10) are provided on the heat-conducting frame (8) and the heat-conducting bracket (9).

6. A metal heat sink structure with rapid heat conduction function according to claim 5, characterized in that: The heat-conducting frame (8), the heat-conducting bracket (9), and the combined square frame (6) are integrated into a single structure, and the frame surface of the heat-conducting frame (8) and the heat-conducting bracket (9) are connected to the surface of the heat dissipation fins (5) by sliding contact.

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