Double-faced adhesive tape attaching and pressure maintaining transfer chamber for PCB machining

Abstract

The utility model discloses a double faced adhesive tape bonding pressure-maintaining transfer chamber for PCB processing, which comprises a support frame, a fixed plate and a protective cover, a vacuum chamber is arranged in the protective cover, a driven plate with adjustable height is horizontally arranged in the vacuum chamber, a pressure-maintaining cylinder is fixedly arranged in the middle of the bottom end of the driven plate, and the pressure-maintaining cylinder is fixedly arranged in the middle of the bottom end of the driven plate. The output end of the pressure maintaining air cylinder is connected with a connecting plate, a vacuum suction plate with the adjustable height is horizontally arranged below the connecting plate, and when the vacuum suction plate operates, the bottom face of the vacuum suction plate makes contact with the PCB, and suction is completed through negative pressure. The height of the connecting plate is adjusted to change synchronously in the operation process of the pressure maintaining air cylinder, and then the height of the heating plate and the height of the vacuum suction plate are driven to change synchronously, so that the vacuum suction plate applies certain pressure to the PCB on the bottom face of the vacuum suction plate, the double-sided adhesive tape and the PCB are further kept to be tightly attached, and the vacuum suction plate is heated through the heating plate; therefore, the double-sided adhesive tape can be more firmly adhered to the PCB.

Description

A double-sided adhesive bonding and pressure-holding transfer chamber for PCB board processing Technical Field

[0001] This utility model relates to the field of double-sided adhesive bonding processing technology for PCB boards, specifically to a double-sided adhesive bonding and pressure-holding transfer chamber for PCB board processing. Background Technology

[0002] Double-sided tape is widely used in the production and processing of PCBs (printed circuit boards) to fix components, including batteries and sensor modules, onto the PCB, thus avoiding the use of screws or clips. When double-sided tape is used to fix metal shielding covers on the PCB, it can effectively prevent electromagnetic interference from affecting the circuit. Using double-sided tape between the PCB and the metal casing can effectively provide insulation and shock protection, thereby effectively preventing friction or short circuits with the casing.

[0003] In current PCB manufacturing processes, when double-sided tape is applied to the surface of a PCB board using a bonding device, it is best to apply vacuum pressure to the PCB board with the double-sided tape for a short period of time to improve the adhesion of the double-sided tape. This removes the air between the PCB board and the double-sided tape, thereby achieving stable adhesion of the double-sided tape to the PCB board surface. The usual method is to transfer a batch of PCB boards to the vacuum pressure equipment for processing after the double-sided tape has been applied. However, this method is time-consuming and affects processing efficiency. In view of the problems exposed in the current PCB manufacturing process, it is necessary to improve and optimize the structure of the double-sided tape bonding and pressure equipment for PCB manufacturing. Summary of the Invention

[0004] To solve the above-mentioned technical problems, this utility model provides a double-sided adhesive bonding and pressure-holding transfer chamber for PCB board processing, which has the characteristics of being easy to directly set up on the production line and directly vacuum-holding PCBs with double-sided adhesive.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a double-sided adhesive bonding and pressure-holding transfer chamber for PCB board processing, comprising a support frame, a fixed plate horizontally fixed on the support frame, a protective cover fixedly fixed at the bottom outer edge of the fixed plate, a height-adjustable vacuum chamber located inside the protective cover, a height-adjustable driven plate horizontally arranged inside the vacuum chamber, a pressure-holding cylinder fixedly arranged at the bottom center of the driven plate, a connecting plate connected to the output end of the pressure-holding cylinder, a height-adjustable vacuum suction plate horizontally arranged below the connecting plate, the vacuum suction plate being connected to an external negative pressure vacuum device through a gas delivery pipe, and a plurality of vacuum negative pressure suction holes evenly arranged on the bottom surface of the vacuum suction plate. When the vacuum suction plate is running, its bottom surface contacts the PCB board and completes adsorption through negative pressure.

[0006] As a preferred technical solution of the double-sided adhesive bonding and pressure-holding transfer chamber for PCB board processing according to this utility model, the inner surface of the protective cover is provided with a number of linear guide rails arranged vertically, and the outer wall of the vacuum chamber is fitted onto the linear guide rails and moves along the guide rails.

[0007] As a preferred technical solution of the double-sided adhesive bonding and pressure-holding transfer chamber for PCB board processing according to this utility model, the top of the driven plate is provided with several guide sleeves, the top of the guide sleeves penetrates the upper surface of the fixed plate, and a lifting cylinder is also provided in the middle of the upper surface of the fixed plate. The telescopic end of the lifting cylinder penetrates the fixed plate and is connected to the driven plate. During the operation of the lifting cylinder, the height of the driven plate is adjusted by pushing the telescopic end.

[0008] As a preferred technical solution for a double-sided adhesive bonding and pressure-holding transfer chamber for PCB board processing according to this utility model, a plurality of linear bearings are fixedly arranged downward on the outer side of the pressure-holding cylinder at the outer edge of the bottom surface of the driven plate, and the bottom end of the linear bearings is connected to the upper surface of the connecting plate.

[0009] As a preferred technical solution of the double-sided adhesive bonding and pressure-holding transfer chamber for PCB board processing according to this utility model, a heating plate is also provided between the connecting plate and the vacuum suction plate. The heating plate is a component formed by bonding two layers of plate-shaped components, and heating resistance wires are laid inside the heating plate.

[0010] As a preferred technical solution for a double-sided adhesive bonding and pressure-holding transfer chamber for PCB board processing according to this utility model, the bottom surface of the connecting plate is uniformly provided with a number of movable positioning tongues. The positioning tongue is an L-shaped sheet-like component with the bottom end bent downwards. The bent part of the bottom end of the positioning tongue is attached to the side wall of the heating plate, and the positioning tongue drives the heating plate to move synchronously when it moves.

[0011] As a preferred technical solution for a double-sided adhesive bonding and pressure-holding transfer chamber for PCB board processing according to this utility model, the bottom surface of the connecting plate is provided with several guide rails, one end of the positioning tongue is fitted onto the guide rail, and a telescopic cylinder is provided on one side of each guide rail on the bottom surface of the connecting plate. The output end of the telescopic cylinder is connected to the positioning tongue and pushes the positioning tongue to slide along the guide rail.

[0012] Compared with the prior art, the beneficial effects of this utility model are:

[0013] 1. This technical solution includes a vacuum chamber for sealing the PCB. The vacuum chamber can be adjusted in height under the guidance of a linear guide rail and simultaneously seals the outer area of ​​the PCB. The vacuum chamber can maintain a vacuum environment inside through external vacuum negative pressure equipment, which facilitates the elimination of air between the double-sided adhesive and the PCB board and improves the stability of the double-sided adhesive on the PCB board.

[0014] 2. During the operation of the pressure-holding cylinder, the height of the connecting plate changes synchronously, which in turn drives the height of the heating plate and the vacuum suction plate to change synchronously. This allows the vacuum suction plate to apply a certain pressure to the PCB board on its bottom surface, further ensuring that the double-sided adhesive is tightly adhered to the PCB board. The heating plate heats the vacuum suction plate, making the double-sided adhesive adhere more firmly to the PCB board.

[0015] 3. This technical solution also includes several positioning tongues. During operation, the positioning tongues are adjusted by telescopic cylinders. The bending part of the positioning tongues pushes the heating plate to move, thereby simultaneously adjusting the horizontal position of the vacuum suction plate, making it easier for the vacuum suction plate to position the PCB board. Attached Figure Description

[0016] To make the content of this utility model easier to understand, the present utility model will be further described in detail below with reference to specific embodiments and accompanying drawings.

[0017] Figure 1 is a schematic diagram of the structure of this utility model;

[0018] Figure 2 is a schematic diagram of the internal structure of the transfer chamber in this utility model;

[0019] Figure 3 is a schematic diagram of a partial explosion structure inside the transfer chamber of this utility model;

[0020] In the diagram: 1. Support frame; 2. Fixing plate; 3. Protective cover; 4. Guide sleeve; 5. Lifting cylinder; 6. Vacuum chamber; 7. Connecting plate; 8. Heating plate; 9. Vacuum suction plate; 10. Driven plate; 11. Linear bearing; 12. Pressure holding cylinder; 13. Guide slide rail; 14. Positioning tongue; 15. Linear guide rail. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] Example

[0023] As shown in Figures 1-3, the double-sided adhesive bonding and pressure-holding transfer chamber for PCB board processing disclosed in this utility model includes a support frame 1. The support frame 1 disclosed in this technical solution is an inverted U-shaped structure. In fact, this structure can be adapted and modified. A fixing plate 2 is horizontally fixed on the support frame 1. A protective cover 3 is fixedly installed at the bottom outer edge of the fixing plate 2. A height-adjustable vacuum chamber 6 is arranged inside the protective cover 3. The vacuum chamber 6 is connected to an external vacuum negative pressure device through a gas supply pipe. When the external vacuum negative pressure device is powered on, it can evacuate the inside of the vacuum chamber 6. An adjustable driven plate 10 is horizontally installed inside the 6. A pressure-holding cylinder 12 is fixedly installed at the bottom center of the driven plate 10. A connecting plate 7 is connected to the output end of the pressure-holding cylinder 12. The connecting plate 7 acts as a driven pressure transmission component, transmitting pressure synchronously to the lower part. A height-adjustable vacuum suction plate 9 is horizontally installed below the connecting plate 7. The vacuum suction plate 9 is connected to an external negative pressure vacuum device through a gas transmission pipe. Several vacuum negative pressure suction holes are evenly arranged on the bottom surface of the vacuum suction plate 9. When the vacuum suction plate 9 is running, its bottom surface contacts the PCB board and completes adsorption through negative pressure.

[0024] Specifically, the inner surface of the protective cover 3 is provided with several linear guide rails 15 arranged vertically. The outer wall of the vacuum chamber 6 is fitted onto the linear guide rails 15 and moves along the guide rails 15. In this embodiment, there are four linear guide rails 15. In fact, the number of linear guide rails 15 can be adjusted by the staff according to the site conditions.

[0025] Specifically, the top of the driven plate 10 is provided with several guide sleeves 4, the top of the guide sleeves 4 penetrates the upper surface of the fixed plate 2, and a lifting cylinder 5 is also provided in the middle of the upper surface of the fixed plate 2. The telescopic end of the lifting cylinder 5 penetrates the fixed plate 2 and is connected to the driven plate 10. During the operation of the lifting cylinder 5, the height of the driven plate 10 is adjusted by pushing the telescopic end. In this embodiment, the guide sleeves 4 are used to maintain the stability of the driven plate 10, so that the driven plate 10 remains horizontal during the height adjustment process.

[0026] Specifically, several linear bearings 11 are fixedly installed on the outer side of the pressure-holding cylinder 12 at the bottom edge of the driven plate 10. The bottom end of the linear bearing 11 is connected to the upper surface of the connecting plate 7. In this embodiment, the linear bearing 11 is a component composed of two sleeves. The number of linear bearings 11 is four, but different numbers can be used according to the needs.

[0027] Specifically, a heating plate 8 is also provided between the connecting plate 7 and the vacuum suction plate 9. The heating plate 8 is a component formed by bonding two layers of plate-shaped components. Heating resistance wires are laid inside the heating plate 8. In this embodiment, the heating resistance wires heat the vacuum suction plate 9 and the double-sided adhesive on its bottom during the power-on operation, making the double-sided adhesive and PCB more tightly bonded.

[0028] Specifically, the bottom surface of the connecting plate 7 is evenly provided with several movable positioning tongues 14. The positioning tongues 14 are L-shaped sheet components with the bottom end bent downwards. The bent part of the bottom end of the positioning tongues 14 is attached to the side wall of the heating plate 8, and the positioning tongues 14 drive the heating plate 8 to move synchronously when they move. The bottom surface of the connecting plate 7 is provided with several guide rails 13. One end of the positioning tongues 14 is fitted into the guide rails 13. A telescopic cylinder is provided on one side of each guide rail 13 on the bottom surface of the connecting plate 7. The output end of the telescopic cylinder is connected to the positioning tongues 14 and pushes the positioning tongues 14 to slide along the guide rails 13. In this embodiment, there are six positioning tongues 14. Two are provided on each side of the long side of the connecting plate 7, and one is provided on each side of the short side, which facilitates precise and accurate adjustment of the position of the heating plate 8.

[0029] The working principle and usage process of this utility model: In the actual implementation of this utility model, the staff first needs to set up the support frame 1 above the PCB board conveyor line. The PCB board with double-sided adhesive is conveyed to the bottom of the vacuum chamber 6 under the conveyor line. At this time, the lower surface of the double-sided adhesive is bonded to the PCB board, and the upper surface of the double-sided adhesive is covered with film. During the operation of the lifting cylinder 5, the height of the driven plate 10 and the vacuum chamber 6 is adjusted by pushing the operation of its own telescopic end. When the height of the driven plate 10 decreases, the height of the linear bearing 11 decreases synchronously, and then the height of the connecting plate 7 decreases synchronously. The connecting plate 7 simultaneously lowers the height of the vacuum suction plate 9, so that the vacuum suction plate 9 contacts the PCB board with double-sided adhesive. During the operation of the vacuum suction plate 9, the bottom surface is evacuated by the vacuum negative pressure device, so that the PCB board is tightly attached to the bottom surface of the vacuum suction plate 9.

[0030] When the bottom of vacuum chamber 6 contacts the upper surface of the conveyor line, the bottom of vacuum chamber 6 and the upper surface of the conveyor line can fit tightly together, so that the inside of vacuum chamber 6 is isolated from the outside. Vacuum chamber 6 is connected to the external vacuum negative pressure equipment through a pipe. When the vacuum negative pressure equipment is running, the inside of vacuum chamber 6 is evacuated through the vacuum negative pressure pipe. Then, during the operation of pressure holding cylinder 12, it pushes its telescopic rod downward, thereby causing the connecting plate 7 to be pressurized downward, which in turn drives the vacuum suction plate 9 to be pressurized downward. The vacuum environment combined with the pressure environment allows the air in the double-sided adhesive attached to the PCB board to be discharged, while maintaining tight adhesion. During this process, the resistance wire inside the heating plate 8 is energized and runs to heat the vacuum suction plate 9, so that the double-sided adhesive on the bottom surface of the vacuum suction plate 9 is tightly bonded to the PCB board.

[0031] In the process of using this technical solution, the guide sleeve 4 and the linear bearing 11 are used to maintain the stability of the driven plate 10 and the connecting plate 7 during the height adjustment process. The positioning tongue 14 on the bottom surface of the connecting plate 7 can run under the push of the telescopic cylinder and adjust the position of the heating plate 8 synchronously. The vacuum suction plate 9 is fixedly connected to the bottom surface of the heating plate 8 and adjusts synchronously with the position of the heating plate 8, which facilitates the precise positioning and adjustment of the PCB board and makes it easier to adsorb the PCB board.

[0032] The above description is only a preferred embodiment of the present utility model and is not intended to further limit the present utility model. All equivalent changes made based on the description and drawings of the present utility model are within the protection scope of the present utility model.

Claims

1. A double-sided adhesive bonding and pressure-holding transfer chamber for PCB board processing, comprising a support frame (1), characterized in that: A fixed plate (2) is horizontally fixed on the support frame (1). A protective cover (3) is fixedly fixed at the bottom outer edge of the fixed plate (2). A height-adjustable vacuum chamber (6) is located inside the protective cover (3). A height-adjustable driven plate (10) is horizontally arranged inside the vacuum chamber (6). A pressure-holding cylinder (12) is fixedly arranged at the bottom center of the driven plate (10). A connecting plate (7) is connected to the output end of the pressure-holding cylinder (12). A height-adjustable vacuum suction plate (9) is horizontally arranged below the connecting plate (7). The vacuum suction plate (9) is connected to the external negative pressure vacuum equipment through a gas delivery pipe. Several vacuum negative pressure suction holes are evenly arranged on the bottom surface of the vacuum suction plate (9). When the vacuum suction plate (9) is running, its bottom surface contacts the PCB board and completes adsorption through negative pressure.

2. The double-sided adhesive tape pasting and pressure maintaining transfer chamber for PCB processing according to claim 1, characterized in that: The inner surface of the protective cover (3) is provided with a number of linear guide rails (15) arranged vertically. The outer wall of the vacuum chamber (6) is fitted onto the linear guide rails (15) and moves along the guide rails (15).

3. The double-sided adhesive bonding and pressure-holding transfer chamber for PCB board processing according to claim 1, characterized in that: The driven plate (10) has several guide sleeves (4) at its top end. The top end of the guide sleeves (4) passes through the upper surface of the fixed plate (2). A lifting cylinder (5) is also provided in the middle of the upper surface of the fixed plate (2). The telescopic end of the lifting cylinder (5) passes through the fixed plate (2) and is connected to the driven plate (10). During operation, the lifting cylinder (5) adjusts the height of the driven plate (10) by pushing the telescopic end.

4. The double-sided adhesive tape pasting and pressure maintaining transfer chamber for PCB processing according to claim 1, characterized in that: Several linear bearings (11) are fixedly installed on the outer side of the pressure-holding cylinder (12) at the bottom edge of the driven plate (10), and the bottom end of the linear bearings (11) is connected to the upper surface of the connecting plate (7).

5. The double-sided adhesive tape pasting and pressure maintaining transfer chamber for PCB processing according to claim 1, characterized in that: A heating plate (8) is also provided between the connecting plate (7) and the vacuum suction plate (9). The heating plate (8) is a component formed by bonding two layers of plate-shaped components, and heating resistance wires are laid inside the heating plate (8).

6. The double-sided adhesive tape pasting and pressure maintaining transfer chamber for PCB processing according to claim 1, characterized in that: The bottom surface of the connecting plate (7) is uniformly provided with a number of movable positioning tongues (14). The positioning tongues (14) are L-shaped sheet members with the bottom end bent downward. The bent part of the bottom end of the positioning tongues (14) is attached to the side wall of the heating plate (8), and the positioning tongues (14) drive the heating plate (8) to move synchronously when they move.

7. The double-sided adhesive bonding and pressure-holding transfer chamber for PCB board processing according to claim 6, characterized in that: The bottom surface of the connecting plate (7) is covered with several guide rails (13). One end of the positioning tongue (14) is fitted onto the guide rail (13). A telescopic cylinder is provided on one side of each guide rail (13) on the bottom surface of the connecting plate (7). The output end of the telescopic cylinder is connected to the positioning tongue (14) and pushes the positioning tongue (14) to slide along the guide rail (13).

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