Liquid cooling plate and electronic equipment

Abstract

The utility model discloses a liquid cooling plate and an electronic device, and relates to the chip heat radiation technology field, the liquid cooling plate comprises a plate body, the plate body is internally provided with a heat exchange flow channel, the upper surface of the plate body is provided with an inlet and an outlet, and two ends of the heat exchange flow channel are respectively communicated with the inlet and the outlet; a liquid collecting groove is formed in the upper surface of the plate body, and the inlet and the outlet are formed in the groove bottom of the liquid collecting groove; the inlet and the outlet are provided with a liquid inlet connector and a liquid outlet connector respectively, the liquid inlet connector and the liquid outlet connector are opposite and arranged in a spaced mode, and the liquid collecting tank is used for receiving liquid leaked from the liquid inlet connector and the liquid outlet connector. According to the utility model, when liquid leakage occurs between the liquid inlet joint and the external pipeline and between the liquid outlet joint and the external pipeline, the leaked liquid is collected in the liquid collecting tank, so that the leaked liquid is prevented from flowing to components such as a chip and the like to cause faults, and the reliability of equipment operation is guaranteed.

Description

A liquid cooling plate and electronic device Technical Field

[0001] This utility model relates to the field of chip heat dissipation technology, specifically to a liquid cooling plate and electronic equipment. Background Technology

[0002] With the increasing integration and power of electronic components such as chips, and the demand for devices to be lighter, thinner, shorter, and smaller, heat dissipation has become increasingly difficult, posing a bottleneck to product development. Existing heat dissipation methods for high-power chips have shifted from air cooling to liquid cooling, and the reliability of the liquid cooling plate will affect the stable operation of the system.

[0003] When the inlet and outlet connectors of liquid cooling plates commonly used for chips are not installed properly, leakage will occur at the connectors. Coolant will flow from the water cooling plate to the chip or other components, which may cause short circuits and other malfunctions, affecting the normal operation of the equipment. Summary of the Invention

[0004] This utility model aims to solve one of the technical problems in related technologies to a certain extent. Therefore, this utility model provides a liquid cooling plate and an electronic device.

[0005] To achieve the above objectives, the first aspect of this utility model provides a liquid cooling plate for heat dissipation of a chip, comprising a plate body, wherein a heat exchange channel is provided inside the plate body, and an inlet and an outlet are provided on the upper surface of the plate body, with the two ends of the heat exchange channel respectively connected to the inlet and the outlet; a liquid collection tank is provided on the upper surface of the plate body, with both the inlet and the outlet formed at the bottom of the liquid collection tank; the inlet and the outlet are respectively provided with a liquid inlet connector and a liquid outlet connector, the liquid inlet connector and the liquid outlet connector being opposite to and spaced apart, and the liquid collection tank being used to collect liquid leaking from the liquid inlet connector and the liquid outlet connector.

[0006] The application of this application has the following beneficial effects: by setting a liquid collection tank on the upper surface of the board, when leakage occurs due to improper installation of the liquid inlet and outlet connectors with external pipelines, the leakage is collected in the liquid collection tank, thus preventing the leakage from flowing onto components such as chips and causing malfunctions.

[0007] Optionally, it also includes an overflow prevention part, which is disposed around the liquid collection tank and is used to prevent liquid in the liquid collection tank from overflowing from the liquid collection tank.

[0008] Optionally, the overflow prevention part is a raised structure formed on the upper surface of the plate in a direction away from the liquid collection tank.

[0009] Optionally, the overflow prevention part includes an overflow prevention plate, which is arranged around the inner wall of the liquid collection tank, and the top surface of the overflow prevention plate is higher than the opening of the liquid collection tank.

[0010] Optionally, the inlet connector and the outlet connector are staggered along the length of the collection tank.

[0011] Optionally, the liquid inlet connector includes a first connecting seat and a first pipe connector, the first connecting seat being in communication with the liquid inlet, and the first pipe connector extending along a first direction;

[0012] The liquid outlet connector includes a second connecting seat and a second pipe connector that are interconnected. The second connecting seat is connected to the liquid outlet, and the second pipe connector extends along a second direction. The first direction and the second direction are opposite and parallel to the upper surface of the plate.

[0013] Optionally, the first pipe connector has an inlet at the end facing the second pipe connector, and the second pipe connector has an outlet at the end facing the first pipe connector.

[0014] Optionally, the liquid collection tank is disposed in the central region of the plate, and multiple connection areas are provided at intervals along the edge of the plate. A connection structure is provided on the connection area, and the connection structure is used to fix the plate near the chip.

[0015] Optionally, the thickness of the connection area is less than the thickness of the plate body, and the connection structure includes a connection hole disposed in the connection area and a connector disposed in the connection hole.

[0016] A second aspect of this invention provides an electronic device including a chip and a liquid cooling plate provided in the first aspect of this invention, the liquid cooling plate being located near the chip.

[0017] These features and advantages of this utility model will be disclosed in detail in the following specific embodiments and accompanying drawings. The preferred embodiments or means of this utility model will be shown in detail in conjunction with the accompanying drawings, but are not intended to limit the technical solutions of this utility model. In addition, each of these features, elements and components appearing in the following text and drawings is multiple and is labeled with different symbols or numbers for convenience, but all represent parts with the same or similar structure or function. Attached Figure Description

[0018] The present invention will be further described below with reference to the accompanying drawings:

[0019] Figure 1 is a schematic diagram of the structure of this utility model.

[0020] Figure 2 is a top view of this utility model.

[0021] Among them, 10 is the plate; 20 is the liquid inlet connector; 21 is the first pipe connector; 211 is the liquid inlet; 22 is the first connecting seat; 30 is the liquid outlet connector; 31 is the second pipe connector; 32 is the second connecting seat; 40 is the connection area; 50 is the connector; 60 is the liquid collection tank; and 61 is the overflow prevention part. Detailed Implementation

[0022] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described are intended to explain this utility model and should not be construed as limiting it.

[0023] The terms "an embodiment," "example," or "trademark" used in this specification refer to a particular feature, structure, or characteristic described in connection with the embodiment itself that may be included in at least one embodiment disclosed in this patent. The phrase "in an embodiment" appearing in various places throughout the specification does not necessarily refer to the same embodiment.

[0024] In related technologies, liquid cooling plates used for heat-generating chips (such as CPUs, GPUs, and ASICs) are typically rectangular with a flat upper surface. Inlet and outlet ports are located at two opposite corners of the upper surface. When leaks occur due to improper installation of the inlet and outlet ports and external piping, the coolant can easily flow onto the chip or other heat-generating components. Since the coolant used in liquid cooling plates usually contains water, leakage can cause the liquid to come into contact with the chip, potentially leading to a short circuit. A short circuit generates a large instantaneous current, which can burn out the chip's internal circuitry, such as transistors and wires, causing permanent physical damage and rendering the chip unable to function properly. Furthermore, leakage can corrode chip pins and other components, affecting the electrical connection between the chip and other parts, resulting in poor or interrupted signal transmission.

[0025] In view of this, an embodiment of the present invention provides a liquid cooling plate for heat dissipation of a chip, as shown in Figures 1 and 2. The liquid cooling plate includes a plate body 10, the interior of which is provided with a heat exchange channel. An inlet and an outlet are provided on the upper surface of the plate body 10, and the two ends of the heat exchange channel are respectively connected to the inlet and the outlet. A liquid collection tank 60 is provided on the upper surface of the plate body 10, and both the inlet and the outlet are formed at the bottom of the liquid collection tank 60. The inlet and the outlet are respectively provided with an inlet connector 20 and an outlet connector 30. The liquid inlet connector 20 and the liquid outlet connector 30 are positioned opposite each other and spaced apart. The liquid inlet connector 20 is used to supply coolant to the heat exchange channel, and the liquid outlet connector 30 is used to return the coolant that has absorbed the heat of the chip to an external heat dissipation device. The external heat dissipation device cools the returned coolant and then introduces it back into the liquid inlet connector 20. The liquid inlet 211 of the liquid inlet connector 20 and the liquid outlet 30 are both located within the range of the liquid collection tank 60. The liquid collection tank 60 is used to collect the liquid that leaks from the liquid inlet connector 20 and the liquid outlet connector 30.

[0026] Specifically, the inlet connector 20 and outlet connector 30 are connected to the heat dissipation equipment via external pipelines. Coolant circulates within the liquid cooling plate, entering the heat exchange channel inside the plate 10 through the inlet connector 20 and exiting through the outlet connector 30. The coolant within the plate 10 dissipates heat from the chip. Improper installation of the inlet connector 20 and outlet connector 30 with the external pipelines may occur, leading to coolant leakage from the connection point. This invention addresses this by providing a collection tank 60 on the upper surface of the plate 10. When leakage occurs between the inlet connector 20 / 20 and the external pipelines, the collection tank 60 collects the leaked coolant, preventing it from flowing onto chips and other components and causing malfunctions, thus maintaining stable performance. It also facilitates timely detection and handling of leaks at the inlet or outlet connectors of the liquid cooling plate.

[0027] Furthermore, the liquid cooling plate provided by this utility model also includes an overflow prevention part 61, which is arranged around the liquid collection tank 60. The overflow prevention part 61 is used to prevent liquid in the liquid collection tank 60 from overflowing from the liquid collection tank 60. The overflow prevention part 61 can prevent the liquid in the liquid collection tank from overflowing to a certain extent, thus buying time for maintenance in case of improper installation of the liquid inlet connector 20 and liquid outlet connector 30 with external pipelines, and reducing the damage to chips or other components caused by possible leakage events at the liquid cooling plate's liquid inlet or liquid outlet connectors.

[0028] In some embodiments, the anti-overflow portion 61 is a protruding structure formed on the upper surface of the plate 10 in a direction away from the liquid collection tank 60. The protruding structure is arranged around the periphery of the liquid collection tank 60 to prevent liquid in the liquid collection tank 60 from overflowing from the liquid collection tank 60.

[0029] In other alternative embodiments not shown in the figure, the overflow prevention part 61 includes an overflow prevention plate, which is disposed around the inner wall of the liquid collection tank 60 and fixedly connected to the inner wall of the liquid collection tank 60. The top surface of the overflow prevention plate is higher than the opening of the liquid collection tank 60 to prevent liquid in the liquid collection tank 60 from overflowing from the liquid collection tank 60.

[0030] In this embodiment, the collection tank 60 is rectangular. The inlet 211 of the inlet connector 20 and the outlet 30 face each other, and the inlet connector 20 and the outlet connector 30 are staggered along the length or width of the collection tank 60. Of course, in optional embodiments, the collection tank 60 can also have other shapes. The inlet connector 20 and the outlet connector 30 are centrally located within the collection tank 60, and the inlet of the inlet connector 20 and the outlet of the outlet connector 30 are opposite and staggered. This staggered arrangement avoids mutual interference between the inlet connector 20 and the outlet connector 30, providing sufficient space for the installation and disassembly of external pipelines, improving installation efficiency, and facilitating subsequent inspection and maintenance.

[0031] Specifically, as shown in Figure 1, the liquid inlet connector 20 and the liquid outlet connector 30 have the same structure. The liquid inlet connector 20 includes a first connecting seat 22 and a first pipe connector 21. The first connecting seat 22 is connected to the liquid inlet 211, and the first pipe connector 21 extends along a first direction.

[0032] The liquid outlet connector 30 includes a second connecting seat 32 and a second pipe connector 31 that are interconnected. The second connecting seat 32 is connected to the liquid outlet, and the second pipe connector 31 extends along a second direction. The first direction is opposite to the second direction and is parallel to the length direction of the plate 10. Of course, in an optional embodiment, it can also be parallel to the width direction of the plate 10.

[0033] In some embodiments, the first pipe connector 21 is provided with an inlet 211 at one end facing the second pipe connector 31, and the second pipe connector 31 is provided with an outlet at one end facing the first pipe connector 21.

[0034] In this embodiment, the liquid collection tank 60 is located in the central region of the plate 10, and the liquid inlet connector 20 and liquid outlet connector 30 are located within the liquid collection tank 60. Six connection areas 40 are spaced apart along the edge of the plate 10. Specifically, the plate 10 is rectangular, with two connection areas 40 on each short side and one connection area 40 on each long side. It is easy to understand that the heat exchange channels inside the plate 10 do not pass through the connection areas 40. A connection structure is provided on the connection areas 40, which is used to fix the plate 10 near the chip or other components for heat dissipation.

[0035] In other alternative embodiments, other numbers of connection areas 40 and connection structures may be provided on the plate 110. It is easy to understand that at least one connection area and one connection structure must be provided on the plate 10, and a connection structure may include other numbers of connectors and connection holes.

[0036] In some embodiments, the connection area 40 is rectangular; however, in optional embodiments, the connection area 40 can also be other shapes. As shown in FIG1, the thickness of the connection area 40 is less than the thickness of the plate 10. The connection structure includes a connection hole disposed in the connection area 40 and a connector 50 disposed within the connection hole. The thickness of the connection area 40 is thinner than the thickness of other areas of the plate 10. A thinner connection area 40 makes it easier for the connector 50 to pass through, reducing resistance and difficulty during installation, especially when multiple connectors 50 need to be installed, thus improving installation efficiency. At the same time, while meeting strength and usage requirements, designing the connection area to be thinner can reduce the amount of material used in the plate 10, thereby reducing the cost and structural weight of the plate 10.

[0037] In some embodiments, the connecting hole is a threaded hole, the connector 50 is a screw adapted to the threaded hole, and a mounting plate for mounting the liquid cooling plate is provided near the chip. The length of the screw should be longer than the total thickness of the plate body 10 and the liquid inlet connector 20 to ensure that the screw has sufficient length to pass through the external mounting plate after tightening, so that the plate body 10 and the external mounting plate form an effective threaded connection for reliable fastening. When fixing the plate body 10 near the chip, the screw is passed through the threaded hole and screwed into the threaded hole. The other end of the screw is used to connect with the threaded hole on the external mounting plate, thus fixing the plate body 10 near the chip. In this way, the plate body 10 can be fixedly connected to the external mounting plate by screws at six points located on the edge of the plate body 10, making the connection between the plate body 10 and the external mounting plate very stable.

[0038] In other alternative embodiments, the board 10 can also be installed near the chip using snap-fit ​​connections, tight-fit connections, or other similar methods. For example, the connection hole can also be a socket, and the connector can be a pin that fits the socket. By tightly fitting one end of the pin into the socket and the other end into the socket on the external mounting plate, the board 10 is fixed near the chip.

[0039] A second aspect of this invention provides an electronic device including a chip and a liquid cooling plate provided in the first aspect of this invention, the liquid cooling plate being located near the chip.

[0040] This invention features a liquid collection tank 60 on the upper surface of the plate 10. When leakage occurs at the liquid inlet or outlet, the collection tank 60 collects the leaking liquid, preventing it from flowing onto chips and other components and causing malfunctions, thus maintaining stable performance. It also facilitates timely detection and handling of leaks by maintenance personnel. Furthermore, the overflow prevention part 61 also prevents liquid from overflowing from the collection tank 60 to a certain extent, providing more time for repairs in cases of improper installation of the liquid inlet connector 20 and liquid outlet connector 30 with external piping, and reducing the damage to chips or other components caused by leakage from the liquid cooling plate's liquid inlet or outlet connectors.

[0041] The above are merely specific embodiments of this utility model, but the scope of protection of this utility model is not limited thereto. Those skilled in the art should understand that this utility model includes, but is not limited to, the contents described in the accompanying drawings and the specific embodiments above. Any modifications that do not depart from the functional and structural principles of this utility model will be included within the scope of the claims.

Claims

1. A liquid cooling plate for heat dissipation of a chip, comprising a plate body (10), wherein a heat exchange channel is provided inside the plate body (10), and an inlet and an outlet are provided on the upper surface of the plate body (10), wherein the two ends of the heat exchange channel are respectively connected to the inlet and the outlet; characterized in that, The upper surface of the plate (10) is provided with a liquid collection tank (60), and the inlet and the outlet are both formed at the bottom of the liquid collection tank (60); the inlet and the outlet are respectively provided with a liquid inlet connector (20) and a liquid outlet connector (30), the liquid inlet connector (20) and the liquid outlet connector (30) are opposite to each other and spaced apart, and the liquid collection tank (60) is used to receive the liquid leaked from the liquid inlet connector (20) and the liquid outlet connector (30).

2. The liquid cooling plate according to claim 1, characterized in that, It also includes an overflow prevention part (61) which is arranged around the liquid collection tank (60) and is used to prevent the liquid in the liquid collection tank (60) from overflowing from the liquid collection tank (60).

3. The liquid cooling plate according to claim 2, characterized in that, The overflow prevention part (61) is a raised structure formed on the upper surface of the plate (10) away from the liquid collection tank (60).

4. The liquid cooling plate according to claim 2, characterized in that, The overflow prevention part (61) includes an overflow prevention plate, which is arranged around the inner wall of the liquid collection tank (60), and the top surface of the overflow prevention plate is higher than the opening of the liquid collection tank (60).

5. The liquid cooling plate according to claim 1, characterized in that, The inlet connector (20) and the outlet connector (30) are staggered along the length of the collection tank (60).

6. The liquid cooling plate according to claim 5, characterized in that, The liquid inlet connector (20) includes a first connecting seat (22) and a first pipe connector (21), the first pipe connector (21) extending along a first direction; the liquid outlet connector (30) includes a second connecting seat (32) and a second pipe connector (31) communicating with each other, the second pipe connector (31) extending along a second direction; the first direction and the second direction are opposite and parallel to the upper surface of the plate (10); the first pipe connector (21) is provided with a liquid inlet (211) at one end facing the second pipe connector (31), and the second pipe connector (31) is provided with a liquid outlet at one end facing the first pipe connector (21); the first connecting seat (22) is connected to the liquid inlet (211), and the second connecting seat (32) is connected to the liquid outlet.

7. The liquid-cooled plate according to any one of claims 1-6, characterized in that, The liquid collection tank (60) is located in the central area of ​​the plate (10). Multiple connection areas (40) are provided at intervals along the edge of the plate (10). A connection structure is provided on the connection area (40) for fixing the plate (10) near the chip.

8. The liquid cooling plate according to claim 7, characterized in that, The thickness of the connection area (40) is less than the thickness of the plate (10), and the connection structure includes a connection hole disposed in the connection area (40) and a connector (50) disposed in the connection hole.

9. An electronic device, characterized in that, It includes a chip and a liquid cooling plate as described in any one of claims 1-8, the liquid cooling plate being located near the chip.

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