Semiconductor laser pin welding device

Abstract

The utility model relates to a semiconductor laser pin welding device, which belongs to the technical field of semiconductor lasers and comprises a base, an angle adjusting support, a shell placing platform, a stroke adjusting shaft and a protective block which are sequentially arranged. Wherein the angle adjusting support can rotate and freely adjust the welding angle, the shell containing platform base facilitates extension of optical fibers and protects the optical fibers from being bent, and the stroke adjusting shaft can freely adjust the distance and can be conveniently matched with shells of different sizes. The device can assist in welding the laser pins, the welding angle is freely changed, the welding efficiency is improved, and an optical fiber is protected from being bent.

Description

Technical Field

[0001] This utility model relates to a semiconductor laser pin welding device, belonging to the field of semiconductor laser technology. Background Technology

[0002] Currently used semiconductor lasers require wire soldering at their pins to ensure stable power supply. However, this soldering process, typically involving horizontal placement, limits the flexibility of the soldering angle. To improve ease of soldering, the laser can be appropriately elevated to adjust the soldering angle. However, during this process, extra care must be taken to protect the optical fiber at the laser's tail to prevent bending and damage. Manually raising the laser is not only inefficient but also prone to damaging the fiber. Summary of the Invention

[0003] To address the shortcomings of existing technologies, this invention provides a semiconductor laser pin welding device that assists in welding laser pins, allows for flexible adjustment of the welding angle, improves welding efficiency, and protects the optical fiber from bending. The technical solution of this invention is as follows to achieve the above objectives.

[0004] The technical solution of this utility model is as follows:

[0005] A semiconductor laser pin welding device includes, from bottom to top, a base, an angle adjustment bracket, and a housing placement platform. The angle adjustment bracket is hinged to the base and can be rotated to freely adjust the welding angle. The housing placement platform is used to place optical fibers, facilitating fiber extension and protecting the fibers from bending. The housing placement platform is equipped with a stroke adjustment shaft, which consists of two axisymmetric T-shaped rods that move horizontally on the platform. Protective blocks are located on opposite sides of the two T-shaped rods, and the fiber housing is placed between the two protective blocks. The stroke adjustment shaft can be freely adjusted to accommodate housings of different sizes. This facilitates fiber extension, allows the fiber to pass flexibly over the base, and provides effective protection for the fiber at different positions.

[0006] Preferably, the housing placement platform below the stroke adjustment shaft is equipped with a track, and the stroke adjustment shaft moves along the track. A spring is provided between the outer side of the stroke adjustment shaft and the end of the track. Under the action of the spring, the two stroke adjustment shafts have opposing forces, which naturally have a certain clamping effect on the housing placed therein. When removing the housing, the spring needs to be compressed in the opposite direction.

[0007] Preferably, the bottom of the housing placement platform has a limiting device for fixing the laser housing, but without obstructing the passage of the optical fiber, thus protecting the optical fiber from bending.

[0008] When pins need to be soldered, place the fiber optic housing on the housing placement platform, fix the housing, rotate the angle adjustment bracket to expose a suitable soldering position, solder the pins, and then remove the housing to solder the next pin.

[0009] The beneficial effects of this utility model are as follows:

[0010] (1) The base of this utility model is equipped with an angle adjustment bracket, which can adjust the angle of the welding product according to different needs, thereby improving welding comfort and welding efficiency.

[0011] (2) The base of this utility model adopts a convenient design, with only the shell stop and the fiber optic outlet reserved, which facilitates the placement of the fiber optic cable and avoids bending and damage to the fiber optic cable.

[0012] (3) This utility model uses a stroke adjustment shaft to fix the product, and the size can be adjusted at will, making it easy to adapt to different products. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the semiconductor laser pin bonding device in the embodiment;

[0014] Figure 2 This is a left view of the semiconductor laser pin bonding apparatus in the embodiment;

[0015] Figure 3 This is a front view of the semiconductor laser pin bonding device in the embodiment;

[0016] The markings in the diagram represent: 1-base, 2-angle adjustment bracket, 3-shell placement platform, 4-stroke adjustment shaft, 5-protective block, and 6-limit. Detailed Implementation

[0017] The present invention will be further described below with reference to the embodiments and accompanying drawings, but is not limited thereto.

[0018] Example 1:

[0019] For ease of description, the words "up," "down," "left," and "right" appearing in this utility model only indicate that they are consistent with the up, down, left, and right directions of the accompanying drawings. They do not limit the structure and are merely for the purpose of facilitating the description of this utility model and simplifying the description. They do not indicate or imply that the device or component referred to needs to have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0020] Terminology Explanation: The terms "installation," "connection," "linking," and "fixing" in this utility model should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, a direct connection, or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of these terms in this utility model based on the specific circumstances. The semiconductor laser beam collimation device of this utility model will now be further described in conjunction with the accompanying drawings and specific embodiments.

[0021] refer to Figure 1-3 Example of a semiconductor laser pin welding device, comprising, from bottom to top: a base 1, an angle adjustment bracket 2, a housing placement platform 3, a stroke adjustment shaft 4, and a protective block 5. The angle adjustment bracket is hinged to the base and can be rotated freely to adjust the welding angle, ensuring convenient and easy operation for welding different housing angles. The housing placement platform is used to place optical fibers, facilitating fiber extension and protecting the fibers from bending. The housing placement platform is equipped with a stroke adjustment shaft, which consists of two axisymmetric T-shaped rods that move horizontally on the housing placement platform. Protective blocks are located on opposite sides of the two T-shaped rods, and the fiber housing is placed between the two protective blocks. The stroke adjustment shaft can be freely adjusted to accommodate housings of different sizes. This facilitates fiber extension, allows the fiber to pass flexibly over the base, and provides effective protection for fibers at different positions. A track is provided on the housing placement platform below the stroke adjustment shaft, and the stroke adjustment shaft moves along the track. A spring is located between the outer side of the stroke adjustment shaft and the end of the track. Under the action of the spring, the two stroke adjustment shafts exert opposing forces, naturally clamping the housing placed within them. When removing the housing, the spring needs to be compressed in the opposite direction. The bottom 3 of the housing placement platform has a limit 6 for fixing the laser housing without obstructing the passage of the optical fiber, thus protecting the fiber from bending. The stroke adjustment shaft 4 is located on the housing placement platform 3, and the spacing of the stroke adjustment shaft 4 can be adjusted according to different housings to facilitate matching with different housings.

Claims

1. A semiconductor laser pin bonding apparatus, characterized in that, From bottom to top, the structure includes: a base, an angle adjustment bracket, and a housing placement platform. The angle adjustment bracket is hinged to the base. The housing placement platform is used to place optical fibers. The housing placement platform is equipped with a stroke adjustment shaft, which consists of two axisymmetric T-shaped rods. The T-shaped rods move horizontally on the housing placement platform. Protective blocks are provided on the opposite sides of the two T-shaped rods, and the optical fiber housing is placed between the two protective blocks.

2. The semiconductor laser pin bonding apparatus according to claim 1, characterized in that, The housing platform below the stroke adjustment shaft is equipped with a track, and the stroke adjustment shaft moves along the track. A spring is provided between the outer side of the stroke adjustment shaft and the end of the track.

3. The semiconductor laser pin bonding apparatus according to claim 1, characterized in that, The bottom of the housing placement platform has a limit.

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