Multi-axis laser processing device

Abstract

The embodiment of the utility model relates to the technical field of machining equipment, and particularly discloses a multi-axis laser machining device which comprises a base, a moving mechanism, a sample table and a machining assembly, the moving mechanism is arranged on the base and comprises a first moving assembly, a second moving assembly and a third moving assembly, the sample table is arranged on the first moving assembly, and the machining assembly is arranged on the second moving assembly. The first moving assembly can drive the sample table to reciprocate in the first direction, the sample table is used for bearing a sample and can rotate, the processing assembly is arranged on the second moving assembly, the second moving assembly can drive the processing assembly to reciprocate in the second direction, the processing assembly is used for processing the sample, and the third moving assembly is connected with the second moving assembly. The third moving assembly can drive the second moving assembly to reciprocate in the third direction, and every two of the first direction, the second direction and the third direction are perpendicular. By means of the moving mechanism and the rotatable sample table, multi-dimensional and multi-angle machining of the sample is achieved, and the flexibility and adaptability of the machining device are improved.

Description

Technical Field

[0001] This utility model relates to the field of processing equipment technology, and in particular to a multi-axis laser processing device. Background Technology

[0002] In modern manufacturing, processing equipment is increasingly widely used, especially in precision machining, micro-nano manufacturing, and semiconductor processing. A processing device typically includes a moving mechanism, a sample stage, and processing components. The sample stage holds the sample, the processing components process the sample, and the moving mechanism drives the sample stage or processing components to move relative to each other to perform multi-dimensional processing on the sample. Currently, processing devices typically use a moving mechanism to move the sample stage or processing components in three mutually perpendicular linear directions to meet the needs of multi-dimensional processing.

[0003] In the process of implementing the embodiments of this utility model, the inventors discovered that when processing samples with complex curved surfaces or irregular shapes, the processing device cannot achieve the ideal processing effect by moving linearly along three axes. Operators also need to manually adjust the position or angle of the sample, which not only increases the difficulty of operation but also reduces processing efficiency and accuracy. Utility Model Content

[0004] In view of the above problems, this utility model provides a multi-axis laser processing device that overcomes or at least partially solves the above problems.

[0005] To solve the above-mentioned technical problems, the present invention provides a multi-axis laser processing device, including a base, a moving mechanism, a sample stage, and a processing component. The moving mechanism is disposed on the base and includes a first moving component, a second moving component, and a third moving component. The sample stage is disposed on the first moving component and can drive the sample stage to reciprocate along a first direction. The sample stage is used to carry a sample and is rotatable. The processing component is disposed on the second moving component and can drive the processing component to reciprocate along a second direction. The processing component includes a laser and is used to emit a laser beam to process the sample. The third moving component is connected to the second moving component and can drive the second moving component to reciprocate along a third direction, wherein the first direction, the second direction, and the third direction are perpendicular to each other.

[0006] In some embodiments, the sample stage is rotatable about a first axis, which is parallel to the second direction.

[0007] In some embodiments, the processing assembly includes a rotating member rotatable about a second axis perpendicular to the second direction. The multi-axis laser processing apparatus further includes a clamping member for clamping the sample. The clamping member is sleeved on the rotating member and can rotate with the rotating member about the second axis.

[0008] In some embodiments, the sample stage is rotatable about a third axis, which is perpendicular to the second direction.

[0009] In some embodiments, the base is provided with a screw hole with an internal thread, a support column extends from one side of the base, one end of the support column is used to abut against the placement surface of the multi-axis laser processing device, the support column is provided with an external thread, the external thread is threadedly connected to the internal thread, and the support column can rotate and move along the screw hole.

[0010] In some embodiments, the first moving component includes a first linear motor and a first moving platform, the first moving platform being connected to the first linear motor, the first linear motor being used to drive the first moving platform to reciprocate along the first direction, and the sample stage being disposed on the first moving platform.

[0011] In some embodiments, the second moving component includes a second linear motor and a second moving platform, the second moving platform being connected to the second linear motor, the second linear motor being used to drive the second moving platform to reciprocate along the second direction, and the processing component being fixed to the second moving platform.

[0012] In some embodiments, the third moving component includes a third linear motor and a third moving platform, the third moving platform being connected to the third linear motor, the third linear motor being used to drive the third moving platform to reciprocate along the third direction, and the second moving component being disposed on the third moving platform.

[0013] In some embodiments, the multi-axis laser processing apparatus further includes a cable chain assembly connected to the first moving component, the second moving component, the third moving component, and the processing component.

[0014] In some embodiments, the cable chain assembly includes a first cable chain, a second cable chain, and a third cable chain, wherein the first moving component is connected to an external power source via the first cable chain, and the second moving component, the third moving component, and the processing component are connected to an external power source via the second cable chain and / or the third cable chain.

[0015] The beneficial effects of this utility model embodiment are as follows: Unlike existing technologies, this utility model embodiment provides a multi-axis laser processing device, including a base, a moving mechanism, a sample stage, and a processing component. The moving mechanism is disposed on the base and includes a first moving component, a second moving component, and a third moving component. The sample stage is disposed on the first moving component and can drive the sample stage to reciprocate along a first direction. The sample stage is used to carry a sample and is rotatable. The processing component is disposed on the second moving component and can drive the processing component to reciprocate along a second direction. The processing component includes a laser and is used to emit a laser beam to process the sample. The third moving component is connected to the second moving component and can drive the second moving component to reciprocate along a third direction, wherein the first direction, the second direction, and the third direction are perpendicular to each other. Through the moving mechanism and the rotatable sample stage, multi-dimensional and multi-angle processing of the sample is achieved, improving the flexibility and adaptability of the processing device. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments of this utility model will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the drawings without creative effort.

[0017] Figure 1 This is a perspective view of a multi-axis laser processing device provided in an embodiment of this utility model;

[0018] Figure 2 This is an exploded view of a multi-axis laser processing device provided in an embodiment of this utility model;

[0019] Figure 3 This is an exploded view of the first moving component provided in this embodiment of the present invention;

[0020] Figure 4 This is an exploded view of the second and third moving components provided in this embodiment of the utility model. Detailed Implementation

[0021] To facilitate understanding of this utility model, a more detailed description is provided below with reference to the accompanying drawings and specific embodiments. It should be noted that when an element is described as being "fixed to" another element, it can be directly on the other element, or one or more intermediate elements may exist between them. When an element is described as being "connected" to another element, it can be directly connected to the other element, or one or more intermediate elements may exist between them. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this specification are for illustrative purposes only.

[0022] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of the invention. The term "and / or" as used in this specification includes any and all combinations of one or more of the associated listed items.

[0023] Please see Figure 1 The multi-axis laser processing device 10000 includes a base 1, a moving mechanism 2, a sample stage 3, a processing component 4, and a cable chain assembly 5. The moving mechanism 2 and the cable chain assembly 5 are disposed on the base 1, and the sample stage 3 and the processing component 4 are disposed on the moving mechanism 2. The sample stage 3 is used to carry the sample, and the moving mechanism 2 is used to drive the sample stage 3 and the processing component 4 to move relative to each other. The moving mechanism 2 and the processing component 4 are connected to an external power source through the cable chain assembly 5.

[0024] It should be noted that a sample refers to an object to be processed or tested, such as a wafer, optical component, mechanical part, or other object with various shapes and materials.

[0025] For the aforementioned base 1, please refer to Figure 2 The base 1 includes a substrate 11 and a base 12. The substrate 11 is disposed on one side of the base 12, and a support column 121 extends from the other side of the base 12. One end of the support column 121 is used to abut against the placement surface of the multi-axis laser processing device 10000. The substrate 11 is used to support the moving mechanism 2, the sample stage 3 and the processing component 4.

[0026] In some embodiments, the number of support columns 121 is one or more, and the support columns 121 are height-adjustable structures to adapt to different processing requirements and placement surfaces with different flatness. Specifically, the height adjustment of the support columns 121 can be achieved through threaded connections, sleeve sliding structures, or hydraulic devices. In some examples, the base 12 is provided with a threaded hole with an internal thread, and the other end of the support column 121 is provided with an external thread. The external thread is threadedly connected to the internal thread, and the other end of the support column 121 mates with the threaded hole so that the other end of the support column 121 can rotate and move along the threaded hole. The height of the base 12 can be adjusted by rotating the support column 121.

[0027] It should be noted that the substrate 11 is marble or other hard materials with high rigidity and stability.

[0028] For the aforementioned mobile mechanism 2, please refer to Figure 1 and Figure 2 The moving mechanism 2 includes a first moving component 21, a second moving component 22, and a third moving component 23. The first moving component 21 drives the sample stage 3 to reciprocate along a first direction x, and the second moving component 22 drives the processing component 4 to reciprocate along a second direction z. The third moving component 23 is connected to the second moving component 22 and drives the second moving component 22 to reciprocate along a third direction y, thereby driving the processing component 4 to reciprocate along the third direction y. The multi-axis laser processing device 10000 achieves relative linear motion of the sample stage 3 and the processing component 4 in three degrees of freedom through the moving mechanism 2, and has a compact structure, improving the adaptability of the multi-axis laser processing device 10000.

[0029] Among them, the first direction x, the second direction z, and the third direction y are all perpendicular to each other.

[0030] Please see Figure 3The first moving component 21 includes a first linear motor 211 and a first moving platform 212. The first moving platform 212 is connected to the first linear motor 211. The sample stage 3 is disposed on the first moving platform 212. The first linear motor 211 drives the first moving platform 212 to reciprocate along a first direction x, thereby driving the sample stage 3 to reciprocate along the first direction x. The first linear motor 211 includes a stator 2111 and a mover 2112. The stator 2111 is fixed to the substrate 11, and the mover 2112 is slidably connected to the stator 2111. The mover 2112 can reciprocate relative to the stator 2111 along the first direction x, and the mover 2112 is connected to the first moving platform 212. The stator 2111 is provided with a guide channel 21111, and the mover 2112 is provided with a protrusion 21121. The mover 2112 is engaged with the stator 2111, and the protrusion 21121 is located in the guide channel 21111 and can slide along the guide channel 21111, thereby realizing the sliding limit connection between the stator 2111 and the mover 2112. The stator 2111 is a permanent magnet or electromagnet, and the mover 2112 is a magnetic conductor including a coil. In the magnetic field generated by the stator 2111, the mover 2112 generates electromagnetic force through the energized coil, interacts with the magnetic field of the stator 2111, and thereby drives the first moving platform 212 and the sample stage 3 to reciprocate along the first direction x.

[0031] In some embodiments, please continue reading Figure 3 The first moving component 21 also includes a slider 213 and a guide rail 214. The guide rail 214 is fixed to the base plate 11, and the slider 213 is slidably limited to the guide rail 214. The slider 213 is also connected to the first moving platform 212. When the first linear motor 211 drives the first moving platform 212 to reciprocate along the first direction x, the slider 213 slides smoothly on the guide rail 214, providing additional support and guidance for the first moving platform 212, thus enhancing the stability and accuracy of the first moving component 21.

[0032] In some embodiments, the first moving component 21 further includes a first protective cover 215, which is disposed on both sides of the first moving platform 212. The first protective cover 215 is a flexible accordion-style protective cover, configured to retract and expand as the first moving platform 212 moves. The first protective cover 215 reduces the entry of external dust and debris into the interior of the first moving component 21, thereby protecting components such as the first linear motor 211, slider 213, and guide rail 214, and enhancing the durability of the moving mechanism 2.

[0033] Please see Figure 4The second moving component 22 includes a second linear motor 221, a second moving platform 222, and a second protective cover 223. The processing component 4 is fixed to the second moving platform 222. The second moving platform 222 is connected to the second linear motor 221. The second linear motor 221 is used to drive the second moving platform 222 to reciprocate along the second direction z. The second protective cover 223 is disposed on both sides of the second moving platform 222. The second protective cover 223 is a flexible bellows-type protective cover, configured to retract and expand as the second moving platform 222 moves. The third moving component 23 includes a third linear motor 231, a third moving platform 232, and a third protective cover 233. The second moving component 22 is disposed on the third moving platform 232. The third moving platform 232 is connected to the third linear motor 231. The third linear motor 231 is used to drive the third moving platform 232 to reciprocate along a third direction y. The third protective cover 233 is disposed on both sides of the third moving platform 232. The third protective cover 233 is a flexible bellows-style protective cover, configured to retract and expand as the third moving platform 232 moves.

[0034] It is understood that both the second linear motor 221 and the third linear motor 231 include a stator and a mover. In some embodiments, the second moving component 22 and / or the third moving component 23 include a slider and a guide rail, with the slider connected to the moving platform to enhance the stability and accuracy of the moving mechanism 2.

[0035] For sample stage 3 mentioned above, please refer to the reference. Figure 1 and Figure 2 The sample stage 3 is mounted on the first moving platform 212. The sample stage 3 can rotate around the first axis, thereby realizing the fourth degree of freedom operation control of the sample by the multi-axis laser processing device 10000 and improving the flexibility of the multi-axis laser processing device 10000. The first axis is parallel to the second direction z.

[0036] In some embodiments, the multi-axis laser processing apparatus 10000 further includes a drive mechanism (not shown) for driving the sample stage 3 to rotate about a first axis. In some examples, the drive mechanism includes a rotary motor and a transmission element, the output shaft of which is connected to the sample stage 3 via the transmission element.

[0037] For the aforementioned processing component 4, please refer to Figure 1 and Figure 2The processing component 4 includes a laser 41 and a rotating component 42. The laser 41 is mounted on the second moving platform 222, and the rotating component 42 is mounted on the laser 41. The rotating component 42 can rotate around a second axis. The second axis is perpendicular to a second direction z, and optionally, the second axis is parallel to a third direction y. The laser 41 is used to emit a laser beam to perform processing operations such as cutting, marking, welding, or surface treatment on samples. The type of laser 41 can be selected according to processing requirements, such as a CO2 laser, a fiber laser, or an ultraviolet laser.

[0038] In some embodiments, the multi-axis laser processing apparatus 10000 further includes a clamping component (not shown), which is sleeved on the rotating member 42 and used to clamp the sample. The clamping component can rotate with the rotating member 42 around the second axis, thereby realizing the operation control of the fifth degree of freedom of the sample by the multi-axis laser processing apparatus 10000. This further enhances the flexibility and adaptability of the multi-axis laser processing apparatus 10000, enabling the multi-axis laser processing apparatus 10000 to perform fine processing or inspection on samples with complex curved surfaces or irregular shapes.

[0039] It is understood that the structure of processing component 4 is not limited to the above-mentioned limitations. The processing parts of processing component 4 can be one or more of the following: laser, mechanical cutting tool, grinding wheel, nozzle (for spraying or depositing materials), milling head, and drilling head, depending on the actual processing requirements and sample material. Furthermore, the structure of the multi-axis laser processing device 10000 to achieve multiple degrees of freedom is not limited to the above-mentioned limitations. In some embodiments, the sample stage 3 is a two-degree-of-freedom rotary stage, capable of rotating about a first axis and a third axis. The third axis is perpendicular to the second direction z, and optionally, the third axis is parallel to the first direction x. In some examples, the sample stage 3 is an AC-axis rotary stage configured to support samples weighing less than or equal to 50 kg.

[0040] For the cable chain component 5 mentioned above, please refer to Figure 1 and Figure 2The cable chain assembly 5 is connected to the first moving assembly 21, the second moving assembly 22, the third moving assembly 23, and the processing assembly 4. The cable chain assembly 5 includes a first cable chain 51, a second cable chain 52, and a third cable chain 53. Both the first cable chain 51 and the third cable chain 53 are disposed on the base plate 11. The first cable chain 51 is disposed on one side of the first moving assembly 21, and the third cable chain 53 is disposed on one side of the third moving assembly 23. The second cable chain 52 is disposed on the second moving assembly 22. The first moving assembly 21 is connected to an external power source via the first cable chain 51. The second moving assembly 22, the third moving assembly 23, and the processing assembly 4 are connected to an external power source via the second cable chain 52 and / or the third cable chain 53. Specifically, the power supply wire of the first moving assembly 21 passes through the first cable chain 51, and the power supply wires of the second moving assembly 22, the third moving assembly 23, and the processing assembly 4 pass through the second cable chain 52 and / or the third cable chain 53. The cable chain assembly 5 reduces the risk of the power supply wires of the moving mechanism 2 and the processing assembly 4 being pulled, worn or tangled during movement, thereby improving the electrical connection stability and reliability of the multi-axis laser processing device 10000.

[0041] It should be noted that the connection between the second moving component 22, the third moving component 23, and the processing component 4 and the external power supply via the second cable chain 52 and / or the third cable chain 53 includes various connection methods, including but not limited to: the power supply wires of the second moving component 22, the third moving component 23, and the processing component 4 all passing through the second cable chain 52; the power supply wires of the second moving component 22, the third moving component 23, and the processing component 4 all passing through the third cable chain 53; the power supply wires of the second moving component 22, the third moving component 23, and the processing component 4 all passing through the second cable chain 52 and the third cable chain 53 sequentially; the power supply wires of the second moving component 22 and the processing component 4 all passing through the second cable chain 52 and the third cable chain 53 sequentially, with the power supply wire of the third moving component 23 passing through the third cable chain 53.

[0042] In some embodiments, please refer to Figure 1 and Figure 2 The multi-axis laser processing apparatus 10000 also includes a lubrication mechanism 6, which provides lubricating oil to lubricate the moving parts of the multi-axis laser processing apparatus 10000, thereby reducing friction, wear, and noise, and improving operational efficiency and lifespan.

[0043] In some embodiments, please refer to Figure 1 and Figure 2The multi-axis laser processing device 10000 also includes a dust collection mechanism 7, which is located on one side of the sample stage 3. The dust collection mechanism 7 is connected to an external power source via a first drag chain 51. The dust collection mechanism 7 is used to collect dust and debris generated during sample processing to maintain a clean processing environment and sample processing quality.

[0044] In this embodiment of the invention, the multi-axis laser processing device 10000 achieves high-precision and multi-dimensional processing of samples through a moving mechanism 2 with three degrees of freedom and a rotatable sample stage 3, thereby enhancing the adaptability of the multi-axis laser processing device 10000 to complex curved surfaces and irregularly shaped samples, and improving processing efficiency and accuracy.

[0045] It should be noted that while the preferred embodiments of this utility model are provided in the specification and accompanying drawings, this utility model can be implemented in many different forms and is not limited to the embodiments described herein. These embodiments are not intended to impose additional limitations on the content of this utility model; their purpose is to provide a more thorough and comprehensive understanding of the disclosure of this utility model. Furthermore, the above-described technical features can be combined with each other to form various embodiments not listed above, all of which are considered to be within the scope of this utility model specification. Moreover, those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. A multi-axis laser processing device, characterized in that, include: Base; A moving mechanism is disposed on the base, and the moving mechanism includes a first moving component, a second moving component, and a third moving component; A sample stage is disposed on the first moving component, the first moving component is capable of driving the sample stage to reciprocate along a first direction, the sample stage is used to carry a sample, and the sample stage is rotatable; A processing component is disposed on the second moving component, the second moving component being capable of driving the processing component to reciprocate along a second direction, the processing component including a laser for emitting a laser beam to process the sample, a third moving component connected to the second moving component, the third moving component being capable of driving the second moving component to reciprocate along a third direction, wherein the first direction, the second direction and the third direction are perpendicular to each other.

2. The multi-axis laser processing device according to claim 1, characterized in that... , The sample stage is rotatable about a first axis, which is parallel to the second direction.

3. The multi-axis laser processing apparatus according to claim 2, characterized in that... , The processing assembly includes a rotating component that can rotate about a second axis, the second axis being perpendicular to the second direction; The multi-axis laser processing device further includes a clamping component for clamping the sample. The clamping component is sleeved on the rotating component and can rotate around the second axis with the rotating component.

4. The multi-axis laser processing apparatus according to claim 2, characterized in that... , The sample stage is rotatable about a third axis, which is perpendicular to the second direction.

5. The multi-axis laser processing apparatus according to any one of claims 1-4, characterized in that, The base is provided with a screw hole, and the screw hole is provided with an internal thread. A support column extends from one side of the base. One end of the support column is used to abut against the placement surface of the multi-axis laser processing device. The support column is provided with an external thread, which is threadedly connected to the internal thread. The support column can rotate and move along the threaded hole.

6. The multi-axis laser processing apparatus according to claim 5, characterized in that... , The first moving component includes a first linear motor and a first moving platform. The first moving platform is connected to the first linear motor, and the first linear motor is used to drive the first moving platform to move back and forth along the first direction. The sample stage is disposed on the first moving platform.

7. The multi-axis laser processing apparatus according to claim 5, characterized in that, The second moving component includes a second linear motor and a second moving platform. The second moving platform is connected to the second linear motor, and the second linear motor is used to drive the second moving platform to reciprocate along the second direction. The processing component is fixed to the second moving platform.

8. The multi-axis laser processing apparatus according to claim 5, characterized in that, The third moving component includes a third linear motor and a third moving platform. The third moving platform is connected to the third linear motor, and the third linear motor is used to drive the third moving platform to reciprocate along the third direction. The second moving component is disposed on the third moving platform.

9. The multi-axis laser processing apparatus according to claim 5, characterized in that, The multi-axis laser processing device also includes a cable chain assembly, which is connected to the first moving assembly, the second moving assembly, the third moving assembly, and the processing assembly.

10. The multi-axis laser processing apparatus according to claim 9, characterized in that, The cable chain assembly includes a first cable chain, a second cable chain, and a third cable chain, wherein the first moving component is connected to an external power source via the first cable chain; The second moving component, the third moving component, and the processing component are connected to an external power source via the second cable chain and / or the third cable chain.

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