ITO conductive glass lens processing device

Abstract

The utility model discloses an ITO (Indium Tin Oxide) conductive glass lens processing device. The ITO conductive glass lens processing device structurally comprises a power-on host, a connecting column, a control panel, a covering plate, a sputtering processor and a placing structure, after the placement structure is further improved, the solid plate is manually controlled according to the pull block, so that the magnetic attraction block of the solid plate can be stably attracted to the front end of the connecting column, a sputtering area below the sputtering processing device is kept in an airtight state, internal air is extracted by combining a vacuum air extracting pump, and the sputtering processing efficiency is improved. Therefore, taking and placing of the ITO conductive glass in the positioning body area can be improved through the direct pulling-out and pushing-in effects, and then internal air can be treated through a vacuum air pump after reorganization. And therefore, the processing, taking and placing convenience of the ITO conductive glass can be improved, and the stability during internal vacuum sputtering is ensured.

Description

Technical Field

[0001] This utility model relates to the field of ITO conductive glass processing technology, specifically an ITO conductive glass lens processing device. Background Technology

[0002] ITO conductive glass lenses are suitable for various fields such as LCD displays, solar cells, and smart homes. They can improve the display intensity and clarity of electronic devices based on their high light transmittance, conductivity, and other physical properties. When applied to the solar energy field, they can improve the intensity of photoelectric conversion.

[0003] Therefore, when processing ITO conductive glass lenses, a special processing device is used to position the glass substrate in parallel, and then a layer of indium tin oxide (ITO) conductive film is deposited on its surface, so that the glass can be bonded with indium tin oxide (ITO) to become ITO conductive glass.

[0004] However, the existing processing equipment still has the following drawbacks: When processing ITO conductive glass, the current processing equipment uses magnetron sputtering to sputter indium tin oxide (ITO) onto the substrate of the glass lens. However, due to the influence of the magnetron sputtering process, it needs to be carried out in a vacuum environment to avoid the influence of gas molecules in the air on the sputtering process. Therefore, magnetron sputtering in a vacuum environment makes it difficult to remove the ITO conductive glass lens after sputtering. As a result, the equipment needs to be cumbersome and complicated to pick up and put down the ITO conductive glass lens, which reduces the processing efficiency of ITO conductive glass. Utility Model Content

[0005] To address the above problems, this utility model provides an ITO conductive glass lens processing device.

[0006] To achieve the above objectives, this utility model is implemented through the following technical solution: an ITO conductive glass lens processing device, the structure of which includes: a power-on main unit, a connecting column, a control panel, a cover plate, a sputtering processor, and a placement structure. The upper end of the power-on main unit determines the position of the control panel through the connecting column, and the cover plate is installed above the power-on main unit in a parallel orientation so that the sputtering processor is installed vertically. The sputtering processor communicates with the placement structure below through the cover plate, and the placement structure contacts the front end of the connecting column in a parallel embedding manner.

[0007] Furthermore, the placement structure is equipped with a pull block, which is welded to the center of the solid plate surface. Magnetic blocks are also mounted on the upper and lower sides of one end of the solid plate surface. A vacuum pump is connected to the center of the solid plate surface, and a support plate is connected below it. A slider is provided at the lower end of the support plate, and a positioning body is connected to the upper end.

[0008] Furthermore, the solid plate is manually controlled by the pull block of the placement structure, and then the magnetic block is attracted to the front surface of the connecting column. At the same time, the vacuum pump faces the area below the sputtering machine. Then, the carrier plate and the slider carry the positioning body and insert it parallel to the surface position of the powered host. Then, the carrier plate is pushed to the innermost side so that the magnetic block is close to the front end of the connecting column, so that the positioning body on the surface and the area below the sputtering machine are on the same vertical line.

[0009] Furthermore, the upper left and right sides of the powered host are connected to two sets of solid connecting columns, which position the control panel and arrange the cover plate in a parallel orientation. The bottom of the sputtering machine of the cover plate is connected to the surface of the placement structure.

[0010] Furthermore, the pull block is perpendicular to the solid plate, and the solid plate carries two solid magnetic blocks and has three conduits in the vacuum pump on its surface. The support plate is set in a parallel orientation and has three solid sliders connected to its lower end.

[0011] Furthermore, the positioning body is also provided with a central insert block, which is welded to the lower center of the overlapping plate and a partition frame is connected to the surface of the overlapping plate. The partition frame has a sputtering groove inside, through which the anti-slip pad is inserted in parallel.

[0012] Furthermore, the central insert block is perpendicular to the bottom center of the overlapping plate, and the overlapping plate is set in a parallel orientation. The edge shape of the overlapping plate matches the shape of the partition frame, and the sputtering groove of the partition frame is opened in a vertical orientation.

[0013] Furthermore, the anti-slip mat is also equipped with an adsorption block, the surface of which is connected to a rubber pad, and a vertical block is inserted and fixed at one end of the rubber pad, with a slot in the center of the vertical block.

[0014] Furthermore, the area of ​​the adsorption block is the same as that of the rubber pad and is placed parallel to the inside of the partition frame through the sputtering groove, contacting the surface of the overlapping plate. The vertical block at one end of the rubber pad is cuboid in shape and is manually pulled using the internal slot. Beneficial effects

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] 1. This utility model, through further improvements to the placement structure, allows for manual control of the solid plate using a pull block, enabling the magnetic block of the solid plate to stably adhere to the front end of the connecting column. This ensures that the sputtering area below the sputtering machine remains airtight. Then, combined with a vacuum pump, the internal air is extracted, creating a vacuum state. This allows for improved handling of the ITO conductive glass in the positioning area through direct pulling and pushing. After reorganization, the internal air is treated by the vacuum pump, enhancing the ease of handling the ITO conductive glass and ensuring stability during internal vacuum sputtering.

[0017] 2. With further improvements to the positioning body, this utility model can improve the parallelism between the partition frame and the surface of the bearing plate by using the central insert block at the lower end of the overlapping plate. In addition, after the partition frame covers the edge of the sputtering groove area, it can improve the stability and accuracy of sputtering a single piece of ITO conductive glass. Furthermore, by cooperating with three sets of partition frames, three pieces of glass can be sputtered simultaneously, thereby improving the processing efficiency of conductive glass.

[0018] 3. This utility model further improves upon the anti-slip pad of the sputtering groove by allowing the adsorption block at the lower end of the rubber pad to overlap and contact the surface of the overlapping plate, ensuring that the rubber pad can be set in a parallel orientation. Then, the vertical block on the side of the rubber pad can be manually pulled vertically through the slot, which improves the convenience of removing the rubber pad from the partition frame. At the same time, the rubber pad can protect the bottom of the glass, preventing scratches caused by friction during placement and processing. Therefore, it can improve the processing stability of ITO conductive glass. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the structure of an ITO conductive glass lens processing device according to the present invention.

[0020] Figure 2 This is a three-dimensional structural diagram of an improved placement structure according to the present invention.

[0021] Figure 3 This is a three-dimensional structural diagram of an improved positioning body according to the present invention.

[0022] Figure 4 This is a three-dimensional structural diagram of an improved anti-slip mat according to the present invention.

[0023] In the diagram: Power-on main unit - 1, Connecting column - 2, Control panel - 3, Cover plate - 4, Sputtering machine - 5, Placement structure - 6;

[0024] Pull block-61, solid plate-62, magnetic block-63, vacuum pump-64, bearing plate-65, slider-66, positioning body-67;

[0025] Center insert block-671, overlapping plate-672, partition frame-673, splash groove-674, anti-slip pad-675;

[0026] Adsorption block-6751, rubber pad-6752, vertical block-6753, empty slot-6754. Detailed Implementation

[0027] The technical solution of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the protection scope of this utility model.

[0028] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Example

[0029] like Figures 1-4 As shown, this utility model provides an ITO conductive glass lens processing device, the structure of which includes: a power-on host 1, a connecting post 2, a control panel 3, a cover plate 4, a sputtering machine 5, and a placement structure 6. The upper end of the power-on host 1 is positioned by the connecting post 2 to determine the position of the control panel 3, and the cover plate 4 is installed above the power-on host 1 in a parallel orientation so that the sputtering machine 5 is installed vertically. The sputtering machine 5 communicates with the placement structure 6 below through the cover plate 4. The placement structure 6 contacts the front end of the connecting post 2 in a parallel embedded manner.

[0030] The placement structure 6 is provided with a pull block 61, which is welded to the center of the surface of the solid plate 62. Magnetic blocks 63 are also mounted on the upper and lower sides of one end surface of the solid plate 62. A vacuum pump 64 is connected to the center of the surface of the solid plate 62, and a support plate 65 is connected below it. A slider 66 is provided at the lower end of the support plate 65, and a positioning body 67 is connected to the upper end.

[0031] In this process, the solid plate 62 is manually controlled by the pull block 61 of the placement structure 6, and then the magnetic block 63 is attracted to the front end surface of the connecting column 2. At the same time, the vacuum pump 64 faces the area below the sputtering machine 5. Then, the support plate 65, together with the slider 66, carries the positioning body 67 and inserts it parallel to the surface position of the powered host 1. Then, the support plate 65 is pushed to the innermost side, so that the magnetic block 63 is tightly attached to the front end of the connecting column 2, and the positioning body 67 on the surface is kept on the same vertical line as the area below the sputtering machine 5.

[0032] The main unit 1 is equipped with two sets of solid connecting columns 2 on the left and right sides of its upper end, which position the control panel 3 and arrange the cover plate 4 in a parallel orientation. The bottom of the sputtering machine 5 of the cover plate 4 is connected to the surface of the placement structure 6.

[0033] The pull block 61 is perpendicular to the solid plate 62, and the solid plate 62 carries two solid magnetic blocks 63 and the vacuum pump 64 on its surface carries three conduits. The support plate 65 is set in a parallel orientation and its lower end is connected to three solid sliders 66.

[0034] The positioning body 67 is further provided with a central insert 671, which is welded to the lower center of the overlapping plate 672. A partition frame 673 is connected to the surface of the overlapping plate 672. A sputtering groove 674 is opened inside the partition frame 673, through which the anti-slip pad 675 is inserted in parallel.

[0035] The center insert 671 is perpendicular to the bottom center of the overlapping plate 672 and the overlapping plate 672 is set in a parallel orientation. The edge shape of the overlapping plate 672 matches the shape of the partition frame 673, and the sputtering groove 674 of the partition frame 673 is opened in a vertical orientation.

[0036] The anti-slip mat 675 is also provided with an adsorption block 6751. A rubber pad 6752 is connected to the surface of the adsorption block 6751. A vertical block 6753 is inserted and fixed at one end of the rubber pad 6752. A slot 6754 is opened in the center of the vertical block 6753.

[0037] The area of ​​the adsorption block 6751 is the same as that of the rubber pad 6752, and it is placed in parallel inside the partition frame 673 through the sputtering groove 674 and contacts the surface of the overlapping plate 672. The vertical block 6753 at one end of the rubber pad 6752 is cuboid in shape and can be manually pulled using the internal slot 6754.

[0038] The working principle of this utility model is explained below: The main unit 1 of the ITO conductive glass lens processing device can determine the positioning of the control panel 3 and the cover plate 4 through the two sets of connecting columns 2 at the top. After the main unit 1 is connected to an external power source, the sputtering device 5 on the cover plate 4 can be controlled through the control panel 3, so that the corresponding placement structure 6 below the sputtering device 5 positions the glass in parallel. Then, in combination with the vacuum environment, sputtering operation is performed on its surface, sputtering indium tin oxide (ITO) atoms onto the glass surface. They will accumulate on the surface, first adsorbing on the surface, and then moving through diffusion, eventually forming tiny crystal nuclei and gradually growing into a continuous layer. The thin film enables the glass to become ITO conductive glass, allowing the solid plate 62 of the placement structure 6 to be manually pulled by the external pull block 61. This allows the magnetic block 63 on the other end of the solid plate 62 to contact or detach from the surface of the connecting post 2. Upon contact, the vacuum pump 64 at the center of the solid plate 62 faces the area below the sputtering machine 5, and the support plate 65 can be inserted parallel to it via the slider 66. This aligns the positioning body 67 on the surface of the support plate 65 with the area below the sputtering machine 5. Therefore, before the sputtering operation begins, the vacuum pump 64 can be electrically controlled via the control panel 3 to cover the area of ​​the solid plate 62 and the area below the sputtering machine 5. The air in the area is treated, followed by a stable sputtering operation. After sputtering, the pull block 61 can be pulled to detach the solid plate 62 from the area above the powered host 1, forming a quick disassembly. Then, the positioning body 67 is exposed to the air, allowing for quick handling of the internal ITO conductive glass. The overlapping plate 672 of the positioning body 67 can be inserted and connected to the surface of the carrier plate 65 using the bottom center insert 671. Subsequently, the partition frame 673 on the surface of the overlapping plate 672 can cover the edge of the sputtering groove 674. Therefore, when the three sets of positioning bodies 67 are used simultaneously, the glass can be separated by the partition frame 673 to avoid mutual interference during sputtering. This improves the stability of the sputtering process. Finally, the anti-slip pad 675 installed in the sputtering tank 674 can be manually and vertically pulled by the groove 6754 of the vertical block 6753 to remove the rubber pad 6752 from the sputtering tank 674 area of ​​the overlapping plate 672, making it detachable. The rubber pad 6752 can then enhance the protection of the ITO conductive glass substrate, so that when one end is sputtered, the other end can be in a flexible area, preventing surface damage caused by scratches on the other end. This improves the processing safety factor of ITO conductive glass.

[0039] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0040] Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. An ITO conductive glass lens processing apparatus, the structure of which includes: The system comprises a power-on host (1), a connecting post (2), a control panel (3), a cover plate (4), a sputtering machine (5), and a placement structure (6). The upper end of the power-on host (1) is positioned so that the control panel (3) is located via the connecting post (2), and the cover plate (4) is installed parallel above the power-on host (1) to allow the sputtering machine (5) to be vertically mounted. The sputtering machine (5) communicates with the placement structure (6) below via the cover plate (4). The placement structure (6) contacts the front end of the connecting post (2) in a parallel embedding manner. The system is characterized by: The placement structure (6) is provided with a pull block (61), which is welded to the center of the surface of the solid plate (62). Magnetic blocks (63) are also mounted on the upper and lower sides of one end surface of the solid plate (62). A vacuum pump (64) is also connected to the center of the surface of the solid plate (62), and a support plate (65) is also connected below it. A slider (66) is provided at the lower end of the support plate (65), and a positioning body (67) is connected at the upper end.

2. The ITO conductive glass lens processing apparatus according to claim 1, characterized in that: The solid plate (62) is manually controlled by the pull block (61) of the placement structure (6), and then the magnetic block (63) is attracted to the front surface of the connecting column (2). At the same time, the vacuum pump (64) faces the area below the sputtering machine (5), and then the carrier plate (65) combined with the slider (66) carries the positioning body (67) and inserts it parallel to the surface position of the powered host (1). Then the carrier plate (65) is pushed to the innermost side so that the magnetic block (63) is close to the front end of the connecting column (2) and the positioning body (67) on the surface is kept on the same vertical line as the area below the sputtering machine (5).

3. The ITO conductive glass lens processing apparatus according to claim 1, characterized in that: The power-on host (1) has two sets of solid connecting columns (2) on the upper left and right sides, and the control panel (3) is positioned and the cover plate (4) is set in a parallel position by arranging it left and right. The sputtering process (5) of the cover plate (4) is connected to the surface of the placement structure (6).

4. The ITO conductive glass lens processing apparatus according to claim 1, characterized in that: The pull block (61) is perpendicular to the solid plate (62) and the solid plate (62) carries two solid magnetic blocks (63) and the vacuum pump (64) on the surface carries three conduits. The support plate (65) is set in a parallel orientation and the lower end face is connected to three solid sliders (66).

5. The ITO conductive glass lens processing apparatus according to claim 1, characterized in that: The positioning body (67) is also provided with a center insert (671), which is welded to the lower center of the overlapping plate (672) and a partition frame (673) is connected to the surface of the overlapping plate (672). A sputtering groove (674) is opened inside the partition frame (673) so that the anti-slip pad (675) can be inserted in parallel through the sputtering groove (674).

6. The ITO conductive glass lens processing apparatus according to claim 5, characterized in that: The center insert (671) is perpendicular to the bottom center of the overlapping plate (672) and the overlapping plate (672) is set in a parallel orientation. The edge shape of the overlapping plate (672) matches the shape of the partition frame (673). The sputtering groove (674) of the partition frame (673) is opened in a vertical orientation.

7. The ITO conductive glass lens processing apparatus according to claim 6, characterized in that: The anti-slip mat (675) is also provided with an adsorption block (6751), and a rubber pad (6752) is connected to the surface of the adsorption block (6751). A vertical block (6753) is inserted and fixed at one end of the rubber pad (6752), and a slot (6754) is opened in the center of the vertical block (6753).

8. The ITO conductive glass lens processing apparatus according to claim 7, characterized in that: The area of ​​the adsorption block (6751) is the same as that of the rubber pad (6752) and is placed parallel to the inside of the partition frame (673) through the sputtering groove (674) and contacts the surface of the overlapping plate (672). The vertical block (6753) at one end of the rubber pad (6752) is cuboid in shape and can be manually pulled using the internal slot (6754).

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