Semiconductor power device test fixture with temperature control function
By designing a test fixture for semiconductor power devices with temperature control, independent temperature control of multiple devices is achieved, improving the accuracy of test results and reducing manufacturing costs, making it suitable for automated testing.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- WUHAN JINGLI ELECTRONICS TECH
- Filing Date
- 2025-04-29
- Publication Date
- 2026-05-05
AI Technical Summary
Existing test fixtures cannot individually control the temperature of multiple devices during high-temperature and high-pressure testing, resulting in inaccurate test results.
A test fixture for semiconductor power devices with temperature control is designed, comprising a fixture base, a flip cover, a temperature control component, and a conduction module. The temperature control component is located in the device body pressing area, and the conduction module is located in the pin pressing area. The temperature control component heats and adjusts the temperature of the device body, thereby achieving independent temperature control of multiple devices.
It improves the accuracy of device test results, can adapt to different types of devices, reduces the manufacturing cost of the device, is suitable for automated testing, and saves labor costs.
Smart Images
Figure CN224203221U_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the field of device testing, and more specifically, relates to a test fixture for semiconductor power devices with temperature control. Background Technology
[0002] High-temperature and high-pressure testing of third-generation semiconductor material silicon carbide power devices (TO, a type of semiconductor packaging) requires high-temperature heating of individual packages, with temperature controlled by sensor feedback. However, existing test fixtures typically lack heating devices, necessitating the placement of the fixture into a high-temperature furnace for overall heating during testing. When testing multiple devices simultaneously, it is impossible to individually control the temperature of any single device, leading to inaccurate test results. Utility Model Content
[0003] To address the shortcomings of existing technologies, this application provides a semiconductor power device test fixture with temperature control, aiming to solve the problem that when multiple test fixtures are placed in a high-temperature furnace for overall heating, the temperature of the device in one of the test fixtures cannot be controlled individually, resulting in inaccurate test results.
[0004] This application provides a temperature-controlled semiconductor power device test fixture, specifically including a fixture base, a flip cover, a temperature control component, and a conduction module. The test fixture includes a device body crimping area and a pin crimping area located between the fixture base and the flip cover. The temperature control component is disposed in the device body crimping area, and the conduction module is disposed in the pin crimping area. During device body testing, the main body of the device body is located in the device body crimping area, and the pin portion of the device body is located in the pin crimping area.
[0005] Compared with the prior art, the above-described technical solution conceived in this application has the advantages of heating the device body by means of the main body being located in the device body pressing area and the pin part being located in the pin pressing area during device body testing. The temperature control component can heat the device body, and the test temperature of the device body can be changed by adjusting the temperature of the temperature control component. When multiple device bodies need to be tested, multiple devices can be used simultaneously. The device body in each device can be heated to different test temperatures as needed, which can achieve the beneficial effect of improving the accuracy of device body test results.
[0006] As a further preferred embodiment, the temperature control component is disposed on the fixture base and / or the flip cover, and the conduction module is disposed on the fixture base and / or the flip cover.
[0007] As a further preferred embodiment, the temperature control component is disposed on the flip cover, the conduction module is disposed on the fixture base, and the test fixture further includes a device body clamping component and a pin clamping component, wherein the device body clamping component is disposed in the device body pressing area, and the pin clamping component is disposed in the pin pressing area.
[0008] As a further preferred embodiment, the device body clamping assembly includes a device body pressure head, a device body base, and a plurality of first springs. The device body pressure head is fixedly connected to the side of the flip cover facing the fixture base, and the device body base is connected to the fixture base by a plurality of first springs.
[0009] As a further preferred embodiment, the temperature control component includes a heating element, a copper block, and a temperature sensor. The main body pressure head of the device is fixedly connected to the flip cover via the copper block. The heating element is fixedly connected to the side of the copper block away from the main body pressure head of the device for heating. The temperature sensor is fixedly connected between the copper block and the main body pressure head of the device for temperature measurement and feedback.
[0010] As a further preferred embodiment, the conductive module includes a pin base, and the pin base is detachably connected to the fixture base.
[0011] As a further preferred embodiment, the pin clamping assembly includes a pin clamping head and several second springs. The pin clamping head is fixedly connected to the side of the flip cover facing the fixture base, and the pin base is connected to the fixture base by several second springs.
[0012] As a further preferred embodiment, the pin base is a three-pin base or a four-pin base.
[0013] As a further preferred embodiment, the flip cover and the fixture base are configured to cooperate, and when the fixture is in the snap-fit state, the flip cover and the fixture base are fixed together by a snap-fit mechanism.
[0014] As a further preferred embodiment, the heating element is made of ceramic and has an internal heating wire, the fixture base and pin pressure head are made of synthetic stone, polyphenylene sulfide or polyether ether ketone, and the main body pressure head of the device is made of a high thermal conductivity metal material.
[0015] In summary, compared with the prior art, the technical solutions conceived in this application have the following main technical advantages:
[0016] 1. In this application, during device body testing, the main body is located in the device body crimping area, the pin part is located in the pin crimping area, and the temperature control component can heat the semiconductor power device. By adjusting the temperature of the temperature control component, the test temperature of the device body can be changed. When multiple device bodies need to be tested, multiple devices can be used simultaneously. The device body in each device can be heated to different test temperatures as needed, thereby improving the accuracy of the device body test results.
[0017] 2. This application allows for the replacement of pin bases depending on the model and specifications of the device body to be tested, enabling the device body to connect with a compatible pin base, thereby improving the applicability of the device and reducing the manufacturing cost of the device.
[0018] 3. The fixture base of this application is set to lie flat, which facilitates automated testing in practical applications, saves labor costs and increases efficiency. Attached Figure Description
[0019] Figure 1 This is a schematic diagram of the overall structure of the test fixture provided in the embodiments of this application;
[0020] Figure 2 This is a schematic diagram showing the usage state of the test fixture provided in the embodiments of this application;
[0021] Figure 3 This is a first cross-sectional view of the test fixture provided in the embodiments of this application;
[0022] Figure 4 This is a second cross-sectional view of the test fixture provided in the embodiments of this application;
[0023] Figure 5 This is a schematic diagram of the overall structure of the three-pin base provided in the embodiments of this application;
[0024] Figure 6 This is a schematic diagram of the overall structure of the four-pin base provided in the embodiments of this application;
[0025] Figure 7 This is a schematic diagram of the overall structure of the three-pin device and the four-pin device provided in the embodiments of this application.
[0026] In all the accompanying drawings, the same reference numerals are used to denote the same elements or structures, wherein:
[0027] 1. Fixture base; 2. Flip cover; 3. Temperature control component; 31. Heating element; 32. Copper block; 33. Temperature sensor; 34. Support block; 4. Conducting module; 41. Pin base; 411. Three-pin base; 412. Four-pin base; 42. Probe; 5. Device body clamping assembly; 51. Device body pressure head; 52. Device body base; 53. First spring; 6. Pin clamping assembly; 61. Pin pressure head; 62. Second spring; 71. Three-pin device; 72. Four-pin device. Detailed Implementation
[0028] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.
[0029] This application discloses a semiconductor power device test fixture with temperature control. When multiple devices need to be tested simultaneously, multiple test devices are used to test each device separately. The temperature of each device can be monitored and controlled individually, and the fixture can be adapted to the testing of various devices by changing the pin base.
[0030] Reference Figures 1-2 The testing device includes a fixture base 1, a flip cover 2, a temperature control component 3, and a conduction module 4. During testing, the device body is placed between the fixture base 1 and the flip cover 2. The flip cover 2 and the fixture base 1 are fitted together. When the fixture is in the closed state, the flip cover 2 is fixed to the fixture base 1 by a snap-fit mechanism. Specifically, one end of the flip cover 2 is hinged to the fixture base 1, and the other end is snap-fitted to the fixture base 1. A buckle is fixedly connected to the flip cover 2, and a slot is provided on the fixture base 1. After the flip cover 2 is closed, the buckle and the slot engage with each other. In another feasible embodiment, both sides of the flip cover 2 are snapped to the fixture base 1 by buckles. The temperature control component 3 heats and monitors the temperature of the device body, and the conduction module 4 transmits a test signal to the device body. The fixture base 1 is horizontally fixed to the PCB board by bolts, and the PCB board is fixedly connected to the base plate. After the fixture base 1 is pressed against the PCB board, it is tightened to the base plate by screws. Optionally, the conduction module 4 is electrically connected to the PCB board to receive test signals from the outside.
[0031] In this embodiment, the test fixture includes a device body crimping area and a pin crimping area located between the fixture base 1 and the flip cover 2. The temperature control component 3 is disposed in the device body crimping area, and the conduction module 4 is disposed in the pin crimping area. During device body testing, the main body of the device body is located in the device body crimping area, and the pin part of the device body is located in the pin crimping area. The temperature control component 3 heats the main body of the device body, and the pin part of the device body is connected to the conduction module 4 to receive signals.
[0032] Specifically, the temperature control component 3 is disposed on the fixture base 1 and / or the flip cover 2, and the conduction module 4 is disposed on the fixture base 1 and / or the flip cover 2. In this embodiment, the temperature control component 3 is disposed on the flip cover 2, and the conduction module 4 is disposed on the fixture base 1. In other feasible embodiments, the temperature control component 3 can be disposed on the fixture base 1, and the conduction module 4 can be disposed on the flip cover 2.
[0033] Reference Figures 3-7 To improve the heating effect and connection stability of the device body, the test fixture also includes a device body clamping component 5 and a pin clamping component 6. The device body clamping component 5 is located in the device body pressing area, and the pin clamping component 6 is located in the pin pressing area. When the flip cover 2 is closed, the device body clamping component 5 corresponds to the main body of the device body, and the pin clamping component 6 corresponds to the pin part of the device body.
[0034] Specifically, the device body clamping assembly 5 includes a device body clamping head 51, a device body base 52, and several first springs 53. The device body clamping head 51 is fixedly connected to the side of the flip cover 2 facing the fixture base 1. The fixture base 1 has a groove for mounting the device body base 52, and the device body base 52 is connected to the groove on the fixture base 1 by several first springs 53. The temperature control assembly 3 includes a heating element 31, a copper block 32, and a temperature sensor 33. The device body clamping head 51 is fixedly connected to the flip cover 2 by the copper block 32, and the heating element 31 is fixedly connected to the copper block 32 away from the device body clamping head 51. One side is used for heating, with copper block 32 transferring heat. The device body is heated by the device main body pressure head 51. Heating element 31 is fixedly connected to the flip cover 2 via support block 34. Temperature sensor 33 is fixedly connected between copper block 32 and device main body pressure head 51 for temperature measurement and feedback. Heating element 31 is used to heat the device under test, and temperature sensor 33 is used for temperature measurement and feedback. Heating element 31 is made of ceramic and contains a heating wire. In this embodiment, alumina ceramic is used, but it can also be replaced with aluminum nitride ceramic. In this embodiment, temperature sensor 33 is preferably a surface-mount thermocouple. After the flip cover 2 is closed, device main body pressure head 51 is pressed against the main body of the device, and the first spring 53 is compressed to ensure good contact between the device body and device main body pressure head 51. When the testing device is working, the heating element 31 heats the copper block 32 and conducts the heat to the device body pressure head 51. The device body pressure head 51 then conducts the heat to the device body under test. The surface-mount thermocouple reads the temperature of the device body pressure head 51 in real time in order to control the test temperature of the device body. The surface-mount thermocouple can realize the temperature monitoring of the heating element 31, which is a common device in the field and will not be described in detail here.
[0035] More specifically, the conduction module 4 includes a pin base 41, which is detachably connected to the fixture base 1. The pin base 41 is either a three-pin base 411 or a four-pin base 412. Probes 42 are arranged inside the pin base 41. Depending on the arrangement of the probes 42, a three-pin base 411 or a four-pin base 412 can be formed. The pin base 41 is a separate module that can be replaced and matched for devices with different pins. In this application, common three-pin devices 71 and four-pin devices 72 are used. Through the structural design of this application, the cost can be greatly reduced.
[0036] Furthermore, the pin clamping assembly 6 includes a pin clamping head 61 and several second springs 62. The pin clamping head 61 is fixedly connected to the side of the flip cover 2 facing the fixture base 1. The pin base 41 is connected to the fixture base 1 via several second springs 62. The fixture base 1 has a groove for mounting the pin base 41. The device body base 52 is connected to the groove on the fixture base 1 via several second springs 62. After the device body is installed, its pins can contact the probes 42 to transmit signals and current. Both the device body base 52 and the pin base 41 are U-shaped, and the U-shaped openings of the device body base 52 and the pin base 41 are arranged opposite each other. When the semiconductor power device is installed, the main body is located in the device body base 52, and the pins are located in the pin base 41. After the flip cover 2 is closed, the pin clamping head 61 presses against the pin portion of the device body, and the second springs 62 are compressed to ensure good contact between the pins of the device body and the probes 42 on the pin base 41.
[0037] Furthermore, in this embodiment, the fixture base 1 and the pin pressure head 61 are made of synthetic stone, polyphenylene sulfide, or polyether ether ketone, and the main body pressure head 51 is made of a high thermal conductivity metal material, such as copper, brass, or aluminum.
[0038] It should be understood that expressions such as "comprising" and "may include" as used in this application indicate the existence of the disclosed functions, operations, or constituent elements, and do not limit one or more additional functions, operations, and constituent elements. In this application, terms such as "comprising" and / or "having" may be interpreted as indicating a specific characteristic, number, operation, constituent element, component, or combination thereof, but should not be interpreted as excluding the existence or possibility of adding one or more other characteristics, numbers, operations, constituent elements, components, or combinations thereof.
[0039] It should be understood that the terms “center,” “upper,” “lower,” “front,” “rear,” “left,” “right,” “vertical,” “horizontal,” “inner,” “outer,” “clockwise,” “counterclockwise,” “axial,” “radial,” and “circumferential” indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.
[0040] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.
[0041] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.
[0042] Those skilled in the art will readily understand that the above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.
Claims
1. A semiconductor power device testing fixture with temperature control, characterized in that, The test fixture includes a fixture base (1), a flip cover (2), a temperature control component (3), and a conduction module (4). The test fixture includes a device body crimping area and a pin crimping area located between the fixture base (1) and the flip cover (2). The temperature control component (3) is located in the device body crimping area, and the conduction module (4) is located in the pin crimping area. When the device body is tested, the main body of the device body is located in the device body crimping area, and the pin part of the device body is located in the pin crimping area.
2. The semiconductor power device test fixture with temperature control as described in claim 1, characterized in that, The temperature control component (3) is disposed on the fixture base (1) and / or the flip cover (2), and the conduction module (4) is disposed on the fixture base (1) and / or the flip cover (2).
3. The semiconductor power device test fixture with temperature control as described in claim 2, characterized in that, The temperature control component (3) is disposed on the flip cover (2), the conduction module (4) is disposed on the fixture base (1), and the test fixture also includes a device body pressing component (5) and a pin pressing component (6). The device body pressing component (5) is disposed in the device body pressing area, and the pin pressing component (6) is disposed in the pin pressing area.
4. The semiconductor power device test fixture with temperature control as described in claim 3, characterized in that, The device body pressing assembly (5) includes a device body pressing head (51), a device body base (52) and several first springs (53). The device body pressing head (51) is fixedly connected to the side of the flip cover (2) facing the fixture base (1). The device body base (52) is connected to the fixture base (1) by several first springs (53).
5. A semiconductor power device test fixture with temperature control as described in claim 4, characterized in that, The temperature control component (3) includes a heating element (31), a copper block (32), and a temperature sensor (33). The main body pressure head (51) of the device is fixedly connected to the flip cover (2) through the copper block (32). The heating element (31) is fixedly connected to the side of the copper block (32) away from the main body pressure head (51) for heating. The temperature sensor (33) is fixedly connected between the copper block (32) and the main body pressure head (51) for temperature measurement and feedback.
6. A semiconductor power device test fixture with temperature control as described in claim 5, characterized in that, The conductive module (4) includes a pin base (41), and the pin base (41) is detachably connected to the fixture base (1).
7. A semiconductor power device test fixture with temperature control as described in claim 6, characterized in that, The pin clamping assembly (6) includes a pin clamping head (61) and several second springs (62). The pin clamping head (61) is fixedly connected to the side of the flip cover (2) facing the fixture base (1). The pin base (41) is connected to the fixture base (1) by several second springs (62).
8. A semiconductor power device test fixture with temperature control as described in claim 6, characterized in that, The pin base (41) is a three-pin base (411) or a four-pin base (412).
9. A semiconductor power device test fixture with temperature control as described in claim 1, characterized in that, The flip cover (2) and the fixture base (1) are configured to work together. When the fixture is in the snap-fit state, the flip cover (2) and the fixture base (1) are fixed together by a snap-fit mechanism.
10. A semiconductor power device test fixture with temperature control as described in claim 7, characterized in that, The heating element (31) is made of ceramic and has an internal heating wire. The fixture base (1) and the pin head (61) are made of synthetic stone, polyphenylene sulfide or polyether ether ketone. The main body of the device (51) is made of a high thermal conductivity metal material.